Abstract: A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.

Abstract: Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex steel with a chromium content of between 28 and 35 wt. % and a nickel content of between 3 and 10 wt. % being used.

Abstract: Reflow solder oven gas management system introduces an inert gas into and removes contaminated gas from a reflow oven tunnel (42) at predetermined points (6, 8) to influence the oven tunnel gas flow and to dilute and expel excess oxygen. The contaminated gas is ducted to a flux separation system (34) to be cleaned, for example remove flux vapors, and returned in part to the tunnel (42) for recirculation and with the remainder routed to end baffle boxes (54) for tunnel end pressurization and exhaust. The system has sufficient pressure to supply end baffle boxes (54) with clean gas to create a gas barrier to effectively seal off the tunnel ends from air infiltration or migration into the tunnel making the system insensitive to external pressure and/or temperature variations. The invention also includes alternative embodiments, low flow oxygen bleed valves (72) to maintain low oxygen content in the oven process tunnel.

Abstract: In a method of making finned tubes as components of air-cooled systems or condensers, a sheet metal strip of aluminum is first shaped into a waved finned structure with plural fins in parallel relationship and arched ends for connecting the fins, thereby defining crests on opposite ends of the finned structure. A fluxing agent of cesium-aluminum tetrafluoride is applied in lines onto the crests on at least one of the ends of the finned structure. The finned structure is then placed upon a broad side of a flat steel tube coated with a zinc/aluminum alloy. The finned structure and the flat tube are subsequently joined in a brazing furnace in the presence of an inert gas at a temperature between 370° C. and 470° C. to produce a unitary structure which is then allowed to cool down at room temperature.

Abstract: The shielding gas mixture is useful for MIG brazing galvanized steel. The gas mixture consists essentially of, by volume percent, about 0.5 to 4 carbon dioxide, about 0.2 to 1 hydrogen, and the balance is argon and incidental impurities.

Abstract: There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a formic acid into the heating/melting area, an exhausting means for exhausting a gas from the heating/melting area and its neighboring area to create a lower pressure area in the heating/melting area as compared to the pressure of outside the chamber, heating means for heating directly or indirectly the solder-adhered object in the heating/melting area, and an air-stream suppressing means for disturbing a gas flow between the heating/melting area and the carrying areas.

Abstract: An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.

Abstract: The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

Abstract: A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.

Abstract: The aim of the present invention is a process for manufacturing a plated product (1) comprising a support part in steel (2) and an anticorrosion metallic coating (3), characterized in that the anticorrosion coating (3) is fixed on the support part (2) by controlled-atmosphere brazing, in particular by vacuum brazing. The process according to the invention makes it possible to fix solidly an anticorrosion coating with a thickness smaller than 1 mm on a steel plate.

Abstract: A shielding gas filter that can be readily incorporated into a gas shielding system for an arc welding apparatus. The gas shielding filter is readily installed to the system upstream of a gas solenoid valve and removes any potentially harmful particles from the supply of the shielding gas to prevent those particles from entering the gas solenoid valve. The shielding gas filter includes a housing having an inlet and an outlet and a specially formed passageway that communicates between the inlet and the outlet. A filter screen is retained within the housing to filter out the particles larger than a predetermined size. Preferably, the filter screen is constructed of stainless steel and filters out particles larger than about 100 microns.

Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding components in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: Reflow solder oven gas management system introduces an inert gas into and removes contaminated gas from a reflow oven tunnel (42) at predetermined points (6, 8) to influence the oven tunnel gas flow and to dilute and expel excess oxygen. The contaminated gas is ducted to a flux separation system (34) to be cleaned, for example remove flux vapors, and returned in part to the tunnel (42) for recirculation and with the remainder routed to end baffle boxes (54) for tunnel end pressurization and exhaust. The system has sufficient pressure to supply end baffle boxes (54) with clean gas to create a gas barrier to effectively seal off the tunnel ends from air infiltration or migration into the tunnel making the system insensitive to external pressure and/or temperature variations. The invention also includes alternative embodiments, low flow oxygen bleed valves (72) to maintain low oxygen content in the oven process tunnel.

Abstract: Blades (20) are friction welded onto a disc (10) to form an integrally bladed rotor. To prevent the formation of defects in the weld interface between the blades (20) and the disc (10) a shielding gas is used. The shielding gas is introduced via two nozzles (22,24). The nozzles (22,24) are circumferentially spaced apart and located on opposite sides of the weld interface. The two gas flows oppose one another to create a curtain of gas, which flows around the weld interface. The gas curtain shields the weld interface from air and so reduces the formation of defects due to oxidation.

Abstract: Arrangement for improving quality in fusion welding operations where protective gas is supplied to the welding point via a hose line. The arrangement comprises means (5, 6), such as a bypass line connected parallel to the solenoid valve (4) which is usually connected into the protective-gas hose (3), in order make a small flush-gas flow pass through the protective-gas hose (3) or a considerable part of its length, when the normal protective-gas flow is shut off. In this way, the quantity of impurities brought along by the protective-gas flow from the inside of the protective-gas hose (3) and supplied to the pool is reduced.

Abstract: A brazing sheet comprises a thin covering material and a core material as well as an Al—Si alloy brazing material inserted between the thin covering material and the core material. The brazing material further contains Mg, Bi and/or Zn, Sn, In. When the above brazing material is molten in an inert gas atmosphere, this molten brazing material seeps onto the surface of the above thin covering material, whereby the brazing sheet is fluxlessly brazed to joint materials.

Abstract: The shielding gas mixture is useful for MIG brazing galvanized steel. The gas mixture consists essentially of, by volume percent, about 0.5 to 4 carbon dioxide, about 0.2 to 1 hydrogen, and the balance is argon and incidental impurities.

Abstract: A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber.

Abstract: The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is used. According to the invention, the shielding gas contains at least one active gas component in addition to the inert gas. As active gases, oxygen and/or carbon dioxide can be used. The proportion of active gas in the shielding gas is preferably in the range of 0.01 to 0.5% by volume.

Abstract: A mounting method for bonding a first object having a metal joint part to a second object, comprising the steps of cleaning at least the surface of the metal joint part of the first object by irradiating an energy wave or energy particle beam, and thermally bonding the cleaned metal joint part of the first object to a portion to be bonded of the second object by heating in a special gas atmosphere, and a device thereof. In the mounting, the primary and secondary oxidations of the metal joint part can be efficiently prevented, and thereby highly reliable bonding can be carried out.

Abstract: A vacuum heat treating furnace for brazing a large metallic part is disclosed. The vacuum furnace includes a pressure vessel having a cylindrical wall and a door dimensioned and positioned for closing an end of the cylindrical wall. A workpiece handling system is mounted on the pressure vessel door for supporting a metallic workpiece to be heat treated or brazed. The workpiece handling system includes apparatus for rotating the workpiece during a processing cycle. A vacuum system is connectable to the workpiece for creating a subatmospheric pressure inside the workpiece during a brazing cycle.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.

Abstract: The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet arranged between the parallel plates and/or sheets, wherein the corrugated aluminium stiffener sheet is an aluminium brazing sheet product made from an aluminium brazing sheet product including a core sheet (1) made of an aluminium alloy having on at least one surface of the core sheet clad, and preferably on both sides, an aluminium clad layer (2), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, preferably 5 to 14%, and a layer (3) comprising nickel on the outer surface of the aluminium clad layer. The invention further relates to a method of manufacturing thereof.

Abstract: A purge ring is provided for supplying a shield gas to the root side of a tubular article to be welded. The purge ring includes a generally U-shaped split-cylindrical body having an adjustable circumference together with slotted side walls connected by a bottom wall, the slotted side and bottom walls defining an isolation zone and a slip joint for insertion or retrieval of the purge ring in relation to the tubular article to be welded.

Abstract: After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection port formed in a soldering iron, and thereby soldering is performed by heating and melting solder with the soldering iron in the atmosphere of the mixed gas.

Abstract: The invention relates to a brazing sheet product comprising a core sheet made of an aluminum alloy, an aluminum clad layer cladding at least one of the surfaces of said core sheet, and a layer comprising nickel on the outersurface of one or both said clad layer or layers, and wherein the brazing sheet product is devoid of a layer comprising zinc or tin as a bonding layer between said outersurface of said aluminum clad layer or layers and said layer comprising nickel, and wherein the aluminum clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: (Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0), impurities each up to 0.05, total up to 0.20, balance aluminum.

Abstract: The shielding gas mixture is useful for MIG brazing galvanized steel. The gas mixture having by volume percent, about 0.5 to 4 carbon dioxide, about 0.2 to 1 hydrogen, and the balance is argon and incidental impurities.

Abstract: Stainless steels are welded using a shielding gas including 88 to 98.9 mole % Ar, 1 to 10 mole % H2, and 0.1 to 2.0 mole % CO2. The shielding gas permits low sulfur, high chromium, austenitic stainless steel pipes to be joined with welds having sufficient penetration, strength, corrosion resistance and durability for practical use.

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: An apparatus and method for recovering solder from dross present on the surface of a molten solder includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave against a printed circuit board to be soldered. The solder nozzle includes opposite side troughs inclined downwardly toward one side of the solder reservoir to direct dross toward a dross zone. A semicircular hood extends across the solder reservoir and is located above the dross zone. A screw extends across the solder reservoir and is covered by the hood. The screw is activated to agitate the dross so as to remove oxides and recover solder from the dross.

Abstract: An object of the invention is to provide a hard sintered body indexable insert in which a hard sintered body used as a cutting edge is brazed to all corners of a tool substrate and to seating grooves of the upper and lower surfaces thereof, and which has high performance and is low-cost. A brazing alloy a part of which contains 0.5 to 65 wt % Ti and/or Zr and the remainder of Cu and inevitable impurities is used as a typical brazing alloy, and the hard sintered body is brazed to the tool substrate by heating it in a vacuum or in an inert gas atmosphere. The thickness of the tool substrate between the upper and lower seating grooves is 30% to 90% of the entire thickness of the hard sintered body indexable insert, and the cutting-edge length of the hard sintered body is 0.5 mm to 4 mm.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A wave soldering apparatus includes a solder reservoir adapted to contain molten solder, and a solder nozzle disposed in the solder reservoir and extending up above the molten solder. The nozzle provides a substantially turbulent free solder wave under a printed circuit board while the board is moved in a predetermined path. A tray is pivotably mounted to the nozzle and angularly moved to vary the flow rate of the molten solder. A shroud is mounted adjacent to and associated with the tray to define a contained space into which an inert gas is supplied to provide an inert gas atmosphere. The shroud includes a canopy extending over a portion of the tray. The canopy extends substantially parallel to the predetermined path and is adjustably positioned in response to angular position of the tray to ensure that the board exits from the solder wave within the inert gas atmosphere.

Abstract: A method and system for instantaneous heat-sink soldering comprising a gripper device, an intense heat source, and an air-jet cooling system is provided for soldering terminals to structures of dissimilar material composition. The gripper device is adapted to secure the terminal between a pair of jaws and selectively position the terminal closely adjacent the structure. The jaws further serve as heat sinks to continually remove residual heat from the terminal, both during and after the application of heat to the terminal. Upon termination of the heat application, air-jet cooling is provided to the terminal to quickly cool the terminal and the molten layer of solder. The method of rapidly heating and cooling the terminal and layer of solder prevents the annealing of certain silica substrates and provides better solder connections.

Abstract: Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.

Abstract: The mechanism which is the subject of this patent application is centered on a control device adapted to facilitate the control and regulation of the electrical current or the gaseous intake and mixture for a welding machine, thereby regulating the output of the welding machine, such mechanism including a foot-operated pedal member, which, in turn, is mechanically linked to electromechanical means activated by radio transmission means to regulate such electrical current input or the gaseous output.

Abstract: The invention relates to a process for controlling the heat transfer to a workpiece during vapor phase soldering. According to said process, a workpiece placed in a vapor phase is first rapidly heated to a predetermined temperature, and then the temperature is controlled by changing the vapor volume on the workpiece surface. Preferably, a workpiece in the vapor phase is heated to a temperature lower than the melting point of the solder, and then the workpiece is heated at the boundary between the vapor phase and the vapor-free space more slowly to the melting point of the solder. This invention is advantageous in that it provides a process for rapid vapor phase soldering with no undesirable side effects, such as, e.g., formation of solder pearls.

Abstract: A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat and pressure. The heat and pressure causes the surface of the superalloy, in the presence of the activator, to diffusion bond without the use of a brazing alloy. By eliminating the brazing alloy, a high strength, high temperature bond is achieved, yet there is no molten brazing alloy to be drawn through capillary action into any fine features surrounding the joint being bonded, and there is no residue left at the interface that would diminish the mechanical properties of the joint.

Abstract: The invention relates to a machine for wave soldering or tinning comprising a solder reservoir (9); means that can form at least one solder wave with a so-called laminar form (8b); a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; and means for injecting (12) a gas in the vicinity of the wave; characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

Abstract: A method of interconnecting components (10, 16) of aluminium having a purity of at least 95%, the method comprising brazing the components (10, 16) together and then surface treating the assembled componetns (10, 16) by subjecting them to a Bohmitting procedure.

Abstract: A process for connecting a winding wire of a coil with a terminal pin of a casing for surface mounting is introduced, whereby one end section of the winding wire is wound around the terminal pin. The area of the terminal pin wound with the end section of the winding wire is soft-soldered, and the soft-solder is then blown off of the partial area of the area wound, which forms the soldering application surface for surface mounting. The inventive process can be used in the manufacture of inductive SMD components, the terminal pins of which possess excellent coplanarity, particularly if terminal pins bent in a wing-shape are used.

Abstract: The aim of the present invention is a process for manufacturing a plated product (1) comprising a support part in steel (2) and an anticorrosion metallic coating (3), characterized in that the anticorrosion coating (3) is fixed on the support part (2) by controlled-atmosphere brazing, in particular by vacuum brazing. The process according to the invention makes it possible to fix solidly an anticorrosion coating with a thickness smaller than 1 mm on a steel plate.

Abstract: A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

Abstract: Provided is a method of operating an apparatus for inerting a wave soldering installation having a solder bath and a conveying system for producing one or more solder waves comprising an immersion box which is closed on all sides, shaped like a frame, can be immersed in the solder bath and which has porous pipes to distribute nitrogen, the pipes being arranged inside the immersion box in housings being designed such that the porous pipes are arranged therein in such a way that the porous pipes essentially cannot be struck by solder splashes produced during the operation of the wave soldering installation. The method includes supplying the inert gas at a temperature far below the temperature of the solder.

Abstract: A brazing sheet product having a core sheet (1) made of an aluminium alloy, having one or both of the surfaces of the core sheet clad with an aluminium clad layer (2), and a layer (3) comprising nickel on the outersurface of one or both the aluminium clad layer or layers (2). There is a layer (4) comprising zinc or tin as a bonding layer between the outersurface of the aluminium clad layer or layers (2) and the layer (3) comprising nickel. The aluminium clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0, impurities each up to 0.05, total up to 0.20; and balance aluminium.