Applied In Powdered Or Particulate Form Patents (Class 228/248.1)
  • Patent number: 11937372
    Abstract: A biphasic composition comprises a quantity of liquid GaIn and a plurality of solid particles of Ga2O3 suspended in the quantity of liquid GaIn, the Ga2O3 particles having a median particle size between 8 ?m and 25 ?m, wherein the volumetric ratio of solid particles of Ga2O3 to liquid GaIn is between 0.4 and 0.7. A method of making a biphasic composition of GaIn, a method of making a stretchable circuit board assembly, and a stretchable circuit board assembly are also described.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: March 19, 2024
    Inventors: Rebecca Kramer-Bottiglio, Shanliangzi Liu, Dylan Shah, Lina Mercedes Sanchez Botero
  • Patent number: 11935777
    Abstract: A semiconductor device is manufactured using a support base and a filling material formed on the support base. The filling material can be a plurality of protrusions or penetrable film. The protrusions are attached to the support base with an adhesive. The protrusions have a variety of shapes such as square frustum, conical frustum, three-sided pyramid with a flat top, four-sided rectangular body, and elongated square frustum. A semiconductor wafer is disposed over the support base with the filling material extending into openings in the semiconductor wafer. The openings in the semiconductor wafer can have slanted sidewalls, or a more complex shape such as ledges and vertical projections. The filling material may substantially fill the openings in the semiconductor wafer. The protrusions may partially fill the openings in the semiconductor wafer. The protrusions occupy at least a center of the openings in the semiconductor wafer.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: March 19, 2024
    Assignee: STATS ChipPAC Pte Ltd.
    Inventors: HyeonChul Lee, HunTeak Lee, HyunSu Tak, Wanil Lee, InHo Seo
  • Patent number: 11887909
    Abstract: In a copper/titanium/aluminum bonded body of the present invention, a copper member made of copper or a copper alloy and an aluminum member made of aluminum or an aluminum alloy are bonded via a titanium layer, an intermetallic compound containing Cu and Ti is formed at a bonded interface of the copper member and the titanium layer, and a maximum value of a length Li of an intermetallic compound unformed part along the bonded interface is 20 ?m or less in the bonding interface of the copper member and the titanium layer, the intermetallic compound unformed part being a part free of formation of the intermetallic compound, and a ratio ?Li/L0 is 0.16 or less, ?Li being a total length of the intermetallic compound unformed part along the bonded interface and of L0 being a total length of the bonded interface along the bonded interface.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: January 30, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Patent number: 11786960
    Abstract: A method for manufacturing a stabilizer, the stabilizer including a main body bar that is elastically deformable, and a pair of connecting plates that are separately connected to a pair of left and right suspension devices, the method including a forging step of forming the connecting plate by forging both end portions of a material tube, in which in the forging step, both end portions of the material tube are crushed in a radial direction to be formed into the connecting plate in a state where a sealing metal plate heated to a temperature equal to or higher than a melting point is disposed inside both end portions of the material tube heated to a temperature lower than the melting point.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: October 17, 2023
    Assignee: NHK SPRING CO., LTD.
    Inventors: Hiroshi Mizukami, Masato Inaba, Masato Sugawara, Michiya Masuda
  • Patent number: 11780022
    Abstract: A solder ball bonding (SBB) tool includes a rotatable feed plate for transporting solder balls from a translatable solder ball reservoir to a nozzle unit, which is a position at which a laser light source can irradiate and thus melt the solder balls. The SBB tool includes a gap between the reservoir and the feed plate positioned over the reservoir, and a feed mechanism coupled with the reservoir, where the feed mechanism is driven by a pressurized gas to translate the reservoir upward across at least a portion of the gap in preparation for movement of a solder ball to the feed plate and downward in preparation for rotation of the feed plate after a solder ball is moved to the feed plate. The gap may have a maximum size that exceeds a nominal size of the solder balls contained in the reservoir.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 10, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yusuke Matsumoto, Kenichi Murata
  • Patent number: 11682650
    Abstract: A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: June 20, 2023
    Assignee: National Pingtung University of Science and Technology
    Inventor: Wei-Hua Lu
  • Patent number: 11637083
    Abstract: In a described example, a method includes: forming cavities in a die mount surface of a package substrate, the cavities extending into the die mount surface of the package substrate at locations corresponding to post connects on a semiconductor die to be flip-chip mounted to the package substrate; placing flux in the cavities; placing solder balls on the flux; and performing a thermal reflow process and melting the solder balls to form solder pads in the cavities on the package substrate.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 25, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rafael Jose Lizares Guevara, John Carlo Cruz Molina, Steffany Ann Lacierda Moreno
  • Patent number: 11557702
    Abstract: A method for manufacturing a light-emitting device includes providing a transparent member having a protrusion formed at an upper surface of the transparent member. A first resin portion is placed on the protrusion in which the first resin portion has a solid form and is made from a first resin material of which the viscosity decreases when heated. A light-emitting element is placed on the first resin portion, the light-emitting element is caused to be self-aligned with respect to the protrusion by reducing a viscosity of the first resin portion by heating to a first temperature. The first resin portion is solidified by cooling.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: January 17, 2023
    Assignee: NICHIA CORPORATION
    Inventor: Toru Hashimoto
  • Patent number: 11511363
    Abstract: Disclosed are ball jumping apparatuses and ball absorption methods using the same. The ball jumping apparatus comprises a fixing part, a moving part spaced apart from the fixing part, and a resilient member that connects the fixing part and the moving part to each other. The resilient member extends upwardly from the fixing part and has a connection with the moving part. The fixing part includes a fixing plate that spreads in a horizontal direction. The moving part includes an oscillating vessel that has a ball receiving space in which a ball is received, and an oscillator coupled to the oscillating vessel. A bottom surface of the oscillating vessel is upwardly spaced apart from a top surface of the fixing plate.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: November 29, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangkeun Ahn, Hyeji Shin, Dongsoo Lee, Sangho Jang
  • Patent number: 11482510
    Abstract: There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The at least one aperture is formed in an interspace between the at least two electronic components. The component substrate is coupled to the base substrate using a solder joint. Each of the at least two electronic components may comprise a light emitting diode element. A method of manufacturing an apparatus is also disclosed.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: October 25, 2022
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Marius Iosif Boamfa, Franciscus Antonius Kneepkens, Bastiaan Wilhelmus Maria Moeskops, Rieko Verhagen, Jonathan Alambra Palero, Frank Anton Van Abeelen
  • Patent number: 11410870
    Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool for contacting the die during a transfer from the die supply source to the substrate; a first motion system for moving the bond head along a first axis; and a second motion system, independent of the first motion system, for moving the bond tool along the first axis.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 9, 2022
    Assignee: ASSEMBLEON B.V.
    Inventors: Roy Brewel, Richard A. Van Der Burg, Rudolphus H. Hoefs, Wilhelmus G. Van Sprang
  • Patent number: 11355438
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, a microelectronic device package may include a redistribution layer (RDL) and an interposer over the RDL. In an embodiment, a glass core may be formed over the RDL and surround the interposer. In an embodiment, the microelectronic device package may further comprise a plurality of dies over the interposer. In an embodiment, the plurality of dies are communicatively coupled with the interposer.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 7, 2022
    Assignee: Intel Corporation
    Inventors: Srinivas Pietambaram, Rahul Manepalli, Gang Duan
  • Patent number: 11289445
    Abstract: An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: March 29, 2022
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Wan Yin Yau, See Lok Chan, Chi Wah Cheng
  • Patent number: 10727193
    Abstract: A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T1, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T1, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 28, 2020
    Assignee: ORMET CIRCUITS, INC.
    Inventors: Catherine Shearer, Eunsook Barber, Michael Matthews
  • Patent number: 10676586
    Abstract: A method for producing a composite polymeric article, an additive for a polymeric article, and a composite polymeric article are provided. The method generally includes providing a plurality of graphene nanoplatelets, providing a plurality of silica nanofibers, providing a polymeric material, and distributing the plurality of silica nanofibers and the plurality of graphene nanoplatelets within the polymeric material to achieve a composite article. The additive for a polymeric article includes a plurality of graphene nanoplatelets and a plurality of silica nanofibers. The composite polymeric article includes a plurality of graphene nanoplatelets, a plurality of silica nanofibers, and a polymeric matrix. The plurality of graphene nanoplatelets and the plurality of silica nanofibers are distributed within the polymeric matrix. The silica nanofibers have a mean cross sectional diameter of not more than 100 nm.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: June 9, 2020
    Assignee: UT-Battelle LLC
    Inventors: Georgios Polyzos, Jaswinder K. Sharma, Ivan V. Vlassiouk, Daniel A. Schaffer, Panagiotis G. Datskos, Timothy J. LaClair, Jaehyeung Park
  • Patent number: 9780067
    Abstract: Various apparatus and methods are disclosed. In one aspect, a method of manufacturing a thermal interface material on a semiconductor chip is provided. The method includes placing a preform of a combination of a first metal and a second metal on one of the semiconductor chip or a lid. The preform is liquid phase sintered to cause the combination to evolve to an equilibrium composition and bond to the semiconductor chip.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: October 3, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Daniel Cavasin, Kaushik Mysore Srinivasa Setty
  • Patent number: 9754850
    Abstract: A circuit carrier. The circuit carrier has at least one electronic component, the electronic component being soldered to the circuit carrier, in particular with the aid of a flux. The circuit carrier has, in particular, an electrically insulating protective layer for anti-condensation, a surface of the circuit carrier being covered at least partially with the protective layer. The protective layer of the circuit carrier is formed by a silicon polymer layer designed to be activatable with the aid of ultraviolet radiation, the silicon polymer layer having filler particles distributed in the silicon polymer layer, in particular homogenously. At least a part of the filler particles or all filler particles have at least one salt of an alkaline earth metal.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: September 5, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Isabel Faria, Peter Pfeiffer, Heiko Elsinger, Andre Hahn
  • Patent number: 9636784
    Abstract: A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: May 2, 2017
    Assignee: Indium Corporation
    Inventors: Hongwen Zhang, Ning-Cheng Lee
  • Patent number: 9303321
    Abstract: The present disclosure is related to a cladding composition. The cladding composition may include cladding powder particles and flux particles. The flux particles may have an average particle size of less than about 40 ?m, and more than about 50% of the flux particles may adhere to the surfaces of the cladding powder particles.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: April 5, 2016
    Assignee: Caterpillar Inc.
    Inventors: Daniel Thomas Cavanaugh, Daniel Joseph Sordelet, Justin Curtis Embrey
  • Patent number: 9299591
    Abstract: A method and structures are provided for implementing individual integrated circuit chip attach in a three dimensional (3D) stack. A plurality of hollow copper pillars is formed, and the hollow copper pillars are coated with lead free solder using vapor deposition.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: March 29, 2016
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Patent number: 9257338
    Abstract: The disclosure provides a TSV substrate structure and the stacked assembly of a plurality of the substrate structures, the TSV substrate structure including: a substrate comprising a first surface, a corresponding second surface, and a TSV communicating the first surface with the second surface through the substrate; and a conductor unit completely filling the TSV, the conductor unit comprising a conductor body which has a first and a second ends corresponding to the first and second surfaces of the substrate, respectively.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: February 9, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chung-Chih Wang, Pei-Jer Tzeng, Cha-Hsin Lin, Tzu-Kun Ku
  • Patent number: 9216742
    Abstract: The vehicle evaluation method and vehicle evaluation apparatus can appropriately and quantitatively evaluate the sense of lateral oscillation of a vehicle. The method and apparatus measure muscle activity waveforms of a pair of left and right muscles in at least one type of skeletal muscle involved in maintaining a posture of a head of an occupant of the vehicle driven under predetermined driving conditions, calculate an amount of simultaneous activity that expresses characteristics of the muscle activity waveforms and evaluate a sense of lateral oscillation of the vehicle based on the amount of simultaneous activity.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: December 22, 2015
    Assignee: The Yokohama Rubber Co., LTD.
    Inventor: Akira Kuramori
  • Patent number: 9087831
    Abstract: According to one embodiment, a semiconductor module includes a semiconductor chip that is mounted on a printed substrate, a terminal electrode that is formed on the printed substrate so as to be electrically connected to the semiconductor chip, a metal coating layer that is formed on the terminal electrode, a plating lead wire that is electrically connected to the terminal electrode, and a gap that is formed in the plating lead wire.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: July 21, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Isao Ozawa
  • Publication number: 20150144683
    Abstract: A screen printer includes a mask, a substrate holding unit that clamps and holds a substrate below the mask by clamping members, a substrate holding unit moving mechanism that moves the substrate holding unit to contact the substrate with a lower surface of the mask, a paste filling unit that fills pattern holes of the mask with a paste, mask suction portions provided in the clamping members which suck the mask contacted with the substrate. The mask suction portions keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing, and release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 28, 2015
    Inventors: Yuuji OOTAKE, Mitsuru KOUCHI, Seiya KURODA
  • Publication number: 20150146399
    Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Inventors: LAKSHMINARAYAN VISWANATHAN, L.M. Mahalingam, David F. Abdo, Jaynal A. Molla
  • Patent number: 9033207
    Abstract: An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: May 19, 2015
    Assignee: HONDA ELESYS CO., LTD.
    Inventors: Seiji Yamashita, Tamotsu Teshima, Amane Murao, Hiroshi Ishizaki, Takashi Honda, Hitoshi Kuroyanagi, Tomoyuki Masubuchi
  • Publication number: 20150125999
    Abstract: Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.
    Type: Application
    Filed: August 28, 2014
    Publication date: May 7, 2015
    Inventors: Seokhyun LEE, Jaegwon JANG, Chul-Yong JANG
  • Publication number: 20150108206
    Abstract: Some embodiments of the present disclosure relate to an apparatus and method to form a pattern of solder bumps. A solder paste is applied a plate comprising a pattern of holes, where each hole is partially filled by a piston attached to a movable stage. The remainder of the holes are filled by applying a force to the solder paste with a first solder paste application tool. A second solder paste application tool then removes excess paste from the front surface of the plate. The solder paste is then disposed onto a surface of a substrate by moving the movable stage, which fills a larger portion of each hole with a piston, forces the solder paste out of each hole, and forms pattern of solder paste on the surface of the substrate. The pattern of solder paste is then subjected to additional processing to form a pattern of solder bumps.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Li Hsiao, Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20150110548
    Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventor: Aarne H. Reid
  • Patent number: 9004343
    Abstract: In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyuki Inoue, Tadayoshi Ohtashiro
  • Patent number: 8991480
    Abstract: Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond components of the heat exchanger together. It has been found that good quality brazed joints can be made by modifying the brazing thermal cycle to first employing a temperature of about 500° C. for an extended period of time and then elevating the temperature to about 590° to 600° C.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 31, 2015
    Assignee: UOP LLC
    Inventor: Thomas J. Godry
  • Patent number: 8985430
    Abstract: A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: March 24, 2015
    Assignee: Zimmer, Inc.
    Inventors: Steven J. Charlebois, Leslie N. Gilbertson, Michael E. Hawkins, Dana J. Medlin, H. Ravindranath Shetty, Steven A. Zawadzki
  • Patent number: 8987629
    Abstract: A process for closing an opening in a surface of a component, and components formed thereby. The process entails forming a channel in the component surface so that the channel at least partially surrounds an opening at the component surface. An alloy is then deposited in the channel to form a crack-free deposit in the channel. A step is then machined that intersects the opening and is at least partially formed in the deposit. The step defines a recess that is at least partially surrounded by a peripheral portion of the deposit and has a surface recessed into the component surface. A cap is placed in the recess and welded to the peripheral portion of the deposit to define a weld joint that completely closes the opening. The surface of the weld joint is then machined to form a machined surface that is substantially flush with the component surface.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: March 24, 2015
    Assignee: General Electric Company
    Inventors: Yan Cui, Gitahi Charles Mukira, Srikanth Chandrudu Kottilingam
  • Publication number: 20150078810
    Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 19, 2015
    Inventors: Paul Joseph Koep, Ellen S. Tormey, Girard Sidone
  • Publication number: 20150069999
    Abstract: A method for contacting at least two metal electrodes, wherein the metal electrodes are located in a cavity of a basic body of sintered ceramic and frontal end faces of the metal electrodes. The metal electrodes are arranged essentially planparallel to an outer surface of the basic body. The method includes steps as follows: introducing a solder into at least one hole of the basic body, wherein the hole is so embodied that it leads to a rear portion of the metal electrode away from the frontal end face of the metal electrode wherein the solder can wet the rear portion of the metal electrode, wherein the metal electrodes are in their longitudinal direction shorter than the basic body, especially have only ? of the length of the basic body; introducing a cable into the hole at least until the cable extends into the solder; and heating the basic body with solder and cable above the solidification temperature of the solder.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 12, 2015
    Inventors: Stephan Buschnakowski, Alexander Serfling
  • Publication number: 20150060529
    Abstract: A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.
    Type: Application
    Filed: April 10, 2012
    Publication date: March 5, 2015
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Hiromitsu Oka, Tetsuo Hayashi
  • Publication number: 20150061129
    Abstract: A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, lsamu Sato
  • Patent number: 8967453
    Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: March 3, 2015
    Assignee: GM Global Technology Operations LLC
    Inventors: Khiet Le, Vicentiu Grosu, Gregory S. Smith, Yunqi Zheng, Gregory D. Rosdahl
  • Publication number: 20150053753
    Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.
    Type: Application
    Filed: March 30, 2012
    Publication date: February 26, 2015
    Applicants: Applied Nanoparticle Laboratory Corporation, Shindengen Electric Manufacturing Co., Ltd.
    Inventors: Teruo Komatsu, Ryo Matsubayashi
  • Patent number: 8960526
    Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: February 24, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tadashi Maeda, Tadahiko Sakai
  • Patent number: 8955735
    Abstract: A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: February 17, 2015
    Assignee: Zen Voce Corporation
    Inventors: Chao-Shang Chen, Yu-Kai Lin
  • Patent number: 8950652
    Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Patent number: 8950653
    Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: February 10, 2015
    Assignee: Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Schäfer, Wolfgang Schmitt, Jian Zeng
  • Patent number: 8944309
    Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: February 3, 2015
    Assignee: The Regents of The University of Michigan
    Inventors: Stephen R. Forrest, Gregory McGraw
  • Publication number: 20150030837
    Abstract: The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040° C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.
    Type: Application
    Filed: March 27, 2013
    Publication date: January 29, 2015
    Applicant: ALFA LAVAL CORPORATE AB
    Inventors: Per Sjödin, Kristian Walter
  • Patent number: 8939347
    Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: January 27, 2015
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Ravindranath V. Mahajan
  • Publication number: 20150021378
    Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.
    Type: Application
    Filed: October 7, 2014
    Publication date: January 22, 2015
    Inventors: Michael SCHÄFER, Wolfgang SCHMITT, Jian ZENG
  • Publication number: 20150014399
    Abstract: The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 ?m to 1.0 ?m; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate.
    Type: Application
    Filed: March 21, 2013
    Publication date: January 15, 2015
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Toshinori Ogashiwa, Masayuki Miyairi, Akikazu Shioya
  • Patent number: 8915418
    Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: December 23, 2014
    Assignees: Tadatomo Suga, Masataka Mizukoshi, Alpha Design Co., Ltd.
    Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
  • Patent number: 8915419
    Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: December 23, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Su Jin Lee, Hye In Kim, Young Kwan Lee, Chang Kyung Woo, Je Kyoung Kim