Abstract: A self-adhesive purge dam for retaining purge gas around a weld zone includes a base configured to substantially obstruct an air passage leading to the weld zone and an adhesive skirt extending from the base and configured to engage portions of the air passage. An adhesive on the adhesive skirt allows the skirt to be adhered to the air passage. An optional removable backing covers the adhesive prior to installation. The adhesive skirt is deployable from a stowed position wherein the adhesive is generally disposed in an interior portion of the purge dam to an installation position wherein the adhesive can be pressed against a surface to which the purge dam is to be adhered. The purge dam can be installed by inserting it in the air passage with the adhesive skirt in the stowed position, removing the removable backing prior to or after insertion in the air passage, exposing the adhesive, and deploying the skirt to the installation position for adhesion.

Abstract: A manufacturing method of an embedded inductor includes the steps of providing a magnetic plastic material, disposing at least one coil into a mold, and injecting or pressing the magnetic plastic material into the mold to form a magnetic body encapsulating the coil. An embedded inductor includes at least one magnetic body encapsulating the coil by injecting molding or pressing molding.

Abstract: A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to reduce the difference in shrinkage behavior during firing between the core and the green ceramic layers.

Abstract: Solder is pumped through a nozzle to produce a jet of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle is mounted on a flange held between slip rings so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube for delivering heated nitrogen gas to pre-heat a region to be soldered.

Abstract: A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal with a permanent dielectric mold that results in sidewall plating defining an easy magnetic axis. The hard axis runs parallel to the longitudinal axis of the core and the inductor coils are orthogonal to the core's longitudinal axis. The magnetic field generated by the inductor coils is, therefore, parallel and self-aligned to the hard magnetic axis. The easy axis can be enhanced by electroplating in an applied magnetic field parallel to the easy axis.

Abstract: An adapter configured to enable a user to quickly and easily couple a fluid supply source to a pipe extending from a system to be brazed without requiring any modification or marring to the pipe. The adapter forming a substantially air-tight seal without requiring any bonding or adhesives. In one form the adapter comprises an access stem fitting on one end, and a step or conic adapter on another end. A method for using this device is also disclosed where in one form, the fitting is connected to a fluid source, the fitting is connected to the system to be brazed or welded, fluid is provided, and the system is brazed or welded.

Abstract: The invention relates to a surface of an object, especially a heat exchanger, e.g. a lateral part, a wavy rib, or a tube of a heat exchanger, which is to be soldered by means of a flux layer (2). In order to improve the properties of the surface that is to be soldered, said surface is provided with at least one more layer (3; 13, 16) in addition to the flux layer (2). The at least one more layer (3; 13; 16) contains an additive which modifies the surface to be soldered, said additive being reacted in order to modify the surface when the surface that is to be soldered is soldered.

Abstract: In one embodiment, a ferroelectric material is processed by placing the material in an environment including metal vapor and heating the material to a temperature below the Curie temperature of the material. This allows the bulk conductivity of the ferroelectric material to be increased without substantially degrading its ferroelectric domain properties. In one embodiment, the ferroelectric material comprises lithium tantalate and the metal vapor comprises zinc.

Abstract: Disclosed is an amorphous, ductile brazing foil with a composition consisting essentially of NirestCraBbPcSid with 2 atomic percent ?a?30 atomic percent; 0.5 atomic percent ?b?14 atomic percent; 2 atomic percent ?c?20 atomic percent; 0 atomic percent ?d?14 atomic percent; incidental impurities ?0.5 atomic percent; rest Ni, where c>b>c/15 and 10 atomic percent ?b+c+d?25 atomic percent. Also disclosed is amorphous, ductile Ni-based brazing foil having a composition consisting essentially of NirestCraBbPcSidCeXfYg wherein a, b, c, d, e, f, and g are numbers such that 2 atomic percent ?a?30 atomic percent; 0.5 atomic percent ?b?14 atomic percent; 2 atomic percent ?c?20 atomic percent; 0 atomic percent ?d?14 atomic percent; 0 atomic percent ?e?5 atomic percent; 0 atomic percent ?f?5 atomic percent; 0 atomic percent ?g?20 atomic percent; wherein incidental impurities are present, if at all, in amounts ?0.

Abstract: A process and apparatus for brazing a metal alloy component, such as a superalloy component of a gas turbine engine. The process employs a plasma torch in a non-transferred arc mode to generate an electric arc between an electrode and a housing in which an orifice is defined. A plasma gas is flowed through the arc so as to ionize the plasma gas, and the resulting ionized plasma gas is discharged through the orifice to form a plasma jet. The plasma torch is configured so that the plasma jet is shrouded from a surrounding oxidizing atmosphere by a shielding gas flowing cocurrently with the plasma jet. A braze alloy material is introduced into the plasma jet, which is directed at a surface of the component to form a brazement that is metallurgically bonded to the component without melting the component.

Abstract: The invention relates to a method for soldering components, in particular heat exchanger, in particular made of aluminium materials, aluminium alloys or wrought alloys, in a soldering furnace, in particular a continuous soldering furnace or a batch-type soldering furnace, which comprises a muffle, which is flushed with protective gas in order to create a protective atmosphere. In order to make the production of soldered components easier, during the soldering of the components the muffle is supplied with such a greatly increased amount of gas, in particular protective gas or reaction gas, that a low-oxygen protective atmosphere is created.

Abstract: The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.

Abstract: To hard-solder parts to be joined along a common joint, the parts are heated by a heat source e.g. a laser beam (3). Melted solder (7) that is stored in a container (6) is then introduced into the joint. Joints can be filled with solder in this manner at higher speed and the solidified solder surface is practically devoid of pores, thus permitting the priming or painting of said parts without the need for subsequent treatment.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: A method of fabricating a coil-embedded inductor provides steps for obtaining uniform density of coil-embedded inductor. The cavity of a first die is filled with dust before being flipped, and then filled with dust a second time. The dust in the cavity is pressed only once for improving the density.

Abstract: A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not require elaborate surface preparation or application techniques.

Abstract: Provided is a detection method of detecting presence or absence of an object to be detected in an object hold portion that is used together with an irradiation portion that irradiates the object to be detected with a heat ray, holds the object to be detected, and has an opening, the detection method including: imaging an image signal in a predetermined region having the opening by an imaging device; and making an irradiation optical path of the irradiation portion and an imaging optical path of the imaging device substantially coincide with each other within the opening by an optical unit.

Abstract: The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the apparatus being adapted to heat the items to be soldered to a temperature required for soldering by condensing the vapor. Further the invention relates to a method and an apparatus for flux deposition connected to a soldering machine, which soldering machine comprises a solder heating medium evaporated by heating means forming a vapor that heats elements to be soldered by heat transfer and by condensation, which apparatus comprises means for condensation, of a vapor containing flux where pumping means circulate vapor containing flux through the condensation means, where the condensation means comprises heat exchangers for cooling the vapor for flux condensation.

Abstract: When aluminium products are preheated in a preheating furnace up to about 500° C. before they are brazed with a flux in a heating furnace, a nitrogen atmosphere in the preheating furnace is made convectional by fans for improving heating efficiencies and also for having the oxygen which is brought into the preheating furnace as a disturbance thereof and scattered about in the nitrogen atmosphere, contacted to furnace inner walls of the preheating furnace which are made from carbonaceous materials, and reacted therewith so as to be changed to CO, resulting in keeping the oxygen concentration of nitrogen atmosphere low, whereby when the aluminium products are brazed by heating them in a continuous atmosphere furnace including said preheating furnace and said heating furnace, heating time thereof is shorten and the brazing is made more economically than before.

Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.

Abstract: A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with the aid of the fiber optic device. The flexible articulate tubular device is then more precisely articulated to direct the terminus along the target weld path, with the aid of the heat sensors. As such, the flexible articulate tubular device operates in a heat seeking manner to follow the weld bead. Ultimately, a gaseous flux is supplied along the flexible articulate tubular device and toward the target weld path, so as to blast the weld bead with an anti-oxidation shield gas and thereby protect the weld.

Abstract: In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electroni

Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.

Abstract: The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.

Abstract: A self-adhesive purge dam for retaining purge gas around a weld zone includes a base configured to substantially obstruct an air passage leading to the weld zone and an adhesive skirt extending from the base and configured to engage portions of the air passage. An adhesive on the adhesive skirt allows the skirt to be adhered to the air passage. An optional removable backing covers the adhesive prior to installation. The purge dam is installed by peeling the removable backing (if present) and exposing the adhesive for adhesion.

Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Abstract: A ceramic armor is disclosed in several embodiments. In a first embodiment, a metal base plate has a metal frame assembled on it having a central opening into which the ceramic material is placed. A cover plate is placed over the frame to enclose the ceramic material on all sides. In a second embodiment, the frame has an open central area that has two crossing walls that define four sub-chambers. Four pieces of ceramic material are placed in the respective sub-chambers and a covering plate is placed over it. In a further embodiment, the frame has a plurality of cavities mechanically formed in it. A ceramic tile or plate is placed in each cavity and a cover plate is placed over the frame. The metal used to encapsulate the ceramic material may, if desired, comprise a Titanium alloy such as Ti-6Al-4V, and the ceramic material may comprise Silicon Carbide, Boron Carbide, Tungsten Carbide, Titanium Diboride or Aluminum Nitride.

Abstract: An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.

Abstract: A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension.

Abstract: In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

Abstract: The inventive system and method allows the control of shielding gas in an electric welding apparatus having automatic wire feed by controlling the flow rate of the shielding gas as a function of the wire feeding speed and/or the welding current obtained. A control circuit 112 receives an input signal 203 that is representative for the wire feeding speed and/or the welding current, and issues, in response to the input signal 203, a control signal 206 to a controllable flow control valve 110 in a gas supply line 201, 202, 208, which passes shielding gas from a tank 101, via a regulator valve 102, to a discharge nozzle of the welding apparatus welding gun. An adjusting unit 113 provides an operator with an interface which permits adjustment of the parameters that determine the flow rate function.

Abstract: A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatus for forming the connection includes a support, capillary member for having a wire pass therethrough, a pair of clamps for clamping the wire, and a “torch” (e.g., electrode, gas flame) which heats the tip of the wire, forming the ball. Successive balls can be formed by this apparatus atop the initially formed ball to provide a stacked configuration.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: A fixing structure for a welding electrode and a welding head is shown which enable improvement of durability of a welding electrode, improvement of work efficiency in welding, and a reduction of time required for welding and also which make it possible to execute welding for an extended time with high reliability. In the fixing structure, a fixed section of a welding electrode is inserted via a thermally conductive material into an inserting section of a fixing base and a peripheral surface of the fixed section of the welding electrode is uniformly contacted to the fixing base to affix the welding electrode to the fixing base.

Abstract: A solder reflow oven with horizontal cyclonic convection air flow for enhancing equalized heating of printed circuit boards conveyed therethrough. Air circulation apparatus can include a first air movement fan for urging air to move horizontally laterally from the first side wall of the oven toward the second side wall of the oven across and above printed circuit boards being conveyed therethrough. A second air fan is positioned below and laterally displaced from the conveying means for directing a second air stream below the first air stream and oppositely oriented in order to urge movement of heated air across the undersurface of the conveyor for enhancing equalization of heating of the printed circuits boards thereupon. Preferably, both blowers are oriented to move air approximately perpendicularly with respect to the direction of movement of the conveyed printed circuit boards in opposite respective directions thereabove and therebelow.

Abstract: A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157). Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a manner so that each window projects outwardly on each side of the plate. Both sides of each window are then simultaneously ground and polished (232). Exposed surfaces of the metal plate are electroplated with nickel and gold (236). One or more coatings (41, 46, 47) are applied to one or both sides of each window. Several sections are then cut from the assembly, each of which can serve as a lid (17) for an optical apparatus (10).

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.

Abstract: There is disclosed apparatus for monitoring a solder wave comprising a board of insulating material simulating a printed circuit board, an array of spaced electrical contact elements on the underside of the board across the entire width thereof, means for measuring the dwell time of each contact in the wave as the board is conveyed over the wave, and means for displaying the measured dwell times to show the contact area and time.

Abstract: The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

Abstract: A method of forge welding laminates of titanium and titanium alloys includes interleaving first and second pluralities of metal pieces in an enclosure, filling the enclosure with an inert gas, heating the enclosure and the first and second pluralities of metal pieces, and mechanically pressing the enclosure on a first axis with a force sufficient to cause the first and second pluralities of metal pieces to forge-weld together. The first and second pluralities of metal pieces may be metallurgically dissimilar from each other, and may each comprise a percentage of titanium.

Abstract: A method for brazing aluminum alloy-assembled articles with a filler alloy having a liquidus temperature of 540° C. or lower and a difference of temperature between the liquidus temperature and the solidus temperature being 100° C. or lower, wherein the highest temperature reached in the assembled article at the time of heating for brazing being set 40° C. or more higher than the liquidus temperature but 585° C. or lower. An aluminum alloy-filler alloy usable at low temperature for brazing, which comprises Si in an amount of 4.0 wt % to 8.0 wt %, Zn in an amount of 7.0 wt % to 20.0 wt % and Cu in an amount of 10.0 wt % to 35.0 wt %, with the balance being made of aluminum.

Abstract: Blades (20) are friction welded onto a disc (10) to form an integrally bladed rotor. To prevent the formation of defects in the weld interface between the blades (20) and the disc (10) a shielding gas is used. The shielding gas is introduced via two nozzles (22,24). The nozzles (22,24) are circumferentially spaced apart and located on opposite sides of the weld interface. The two gas flows oppose one another to create a curtain of gas, which flows around the weld interface. The gas curtain shields the weld interface from air and so reduces the formation of defects due to oxidation.

Abstract: A magnetic head slider with at least one thin-film magnetic head element on a suspension is mounted. This mounting includes electrically connecting the magnetic head slider with the suspension with ball bonding connections. Electrical property of the thin-film magnetic head element is inspected, and then the ball bonding connections are separated when it is judged that the thin-film magnetic head element has defective electrical property. Then, the magnetic head slider is detached from the suspension, and thereafter a new magnetic head slider with at least one thin-film magnetic head element is mounted on the suspension from which the magnetic head slider was detached.

Abstract: A component which has a surface crevice or crack and contaminants on at least one face of the opening is welded. The weld is effected by first plastically deforming the surface of the component to close the surface opening to a predetermined depth less than the depth of the opening and contaminated faces defining the opening to form a sealed ligament. The sealed ligament leaves unclosed a portion of the crack below the sealed ligament. The closed surface is hermetically sealed by fusion-welding to a depth of penetration equal to or less than the predetermined depth of the sealed ligament to minimize or eliminate expulsion of contaminants in the sealed ligament.

Abstract: A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.

Abstract: In one embodiment, a method of processing a ferroelectric material comprises enclosing the ferroelectric material and a metal source in a container, ramping up the temperature of the container, heating the container for a target amount of time at a temperature below a Curie temperature of the ferroelectric material, and then ramping down the temperature of the container. The target amount of time may be set to obtain a target conductivity. For example, the target amount of time may be about 25 hours or less.

Abstract: A metal plate (126) has a plurality of openings (127) extending through it, and is cleaned using a wet hydrogen process (157). Glass windows (106) are then placed in the openings, and are each fused to the metal plate by heat (231) in a manner so that each window projects outwardly on each side of the plate. Both sides of each window are then simultaneously ground and polished (232). Exposed surfaces of the metal plate are electroplated with nickel and gold (236). One or more coatings (41, 46, 47) are applied to one or both sides of each window. Several sections are then cut from the assembly, each of which can serve as a lid (17) for an optical apparatus (10).

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.