Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: Method for manufacturing a heat pipe is disclosed. A tube and a vessel mesh are provided. Solder paste in a pattern is coated on the vessel mesh. The vessel mesh is rolled into a vessel and the vessel is placed in the tube. The tube is heat to weld to the vessel to the tube. The present disclosure also provides an exemplary heat pipe having a vessel welded therein.

Abstract: A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.

Abstract: An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.

Abstract: In a Ni-based, Co-based, or Ni—Co-based braze alloy (1) for high-temperature brazing of components (7) of modular structure and for repairing damaged components (7) which are formed of single crystal or directionally solidified superalloys using said braze alloy (1), the braze alloy has a first metallic powder component (2) having particle sizes in the nanometer range and a second metallic powder component (3) having particle sizes in the micrometer range. The surface of the particles of the second powder component (3) is thinly coated with particles of the first powder component (2). The braze alloy (1) additionally includes grain boundary stabilizing elements as alloying elements. In addition, melting point depressants can be present in the braze alloy (1) in a commercially common quantity or with a considerably increased proportion. Both the melting temperature of the braze alloy (1) and the probability of recrystallization are advantageously reduced.

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Abstract: A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member.

Abstract: A method for producing a metal sheet with a welded-on tube which has at least partially curved sections, wherein the tube is guided by at least one guide element onto the sheet, is pressed thereon with at least one pressure element and is welded thereto at least at some points and wherein the tube is bent to form the curved sections. In order to achieve the welding-on in a simple manner even in the curved sections, it is provided that a bending is carried out in a plurality of discrete steps, wherein in individual steps firstly the tube with the at least one guide element is bent around a last created welding point and thereafter a new welding point is created. Furthermore, the invention relates to a device for carrying out the method.

Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

Abstract: A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XY? stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion.

Abstract: A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball.

Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Abstract: The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

Abstract: A system and method of restoring material properties is disclosed. A subject material may have one or more of its material properties restored by contacting a packed bed of a reactive material contained within a container with the subject material in which material properties are desired to be restored. The packed bed and the subject material may be heated to restore the material properties. The packed bed may be formed from boron, silicon or other appropriate materials. An inert atmosphere system may have an argon injection system or a helium injection system in communication with the container. A deoxidizing system may be in communication with the container for creating a vacuum within the container or injecting hydrogen into the container.

Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Abstract: A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.

Abstract: A method for depositing material on a turbine airfoil having a tip wall extending past a tip cap, wherein the tip wall includes a first alloy with a single crystal microstructure. The method includes: depositing a second alloy on at least a portion of the tip wall to form a repair structure, wherein a high temperature oxidation resistance of the second alloy is greater than a high temperature oxidation resistance of the first alloy, and wherein the repair structure has a crystallographic orientation that is substantially the same as a crystallographic orientation of the tip wall.

Abstract: Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

Abstract: A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.

Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.

Abstract: A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer.

Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.

Abstract: A continuous hot bonding method for producing a bi-material strip with a strong bond therebetween is provided. The method comprises sanding a first strip formed of steel; and applying a layer of first particles, typically formed of copper, to the sanded first strip. The method next includes heating the first strip and the layer of the first particles, followed by pressing a second strip formed of an aluminum alloy onto the heated layer of the first particles. The aluminum alloy of the second strip includes tin particles, and the heat causes the second particles to liquefy and dissolve into the melted first particles. The first particles and the second particles bond together to form bond enhancing metal particles, which typically comprise bronze.

Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminum. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.

Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Abstract: Disclosed herein are a solder paste print squeegee and a method of using the same. The solder paste print squeegee includes: a rotation module driven rotatably; a pair of rods coupled with the rotation module in parallel; a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; and a pair of squeegee blades supported by the squeegee holder.

Abstract: In supplying flux to a brazing heat exchanger member, a given amount of the flux is stably adhered to brazing portions without interposing any substance which becomes unnecessary for the brazing such as binder. In manufacturing a heat exchanger member, particles containing flux are injected to a surface of a substrate made of aluminum or its alloy at a temperature lower than a melting point of the flux by 30° C. or more to collide against the surface at an average speed of 100 m/sec or higher to thereby mechanically adhere the particles thereto.

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract: A semiconductor device includes an electrically conducting carrier and a semiconductor chip disposed over the carrier. The semiconductor device also includes a porous diffusion solder layer provided between the carrier and the semiconductor chip.

Abstract: Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

Abstract: A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.

Abstract: A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.

Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.

Abstract: A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.

Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: The invention relates to a method for joining objects made of metal, plastic, hybrid structures or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles as heat is being applied to the joint.

Abstract: The present invention relates to a starting material for producing a sintered connection. In order to avoid the formation of cracks in the joining partners in the case of fluctuating thermal loading, the starting material comprises second particles 20 in addition to metallic first particles 10, wherein the second particles 20 at least proportionately contain a particle core material which has a coefficient of thermal linear expansion ? at 20° C. which is less than the coefficient of thermal linear expansion ? at 20° C. of the metal or of the metals of the first particles in metallic form, and wherein the D50 value of the second particles 20 is greater than or equal to half the D50 value of the first particles 10 and less than or equal to two times the D50 value of the first particles 10. In addition, the present invention relates to a corresponding sintered connection 100?, to an electronic circuit 70 and also to a process for forming a thermally and/or electrically conductive sintered connection.

Abstract: A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.

Abstract: The present invention describes a new method for creating hybrid edge seals using metal, alloy, powder coated metal and other conductive surfaces in between two substrates. The methods utilize various materials, seal designs, and geometries of hybrid seals based on polymeric powder coatings and glass powder coatings.

Abstract: The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles 20, in addition to metallic first particles 10, which at least proportionately contain elemental silicon and/or silicon dioxide. In addition, the present invention relates to the use of elemental silicon and/or silicon dioxide for reducing the coefficient of thermal linear expansion ? of a starting material 100 of a sintered join 100? or of a sintered join 100?, in particular in a sintered paste, a sintered powder or a sintered material preform. Furthermore, the present invention relates to sintered joins 100?, to electronic circuits 70 and also to processes for forming a thermally and/or electrically conductive sintered join.

Abstract: A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO2, Al2O3, YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.