Abstract: The present invention relates to an apparatus for mass production of metal substrates used in catalytic purification of exhaust gas, which comprises: (a) an uncoiler part for continuously feeding a strip in the lengthwise direction, wherein said strip is coiled along the rotation axis; (b) a tubing processing part for changing the strip into the shape of a pipe by means of gradually putting pressure through multi-stage rolls onto the both side edges of the strip in feed from said uncoiler part; (c) a feeder part, which is installed at one side of said tubing processing part, for feeding a pre-made honeycomb body at an equal interval to the strip being changed into the shape of a pipe; (d) a welding part, which is installed at the rear end of said tubing processing part, for welding into a unit the both side edges of the strip in feed after being changed into the shape of a pipe; (e) a sizing part, which is installed at the rear end of said welding part, for evening the girth of the pipe in feed; and (f) a cut

Abstract: The invention is a single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1.

Abstract: The present invention is drawn to a method of making solder bump interconnections or BGAs ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit board connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other.

Abstract: A microelectronic connection component is provided with leads having a surface wettable by a bonding material such as a solder at the tips of the leads which are intended to be bonded with microelectronic devices. The leads have non-wettable surfaces bounding the wettable surfaces. During bonding, the non-wettable surfaces confine liquid bonding material such as liquid solder and prevent the liquid bonding material from spreading along the leads.

Abstract: Ultra-small satellite droplets of molten metal, generated from capillary stream break-up, are selectively directed to predetermined locations on a substrate. The satellite droplets are produced at a high rate and are highly uniform because of the nature of capillary stream break-up. Applied harmonic disturbances are used to control and generate the satellite and parent droplets. The satellite droplets are electrostatically charged on a droplet-by-droplet basis and are then deflected by, e.g., an electric field to predetermined locations on a substrate. The substrate is moveable, attached to an x-y table, for facilitating the placement of satellite droplets on the substrate. The satellite droplets can be placed in individual locations on the substrate (e.g., for forming a ball grid array) or can be overlapped to form conductive traces. Because the satellite droplets have small diameters, these traces may have correspondingly small widths or pitches.

Abstract: By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material

Abstract: Disclosed is a method of manufacturing a golf club head in which in integrating a metal plate part with a club head main body, either a fused metal or a fused ceramic is adhered onto a surface of the metal plate part before the metal plate part is welded to the club head main body, and the metal plate part is then welded to the club head main body thus integrating the metal plate part with the club head main body.

Abstract: A method of welding an assembly comprising two aligned cylindrical end pieces and an interposed transverse intermediate piece, the method comprising friction welding the end pieces to the intermediate piece, where the intermediate piece is held in a cavity of a holder. The intermediate piece is made from strip stock and has a non-round profile to form radially protruding ears, the ears contacting the correspondingly shaped cavity in the holder.

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract: The soldering method comprising the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed to the trowel members, and the soldering point to which molten solder has been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a flip chip, or ball grid array package. The wiring substrate has a thermal expansion stress reduction insert, void, or constructive void in a thermal expansion stress region proximate to the integrated circuit. The thermal expansion stress reduction insert or void may extend a selected distance from the edge or edges of the integrated circuit attachment area. The thermal expansion stress reduction insert or void improves the flexibility of the wiring substrate in the region that is joined to the integrated circuit, thus reducing thermal stress between components of the wiring substrate-integrated circuit assembly. In another embodiment, layers of a laminated wiring substrate are intentionally not bonded beneath the chip attach area, thus allowing greater flexibility of the upper layer of the laminate.

Abstract: In a soldering method for soldering a thermit case 26 and a pair of bus bars 11a, 19a to be electrically connected to the thermit case 26, a portion to be heated P of the thermit case 26 which is spaced from the respective bus bars 11a, 19a by an approximately equal distance is heated by a gas burner 71, and solders are simultaneously supplied from solder wire supply portions 75a, 75b to a pair of solder joining faces 22 for joining the thermit case 26 and the pair of bus bars 11a, 19a, after the portion to be heated P has been heated. The temperatures of the pair of solder joining faces 22 are made substantially equal to each other by heating the portion to be heated P so that solders are simultaneously supplied to the pair of solder joining faces 22.

Abstract: A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

Abstract: A method is disclosed of manufacturing a pulley with integral bearing comprising a sheet metal pulley mounted on the outer race of a bearing. The pulley is a close sliding fit on the outer race. The interstice between the pulley and the race is at least partly filled with a low-melting-point filler metal which, when heated, melts and diffuses by capillary action into the interstice between the pulley and the race, at least partly filling the interstice and fastens the pulley to the race when it solidifies. The filler metal is advantageously a brazing alloy having a melting point much lower than that of the parts to be joined together. Applications of the method include the manufacture of belt tensioning pulleys with integral bearings, as used on automobile vehicle engines, for example.

Abstract: A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

Abstract: The present invention is a method of sealing a metal vacuum structure (vacuum bottle) for evacuating a space S closed by component members (an inner shell 2 and an outer shell 3) through an evacuation port and then sealing the evacuation port.

Abstract: The present invention is drawn to a method of making solder bump interconnections or BGA ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit boards connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other.

Abstract: The method for hermetically encapsulating microsystems in situ consists, in a first phase, of mounting on a common substrate (1), several microsystems (6) surrounded by a metal adhesion layer (4) deposited on the substrate (1). In a second phase, in a common deposition step a first metal layer (7) is deposited by electrolytic means on each microsystem (6) and on an annular zone (7a) of the adhesion layer (4) surrounding each microsystem (6), so as to completely cover each microsystem by overlap. Subsequently a second metal layer (9) is deposited by electrolytic means on the first metal layer (7) and on the adhesion layer so as to cover most of the first layer with the exception of at least one passage (10) per microsystem (6), providing access to the first layer (7). The metal of the first layer is different from the metals of the adhesion layer, the second layer and the microsystem.

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract: Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.

Abstract: A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the workpieces to be joined; mechanically activating the molten solder material, to break oxide films on the solder material, while the solder material contacts the surfaces of the workpieces to be joined; assembling the surfaces of the workpieces to be joined; and applying pressure to the surfaces of the workpieces to be joined both while the solder material is molten and as the solder material cools to a solid.

Abstract: A method has been formed for direct solder "bumping" of wafers, chips and interconnection pads or traces on hard to solder surfaces such as aluminum and indium tin oxide. It has been discovered that conventional solders modified by the addition of a light reactive metal can be jetted in the form of microdroplets onto a hard to solder substrate and that the modified droplets will wet and bond to the surface of the hard to solder substrate. This makes it possible for the first time to create solder bumps on bare uncoated hard to solder substrates such as aluminum and indium tin oxide without the need for first applying a different surface which conventional solder will wet.

Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

Abstract: A wear surface for helicopter shoes is constructed by forming a railed enclosure on a curved base plate, placing a mosaic of smooth-surfaced tungsten carbide blocks on the base plate within the enclosure, brazing the blocks to the plate and rails, and grinding the rails to form a smooth, edgeless transition between the wear surface and the plate surface.

Abstract: Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

Abstract: The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).

Abstract: An essentially fluxless solder joining process comprises a solder coating to be applied to a surface under controlled pressure conditions enabling the volume and shape of the solder to be desirably controlled. Coatings produced by essentially fluxless processes enable joining processes to be carried out in an essentially fluxless manner with highly desirable processing flexibility.

Abstract: A component made of superalloy is provided with a localized coating formed from three layers by a brazing heat treatment, the layers comprising an outer layer having a composition adapted to the specific surface properties sought, an inner layer having a composition which includes flux elements, and an intermediate layer obtained by the deposition of a mixture of the materials used for the other two layers.

Abstract: An essentially fluxless soldering process enables a solder coating to be applied to a surface under controlled pressure conditions enabling the volume and shape of the solder to be desirably controlled. Coatings produced by essentially fluxless processes enable joining processes to be carried out in an essentially fluxless manner with highly desirable processing flexibility.

Abstract: A bump having a shape adapted to bonding of a flip chip method and an enough volume is efficiently accurately formed at low costs. By applying a pressure into a chamber, a fused solder 8 in the chamber 1 is extruded from a micro opening 3 and adhered onto a pad 12. After that, by eliminating the pressure, the fused solder is separated by the surface tension of the fused solder itself and is allowed to remain as a solder bump onto the pad.

Abstract: A method of bonding a sputtering target to a backing member or plate for subsequent use in a sputtering operation. A target and a backing plate are first provided and one face of each of the target and backing plate are wetted with solder. The target and backing plate are then submerged in a solder bath, and the wetted faces of the target and backing plate are pressed into contact. The target and backing plate are then removed from the solder bath and while maintaining them pressed together, the solder interface therebetween is cooled directionally by causing cooling to occur from the center of the solder interface radially outwardly toward the periphery. The lowermost of the target and backing plate is provided with a circumferential lip adjacent the periphery of the solder interface.

Abstract: Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes in the board while leaving sufficient solder on the surface mount features. Additionally, a Mach number of the fluid of less than 0.8 is created.

Abstract: A system and process, including a combination of a solder well and a vacuum system wherein micro through holes are filled with solder. A PC board or the like is supported for contact with solder on one side and with a vacuum apparatus for the application of a vacuum to the other side so that solder is drawn into the through holes for establishing electrically conductive connections therethrough.

Abstract: A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a molten solder bath. The electronic device, with the leads to be solder plated exposed, is lowered horizontally in the solder bath and is pulled out horizontally. A large quantity of solder adhering on the inclined plate pulls solder adhering on the leads sequentially along an inclined surface of the plate to obtain uniform thickness of solder plating on the leads without causing bridging.

Abstract: The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.

Abstract: This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.

Abstract: A device for applying solder to two opposite faces of an object, such as an array of conductors of a flat electrical cable, in a predetermined location, comprises a support sheet having a line of weakness along which the sheet can be folded to define two arms, each having a free end; a quantity of solder located on a face of each of the arms of the support sheet; and means for controlling flow of the solder, when heated, in a direction perpendicular to the line of weakness. The controlling means may be a strip of a resiliently deformable material.

Abstract: A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the leads. Thereafter, the tips of the leads of the component are placed in contact with the solder spheres while, at the same time, at least a pair of leads are each engaged by a separate one of a pair of alignment pins (32) rising upwardly from the baseplate. The alignment pins serve to constrain the lateral movement of the component, thereby maintaining the leads thereof in alignment with the solder spheres when the solder spheres are reflowed to bond to the tips of the leads.

Abstract: This invention relates to heat-shrinkable devices for forming solder connections between two bodies such as electrical conductors or pipes. The devices each comprise a hollow, heat-shrinkable sleeve having at least one aperture and containing first and second solder inserts. The solder inserts are located adjacent to each other and the second insert responds to heat applied to the device more slowly than the first insert. Usually the second insert has a higher melting point than the first insert. When the device is installed the first solder insert melts but is prevented from flowing out of the aperture in the device by the second insert. Also flow of the fused first solder insert onto the second solder insert causes the second insert to melt with less heat being applied to the device than would be needed if only the second, higher melting point solder insert were present in the device.

Abstract: A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium, with an array of cavities matching the component lead pattern, each having a volume corresponding to the desired amount of solder to be applied to the corresponding lead. The method includes placing solder paste on the transfer member and filling the cavities by wiping the plate surface. The component is placed on the transfer member with the leads contacting the solder paste in the cavities. Reflow of the solder paste bonds to each lead a discrete body of solder having a precisely determined size.

Abstract: A carrier matrix for use in the manufacture of a catalytic reactor for the purification of exhaust gases in an internal combustion engine of a motor vehicle is prepared by joining in wound form a corrugated steel sheet and a generally flat steel sheet, the sheets being joined in locations where they contact one another by the use of solder or brazing material. In one embodiment solder is applied in spots along the tops of the arches of the corrugated sheet, and after coiling the solder is activated by heating. In another embodiment, coiling is first carried out and then soldering is accomplished by the application of solder into one or both end faces of the coil.

Abstract: A inexpensive pressure vessel which can be disposed of rather than being repaired once it fails, which includes a cylindrical housing having two chambers separated by a resilient bladder. One chamber is for housing a gas while the second is for housing a fluid such as hydraulic oil. The cylindrical housing contains a port at one end and is open at the opposite end. The end cap which contains a through port and a gas valve is insertable into the open end of the cylindrical housing and is welded thereto. This weld joint in conjunction with a seal formed by attaching the resilient bladder to the end cap, will positively seal the pressure vessel. The unique seal between the end cap, bladder and housing is such that it will not be thermally damaged by the welding process which seals the end cap to the cylindrical housing.

Abstract: Honeycomb structures, such as those used in turbine engine abradable seals, are provided with a uniform density filling of a suitable abradable material. The abradable material is prepared as a tape preform using an organic binder. The preform is forced into the honeycomb using a rubber tool.

Abstract: A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead.

Abstract: The invention concerns a process for the final assembly of a nuclear reactor vessel comprising two sub-assemblies which are brought together and welded along mating surfaces. At least three female centering stubs, each associated with a seat recessed relative to the outer surface of the stub, are provided on the mating surface of one of the sub-assemblies, and at least three male centering stubs, corresponding to the seats of the female stubs, are provided on the mating surface of the other sub-assembly, the positions of the stubs being registered relative to elements for positioning internal fitments of the vessel. The two sub-assemblies are brought together to engage the male stubs in the female stub seats and to bring projecting annular ridges on the mating surfaces into contact. A key is inserted into a socket defined by one of the pairs of stubs and the stubs are then joined to each other by point-welds.

Abstract: A method of manufacturing hand wrenches having a relatively long handle attached at one end to a yoke pivotally carrying the housing of a ratcheting socket drive mechanism fabricates the yoke, instead of casting or forging it, and employs a separate ferrule at the joint between the handle and the yoke, the parts being held in assembled relation and rotated while during a two step operation weld metal is deposited between the ferrule and the yoke, the legs of the yoke at the same time being compressed upon the ratchet housing.

Abstract: When a welded joint is produced for joining metal components by applying a plurality of layers of deposited metal, the plurality of layers of deposited metal are provided in a groove of a weld preparation formed between the metal components to be joined in such a manner that each layer of deposited metal has a small thickness and a large width crosswise of the groove and the layers are arranged to be superposed one over another. During this process, a coarse metal structure formed when each underlying layer of deposited metal is provided is completely tempered and transformed into a fine metal structure by the heat generated when each overlying layer of deposited metal is provided. Thus the welded joint produced by this method shows an excellent performance in service.

Abstract: A method of welding together two members placed with the edge surfaces to be joined in mutually facing relationship and separated by a weld gap. A weld material is endothermically heated to a molten state and flowed through the weld gap for heating the members to cause melting of the edge surfaces with the weld metal flow being continued for a time sufficient to provide a ratio of weld gap metal to total metal flowed of at least 1:50, and then the flow is terminated to provide for weld solidification.