Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area along at least a portion of a length of the second section.

Abstract: A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate electronic devices by any electrostatic discharge, an ultrasonic bonding wedge tool tip must conduct electricity at a rate sufficient to prevent charge buildup, but not at so high a rate as to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 105 to 1012 ohms. In addition, the wedges must also have specific mechanical properties to function satisfactorily.

Abstract: A tension mechanism that applies a back tension to a wire in a bonding apparatus including: a first nozzle which has a through-hole through which the wire passes, second and third nozzles which have diameters that are larger than the diameter of the through-hole of the first nozzle and which are disposed above and below the first nozzle, a first air passage formed in the joining surfaces of the first nozzle and second nozzle, and a second air passage formed in the joining surfaces of the second nozzle and third nozzle. A compressed air supply device is connected to the tension mechanism and supplies compressed air to the first air passage from an air supply source, and a vacuum suction device is also connected to the tension mechanism and applies vacuum suction to the second air passage from a vacuum supply source.

Abstract: A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined and a wire feeding hole being open to the pressing surface; a wire feeding means for feeding the wire to an outside of the bonding tool through the wire feeding hole; and an attracting and holding means for applying an attraction force to a wire tip end part that is protruded from the wire feeding hole, thereby to bend and hold the wire tip end part towards the pressing surface.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: Wire-bonding between first and second bonding parts of an electronic component is done by first using a capillary tool to press downward to thereby bond a first end of a metallic wire to the first bonding part and to bend the metallic wire towards the second bonding part and then by using a bonding tool having a sloped lower surface to bond the other end downward towards and onto the second bonding part. The sloped lower surface of the bonding tool is wide enough and extends at least to a center part of the metallic wire and is sloping diagonally upwards towards the first bonding part. The sloped surface may have two sections having different slope angles.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a damper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the damper is set as a very short distance as 1.5 mm or less.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: There is provided a wire bonding apparatus operated steadily at a high speed without excitation of vibrations of an XY stage 102 and a capillary 104, which are movable parts. The wire bonding apparatus is configured so as to have a composite target path generating section 208 for generating a target path 109, in which the deceleration part of a go path and the acceleration part of a return path are composed to one continuous path, for a path part of reciprocating movement of said target path indicating a motion process of either one or both of the XY stage and capillary. Therefore, the period of a composite target acceleration path can be set long while the required time until the end of path is shortened, and the wire bonding apparatus can be operated steadily at a high speed without excitation of vibrations of the XY stage and capillary, which are movable parts.

Abstract: A wire bonding method in which first and second bonding points are connected by a wire comprising the steps of: connecting the wire that passes through a capillary to a first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising and moving the capillary toward the second bonding point and then lowering the capillary slightly, raising the capillary and performing at least once another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point and connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.

Abstract: An apparatus for making wire connections between a first connection area (2) and a second connection area (3) by means of a capillary (10) contains an image recognition system which is designed so that the tip (27) of the capillary (10) enters the image area of the image recognition system immediately before impacting on the respective connection area (2). In this way, the position of the desired point of impact of the capillary (10) on the connection area (2) as well as the position of the tip (27) of the capillary (10) can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary (10).

Abstract: A rotation device provides precise, stepwise rotation of a wire bonding capillary about the longitudinal axis of the capillary. This enables the capillary to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device can be a click ring-type device, a cam-type device or any other device to provide stepwise rotation. At least a part of the rotation device is coupled to the capillary. Another part of the rotation device is separate from the capillary but engageable with the first part to provide rotation. Indicators may be positioned on the capillary to provide signals to detectors. The signals can be used to initially align the capillary and to realign the capillary during wire bonding. A computer may be used to provide automated control of the indicators and detectors, and automated rotation of the rotation device.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A wire bonding apparatus for a semiconductor device comprising a semiconductor chip, and a lead frame having a die pad to which the semiconductor chip is joined and a plurality of inner leads which are aligned along a periphery of the die pad at specified intervals. The apparatus includes a heat block having an inner lead mounting portion for mounting the inner leads, a concave portion provided inward of the inner lead mounting portion and at least one supporting pad for mounting the semiconductor chip. Influences of restoration of the lead frame on wire bonding portions can be decreased at the time the lead frame forcing means is detached.

Abstract: A high-speed multi-task system which configures with an industrial personal computer and a numerical controller. The industrial personal computer handles the human-machine interface, visual function and main process control, while the numerical controller controls the movements of hardware and input/output. Conventional serial communication port RS-232 is employed for data transmission between the two sub-systems. The high-speed multi-task system of the present invention is built to work in a real-time extension environment to optimize the control and efficiency of a wire bonding system.

Abstract: A wire bonding capillary (1), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (5) for feeding a bonding wire, a funnel-shaped bore (3) for guiding the wire to the through bore, and a tapered portion (11) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.

Abstract: A method of wire bonding for small clearance employs a conductive bump over the pad of a chip to prevent a capillary from colliding with the chip during three-dimensional package wiring process. The conventional constraint which limits the clearance to greater than 0.2 mm so as to find an appropriate capillary is overcome in this method.

Abstract: A method of forming a bump, comprising: a first step of bonding a ball-shaped tip portion of a conductive wire to an electrode by a first tool so that a portion of the tip portion, positioned around a central portion that leads to the conductive wire and avoiding an outer peripheral portion, is pressed and plastically deformed by the first tool; a second step of tearing off the conductive wire in such a manner that the tip portion remains on the electrode; and a third step of pressing at least the central portion of the tip portion by a second tool to cause plastic deformation.

Abstract: A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a first diameter; a second cylindrical section coupled to an end of the first cylindrical section, the second cylindrical section having a second diameter less than the first diameter; and a tapered section coupled to an end of the second cylindrical section.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: A method of wire bonding for small clearance is disclosed. The method employs a conductive bump over the pad of the chip to prevent the capillary from colliding with the chip during the three-dimensional package wiring process The conventional constraint which limits the clearance to greater than 0.2 mm so as to find the appropriate capillary is overcome in this method.

Abstract: A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

Abstract: The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used for creating the permanent electrical connection between each high power semiconductor chip and the high power hybrid module. The soldering reflow process is used to attach each SMT component to the high power hybrid module. The automated high power hybrid modules assembling process yields the high power hybrid modules with excellent thermal properties.

Abstract: A wire bonding method for connecting first and second points with a wire, comprising the steps of: connecting the wire to the first bonding point, raising the capillary and performing a reverse operation so as to move the capillary in the opposite direction from the second bonding point, raising the capillary obliquely upward toward the second bonding point (and then raising the capillary further), then raising the capillary and performing another reverse operation so as to move the capillary in the opposite direction from the second bonding point, and raising and then moving the capillary toward the second bonding point, thus connecting the wire to the second bonding point; thus forming a stable wire loop that has a high shape retention strength.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes generating an ultrasonic output table. In the table, the current status of the bonding process is represented as a function of the gradient of deformation of the wire, the impedance of the transducer-bond wedge unit, as well as the currently reached deformation of the wire. The desired gradient of deformation of the wire, a function of the particular status of the process, is specified as the desired value. A correcting variable for the ultrasonic generator is calculated by the addition of correction values formed in the controller to the respective current table values.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. Byway of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die are available. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling oscillation to seal a small size of surface mounting type quartz oscillator or the like. A bonding face (1a) of a sealing metal cap (1) is positioned on a bonded face (2a) of a package substrate (2), and ultrasonic oscillations of different directions are simultaneously imparted in the bonding plane while a suitable load is applied from an upper or a lower part of the bonding portion to the plane in a vertical direction so that the sealing metal cap (1) and the package substrate (2) are welded and fixed to be sealed on the bonding face.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: The ball bump mainly includes a body and a protrusion. The protrusion is located at the upper of the body and essentially consists of a flat upper surface with an annular inclination. The flat upper surface and the annular inclination together define the area for wire bonding.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: In a bump forming method and its forming apparatus, a torch is made to approach a bottom end of a wire extended from a capillary tool to form a ball, thereafter the wire is held by first clampers to lower the capillary tool, and the ball is inserted into the bottom end of the central hole of the capillary tool. Then, the wire is held by the first clampers so that it does not lower and cut by lowering of the capillary tool. Moreover, the capillary tool is further lowered and the ball is pressed against the electrode of a workpiece to bond the ball to the electrode to form a bump. A tail protruded from the bump is crushed by pressing a pressing jig against the tail to make the height of the bump uniform. Thereby, the ball is firmly bonded to the electrode and the joint surface between the ball and the electrode is not damaged.

Abstract: A method and apparatus for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing &mgr;BGAoIC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the tape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. Afterward, the center line of the inner lead is recognized, the inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.