Abstract: An apparatus and method are provided for attenuating vibration when driving an object. The apparatus includes a driving device for generating a driving force to drive the object and an attenuation actuator mounted in reciprocal relationship with the driving device for generating an attenuation force substantially concurrently with the generation of the driving force. The attenuation force is generated so as to oppose and at least partially cancel a reaction force exerted by the object in response to the driving force.

Abstract: An optically baffled heating station for joining wire connections by using a solder sleeve includes: an outer housing; a reflection block where said reflection block includes a reflection chamber where the reflection chamber forms the shape of two overlapping ellipses where the ellipses intersect at one respective focal point of each ellipsis and the opposing non-intersecting focal points are separated by about a 90° angle; two heating elements within a heating element block where the two heating elements extend beyond the heating element block and protrude into the reflection pockets of the reflection chamber. A slot extends between the two heating elements through the reflection block and the heating element block. The closed end of the slot includes a target area where the shrinking of the sleeve occurs. The target area receives the reflected light and minimizes the reflection of light toward the open end of the slot.

Abstract: An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.

Abstract: An ultrasonic horn used in a wire bonding apparatus and includes a horn main body that has a capillary, which is at one end of the horn main body and through which a wire is passed, and a vibrator, which is at another end of the horn main body; and the horn main body being formed with at least two grooves that extends along the central axis of the horn main body. The cross-sectional shape of the portion of the horn main body where the grooves are formed is, for instance, left-right symmetry, top-bottom symmetry, or left-right and top-bottom symmetry; and the cross section of the portion of the horn main body where the grooves are formed, for instance, a cruciform shape, X shape, Y shape or H shape.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body, which may include head member, and a tail member. In some aspects, the tool body may include a support member of a super hard material that is coupled to the pressing member along a bonding surface thereof. Further, in some aspects, the tool body may contain a heat directing member that facilitates the transfer of heat energy in a direction toward the pressing member. Such compression bonding tools have been found useful in a variety of well-known procedures, such as tap bonding systems (TAB).

Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

Abstract: Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding contact area, wherein the knife is mounted so as to be yielding with respect to the movement component perpendicular to the substrate surface, so that the force acting on the cutting edge of the knife when the knife encounters the substrate is limited to a prespecified peak value.

Abstract: Apparatus for detecting the oscillation amplitude of an oscillating object (3) includes an optical radiation source (9) and a detector (10) including first and second optical radiation sensing areas (24A, 24B) adjacent each other. The detector (10) and the optical radiation source (9) are adapted to be located opposite each other with the oscillating object (3) located between the source (9) and the detector (10) so that the object (3) blocks a portion of the sensing areas (24A, 24B) from receiving optical radiation from the source (9). A processor (18) coupled to the detector (10) receives first and second output signals representing the magnitude of optical radiation sensed by the first and second optical radiation sensing areas (24A, 24B), respectively. The processor (18) processes the first and second output signals to obtain an indication of the amplitude of oscillation of the object (3).

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.

Abstract: Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.

Abstract: An auto-feed terminal wire clamping machine and its terminal structure comprises a terminal wire clamper having a feeding groove, and the feeding groove at its rear end having a feeding push rod and at its front end having a terminal mold plate module that further comprising an upper mold plate and a lower mold plate; an aligning conveyer comprising an aligning groove with an opening at one end coupled to the side of the feeding groove; an auto aligning feeder having a vibratory disc on a machine table, and such vibratory disc having a spiral track that includes a positive and inverse alignment area, an angle alignment area, and an open position alignment area; wherein the spiral track is coupled to an opening at another end of the aligning groove; by the foregoing structure, this invention can automatically sieve and randomly arrange the disordered terminal inner molds and feed them in an ordered direction to the feeding groove of such terminal wire clamper and automatically complete the terminal wire clampi

Abstract: Wedge wire bonding apparatus are disclosed with an improved configuration in which the transducer axis lies on a line that bisects the XY axes, and the operator views the bonding process by looking directly along the axis of the transducer. The result is a shorter bonding cycle time as time is saved as the bonding head moves from a first to a second bonding position while at the same time the operator is placed in the best possible position for viewing the bonding operation, which facilitates in particular any necessary alignment and set-up steps.

Abstract: A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to meld the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

Abstract: A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial distance D. The Wire Bonder has a device with a body with an optical marking and with two stop faces that enable the vectorial distance D to be recalibrated at any time. The control program of the Wire Bonder is set up on the one hand to move the capillary towards the first stop face and to determine a first co-ordinate xC of the position of the bondhead as soon as the capillary touches the first stop face and then to move the capillary towards the second stop face and to determine a second co-ordinate yC of the position of the bondhead as soon as the capillary touches the second stop face.

Abstract: A method for insulating a bonding wire that includes the steps of attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire through a bond tool from the bond pad to a package lead.

Abstract: The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: An ultrasonic horn assembly for applying ultrasonic energy at an operating location which assembly includes a metallic fusion zone at an interface between adjacent horn assembly components. A method of manufacturing an ultrasonic horn assembly including forming this metallic fusion zone.

Abstract: An ultrasonic welding assembly is disclosed. The assembly includes a vibratory horn and at least one mount securing the horn. The horn has a resonant frequency and the mount has a resonant frequency about the same as the horn. The mount includes an inner portion that holds the horn at a nodal region. The mount also includes an outer surface that is coupled to a support member, for example, a bearing. The mount vibrates in resonance with the horn at the resonant frequency, wherein the vibration amplitude of the outer surface of the mount is generally up to about 15 percent of the vibration amplitude of the inner portion.

Abstract: A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to form a ball at a tip end of the wire, and an insulating member is provided so as to cover the electric torch with a space between the vicinity of a discharge portion of the electric torch and the insulating member, a heater being further provided on the insulating member so as to heat such a space.

Abstract: The invention provides an apparatus and method for clamping an object. The apparatus comprises a clamping mechanism and an actuation system to actuate clamping and de-clamping of the clamping mechanism, wherein the actuation system comprises two actuator devices which are operatively coupled whereby to provide an actuation force to the clamping mechanism. Preferably, the actuator devices comprises a variable reluctance actuator and a linear induction actuator coupled together and adapted to cooperate to provide the actuation force to the clamping mechanism.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.

Abstract: In a wire bonding apparatus including a horn driver for generating ultrasonic waves, a capillary, an ultrasonic horn formed by a symmetrical section fixed to the horn driver and an asymmetrical section having an end for mounting the capillary, the asymmetrical section is constructed by a spurious vibration suppressing structure for suppressing a vibration component of the ultrasonic horn perpendicular to a propagation direction of the ultrasonic waves with the ultrasonic horn.

Abstract: A wire bonding apparatus including a capillary, which allows a tip end of a bonding wire to protrude from the bottom, and a discharge electrode, which generates a spark between the electrode and the tip end of the wire by an electrical discharge; and auxiliary electrodes being disposed so as to surround the area between the tip end of the wire and the tip end of the discharge electrode. The end portion of the spark on the wire side is guided onto the axial line of the portion of the wire that protrudes from the capillary by the electric fields from the auxiliary electrodes, and the end portion of the spark on the discharge electrode side is guided onto the axial line of the discharge electrode. Dissociated ions are adsorbed on the auxiliary electrodes, preventing the discharge electrode from being contaminated.

Abstract: A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. Specifically, a wafer, which is populated with integrated circuit dies, is electrically tested and a wafer map is generated depicting the electrically good dies. An adhesive material is deposited on only the electrically good dies in accordance with the wafer map. The electrically good integrated circuit die may then be attached to a leadframe or substrate.

Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

Abstract: A clamp post holder has a mounting portion for mounting on a wire bonding machine, and a clamp post holding portion, which holds a clamp post. The mounting portion and post holding portion are separated by a slot except for a connecting portion. A screw passes through a threaded hole in the clamp post holding portion into the slot, with its end abutting the mounting portion. By turning the screw, the clamp post holding portion is pulled away from the mounting portion, thereby moving the clamp post. This allows fine adjustment of the positioning of a clamp member on the clamp post.

Abstract: An optically baffled heating station for joining wire connections by using a solder sleeve includes: an outer housing; a reflection block where said reflection block includes a reflection chamber where the reflection chamber forms the shape of two overlapping ellipses where the ellipses intersect at one respective focal point of each ellipsis and the opposing non-intersecting focal points are separated by about a 90° angle; two heating elements within a heating element block where the two heating elements extend beyond the heating element block and protrude into the reflection pockets of the reflection chamber. A slot extends between the two heating elements through the reflection block and the heating element block. The closed end of the slot includes a target area where the shrinking of the sleeve occurs. The target area receives the reflected light and minimizes the reflection of light toward the open end of the slot.

Abstract: The invention relates to a processing device for cables or wires, which uses at least one unit for displacing a cable or wire (9), or micro-mechanical actuators for displacing a tool (5). This permits thinner cables or wires to be processed and produces a high degree of precision and excellent control.

Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

Abstract: A wire bonding capillary having an extended service life-time, the use of which results in bonds with improved and stable qualities. The capillary includes a polymeric film which is vapor phase polymerized on the out side of the capillary tip in which a threaded bond wire travels. The polymeric film prevents bond deterioration and capillary clogging by a layer of contaminates which originate from the wire and the capillary manufacturing processes, and which would otherwise accumulate inside the bore and on the face of the tip of the capillary.

Abstract: A transducer for, for instance, a flip-chip bonding apparatus. The transducer has a passage that communicates between a piping attachment and a suction holding port that suction-holds an object to be processed (bonded); and in this transducer, an air pressure piping used for the suction is fastened to the piping attachment with a connecting member in between, and this connecting member made of foam styrol suppresses effects of reaction force of the air pressure piping.

Abstract: An apparatus for performing a pull test to determine the resistance of a bonded-wire loop extending between two bond contacts on a substrate to tensile force. The apparatus includes a traction hook controllably inserted under the bonded-wire loop, a drive device connected to the hook and generating a tensile force directed substantially perpendicular to the substrate surface, a force-measurement device associated with the hook to detect the tensile force at each moment, and a recording device connected to the force-measurement device in order to record a breaking force value for the bonded-wire connection. The force-measurement device is disposed substantially coaxially with the vector of the tensile force. The apparatus also includes a detector to detect the highest point of bonded-wire loop and a position controller for the automatic positioning of the traction hook and thus the tensile force vector origin substantially adjacent the highest point of the bonded-wire loop.

Abstract: A wire clamp including a housing having a guide slot for receiving a wire, a first clamp arm rotatably mounted in the housing and having a first wire clamping surface, a second clamp arm rotatably mounted in the housing and having a second wire clamping surface, a bias means for applying a tension force between the first and second clamp arms, and an actuator cylinder for applying a pushing force against the first clamp arm. The second clamp arm, when receiving pressure from a wire inserted in the guide slot, rotates against the tension force toward a clamping position and thereby clamps such wire between the first and second wire clamping surfaces by the tension force. Activation of the actuator cylinder applies a pushing force against the first clamp arm to urge the first clamp arm to rotate against the tension force toward an open position so that an increased tension force simultaneously acting on the second clamp urges the second clamp to rotate toward an ejection position, thereby ejecting the wire.

Abstract: An upgrade site is formed into a flatwire for upgrade or repair of the flatwire. Generally, the upgrade site comprises a substrate, a plurality of conductive elements, a solder element, a heating element, and an adhesive layer. The plurality of conductive elements are positioned on and extend along the substrate. The solder element is positioned on an exposed surface of each conductive element. The heating element is positioned adjacent the substrate and the plurality of conductive elements for heating the solder elements. The adhesive layer is positioned on the substrate for sealing the upgrade site after upgrade or repair of the flatwire.

Abstract: The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.

Abstract: With a device for the formation of a wire ball at the end of a wire an in and out swivelling electrode with an oblong shape is connected to the shaft of a motor directly or indirectly via a connecting piece so that the electrode is essentially rotated on its longitudinal axis when swivelling in and out. The mass inertia of the electrode is low as regards the rotational axis which is why it can be turned with negligible expenditure of energy. On swivelling in and out, the electrode is turned back and forth between a lower limit position in which a surface necessary for creating the spark, the so-called firing lug is located underneath the capillary of the Wire Bonder and an upper limit position in which the firing lug is located laterally elevated next to the capillary.

Abstract: A device with electrodes for the formation of a ball at the end of a wire protruding out of a capillary comprises a first electrode which has a tip and at least one further electrode. The first electrode and the at least one further electrode are electrically connected. The distance between the tip of the first electrode and the end of the wire is smaller than the distance between any point on the at least one further electrode and the end of the wire.

Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.

Abstract: A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and connecting portions each connecting the tip ends of two protruding holding portions to each other. The transducer main body, holding portions and connecting portions are integrally formed from a single material member.

Abstract: Compression bonding tools having a CVD-formed pressing member with a non-reactive working surface are disclosed and described. Generally speaking, the pressing member is coupled to a tool body, which may include head member, and a tail member. In some aspects, the tool body may include a support member of a super hard material that is coupled to the pressing member along a bonding surface thereof Further, in some aspects, the tool body may contain a heat directing member that facilitates the transfer of heat energy in a direction toward the pressing member. Such compression bonding tools have been found useful in a variety of well-known procedures, such as tap bonding systems (TAB).

Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Abstract: The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80% ZrO2 by weight.