Abstract: The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.

Abstract: A method for processing a wafer includes subjecting the wafer to a reduction treatment with heat and a reducing agent that has a melting point of lower than 600° C. The wafer is made of a material selected from the group consisting of lithium tantalate, lithium niobate, and a combination thereof. The wafer and the reducing agent are spaced apart from each other so that the reducing agent indirectly interacts with the wafer during the reduction treatment. Also disclosed is a processed wafer obtained by the method.

Abstract: An aluminum alloy material comprises: Si: less than 0.2 mass %, Fe: 0.1 to 0.3 mass %, Cu: 1.0 to 2.5 mass %, Mn: 1.0 to 1.6 mass %, and Mg: 0.1 to 1.0 mass %, the balance being Al and incidental impurities. A number density of Al—Mn compound having a circle equivalent diameter of not less than 0.1 ?m is not less than 1.0×105 mm?2, and a number density of Al2Cu having a circle equivalent diameter of not less than 0.1 ?m is not more than 1.0×105 mm?2.

Abstract: A solder scattering is prevented at the time of reflow and the oxide films formed on the surfaces of solder or electrodes are thoroughly removed. The soldering method according to the present invention contains the steps of: applying solder paste to the electrode on a printed circuit board and mounting an electronic part on the solder paste, volatilizing the residue-free flux contained in the solder paste by heating the printed circuit board in a chamber set to be a vacuum state and approximately 180 degree C. at the time of pre-heating (interval A), removing oxide films formed on the electrode and the like by heating the printed circuit board in the chamber set to be a formic acid atmospheric state and the temperature of approximately 200 degree C. at the time of reducing (interval B), and melting solder powder contained in the solder paste by heating the printed circuit board in the chamber set to be a vacuum state and the temperature of 250 degree C. at the time of main heating (interval C).

Abstract: A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.

Abstract: Systems and methods are provided for a boss welding positioning tool. The boss welding positioning tool may, at least, include a purge base, a purge gas delivery connector, and features for aligning two items to be welded together. The purge gas delivery connector may be configured to be coupled to the purge base and may include ports that receive purge gas and deliver purge gas to an inner portion of the items to be welded.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: A solder joint layer has a structure in which plural fine-grained second crystal sections (22) precipitate at crystal grain boundaries between first crystal sections (21) dispersed in a matrix. The first crystal sections (21) are Sn crystal grains containing tin and antimony in a predetermined proportion. The second crystal sections (22) are made up of a first portion containing a predetermined proportion of Ag atoms with respect to Sn atoms, or a second portion containing a predetermined proportion of Cu atoms with respect to Sn atoms, or both. The solder joint layer may have third crystal sections (23) which are crystal grains that contain a predetermined proportion of Sb atoms with respect to Sn atoms. As a result, solder joining is enabled at a low melting point, and a highly reliable solder joint layer having a substantially uniform metal structure can be formed.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: Embodiments herein may relate to a solder paste. The solder paste may include a solder powder and a flux. In embodiments, the flux may be a non-rosin based flux. The flux may further include a thixotropic agent (TA) that may be a non-polymer based TA. Other embodiments may be described and/or claimed.

Abstract: A welding method includes inserting a weldable object at least partially into a through-bore formed in a generally tubular body, the tubular body having an interior flow passageway and an outer surface, and the through-bore having a borehole wall; transmitting inert gas between the weldable object and the borehole wall, the gas being transmitted through the through-bore; and welding the weldable object to the tubular body while the inert gas is being transmitted.

Abstract: In order to enable a satisfactory fluxless brazing without needing flux or vacuum facilities, a brazing object including an aluminum alloy material provided with an Al—Si—Mg brazing filler metal is joined by the Al—Si—Mg brazing filler metal without the use of flux by heating the aluminum alloy material, when raising the temperature in a brazing furnace, at least in a temperature range of 450° C. to before melting of the filler metal under a first inert gas atmosphere having an oxygen concentration of preferably 50 ppm and following by heating at least at or above a temperature at which the filler metal starts to melt under a second inert gas atmosphere having an oxygen concentration of preferably 25 ppm and a nitrogen gas concentration of preferably 10% by volume or less.

Abstract: An aluminum alloy fin material for a heat exchanger having suitable strength before brazing enabling easy fin formation, having high strength after brazing, having a high thermal conductivity (electrical conductivity) after brazing, and having superior sag resistance, erosion resistance, self corrosion prevention, and sacrificial anode effect, a method of production of the same, and a method of production of a heat exchanger using the fin material are provided, that is, an aluminum alloy fin material having a chemical composition of Si: 0.7 to 1.4 wt %, Fe: 0.5 to 1.4 wt %, Mn: 0.7 to 1.4 wt %, and Zn: 0.5 to 2.5 wt %, Mg as an impurity limited to 0.

Abstract: The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.

Abstract: The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 ?m. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.

Abstract: A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Abstract: Use of an aluminium composite material consisting of at least one aluminium core alloy and at least one outer brazing layer consisting of an aluminium brazing alloy provided on one or both sides of the aluminium core alloy. Based on this prior art the object of the present invention is to provide a thermal joining process for an aluminium composite material, so that the use of fluxes can be dispensed with, this object being achieved in that the aluminium brazing layer of the aluminium composite material has a pickled surface and the aluminium composite material is used in a fluxless thermal joining process and the joining process is carried out in the presence of a protective gas.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: An aluminum alloy material contains Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mm2 or more to 7×105 pcs/mm2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 ?m are present in a cross-section of the aluminum alloy material, while 100 pcs/mm2 to 7×105 pcs/mm2 of Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 ?m are present in a cross-section of the aluminum alloy material. An aluminum alloy structure is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material to a total mass of the aluminum alloy material is 5% or more and 35% or less.

Abstract: In order to enable a satisfactory fluxless brazing without needing flux or vacuum facilities, a brazing object including an aluminum alloy material provided with an Al—Si—Mg brazing filler metal is joined by the Al—Si—Mg brazing filler metal without the use of flux by heating the aluminum alloy material, when raising the temperature in a brazing furnace, at least in a temperature range of 450° C. to before melting of the filler metal under a first inert gas atmosphere having an oxygen concentration of preferably 50 ppm and following by heating at least at or above a temperature at which the filler metal starts to melt under a second inert gas atmosphere having an oxygen concentration of preferably 25 ppm and a nitrogen gas concentration of preferably 10% by volume or less.

Abstract: A back-shielded welding method according to the present invention includes communicating a front surface-side and a back surface-side of two welding base materials (2, 3) with each other in the welding base materials (2, 3) that abut against each other; forming notched portions (21, 22) in abutting edge portions (15, 16) of two welding base materials (2, 3) in such a manner that a slit-shaped gas supply opening (17) is formed to extend along a forming direction of a welding bead; forming the gas supply opening (17) with the notched portions (21, 22) by abutting the abutting edge portions (15, 16) of the welding base materials (2, 3) against each other and temporarily fixing the abutting edge portions (15, 16); and forming the welding bead while supplying an inert gas via the gas supply opening (17), and blocking the gas supply opening (17) by the welding bead.

Abstract: In a method for brazing a sheet material without use of flux, an inert gas is firstly introduced into an oxygen pump to reduce an oxygen partial pressure in the inert gas to 1×10?10 Pa or less, and the sheet material is heated in a brazing furnace in an atmosphere of the inert gas discharged from the oxygen pump. A core alloy of the sheet material or a brazing filler alloy cladded to a surface of the core alloy contains Mg. Both the core alloy and the brazing filler alloy may contain Mg. Accordingly, brazability of the sheet material is sufficiently improved.

Abstract: In some embodiments, a forming body for the temporary sealing of a flow cross-section of an assigned object to be welded is disclosed. In some embodiments, the forming body comprises a dimensionally stable, preferably biologically-degradable material, which has a water solubility?90% and of which the main component is corn starch and/or corn semolina and/or corn flakes.

Abstract: Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board. According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300 ?m or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder, and it may be easy to surface treat the package board or interposer board based on the organic material sensitive to a high temperature.

Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: An aluminium alloy extruded tube product for a heat exchanger assembly and made from a 3xxx-series aluminium alloys and including furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to 0.5%, Se 0.03% to 0.5%, Y 0.03% to 0.05%, Th 0.03% to 0.05%, and the sum of these elements being 0.5% or less.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.

Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.

Abstract: A purge dam for retaining a purge gas around a weld zone includes a purge dam structure configured to substantially obstruct an air passage leading to the weld zone. The purge dam includes a main blocking portion configured to substantially block the air passage. The purge dam structure further includes a wall portion configured to engage the air passage for attachment. Adhesive can be optionally provided on the wall portion to facilitate the air passage attachment. Some or all of the purge dam structure may be formed as a multi-layer structure that includes one or more layers of water degradable paper and one or more layers of water degradable polymer. If present, the optional adhesive may be applied to the water degradable polymer layer. The purge dam may be installed by placing the purge dam in the air passage and adhering the wall portion thereto.

Abstract: A brazing filler metal powder is provided for brazing thin stainless steel parts together with reduced erosion. The brazing filler metal powder is formed by processing first metal particles, which typically comprise a nickel-based alloy including chromium, phosphorous, silicon, to a particle size of not greater than 0.0098 inch; providing second metal particles, typically consisting of copper, molybdenum, or cobalt; combining the first metal particles with the second metal particles by mixing and/or, milling, or sintering; and processing the combined composition to a particle size of not greater than 0.0098 inch. The first and second metal particles are less than fully alloyed together and are distinct from one another. A preferred composition of the brazing filler metal powder is 26.1 wt. % chromium, 5.4 wt. % phosphorous, 5.9 wt. % silicon, 10.0 wt. % cobalt, and a balance essentially of nickel.

Abstract: A water-degradable purge dam apparatus for purging a weld zone of a pipe assembly comprising first and second pipes having respective first and second ends. A first purge dam subassembly adapted for installation in the first pipe end has a hollow first conduit defining a first air flow pathway. A second purge dam subassembly adapted for installation in the second pipe end has a hollow second conduit defining a second air flow pathway. Each subassembly has one or more air flow blocking plates. A hollow third conduit, defining a third air flow pathway, is interconnectable to the first and second conduits members to span the weld zone. The first, second and third air flow pathways allow pressurized air within the pipes to pass through the purge dam apparatus and the weld zone in a sequestered by-pass zone defined by the first, second and third conduits.

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.

Abstract: A brazing sheet material including a core alloy layer bonded on at least one side with an aluminium brazing clad layer or layers forming a filler material of a 4000-series aluminium alloy. The core layer is made from an aluminium alloy having (in wt. %): Mg 1.0 to 3.0, Mn 0 to 1.8, Cu 0 to 0.8, Si 0 to 0.7, Fe 0 to 0.7, optionally one or more elements selected from the group (Zr, Cr, Hf, T), Zn 0 to 0.5, impurities and aluminium. The filler material forms a 4000-series aluminium alloy further including one or more wetting elements selected from Bi 0.03-0.5, Pb 0.03-0.5, Sb 0.03- 0.5, Li 0.03-0.5, Se 0.03-0.5, Y 0.03-0.05, Th 0.03-0.05, wherein the sum of these elements being 0.5% or less.

Abstract: A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.

Abstract: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.

Abstract: A water-degradable welding purge dam for purging a weld zone of a pipe assembly comprising first and second pipes having respective first and second ends to be welded together at a root gap. The purge dam includes a blocking plate comprising one or more plate members. The one or more plate members include a friction plate member having a plurality of flexible members on its periphery adapted to flexibly engage an inside wall of one of the first or second pipe ends in a self-retaining manner. The purge dam comprises one or more water degradable materials so that it can be flushed from the pipe assembly following welding.

Abstract: Some embodiments include a reinforced face of a club head. Other embodiments for related reinforced faces of club heads and related methods are also disclosed.

Abstract: Provided are: a method for brazing an aluminum alloy, which is characterized in that brazing is carried out by heating an aluminum brazing sheet without using flux in a furnace that is in an argon gas-containing atmosphere, said aluminum brazing sheet comprising a core material that is composed of aluminum or an aluminum alloy and a brazing filler material that is composed of an aluminum alloy and clad on one surface or both surfaces of the core material, and said core material and/or said brazing filler material containing Mg; and a brazing apparatus which is used in the method for brazing an aluminum alloy. The brazing method has good and stable brazing properties and is applicable in industrial practice.

Abstract: In the present invention, when a power module is soldered to a heatsink, steam which is temperature-adjusted to at least the melting point of a solder is introduced from a steam generating tank into the flow path provided in the heatsink, the heatsink is heated and the solder is melted. Inert gas is introduced into a soldering tank from another route so as not to mix with the steam supplied to the heatsink. Voids in the solder are reduced and condensed by pressure regulation and as a result the negative impact of voids is eliminated.

Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

Abstract: A method of centering a disk of a hard disk drive includes arranging a disk on an upper end portion of a hub on which a plurality of disks are rotatably assembled, and assembling the disk on the hub by vibrating the hub. Accordingly, the disks and/or spacers may be easily assembled on the hub, a time of centering may be relatively much reduced, and a superior centering quality may be obtained.

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

Abstract: The invention relates to a strip or sheet of aluminium alloy, comprising at least 80% by weight of aluminium and 0.01 to 0.5% yttrium and/or 0.05 to 0.5% bismuth, coated on at least one face with a brazing alloy. Said sheets and strips are used for the production of pieces by non-flux brazing.

Abstract: A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal with a permanent dielectric mold that results in sidewall plating defining an easy magnetic axis. The hard axis runs parallel to the longitudinal axis of the core and the inductor coils are orthogonal to the core's longitudinal axis. The magnetic field generated by the inductor coils is, therefore, parallel and self-aligned to the hard magnetic axis. The easy axis is enhanced by electroplating in an applied magnetic field parallel to the easy axis.