Abstract: In providing electrical wire-like connections between at least one semiconductor die arranged on a semiconductor die mounting area of a substrate and an array of electrically-conductive leads in the substrate, pressure force is applied to the electrically-conductive leads in the substrate during bonding the wire-like connections to the electrically-conductive leads. Such a pressure force is applied to the electrically-conductive leads in the substrate via a pair of mutually co-operating force transmitting surfaces. These surfaces include a first convex surface engaging a second concave surface.

Abstract: An RFID device that can be connected to a piece of material, in particular, a piece of fabric (22), in an efficient manner and that is small and flexible is provided. A wire antenna (16) is coupled to an integrated circuit provided on a substrate (12) of the RFID device (10). The wire antenna (16) is attached to the substrate (12) by being laced with the substrate (12) via a pair of through holes. In this state, the wire antenna (16) is fixedly connected to the piece of material by heating a coating of the wire antenna (16), which coating includes a thermoset adhesive material. In this manner, the substrate (12) is connected to the piece of material via the wire antenna (16).

Abstract: A three-dimensionally laminated object modeling apparatus includes a cylinder configured to store a molten resin, a discharging nozzle that is communicated with the cylinder, and a piston configured to discharge the molten resin from the discharging nozzle by moving in a direction of approaching the discharging nozzle and by pressurizing the molten resin in the cylinder, and models a three-dimensionally modeled object by laminating a resin bead that is the molten resin discharged from the discharging nozzle on a table. It includes a drive device configured to relatively move the discharging nozzle with respect to the table and at least one processor configured to acquire a movement speed of the discharging nozzle and control movement of the piston based on the movement speed of the discharging nozzle.

Abstract: A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.

Abstract: Methods and systems are disclosed for apparel assembly using three-dimensional printing directly onto fabric apparel materials. Disclosed is a method and system for direct three-dimensional printing and assembly of an article of apparel, including designing a three-dimensional pattern for printing, positioning at least a portion of the article on a tray in a three-dimensional printing system, the portion being positioned substantially flat on the tray, printing a three-dimensional material directly onto the article using the designed pattern, curing the printed material, and removing the article from the three-dimensional printing system.

Abstract: A method for manufacturing a three-dimensional shaped object includes: a first step of forming a first portion of the three-dimensional shaped object by discharging a shaping material containing a resin from a discharge portion toward a stage or a previously formed layer and pressing the discharged shaping material against a tip end surface of the discharge portion; a heating step of heating the first portion to a temperature less than a glass transition temperature of the resin; and a second step of forming a second portion of the three-dimensional shaped object by discharging the shaping material from the discharge portion toward the first portion heated in the heating step and pressing the discharged shaping material against the tip end surface.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: A metallization structure electrically connected to a conductive bump is provided. The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad, and an under bump metallurgy covering the conductive via, wherein the conductive bump is disposed on the UBM. Furthermore, a package structure including the above-mentioned metallization structures is provided.

Abstract: A three-dimensional (3D) drawing pen can include a housing that has a port that permits insertion of a strand of material into the housing, an actuator for controlling a movement of the strand, and a nozzle assembly configured to permit the strand to be extruded out of the 3D drawing pen in a form that retains its shape against gravity in free space to draw a 3D object.

Abstract: It is an object to enable a non-destructive inspection of reliability of a bonding part and enabling an accurate inspection. A wedge tool includes: a groove which is formed along a direction of an ultrasonic vibration in a tip portion and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding.

Abstract: Implementations described herein are directed to forming objects including one or more layers of a polymeric material that include a magnetic material. The objects can be produced by forming one or more first layers that include a first polymeric material. The one or more first layers can be free of a magnetic material. Additionally, the object can be produced by forming one or more second layers that include a second polymeric material having a magnetic material. For example, the one or more second layers can include a polymeric material embedded with magnetic particles. The one or more first layers and the one or more second layers can be formed by extruding the first polymeric material and the second polymeric material onto a substrate according to a pattern. A magnetizing device can be used to magnetize the magnetic material included in the one or more second layers.

Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.

Abstract: A direct ink writing device and method for a bias-controllable continuous fiber reinforced composite material are provided. The device includes a cartridge fixed by an external device, a bottom of the cartridge is connected to a nozzle. A piston is arranged in the cartridge, the piston is provided with a chamber for containing sealing liquid and a capillary for a continuous fiber to pass through. The centers of an inner circumference and an outer circumference of the cartridge do not coincide with each other. The bias position of the continuous fiber in the composite material is achieved using the piston, and each filament of composite material is printed in steps of rotation, extrusion, revolution and curing. A structure produced according to the disclosure has high mechanical properties and outstanding intelligent properties, and the bias position of the continuous fiber material in the structure can be accurately adjusted.

Abstract: Examples described herein generally relate to wafer testing and structures implemented on a wafer for wafer testing. In an example method for testing a wafer, power is applied to a first pad in a test site (TS) region on the wafer. The TS region is electrically connected to a device under test (DUT) region on the wafer. The DUT region includes a DUT. The TS region and DUT region are in a first and second scribe line, respectively, on the wafer. A third scribe line is disposed on the wafer between the TS region and the DUT region. A signal is detected from a second pad in the TS region on the wafer. The signal is at least in part a response of the DUT to the power applied to the first pad.

Abstract: A system for producing pharmaceutical objects, such as tablets, granules and capsules, via 3D printing. The system comprises a 3D printing machine (2) with a mechanical system (3) movable in one or more directions, at least one print head (5) with a nozzle (37) being movable by the mechanical system and a base system (4) carrying a print base (6) for receiving a prepared mixture (27) applied by the print head (5). The system comprises at least one carrier (35) for holding a cartridge (28). Printing is done at formatted print locations (49) on the base (6). A method for producing pharmaceutical objects by providing at least one pharmaceutical substance in at least one cartridge, placing the cartridge in a carrier, establishing a fluid connection between a cartridge and a print head, moving the print head nozzle according to a program and dispensing the pharmaceutical substance to a print base.

Abstract: A system is disclosed for additively manufacturing a composite structure. The system may include a support, and a print head operatively connected to and moveable by the support. The print head may include a first supply configured to hold a liquid matrix, a second supply configured to hold a continuous reinforcement, and a wetting module configured to separately receive the liquid matrix and the continuous reinforcement from the first and second supplies, respectively, and to discharge a composite material including the continuous reinforcement wetted with the liquid matrix. The wetting module may include a body forming an internal chamber having an upstream open end and a downstream open end, an entrant nozzle disposed within the upstream open end and configured to receive the continuous reinforcement, and an exit nozzle disposed within the downstream closed end and configured to discharge the composite material.

Abstract: A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.

Abstract: A three-dimensional molding apparatus is provided and includes a reservoir portion, a nozzle portion, a liquid-sending unit, and a temperature control unit that correspond to each of the two or more different types of materials, a molding stage, a relative movement mechanism for moving the stage and the nozzle portions, and a control computer. By using this apparatus, industrial additive manufacturing with two or more different types of materials can be realized with high precision, and high-definition molded products in which different types of materials are arbitrarily combined can be produced.

Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.

Abstract: In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed V6 of the batch multiple lowering operation, an operation time T6 (min) of the ultrasonic vibration operation, and an adjustment gap length ?g among the initial heights are set to satisfy {T6<?g/V6}.

Abstract: A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.

Abstract: A method for manufacturing a semiconductor device includes (i) a step of preparing a first semiconductor chip having a first electrode pad thereon and a second semiconductor chip having a second electrode pad thereon and larger in thickness than the first semiconductor chip, the second electrode pad being larger in size than the first electrode pad, (ii) a step of mounting the first semiconductor chip and the second semiconductor chip on the same planarized surface of a substrate having a uniform thickness, (iii) a step of bonding a ball formed by heating and melting a bonding wire to the second electrode pad, (iv) a step of first-bonding the bonding wire to the first electrode pad, and (v) a step of second-bonding the bonding wire to the ball.

Abstract: A control device, method and device for applying at least one material to a substrate or a workpiece, an extruder, a 3D print head, a 3D printer and a machine tool, wherein the device includes a main body with an outlet for the materials, where the materials are fed through at least two access channels to the outlet and mixed and/or blended at this location, where a rotational movement of the main body with respect to the substrate or the workpiece causes the materials to blend in a manner analogous to a double helix or a plait such that mixing/blending of the materials is advantageously improved, and where if applied to a 3D printing process, then either the workpiece rotates about an axis of rotation that extends through the outlet of the main body, or the main body and consequently the outlet itself rotates.

Abstract: A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.

Abstract: The reliability of semiconductor device is improved. The method of manufacturing a semiconductor device has a step of performing plasma treatment prior to the wire bonding step, and the surface roughness of the pads after the plasma treatment step is equal to or less than 3.3 nm.

Abstract: A system may include a controller configured to determine a user interface status, wherein the user interface status includes user interaction of a user interface. The controller may also be configured to determine a drive mechanism location relative to a first limit and a second limit and select a clutching location based on the user interface status and drive mechanism location.

Abstract: A semiconductor package including an organic interposer includes: a semiconductor chip; a connection member on the semiconductor chip and including a pad layer, a redistribution layer, and an insulating layer; a bonding member between the semiconductor chip and the pad layer; a surface treatment layer on the pad layer and including at least one metal layer; and an under-bump metallurgy (UBM) layer embedded in the connection member. The UBM layer includes a UBM pad, at least one plating layer on the UBM pad, and a UBM via. The surface treatment layer is disposed only on one surface of the pad layer, the plating layer are is disposed only on one surface of the UBM pad, and at least a portion of a side surface of the plating layer is spaced apart from a side surface of the insulating layer surrounding the plating layer.

Abstract: A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

Abstract: A semiconductor chip package includes a substrate; a semiconductor die mounted on the substrate, wherein the semiconductor die comprises a bond pad disposed on an active surface of the semiconductor die, and a passivation layer covering perimeter of the bond pad, wherein a bond pad opening in the passivation layer exposes a central area of the bond pad; a conductive paste post printed on the exposed central area of the bond pad; and a bonding wire secured to a top surface of the conductive paste post. The conductive paste post comprises copper paste.

Abstract: A semiconductor device is provided to reduce thermal fatigue in a junction portion of an external wiring to enhance long-term reliability, where the semiconductor device includes a semiconductor substrate, a transistor portion and a diode portion that are alternately arranged along a first direction parallel to a front surface of the semiconductor substrate inside the semiconductor substrate, a surface electrode that is provided above the transistor portion and the diode portion and that is electrically connected to the transistor portion and the diode portion, an external wiring that is joined to the surface electrode and that has a contact width with the surface electrode in the first direction, the contact width being larger than at least one of a width of the transistor portion in the first direction and a width of the diode portion in the first direction.

Abstract: A method for manufacturing a semiconductor device includes forming a first metal layer above a substrate of a semiconductor chip, forming a nickel layer on the first metal layer, performing a first cleaning treatment on the nickel layer with diluted hydrochloric acid having a concentration of less than 1% by weight, forming a gold layer on the nickel layer, and connecting a bonding wire to a surface of the gold layer.

Abstract: An electrical interconnection includes a wire loop having a first end bonded to a first bonding site using a first bonding portion, and a second end bonded to a second bonding site using a second bonding portion. The second bonding portion includes a folded portion having a wire that extends from the second end of the wire loop and is folded on the second bonding site. The folded portion includes a first folded portion connected to the second end of the wire loop and extending toward the first bonding site, a second folded portion provided on the first folded portion, and a tail protruding from a portion of the second folded portion. An interface is formed between the first and second folded portions. A top surface of the second folded portion includes an inclined surface recessed toward the first folded portion.

Abstract: According to one aspect, embodiments herein provide a 3-D printer comprising a composite filament supply, a build platen, a print head comprising a composite filament ironing tip and a heater, a plurality of actuators that move the print head and the build platen relative to one another in three degrees of freedom at a printing rate, at least one linear feed mechanism that advances the composite filament at a feed rate and drives the composite filament into the print head to deposit the composite filament, and a controller configured to operate the heater to heat the composite filament ironing tip to flow matrix material among axial fiber strands within the composite filament and operate the plurality of actuators to press the composite filament ironing tip against the composite filament and reshape the composite filament against one of the build platen and a composite filament previously deposited upon the build platen.

Abstract: An additive elastomeric manufactured part having an elongation at break of at least 50% may be made by a method comprising the following. A material comprising a prepolymer and filler is first dispensed through a nozzle to form an extrudate deposited on a base. The base, nozzle or combination thereof is moved while dispensing the material so that there is horizontal displacement between the base and nozzle in a predetermined pattern to form an initial layer of the material on the base. Subsequent layers are then formed on the initial layer by repeating the dispensing and movement on top of the initial layer and layers that follow.

Abstract: Provided is a 3D printer which can use pellets of various materials and produce a large molded object without requiring an inactive gas. The printer is equipped with: an extrusion apparatus, having a nozzle provided on a lower end side of a cylinder, a screw arranged in the cylinder and controllably rotated by a screw motor, a gear pump provided on a tip side of the screw and controllably rotated by a gear pump motor, a heater for heating an inside of the cylinder, and a hopper for supplying a resin material into the cylinder; a table apparatus positioned facing the nozzle of the extrusion apparatus; and a control apparatus for controlling discharge of a resin from the nozzle of the extrusion apparatus, and for controlling a movement of the extrusion apparatus and/or the table apparatus in X-axis, Y-axis, and Z-axis directions with respect to a reference plane.

Abstract: A linear motor for short strokes includes a primary section including a coil brace and coils disposed in it, as well as a secondary section that is movable relative to the primary section and has magnet holders with magnets placed on both sides of the coil brace. Spacers separate the magnet holders from each other such that the coil brace is movable between the two magnet holders. The spacers are guided through openings in the primary section.

Abstract: In one embodiment, an additive manufacturing method including the steps of positioning a removable surface on a worktable; applying an adhesive material to the removable surface; depositing a plurality of pellets into the adhesive material, wherein at least a portion of each pellet of the plurality of pellets remains exposed; and depositing a flowable material on at least some of the plurality of pellets.

Abstract: Printing devices and methods are provided that utilize high throughput extrusion to generate a printer material, such as a three-dimensional object. High-throughput extrusion systems as provided volumetrically pre-heat an extruded filament to a desired pre-heat temperature, and then either maintain or heat the extruded filament to a desired melt temperature prior to having the filament extruded out of the system and onto a surface, such as a build platform. By pre-heating the filament prior to heating it to the temperature at which it is excluded, it helps increase the throughput of the system. Likewise, by doing the heating volumetrically, it further helps increase the throughput of the system. Various embodiments of devices and methods typically used for printing in conjunction with the disclosed high throughput systems are also provided.

Abstract: 3D printers include a feed stepper motor coupled to an extruder, a platen positioned adjacent the extruder, a platen support coupled to a platen lifter, and directional stepper motors, wherein the extruder comprises an air scoop, extruder nozzle and heater, wherein the heater is positioned to heat the extruder nozzle and air to provide heated air and the air scoop is configured and positioned to route the heated air which is emitted adjacent the extruder nozzle directly onto the surface of a workpiece positioned on the platen. A feed stepper motor may include a hollow bore motor shaft. A substrate made of the same material being extruded may be provided. A method of 3D printing employs such a substrate.

Abstract: Systems and methods of simulating a physical bond layer comprising a composite material and predicting one or more properties of the composite material are disclosed. A method includes obtaining one or more X-ray images of a bulk physical sample of a composite material, the one or more X-ray images including one or more visual identifiers that correspond to one or more materials present in the bulk physical sample, and generating a three dimensional image of the bulk physical sample from the one or more X-ray images. The three dimensional image includes one or more labels indicating the presence and location of the one or more materials. The method further includes creating a meshed three dimensional microstructure-based model from the three dimensional image and simulating a physical bond layer with the meshed three dimensional microstructure-based model. The meshed three dimensional microstructure-based model incorporates data obtained from the one or more labels.

Abstract: A barrel for use in an additive manufacturing machine is disclosed. The barrel includes a sleeve extending along a longitudinal axis. A conduit extends along the longitudinal axis through the sleeve. The conduit is movable relative to the sleeve along the longitudinal axis between a first position and a second position. A nozzle is associated with the conduit. The nozzle is movable with the conduit relative to the sleeve between the first position and the second position.

Abstract: A semiconductor device may comprise a semiconductor die comprising an active surface and contact pads disposed. Conductive interconnects comprising first ends may be coupled to the contact pads and second ends may be disposed opposite the first ends. An encapsulant may comprise a planar surface disposed over the active surface of the semiconductor die. The planar surface may be offset from the second surface of the conductive interconnects by a distance greater than or equal to 1 micrometer. A build-up interconnect layer may be disposed over the planar surface and extend into the openings to electrically connect with the conductive interconnects. A method of making the semiconductor device may further comprise grinding a surface of the encapsulant to form the planar surface and the conductive residue across the planar surface. The conductive residue may be etched to remove the conductive residue and to reduce a height of the conductive interconnects.

Abstract: A packaged multichip device includes a first IC die with an isolation capacitor utilizing a top metal layer as its top plate and a lower metal layer as its bottom plate. A second IC die has a second isolation capacitor utilizing its top metal layer as its top plate and a lower metal layer as its bottom plate. A first bondwire end is coupled to one top plate and a second bondwire end is coupled to the other top plate. The second bondwire end includes a stitch bond including a wire approach angle not normal to the top plate it is bonded to and is placed so that the stitch bond's center is positioned at least 5% further from an edge of this top plate on a bondwire crossover side compared to a distance of the stitch bond's center from the side opposite the bondwire crossover side.

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: The invention relates to a device for welding rod-shaped conductors (14), comprising a compression chamber for receiving joining sections (13) of the conductors to be joined together, the compression chamber being limited in a first axial direction (z-axis) on two opposite sides by an active surface of a sonotrode (16) transmitting ultrasonic vibrations in the direction of the z-axis and by a counter surface of a counter electrode (18), the device having a knife device which is provided with a drive device and comprises a knife (24) movable in the direction of the z-axis, said knife having a cutting edge which can be moved past the compression chamber, wherein a drive motor of the drive device is arranged in an installation space arranged below the sonotrode, the drive motor being connected to a knife holder (26) via a deflection gear (31) in order for the knife to be able to perform a cutting motion, the knife being moveable in the direction of the z-axis.

Abstract: A system may include a controller configured to determine a user interface status, wherein the user interface status includes user interaction of a user interface. The controller may also be configured to determine a drive mechanism location relative to a first limit and a second limit and select a clutching location based on the user interface status and drive mechanism location.

Abstract: A method for manufacturing a light-emitting device includes: a first connecting step of forming a ball portion of the wire joined to a first connecting point on a light emitting element; a first transferring step of transferring the capillary to a first point located in a +Z direction above the first connecting point; a second transferring step of transferring the capillary from the first point to a second point located in a ?X direction opposite from a second connecting point on the substrate; a third transferring step of transferring the capillary from the second point to a third point located in a +X direction beyond the second connecting point and in the +Z direction above the second connecting point; a second connecting step of transferring the capillary and joining the wire to the second connecting point; and forming an encapsulating member to encapsulate the wire.

Abstract: Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant. The redistribution structure is electrically coupled to the integrated circuit die. The redistribution structure includes a first dielectric layer on at least the encapsulant, a metallization pattern on the first dielectric layer, a metal oxide layered structure on the metallization pattern, and a second dielectric layer on the first dielectric layer and the metallization pattern. The metal oxide layered structure includes a metal oxide layer having a ratio of metal atoms to oxygen atoms that is substantially 1:1, and a thickness of the metal oxide layered structure is at least 50 ?. The second dielectric layer is a photo-sensitive material. The metal oxide layered structure is disposed between the metallization pattern and the second dielectric layer.

Abstract: A window clamp includes a center portion, side portions, and flexible members. The side portions are arranged on opposing sides of the center portion. The flexible members extend between the side portions and the center portion. The flexible members allow movement of the center portion in X, Y, and Z directions independent of movement of the side portions.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.