Chemical Deposition Patents (Class 228/209)
  • Patent number: 9194025
    Abstract: A method of manufacturing a sintered silver alloy body of the present invention includes steps of adding copper oxide to a silver-containing clay-like composition that contains silver-containing metal powder containing silver, a binder, and water to manufacture a clay-like composition for forming a sintered silver alloy body; making an object by making the clay-like composition for forming a sintered silver alloy body into an arbitrary shape; and baking the object in a reduction atmosphere or a non-oxidizing atmosphere after the object is dried.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: November 24, 2015
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takashi Yamaji, Yasuo Ido, Shinji Otani
  • Patent number: 8492005
    Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: July 23, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
  • Patent number: 8448842
    Abstract: An advanced copper bonding with ceramic substrate technology includes the steps of (1) forming a copper film of thickness <1 ?m on a ceramic substrate by sputtering deposition under 1.33×10?3 torr and 150° C., (2) plating a copper layer of thickness 10˜50 ?m at room temperature, and (3) bonding a copper foil to the ceramic substrate by diffusion bonding under environments of high temperature, vacuum, and negative pressure inertia gas or H2 partial pressure.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: May 28, 2013
    Assignee: Vaclong Vacuum Technology Co., Ltd.
    Inventor: Rong-Fu Wu
  • Patent number: 8226750
    Abstract: A hydrogen purifier utilizing a hydrogen-permeable membrane to purify hydrogen from mixed gases containing hydrogen is disclosed. Improved mechanical support for the permeable membrane is described, enabling forward or reverse differential pressurization of the membrane, which further stabilizes the membrane from wrinkling upon hydrogen uptake.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: July 24, 2012
    Assignee: Genesis Fueltech, Inc.
    Inventor: Peter David DeVries
  • Patent number: 8179690
    Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: May 15, 2012
    Assignee: Askey Computer Corp.
    Inventors: Hsiang-Chih Ni, Ching-Feng Hsieh
  • Publication number: 20120048914
    Abstract: A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface of the core layer, a solder resist layer including opening portions and formed on an outermost surface of the at least one laminated layer such that respective portions of an outermost conductor layer are exposed from the opening portions; forming a Sn-containing underlying layer on the respective portions of the outermost conductor layer by a plating process; and fusing the Sn-containing underlying layer to the respective portions of the outermost conductor layer by a heating process, then mounting solder balls directly on respective portions of the Sn-containing underlying layer, and then connecting the solder balls to the respective portions of the Sn-containing underlying layers.
    Type: Application
    Filed: August 24, 2011
    Publication date: March 1, 2012
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Takahiro HAYASHI, Satoru WATANABE, Hajime SAIKI, Koji SAKUMA
  • Patent number: 8110022
    Abstract: A hydrogen purifier utilizing a hydrogen permeable membrane, and a gas-tight seal, where the seal is uses a low temperature melting point metal, which upon heating above the melting point subsequently forms a seal alloy with adjacent metals, where the alloy has a melting point above the operational temperature of the purifier. The purifier further is constructed such that a degree of isolation exists between the metal that melts to form the seal and the active area of the purifier membrane, so that the active area of the purifier membrane is not corrupted. A method of forming a hydrogen purifier utilizing a hydrogen permeable membrane with a seal of the same type is also disclosed.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: February 7, 2012
    Assignee: Genesis Fueltech, Inc.
    Inventor: Peter David DeVries
  • Patent number: 7875129
    Abstract: A method of assembling aluminum alloy products, such as sheets, strips or tubes, by means of fluxless brazing, where the absence of flux is made possible by using a prior treatment resulting in formation of a conversion layer on the surface of the products. The treatment involves using a solution containing K+ and F? ions and at least one acid in a quantity such that the pH of the solution is less than 3. The inventive method enables effective flux was brazing in industrial conditions, such as a for the production of heat exchangers used in motor vehicles.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: January 25, 2011
    Assignee: Alcan Rhenalu
    Inventors: Sylvestre Safrany, Michel Mediouni, Sylvain Henry, Sandrine Dulac
  • Publication number: 20100187560
    Abstract: A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to each other; heating the bodies placed adjacent to each other to a temperature which lies in a target range below the melting point of the metal and above the eutectic temperature of the eutectic of the metal and the metal oxide; and holding the temperature within the target range over a predetermined or a controllable duration of time.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 29, 2010
    Applicant: PERKIN ELMER OPTOELECTRONICS GMBH & CO. KG
    Inventors: Ulrich Traupe, Stefan Weise, Pellegrino Ballacchino, Edgar Spandl
  • Publication number: 20100012708
    Abstract: Oilfield tools, assemblies and methods of manufacturing same are described comprising a modified-soldered electronic component, wherein the modified-solder includes a high-melting metal matrix and from about 0.1 to about 20 weight percent, based on total weight of the modified solder, of a strength-reinforcing additive dispersed in the metal matrix, the additive comprising a polyhedral oligomeric silsesquioxane. Methods of using the oilfield tools and assemblies in oilfield operations are also described.
    Type: Application
    Filed: July 16, 2008
    Publication date: January 21, 2010
    Applicant: Schlumberger Technology Corporation
    Inventors: Rejanah Steward, Glen Schilling, Manuel Marya, Nitin Vaidya, Anthony Collins, Mark Kostinovsky
  • Publication number: 20090130478
    Abstract: The invention relates to a method of producing and joining superalloy balls by means of brazing and to objects produced with such joints. According to the invention, an alloy powder covered with a brazing solder is bonded to a spherical core and subsequently transformed into a continuous alloy layer by means of brazing.
    Type: Application
    Filed: July 7, 2006
    Publication date: May 21, 2009
    Inventors: Myriam Douin, Marie-Pierre Bacos, Alexandra Boyer, Aurelie Gregoire, Pierre Josso, Sebastien Mercier, Ariel Moriel, Jason Nadler, Serge Naveos, Catherine Rio
  • Publication number: 20090127319
    Abstract: A method for soldering a magnesium alloy workpiece is provided. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt % of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
    Type: Application
    Filed: May 20, 2008
    Publication date: May 21, 2009
    Inventor: Climent Ho
  • Publication number: 20090050470
    Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.
    Type: Application
    Filed: October 30, 2008
    Publication date: February 26, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tao-Chih Chang, Chiao-Yun Chang, Shan-Pu Yu
  • Patent number: 7267259
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: September 11, 2007
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Patent number: 7134199
    Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: November 14, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen, Wen-Chang Kuo, Yue-Ying Jian
  • Patent number: 7056597
    Abstract: Disclosed is a brazing sheet product comprising a core metal sheet, on at least one side of the core sheet a clad layer of an aluminium brazing alloy comprising silicon in an amount in the range of 4 to 14% by weight, and further comprising on at least one outersurface of the clad layer a coated layer of iron-X alloy, wherein X is selected from one or more members of the group consisting of tin, zinc, manganese, and copper, and such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and having a composition with the proviso that the mol-ratio of Fe:X is in the range of 10:(0.3 to 6). The invention also relates to a method of manufacturing such a brazing product, and to a brazed assembly comprising at least one component made of this brazing product.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: June 6, 2006
    Assignee: Corus Aluminium Walzprodukte GmbH
    Inventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg
  • Patent number: 6923875
    Abstract: According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: August 2, 2005
    Assignee: Harima Chemicals, Inc.
    Inventors: Kazuki Ikeda, Hiroshi Tanaka, Hisao Irie, Keigo Obata, Takao Takeuchi, Naoya Inoue
  • Patent number: 6905587
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: June 14, 2005
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Patent number: 6814276
    Abstract: A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Zn, placing the solder material in contact with the barrier metal layer while the solder material is in a molten state, and solidifying the solder material. Thus, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Zn-based material, the degradation of a soldering part is avoided, Consequently, a sufficient thermal fatigue strength of the soldering part is obtained.
    Type: Grant
    Filed: December 24, 2002
    Date of Patent: November 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Atsushi Yamaguchi
  • Patent number: 6783867
    Abstract: A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. and consists mainly of at least one selected from among Ni, Cu and Fe, are provided on an AlN substrate material in this order on the AlN substrate material, and a conductor layer consisting mainly of copper is directly bonded to the intervening metal layer without intervention of a solder material layer. A semiconductor element or the like is mounted on the member for a semiconductor device, thereby fabricating a semiconductor device. The high melting point metallizing layer is formed on an aluminum nitride substrate by post-fire or co-fire metallization.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: August 31, 2004
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazutaka Sasaki, Hirohiko Nakata, Akira Sasame, Mitsunori Kobayashi
  • Patent number: 6783056
    Abstract: Fluoride-based flux is uniformly dispersed in and mixed with synthetic resin, which has fluidity at room temperature and sublimes at a temperature lower than a brazing temperature, so as to constitute 40 to 70 wt. % of the mixture, thereby producing coating material. This coating material is applied to coating belts which undergo rotation and is transferred from the coating belts to the surface of the aluminum material. The coating material has high viscosity and stably adheres to the transferred areas.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: August 31, 2004
    Assignee: Calsonic Kansei Corporation
    Inventors: Makoto Kouno, Ryoji Matsunami, Tatsuya Fujiyoshi
  • Patent number: 6779711
    Abstract: A self-aligned process for fabricating a corrosion-resistant conductive pad on a substrate, and a structure that includes an interconnect to allow a terminal connection to the pad. The process generates a metallic layer on an initially exposed metal layer. The metallic layer is electrically conductive and corrosion resistant. The process includes providing a substrate having a metal layer with an exposed surface, depositing a second metal layer on the exposed surface, annealing the substrate to alloy a portion of the metal layer that includes the exposed surface and a portion of the second metal layer, and removing the unalloyed portion of the second metal layer. An alternative process includes providing a metal layer on the substrate, and electroless plating a corrosion-resistant metal or alloy on the metal layer. The alternative process may additionally include electroless plating a second corrosion-resistant metal on the corrosion-resistant metal or alloy.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: August 24, 2004
    Assignee: International Business Machines Corporation
    Inventors: Daniel C. Edelstein, Anthony K. Stamper, Judith M. Rubino, Carlos J. Sambucetti
  • Patent number: 6691912
    Abstract: A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (“Through holes” as used herein refers both to through holes and to vias.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: February 17, 2004
    Assignee: Electrochemicals, Inc.
    Inventors: Michael V. Carano, Frank Polakovic
  • Publication number: 20040016794
    Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.
    Type: Application
    Filed: July 25, 2002
    Publication date: January 29, 2004
    Applicant: International Business Machines Corporation
    Inventors: Timothy A. Gosselin, Donald I. Mead
  • Publication number: 20040000580
    Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Yeng-Ming Chen, Kai-Ming Ching, Li-Chih Chen, Hao-Chih Tien
  • Patent number: 6613397
    Abstract: In a method for manufacturing an Al clad product, first, cladding material is fused and coated on base material having Al. Then, slurry material is coated on the cladding material coated on the base material, the slurry material including mixture of a flux powder, a resin binder powder and a diluent. Thereafter, the slurry material is hardened to thereby provide a hardened product including the base material, the cladding material and hardened slurry material. In a subsequent step, the hardened product is brazed to thereby provide an Al clad product, wherein the diluent included in the slurry material is gasified in the hardening process of the slurry material and the cladding material is fused by employing an arc discharge technique.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: September 2, 2003
    Assignee: Mando Climate Control Corporation
    Inventor: Seung Taek Oh
  • Patent number: 6575355
    Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: June 10, 2003
    Assignee: McGraw-Edison Company
    Inventors: Michael M. Ramarge, David P. Bailey, Thomas C. Hartman
  • Patent number: 6572010
    Abstract: An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: June 3, 2003
    Assignee: Applied Materials Inc.
    Inventors: Yezdi N. Dordi, Robin Cheung
  • Patent number: 6474536
    Abstract: A new soldering flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards is disclosed. The new flux composition includes chemical reducing agents such as hydrazine, hydroxylamine, dimethylamine borane, and hydroquinone.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: November 5, 2002
    Inventor: Peter Kukanskis
  • Patent number: 6428911
    Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: August 6, 2002
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Masakazu Takesue, Tadaaki Shono, Motoko Fujioka
  • Patent number: 6375822
    Abstract: A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprises an organic heterocyclic mercapto compound and most preferably an alkali metal hydroxide.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: April 23, 2002
    Inventor: Lev Taytsas
  • Patent number: 6317913
    Abstract: The present invention is directed to a means for the surface preparation of a metal or metal alloy substrate. In the process of the present invention, a stream of a mixture of flux particles and metal particles is hurled at the substrate at velocities effective for flux adhesion to the surface. The velocities of the particle stream is adjusted so that the flux particles adhere to the surface and the metal particles bounce off the surface. At higher temperatures and velocities, the metal particles are co-deposited with the flux.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: November 20, 2001
    Assignee: Alcoa Inc.
    Inventors: Raymond J. Kilmer, John B. Eye
  • Publication number: 20010023888
    Abstract: The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no generation of particles or dust, and superior resistance is provided to fluorine system gases.
    Type: Application
    Filed: December 27, 2000
    Publication date: September 27, 2001
    Applicant: Tadahiro OHMI and KABUSHIKI KAISHA ULTRACLEAN TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tadahiro Ohmi, Takahisa Nitta, Yasuyuki Shirai, Osamu Nakamura
  • Patent number: 6283360
    Abstract: The present invention relates to a composition for preventing creeping of a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment. The present invention provides a composition for preventing creeping of a flux for soldering, consisting of a composition comprising a polymer containing polymer units of an unsaturated ester containing a polyfluoroalkyl group, a fluorine-type surfactant and an aqueous medium. Further, the present invention provides a method for soldering by means of the composition. Furthermore, the present invention provides an electronic part or printed board soldered by the method. Still further, the present invention provides an electric appliance employing such an electronic part or printed board.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: September 4, 2001
    Assignee: Seimi Chemical Co., Ltd.
    Inventors: Seisaku Kumai, Yutaka Fukatsu, Shunji Odaka
  • Patent number: 6234379
    Abstract: A method for attaching a semiconductor die or flip chip to a substrate to form a printed circuit board. A dispensing apparatus is spaced away from a substrate so that the dispenser does not contact the substrate. Droplets of no-flow flux and underfill material are dispensed from the dispensing apparatus onto a substrate. A flip chip with an array of solder balls or bumps on its underside is push through the material until it contacts the substrate. The flip chip and the substrate are heated sufficiently to form mechanical and electrical connections therebetween. The method of the present invention can apply the no-flow flux and underfill material in a predetermined pattern. Furthermore, the predetermined pattern of droplets can be tailored to also include a desired topography. That is, the height of the no-flow flux and underfill material can vary relative to the substantially flat surface of the substrate.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: May 22, 2001
    Assignee: Nordson Corporation
    Inventor: William E. Donges
  • Patent number: 6204490
    Abstract: Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: March 20, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Toshiharu Ishida, Tetsuya Nakatsuka, Hanae Shimokawa, Koji Serizawa, Yasuo Amano, Suguru Sakaguchi, Hiroshi Yamaguchi
  • Patent number: 6073829
    Abstract: The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention is also related to a method of attaching a component (11) to the surface of a circuit card (15) using bumps. In accordance with the invention, bumps are formed from preforms (13a) made from a flexible material, which preforms (13a) are metallized (13b) over their entire surface. The bump (13a, 13b) is attached to the attachment pads (12a, 16a) of the component (11) and the circuit card (15) by means of metallizations (12b, 13b, 16b) between the attachment pads and the bump. The bond is formed metallurgically by transfusion. The surface of the bonding side of the component (11) is coated with an insulating material (14) before the mentioned bonding elsewhere than at the attachment pads (12).
    Type: Grant
    Filed: February 26, 1998
    Date of Patent: June 13, 2000
    Assignee: Nokia Mobile Phones Limited
    Inventor: Seppo Pienimaa
  • Patent number: 5967400
    Abstract: The method provides a process for fabricating metal matrix composites. First the process coats the fibers with nickel by electrodeposition or gaseous deposition to form nickel-coated fibers. Over-plating the nickel-coated fibers with aluminum by either electrodeposition in a non-aqueous electrolyte or gaseous deposition forms aluminum-coated-nickel-coated fibers. Sintering this product under compression, perpendicular to the fiber's central axis, forms the final metal matrix composite. The metal matrix composite has a nickel-aluminum matrix, very few voids and extended unbroken lengths of fibers within the nickel-aluminum matrix.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: October 19, 1999
    Assignee: Inco Limited
    Inventors: James Alexander Evert Bell, Kirt Kenneth Cushnie, Anthony Edward Moline Warner, George Clayton Hansen
  • Patent number: 5960251
    Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: September 28, 1999
    Assignee: International Business Machines Corporation
    Inventors: Vista A. Brusic, Vijay S. Darekar, Michael A. Gaynes, Ravi F. Saraf
  • Patent number: 5759379
    Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: June 2, 1998
    Assignee: International Business Machines Corporation
    Inventors: Pietro Luigi Cavallotti, Adelio Monzani, Vittorio Sirtori, Giovanni Zangari
  • Patent number: 5672261
    Abstract: A method for preparing a Ni base superalloy inner wall surface of a body open end, such as an end of a turbomachinery blade, and an end plate, such as a blade tip cap, for brazing together at a rim of the end plate includes electrochemically removing oxides from the inner wall surface. The end plate is prepared, at least at its rim, by first removing surface and subsurface oxides, for example by mechanical abrading or a combination of such abrading and acid cleaning. Then at least the rim is electroplated with Ni which is heated to diffuse the Ni into the rim substrate. This provides an improved combination of surfaces for brazing for example with a Ni base brazing alloy. After brazing the rim to the inner wall, there is provided an article with an improved relatively low oxide brazed joint, including less than about 20 volume % oxides, and a plate rim of substantially Ni along with elements diffused from the brazing alloy and the rim.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: September 30, 1997
    Assignee: General Electric Company
    Inventors: Gary E. Wheat, Robert E. McCracken, Nicholas C. Palmer
  • Patent number: 5626279
    Abstract: For fastening a first substrate (11) on a second substrate (21), gallium is selectively deposited on the surface of electrically conductive structures (18) located on the first substrate (11), being deposited in a CVD process upon employment of a metalloorganic compound. After the joining of the substrates (11, 21), the gallium (19) is mixed with a metal (28) that forms a refractory intermetallic phase with gallium, this forming a firm connection between the substrates. The method can be especially utilized for cubic integration.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: May 6, 1997
    Assignee: Siemens Aktiengesellschaft
    Inventors: Werner Pamler, Siegfried Schwarzl
  • Patent number: 5601228
    Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
    Type: Grant
    Filed: August 2, 1995
    Date of Patent: February 11, 1997
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Takao Fukunaga, Kazuhito Higasa, Hirokazu Shiroishi, Seishi Kumamoto, Takahiro Fujiwara, Noriko Katayama
  • Patent number: 5411199
    Abstract: A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).
    Type: Grant
    Filed: March 7, 1994
    Date of Patent: May 2, 1995
    Assignee: Motorola, Inc.
    Inventors: Anthony J. Suppelsa, Robert F. Darveaux, Thomas A. Goodwin, Julio Abdala, Henry F. Liebman
  • Patent number: 5402926
    Abstract: A method of brazing a plurality of components by heating the components superposed on each other with a brazing material interposed between adjacent bonding surfaces of the components, wherein the brazing material has a relatively low degree of wettability with respect to the material of the components to be brazed, and is applied to a patterned film of a high-wettability metal having a relatively high degree of wettability with respect to the brazing material, which film is formed on at least one of bonding surfaces of the components, so as to cover predetermined areas of the bonding surface while leaving adjacent non-bonding areas of the bonding surface uncovered so as to restrict the flow of brazing material.
    Type: Grant
    Filed: September 28, 1993
    Date of Patent: April 4, 1995
    Assignee: NGK Insulators, Ltd.
    Inventors: Yukihisa Takeuchi, Natsumi Shimogawa, Nobuo Takahashi
  • Patent number: 5318217
    Abstract: In a method of making a load-bearing article by spray casting a molten metal onto a metal substrate, the substrate surface receiving the spray cast deposit is treated by vacuum cleaning, boronizing and/or knurling to enhance the structural integrity of the diffusion bond joint subsequently formed between the spray cast deposit and the substrate in sustaining a load across the joint without premature joint failure.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: June 7, 1994
    Assignee: Howmet Corporation
    Inventors: Jonathan S. Stinson, Kim E. Bowen
  • Patent number: 5275328
    Abstract: This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).
    Type: Grant
    Filed: October 21, 1992
    Date of Patent: January 4, 1994
    Assignee: GEC-Marconi Limited
    Inventors: Lodge, Kevin J., Kevin Bass, Elizabeth A. Logan
  • Patent number: 5253797
    Abstract: A thin layer of silver metal is formed between a molybdenum surface and a eel surface. The silver metal layer is diffusion bonded to the molybdenum surface and diffusion bonded to the steel surface, thus bonding the molybdenum and steel surfaces together.
    Type: Grant
    Filed: July 21, 1992
    Date of Patent: October 19, 1993
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: William A. Ferrando, Subhash D. Karmarkar, Scott M. Hoover, Amarnath P. Divecha
  • Patent number: 5209388
    Abstract: A diffusion bonding process for bonding one rhenium-coated carbonaceous body to another. The rhenium-coat surfaces 18,20 of the bodies are coated with ruthenium, and the bodies are diffusion bonded at the interface formed by adjoining ruthenium coats 22,24.
    Type: Grant
    Filed: September 26, 1991
    Date of Patent: May 11, 1993
    Assignee: Allied-Signal Inc.
    Inventors: Donald L. Mittendorf, Gary A. West
  • Patent number: RE45297
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: December 23, 2014
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson