Abstract: Disclosed are an electrode structure and a method for producing an electrode. The method includes disposing first and second wires on a substrate, and bonding the first and second wires to each other. The electrode structure includes a substrate, a first wire disposed on the substrate, and a second wire disposed on the substrate. The first wire crosses the second wire, and the first and second wires are bonded to each other.

Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.

Abstract: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.

Abstract: In some examples, the disclosure relates to a medical device comprising a lead including an electrically conductive lead wire; and an electrode electrically coupled to the lead wire, the electrode including a first portion and a second portion, wherein the first portion defines an exposed outer surface of the electrode and is electrically coupled to the second portion along a first interface, wherein the second portion is electrically coupled to the lead wire along a second interface different from the first interface via welding to couple the lead wire to the electrode, wherein an electrical signal may be transferred between the lead wire and exposed outer surface of the first portion via the second portion, and wherein the first portion is formed from a first material having a first composition, and the second portion is formed from a second material having a second composition different from the first composition.

Abstract: A method of processing an alloy workpiece to reduce thermal cracking may comprise spraying a metallic coating material onto at least a portion of a surface of the alloy workpiece to form a surface coating metallurgically bonded to the alloy workpiece. The surface coating may be more ductile than the alloy workpiece and reduces heat loss from the alloy workpiece.

Abstract: A rotary sputtering target assembly and method of making the same including a target and a backing tube having a plated bonding surface. The backing tube and the target are bonded together along the plated bonding surface.

Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.

Abstract: A welded stent and stent delivery system, with a stent including a first strut having a first strut nickel titanium alloy layer and nickel titanium soluble core, the first strut nickel titanium alloy layer being disposed around the first strut nickel titanium soluble core; and a second strut having a second strut nickel titanium alloy layer and nickel titanium soluble core, the second strut nickel titanium alloy layer being disposed around the second strut nickel titanium soluble core, the second strut nickel titanium alloy layer being connected to the first strut nickel titanium alloy layer with a weld. The first and second strut nickel titanium alloy layers are made of a nickel titanium alloy, the first and second strut nickel titanium soluble cores are made of a nickel titanium soluble material, and the weld is made of an alloy of the nickel titanium alloy and the nickel titanium soluble material.

Abstract: This document describes an apparatus including an implantable medical device having a printed circuit board. The apparatus can include a connector block for a lead terminal of the implantable medical device mounted directly to the printed circuit board.

Abstract: An integrated reference vacuum pressure sensor with an atomic layer deposition (ALD) coated input port comprises a housing with an port for a media to enter the housing; a substrate and stress isolation member in the housing; wherein a channel extends through the substrate and the stress isolation member, wherein a trace is embedded within the stress isolation member, wherein stress isolation member and substrate surfaces exposed to the channel are coated with an ALD; a sensor die bonded to the stress isolation member, the sensor die comprising a diaphragm having circuitry, wherein a side of the diaphragm is exposed to the channel and the circuitry is mounted to another side of the diaphragm; a via extending through the sensing die electrically connecting the circuitry to the trace; and a cover bonded to the stress isolation member, the cover having a recess, the sensor die in the recess.

Abstract: An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.

Abstract: A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.

Abstract: A method of manufacturing a thermal management hybrid article includes electroplating a copper layer on a graphitic layer, adhering the copper-plated graphitic layer to a plate of aluminum with a nano-copper paste to form a substrate, heating the substrate in a forming gas at a temperature less than 500° C. to melt to recrystallize the nano-copper paste, and cooling the substrate after the heating. A method of manufacturing a thermal management hybrid article includes electroplating a copper layer on a graphitic layer, electroplating copper on a plate of aluminum, and soldering the copper-plated layer on the graphitic layer to the copper-plated plate of aluminum. A method of manufacturing a thermal management hybrid article also includes electroplating a copper layer on a graphitic layer and immersing the copper-plated graphitic layer in molten aluminum to cast the an aluminum layer on the copper layer.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.

Abstract: Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

Abstract: A visually seamless method of joining a first piece of metal and a second piece of metal is described. The first piece of metal is placed in contact with an edge of the second piece of metal. In some embodiments, the edge includes a sacrificial lip. The first piece of metal forming a junction area with the edge of the second piece of metal, applying a forging force to the first piece of metal, the forging force having an effect of creating an extremely tight fit up between the first and the second pieces of metal, welding the first and the second pieces to form an assembly and forming a cosmetically enhancing protective layer on the surface of the assembly, the protective layer obscuring any visible artifacts on the surface of the assembly, the obscured visible artifacts including any discoloration or discontinuity created by the laser welding.

Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.

Abstract: A self-aligning pick-up head, a method to manufacture a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a nozzle having a first end portion and a second end portion and a base tool comprising a collet head, wherein the first end portion of the nozzle is gimbaled to the base tool.

Abstract: Relating to electronic components, the present disclosure provides a method for welding a gold-silicon eutectic chip, and a transistor. The method for welding a gold-silicon eutectic chip includes: electroplating a gold layer with a thickness smaller than or equal to 1 micron on surfaces of a chip carrier; bonding multiple gold protrusions on the gold layer in a welding region; and rubbing a chip in the welding region at a eutectic temperature to form a welding layer. The transistor includes a chip, a chip carrier, and a middle layer connecting the chip and the chip carrier, where the welding middle layer is a welding layer obtained by using the above welding method. The present disclosure reduces an amount of gold in use and lowers a cost of gold-silicon eutectic welding to a relatively large extent, and, accordingly, cuts down the cost of a transistor.

Abstract: Radio frequency system (250) which includes a first and second sub-assembly (100, 200), each formed of a plurality of layers of conductive material (504, 508, 516) disposed on a substrate (102) and arranged in a stack. The stacked layers form signal processing components (108, 110) and at least one peripheral wall (104, 204) surrounding a walled area (118, 218) of each substrate. The second sub-assembly is positioned on the first sub-assembly with a first walled area of a first substrate aligned with a second walled area of a second substrate.

Abstract: An underwater sliding member of the present embodiment is an underwater sliding member used under water, and has: a base material 11 made of a first metal material; an intermediate layer 12 of a porous structure joined to the base material 11 and made of a second metal material; a corrosion inhibiting layer 122 a part of which is melted and filled into a hole of the porous structure of the intermediate layer 12; and a sliding layer 13 formed on the corrosion inhibiting layer 122 and made of a resin material.

Abstract: A method of constructing a thermistor includes forming a semiconductor ceramic substrate. The method also includes coating a surface of the substrate with contact material and applying a solder mask on the contact material. The applying includes applying the solder mask to one or more portions of the contact material to leave an exposed area without the solder mask and a masked area with the solder mask. The method includes trimming the contact material at the masked area to adjust a resistance of the thermistor.

Abstract: A capacitive sensor device and a method of manufacture are provided. The capacitive sensor device includes at least one sensor tip that includes an electrode positioned at a first end of the sensor tip, and a stem member coupled to the electrode and extending toward a second end of the sensor tip. The device also includes a coaxial cable including a center conductor, the center conductor coupled to the sensor tip at the second end, and an insulation layer supporting the sensor tip between the first and second ends. The insulation layer includes a metallization on a portion surrounding the second end of the sensor tip. The device further includes a casing surrounding a portion of the coaxial cable, the metallization, and the coupling of the center conductor and the sensor tip, wherein a braze joint is formed between the casing and the metallization to form a hollow, hermetic cavity.

Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

Abstract: A solder joint and method of soldering are disclosed. Formation is controlled of atomic vacancies in a surface layer of a component to be soldered. Diffusion of the atomic vacancies during soldering is controlled. Vacancy formation may be controlled using a low current density during surface layer creation. Diffusion may be controlled by controlling layer thickness and soldering temperature.

Abstract: Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface.

Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.

Abstract: A process of fabricating a shield, a process of preparing a component, and an erosion shield are disclosed. The process of fabricating the shield includes forming a near-net shape shield. The near-net shape shield includes a nickel-based layer and an erosion-resistant alloy layer. The nickel-based layer is configured to facilitate secure attachment of the near-net shaped to a component. The process of preparing the component includes securing a near-net shape shield to a substrate of a component.

Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving area and electrically connected to the first thick-film substrate.

Abstract: The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract: A resin molded product for reducing the external force applied to a first element from each electroconductive member due to a pressure of a resin at the time of molding, when each of the electroconductive members and the first element are insert-molded with the resin, and a method for producing the same. A second element fixing the electroconductive members to each other is connected to each of the electroconductive members so as to lie astride each of the electroconductive members. Accordingly, even though a pressure of the resin which flows into a die has been applied to each of the electroconductive members when a resin part that covers each of the electroconductive members and the first element is formed by insert molding, the distortion occurring among each of the electroconductive members is reduced by the second element.

Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract: A method of manufacturing a fiber reinforced metal matrix composite article, the method comprises forming a first metal component, forming a second metal component and forming at least one fiber preform comprising at least one metal coated fiber. The metal at least one first portion of the at least one metal coated fiber of the at least one fiber preform is bonded to the metal at least one second portion of the at least one metal coated fiber of the at least one fiber preform to hold the at least one fiber in position. The at least one fiber preform is placed between the first metal component and the second metal component. The second metal component is sealed to the first metal component, and heat and pressure is applied such as to consolidate the at least one fiber preform and to diffusion bond the metal on the fiber of the at least one fiber preform, the first metal component and the second metal component to form a unitary composite article. The bonding comprises ultrasonic welding.

Abstract: The present invention relates to a compressor blade of a gas turbine having an airfoil made of a fiber-reinforced plastic and a leading-edge element connected to said airfoil, characterized in that the leading-edge element includes two partial elements, which are fabricated as separate elements and connected to one another, with the leading-edge element being connected to the airfoil essentially using the clamping effect of the two partial elements, as well as to a manufacturing method.

Abstract: Recycling of isotopically enriched molybdenum metal targets that are suitable for the large scale cyclotron production of 99mTc or 94mTc includes the charged particle irradiation of an enriched molybdenum metal target to produce a technetium isotope, separation of the technetium isotope following irradiation of the molybdenum, re-claiming the molybdenum metal and reformation of the molybdenum target for a further irradiation step. This process may then be repeated. Separation of the technetium isotope preferably is achieved by oxidative dissolution of the molybdenum thereby removing it from a target support plate, and forming molybdate and pertechnetate. The technetium isotope is isolated by various means, such as the ABEC process. To reuse the molybdenum, additional steps of isolating the molybdate and reducing it back to molybdenum metal are required.

Abstract: The present invention relates to a food forming drum comprising a multitude of rows of cavities. The present invention further relates to the process of manufacturing the inventive drum.

Abstract: A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: A method for manufacturing a multilayer printed circuit board includes the step as follows: providing a glass wiring substrate, the glass wiring substrate comprising a first electrically conductive pattern, a glass base, and a second electrically conductive pattern, the second electrically conductive pattern comprising a plurality of first solder pads; laminating a first lamination substrate onto the glass wiring substrate, the first lamination substrate comprising a first base layer and a first electrically conductive material layer on the first base layer, such that the first base layer is sandwiched between the first electrically conductive pattern and the first electrically conductive material layer; patterning the first electrically conductive material layer to form a third electrically conductive pattern, and electrically connecting the third electrically conductive pattern to the first electrically conductive pattern, and forming a first solder mask on the glass wiring substrate, thereby obtaining a mu

Abstract: A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal carrier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Abstract: A method of increasing wear resistance of one or more part(s) of a rotating mechanism includes manufacturing the one or more part(s) with a portion thereof configured to be exposed to wear during fluid flow associated with the rotating mechanism having a dimension different from that of a desired dimension, applying a protective coating of an aluminum bronze alloy to the portion through welding deposition, and mechanically treating the protective coating. The method also includes applying one or more layer(s) of solid-alloy over the protective coating through electro-erosion deposition, and continuing the mechanical treatment of the protective coating and/or the one or more layer(s) of solid-alloy after the solid-alloy deposition to obtain the desired dimension of the portion.

Abstract: A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.

Abstract: A method of making a shaped electrical conductor (610, 630) includes providing a first sheet of metal (319) and applying a first and second thermoplastic adhesive pattern (311, 312) to a first and a second surface thereof. The second pattern is are fully justified with the applied first pattern. The first sheet is etched to remove metal not covered by the patterns so that no metal bridges remain between disconnected coated portions. A second sheet of metal (339) is provided and a third and fourth thermoplastic adhesive pattern (333, 334) is applied to a first and second surface thereof. The third and fourth patterns are fully justified. The second sheet is etched as for the first sheet. Contact regions (315, 335) in the second and third patterns are joined to form electrical contact between the first and second sheets.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A method of fabricating a part, for example a reinforcing edge for a turbomachine blade, the method including: making at least one fiber structure by three-dimensionally weaving metal yarns; and subjecting the fiber structure to hot isostatic pressing to cause the metal yarns to agglomerate so as to obtain a solid part. A composite solid part, for example a reinforcing edge for a turbomachine blade, includes a reinforcing structure of three-dimensionally woven ceramic fibers and a metal or metal alloy matrix.