Including Means To Move Or Guide Applicator Patents (Class 228/45)
  • Patent number: 8941025
    Abstract: Plume shield shroud (10) for a plasma gun (30) includes a substantially tubular member (14) comprising an axial length, a plume entry end (11), and a plume exit end (13). The shroud (10) is adapted to be mounted to a plasma gun (30). A method of protecting, confining or shielding of a gas plume of a plasma gun (30) includes mounting (20) a gas plume shroud (10) on the plasma gun (30) such that the shroud (10) is sized and configured to substantially surround at least a portion of the gas plume.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: January 27, 2015
    Assignee: Oerlikon Metco (US) Inc.
    Inventors: Richard McCullough, Mark F. Spaulding, Robert F. Savill, Jr., Ronald J. Molz
  • Patent number: 8938867
    Abstract: There is provided a transmission device comprising a rigid casing configured to be mounted perpendicularly on a pair of parallel rotatable driving and driven shafts. Annular driving and driven gears are provided in the casing. The annular driving gear is adapted for rotating simultaneously with the driving shaft, and is also adapted for forwarding rotational motion of the inner section to a transmission device. The annular driven gear is adapted for engaging and rotating simultaneously with the driving shaft and sliding over the same, and for forwarding to the inner section rotational motion received from the transmission device. The transmission device is rotatively connected to the annular driving and driven gears for transmitting rotational movement of the driving shaft to the driven shaft. There is also provided a portable boring-welding apparatus using this transmission device and a method for rotating a driven shaft using a parallel driving shaft.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 27, 2015
    Assignee: Usinage Filiatrault Inc.
    Inventors: Stéphane Filiatrault, Guy Filiatrault
  • Publication number: 20140263576
    Abstract: A welding apparatus includes a first welding element, a second welding element and a support on which the first welding element and the second welding element are mounted and which is movable relative to the welding apparatus. The support is configured to move the first welding element and the second welding element respectively from a first start position to a first end position and from a second start position to a second end position as the support is moved such that welding points of the first welding element and the second welding element are altered. The first welding element and the second welding element are oriented to mirror one another at the first start position and at the second start position. The first welding element and the second welding element are oriented to mirror one another at the first end position and at the second end position.
    Type: Application
    Filed: July 11, 2013
    Publication date: September 18, 2014
    Applicant: HONDA MOTOR CO., LTD.
    Inventor: Michael B. Moyer
  • Publication number: 20140263578
    Abstract: A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventor: JOHN S. YOUNGQUIST
  • Patent number: 8651356
    Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: February 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Noriaki Mukai, Hueng Jae Oh, Dae Young Lee, Jin Won Choi
  • Patent number: 8651357
    Abstract: An embodiment of a robotic welding apparatus comprises a robot having a welding torch and a base, where the base rotates about an axis of rotation. The embodiment further comprises an indexing table including a plurality of workpiece holding positions, where the indexing table is fixedly connected to the base substantially at a center position of the indexing table, and where the indexing table rotates about the axis of rotation.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: February 18, 2014
    Assignee: Lincoln Global, Inc.
    Inventor: Geoff Lipnevicius
  • Patent number: 8651159
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 18, 2014
    Assignee: ASM Assembly Automation Ltd
    Inventors: Sun Kuen Wong, Hon Chiu Hui, Yin Fun Ng
  • Publication number: 20130306710
    Abstract: Provided is a pipe welding apparatus, including: a support fixed to the ground; a torch which is supported by the support and is formed to correspond to a welding portion of a pipe; and a first rotation part for rotating the torch in a circumferential direction of the pipe up to a predetermined angle.
    Type: Application
    Filed: June 15, 2012
    Publication date: November 21, 2013
    Applicant: HYUNDAI HEAVY INDUSTRIES CO., LTD.
    Inventors: Jong Jun Kim, Hyeong Soon Moon, Jong Cheol Kim, Yong Baek Kim
  • Patent number: 8448835
    Abstract: A welding crane (1) for welding large structures is described. The welding crane (1) comprises a base part (2) which is arranged to be positioned on a ground (3), a mast (4) with a longitudinal axis (5). The mast (4) can be arranged in at least a first position in which the longitudinal axis (5) of the mast (4) extends substantially vertically from the base part (2). A boom (6) with a longitudinal axis (7) is arranged on the mast. The boom (6) can be arranged in at least a first position in which the longitudinal axis (7) of the boom (6) is substantially perpendicular to the longitudinal axis (5) of the mast (4). The boom (6) is arranged for receiving a welding head (13). The boom (6) is rotatable in relation to the mast (4) such that the boom (6) can be arranged in a second position in which the longitudinal axis (7) of the boom (6) is substantially parallel with the longitudinal axis (5) of the mast (4).
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: May 28, 2013
    Assignee: ESAB AB
    Inventor: Håkan Larsson
  • Patent number: 8231045
    Abstract: A suggested welding crane for welding of objects comprises an arm, a stand and a welding head. The arm includes at least a first and a second segment, which are arranged with their length axes essentially parallelly and are telescopically movable along their length axes in relation to each other so that at least a first segment of said segments at least partly slides into at least a second segment of said segments. The welding head is arranged in a distal end of an outermost segment of the arm while an innermost segment of the arm is suspended in the stand. A linear guide is arranged on at least a first segment of said segments. A co-operating part of said at least one linear guide is arranged on at least a second segment of said segments, wherein the at least one linear guide is adapted to provide said telescopic movement.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: July 31, 2012
    Assignee: ESAB AB
    Inventor: Arne Lagerkvist
  • Patent number: 8186041
    Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: May 29, 2012
    Assignee: Rantec Power Systems, Inc.
    Inventors: Kurt Walker, Paul J. Schmidt
  • Patent number: 8123104
    Abstract: A friction stir welding apparatus is provided herein. More specifically, traditional friction stir welding requires a rotatable head that is forced against a plurality of work pieces to bond the same. The rotational and normal forces generated by the friction stir welding tool are generally reacted by a backing plate, anvil, mandrel or other mechanisms, such hardware are subject to the applied forces and are often supported with additional internal supports. Conversely, an apparatus for performing a friction stir weld is described that omits the need for such a backing member and internal supports as it is performed using a self reacting pin tool.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: February 28, 2012
    Assignee: United Launch Alliance, LLC
    Inventors: David M. Potter, Richard K. Hansen
  • Patent number: 8092120
    Abstract: Method for assembling a rack portion (1) of a self-raising oil rig, which rack portion (1) is constituted by at least one rectangular plate (3) which comprises teeth (51) at the longitudinal lateral faces (5) thereof, and at least one reinforcement (8) which is in the form of a half-shell and which is welded to a main face (6) of the at least one rectangular plate, along the longitudinal edges (11) of the at least one reinforcement, according to which an internal chamfer and an external chamfer which are separated by a projection of thickness T are produced at each of the longitudinal edges (11) of the at least one reinforcement (8), the at least one reinforcement (8) is provided at a main face (6) of the rectangular plate (3), at least one welding pass is carried out at the internal portion of each of the longitudinal edges (11) of the at least one reinforcement in order to produce an internal weld bead having a connection radius R greater than or equal to 4 mm, and the chamfers are filled at the external po
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: January 10, 2012
    Assignees: Industeel France, Civad SA
    Inventors: David Cardamone, Philippe Mabelly
  • Patent number: 8091759
    Abstract: A soldering machine for soldering components which are mounted on a circuit board contains a soldering module and comprises at least one soldering station which is mobile and exchangeably insertable in the soldering module. The soldering station and the soldering module are equipped with means for mutual alignment and with female or male plugs, which fit with one another and which terminate supply lines for goods. When inserting the soldering station in the soldering module said means align the soldering station in relation to the soldering module. Preferably, the soldering machine is composed of modules which are situated one behind another in the transport direction and are removably connected to one another. Each module comprises an own transport system.
    Type: Grant
    Filed: May 19, 2007
    Date of Patent: January 10, 2012
    Assignee: Kirsten Soldering AG
    Inventors: Hans Otto Willenegger, Bruno Ghidotti
  • Patent number: 8016010
    Abstract: A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: September 13, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yin Fun Ng, Gary Peter Widdowson, Hon Chiu Hui
  • Patent number: 8006890
    Abstract: An apparatus for a friction stir and a friction stir processing of the present invention suppress an occurrence of a surface defect in an area processed by the friction stir. The apparatus for the friction stir includes a tool having a columnar tip-side part, a rotating unit for rotating the tool on a central axis, a first pressing unit for pressing a tip of the tool rotated by the rotating unit against a work, a jig having a tool insertion hole into which the tip-side part of the tool is inserted so that the tip-side part of the tool is encircled around the jig, a second pressing unit for slidably pressing the jig against the work, and a press control unit for controlling the first pressing unit so that the tip-side part of the tool is gradually pulled out of the work by the first pressing unit while moving the tool and the jig relative to the work, in a state that the tool is rotated by the rotating unit and the tip of the tool has been sunk into the work to a predetermined depth by the first pressing unit.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: August 30, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Kazutaka Okamoto, Seung Hwan Park, Satoshi Hirano
  • Publication number: 20110163151
    Abstract: A welding crane (1) for welding large structures is described. The welding crane (1) comprises a base part (2) which is arranged to be positioned on a ground (3), a mast (4) with a longitudinal axis (5). The mast (4) can be arranged in at least a first position in which the longitudinal axis (5) of the mast (4) extends substantially vertically from the base part (2). A boom (6) with a longitudinal axis (7) is arranged on the mast. The boom (6) can be arranged in at least a first position in which the longitudinal axis (7) of the boom (6) is substantially perpendicular to the longitudinal axis (5) of the mast (4). The boom (6) is arranged for receiving a welding head (13). The boom (6) is rotatable in relation to the mast (4) such that the boom (6) can be arranged in a second position in which the longitudinal axis (7) of the boom (6) is substantially parallel with the longitudinal axis (5) of the mast (4).
    Type: Application
    Filed: June 23, 2009
    Publication date: July 7, 2011
    Applicant: ESAB AB
    Inventor: Håkan Larsson
  • Patent number: 7966713
    Abstract: Embodiments of tool mounted structural positioning devices and techniques are described. In one embodiment, a positioning device includes mountings to mount the device directly to a tool device configured to travel a path and perform a manufacturing operation on an element. Engagement mechanisms coupled to the positioning device are aligned to the predefined path and are configured to exert a clamping force upon the element such that the element is secured and positioned by the positioning device in constant relation to the predefined path as the operations are performed.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: June 28, 2011
    Assignee: The Boeing Company
    Inventors: Kurt A. Burton, Michael P. Matlack
  • Publication number: 20110108607
    Abstract: An embodiment of a robotic welding apparatus comprises a robot having a welding torch and a base, where the base rotates about an axis of rotation. The embodiment further comprises an indexing table including a plurality of workpiece holding positions, where the indexing table is fixedly connected to the base substantially at a center position of the indexing table, and where the indexing table rotates about the axis of rotation.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 12, 2011
    Applicant: LINCOLN GLOBAL, INC.
    Inventor: Geoff Lipnevicius
  • Patent number: 7900807
    Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: March 8, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kiyoaki Iida, Kazuo Tanaka, Norio Kondo, Hideaki Sakaguchi, Mitsutoshi Higashi
  • Publication number: 20110036898
    Abstract: A suggested welding crane (1) for welding of objects comprises an arm (A), a stand (2) and a welding head (8). The arm (A) includes in turn at least a first and a second segment (4, 5, 6), which are arranged with their length axes (7) essentially parallelly and are telescopically movable along their length axes (7) in relation to each other so that at least a first segment (6, 5) of said segments at least partly slides into at least a second segment (5, 4) of said segments. The welding head (8) is arranged in a distal end of an outermost segment (6) of the arm (A) while an innermost segment (4) of the arm (A) is suspended in the stand (2). A linear guide is arranged on at least a first segment of said segments (4, 5, 6). Furthermore, a co-operating part of said at least one linear guide is arranged on at least a second segment of said segments (4, 5, 6), wherein the at least one linear guide is adapted to provide said telescopic movement.
    Type: Application
    Filed: March 13, 2009
    Publication date: February 17, 2011
    Applicant: ESAB AB
    Inventor: Arne Lagerkvist
  • Patent number: 7886955
    Abstract: A solder ball mounting device that can mount minute solder balls with a diameter of 200 ?m or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding to electrodes of a printed circuit board. The device includes a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings. A movement mechanism is for moving the cylindrical member horizontally relative to the mask for arraying solder balls, wherein solder balls gathered on the mask for arraying solder balls are moved by moving the cylindrical member and are then dropped on electrodes of the printed circuit board via openings of the mask for arraying solder balls.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: February 15, 2011
    Assignee: Ibiden Co., Ltd.
    Inventor: Yoji Kitamura
  • Publication number: 20110006105
    Abstract: Equipment for carrying out a method for manufacturing a power capacitor including at least one capacitor element. The equipment includes a solder pot. A solder head includes a first linear module for movements in the x-direction (horizontally) and a second linear module for movements in the y-direction (vertically). A press unit fixes the capacitor elements. The solder pot, the solder head, the first and second linear modules and the press unit are arranged on a steel frame.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 13, 2011
    Applicant: ABB Technology Ltd.
    Inventor: Per MILWERTZ
  • Patent number: 7866529
    Abstract: A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: January 11, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Atsunori Sumita, Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Isao Tsuchiya, Yoshiyuki Mabuchi, Osamu Kimura
  • Patent number: 7810697
    Abstract: A robotic welding system is provided that includes multiple welding cells equidistantly spaced in a circular arrangement, multiple perimeter light curtains to provide safety protection around the welding cells, a turntable centrally located in the circular arrangement, and multiple welding robots attached to the turntable. The welding system further includes a first welding process and a second welding process whereby both the first welding process and the second welding process each include a primary welding operation and a secondary welding operation whereby the turntable rotates between the welding cells to perform the primary and secondary welding operations.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: October 12, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: George Charbel, Yoshinori Ishihata, Julia Zoldak
  • Publication number: 20100187287
    Abstract: An apparatus for applying a helical cladding bead to the interior surface of a pipe elbow has a rotor mounted to an elbow carriage so as to be rotatable about a primary axis. The elbow carriage is longitudinally movable parallel to the rotor's rotational axis. A radially-movable elbow collar is mounted to the rotor, and has means for mounting a first end of a pipe elbow. The second end of the elbow passes through a stationary frame with centering means for keeping the elbow's curved centerline tangential to the primary axis. A weld arm, extending from a weld arm carriage into the second end of the elbow, is sinuously configured so that it will not interfere with the elbow. The weld arm is rotatable about the primary axis in coordination with the rotor. A weld head is mounted at the extending end of the weld arm so as to remain spatially fixed regardless of rotation of the weld arm.
    Type: Application
    Filed: September 18, 2007
    Publication date: July 29, 2010
    Applicant: 1272507 ALBERTA LTD.
    Inventor: Norman Alexander Greenwall
  • Patent number: 7703662
    Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: April 27, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kiyoaki Iida, Kazuo Tanaka, Norio Kondo, Hideaki Sakaguchi, Mitsutoshi Higashi
  • Publication number: 20100059574
    Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.
    Type: Application
    Filed: November 3, 2008
    Publication date: March 11, 2010
    Applicant: KAIJO CORPORATION
    Inventors: Toru ARAHATA, Shinobu Ishii, Hiromi Fujisawa
  • Publication number: 20090236402
    Abstract: A soldering machine for soldering components which are mounted on a circuit board contains a soldering module and comprises at least one soldering station which is mobile and exchangeably insertable in the soldering module. The soldering station and the soldering module are equipped with means for mutual alignment and with female or male plugs, which fit with one another and which terminate supply lines for goods. When inserting the soldering station in the soldering module said means align the soldering station in relation to the soldering module. Preferably, the soldering machine is composed of modules which are situated one behind another in the transport direction and are removably connected to one another. Each module comprises an own transport system.
    Type: Application
    Filed: May 19, 2007
    Publication date: September 24, 2009
    Inventors: Hans Otto Willenegger, Bruno Ghidotti
  • Publication number: 20090173725
    Abstract: A robot welding apparatus including a welding station having a welding robot with weld tips for creating a weld along a work piece. A welding power supply and control pendant is also provided. A visual screen of the control pendant provides a view of the weld tips for use with the method to detect characteristics such as weld tip face measurement, tip wear measurement, tip alignment measurement, and cap replacement and type verification.
    Type: Application
    Filed: January 8, 2008
    Publication date: July 9, 2009
    Inventors: Timothy J. Holcomb, Scott M. Dreslinski
  • Patent number: 7546941
    Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: June 16, 2009
    Assignee: Hynix Semiconductor Inc.
    Inventors: Hai Ju No, Hee Sung Kim, Jung Bum Woo, Sang Nam Go, Tae Hyung Kim
  • Publication number: 20090140029
    Abstract: The invention provides a device for wire bonding with a copper-containing bonding wire for connecting a component to a support, wherein provision is made on the component as well as on the support for at least one bond pad, encompassing a guide for the bonding wire and a device for melting a part of a bonding wire, which is provided for a connection to one of the bond pads, wherein the guide for the bonding wire is embodied in such a manner that the melted part of the bonding wire is brought into contact in each case with at least one bond pad in a bonding chamber, characterized in that provision is made for at least one plasma nozzle, with part of the bonding wire provided for the connection to the bond pad can be acted upon by a plasma and/or the bond pad can be acted upon by a plasma and/or the bonding chamber can be acted upon by a plasma. The invention also relates to a method for wire bonding.
    Type: Application
    Filed: November 26, 2008
    Publication date: June 4, 2009
    Inventors: Ernst WANDKE, Christoph Laumen, Pang Ling Hiew, Boon Ann Tan
  • Patent number: 7497365
    Abstract: A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: March 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Hideo Kimura, Toshiyuki Yokoue, Yasuhiko Shiota
  • Patent number: 7494913
    Abstract: Microball delivery solutions for solder bumping are generally described. In this regard, according to one example embodiment, a microball delivery assembly includes a mask with at least two microball holder(s) to hold at least two different sizes of microball(s) that may correspond with at least two different-sized openings on a substrate, to provide simultaneous delivery of different-sized microballs upon a substrate.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: February 24, 2009
    Assignee: Intel Corporation
    Inventors: Houssam Jomaa, Ravi K. Nalla, H. Ryan Chase
  • Publication number: 20090045244
    Abstract: A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventors: Gang OU, Ajit GAUNEKAR, Dongsheng ZHANG, Ka Shing KWAN
  • Publication number: 20090042491
    Abstract: A method for the circumferential interior treatment of pipe elbows, including a step of positioning a working member within a pipe elbow and moving the working member along a portion of a length of the pipe elbow between selected working positions, while concurrently manipulating the pitch and rotational positioning of the pipe elbow to maintain a concentric rotation of the pipe elbow about the working member.
    Type: Application
    Filed: July 25, 2008
    Publication date: February 12, 2009
    Applicant: ALMAC MACHINE WORKS LTD.
    Inventor: Fred Harmat
  • Publication number: 20090008427
    Abstract: There is provide a driving unit of welding equipment capable of surely stopping turning of a pressure application shaft while shortening the entire length of welding equipment without enlarging a hole diameter of a rotary shaft of a motor, thereby rendering a welding gun small-sized, lightweight and compact as a whole. The driving unit of welding equipment provided with the pressure application shaft that is driven by the motor and has a portion to be drawn into the motor, wherein the rotary shaft of the motor is formed of a hollow shaft, a screw shaft is fixed to the rotary shaft, and a nut to be threaded with the screw shaft is provided in the pressure application shaft, characterized in that the pressure application shaft is formed of a ball spline shaft and a part or whole of a ball spline bearing is housed in the rotary shaft.
    Type: Application
    Filed: June 30, 2008
    Publication date: January 8, 2009
    Inventor: Yoshio Sato
  • Publication number: 20080272178
    Abstract: A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 6, 2008
    Inventors: Ka Shing Kenny KWAN, Yue ZHANG, Yam Mo WONG
  • Publication number: 20080223905
    Abstract: The present invention relates to a fixing structure for printed circuit board (PCB) of micro motor, including a base and a PCB. The base has a shaft tube disposed centrally therein; at least a circuit board fixing pin is protruded beyond the base peripheral to the shaft tube; the PCB has a center hole for the shaft tube to be inserted in, and the diameter of the center hole shall be close to but not less than the outer diameter of the shaft tube; each circuit board fixing pin corresponds to a through hole disposed on the center of the PCB. Sensing plates are prevented from dropping to secure the motor to stably rotate; the circuit board fixing pin, after passing through the through hole, is fixed by an adhesive or a soldering means to make the PCB and the base perfectly fit and free from warp and vibration.
    Type: Application
    Filed: May 3, 2007
    Publication date: September 18, 2008
    Applicant: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Tso-Kuo Yin
  • Publication number: 20080197171
    Abstract: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
    Type: Application
    Filed: April 8, 2008
    Publication date: August 21, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: E. WALTER FRASCH, RICHARD D. SADLER, MICHAEL P. SCHMIDT-LANGE
  • Patent number: 7357288
    Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: April 15, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoto Hosotani, Kazuki Fukada, Keiichi Iwata, Daido Komyoji
  • Publication number: 20080083815
    Abstract: A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.
    Type: Application
    Filed: October 8, 2007
    Publication date: April 10, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Beni Nachon, Joseph M. Martin, John Randolph Simon
  • Publication number: 20070284421
    Abstract: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.
    Type: Application
    Filed: May 1, 2007
    Publication date: December 13, 2007
    Inventors: Gary S. Gillotti, E. Walter Frasch, Krishnan Rama, Xin Ji Zhang
  • Patent number: 7159751
    Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: January 9, 2007
    Assignee: ESEC Trading SA
    Inventor: Dieter Vischer
  • Patent number: 7096912
    Abstract: A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is movable in the horizontal plane. The linear motors 130 and 140 respectively include driving sections 132 and 142 and movable coil assemblies 134 and 144. An arm 136 extending from the movable coil assembly 134 of the first linear motor 130 is fastened to the bonding head 120, and an arm 146 extending from the movable coil assembly 144 of the second linear motor 140 is engaged with the bonding head 120. A driving force aimed at the center of gravity of the bonding head 120 is applied to the bonding head 120 via the arms 136 and 146, so that the bonding head 120 is moved.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: August 29, 2006
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Osamu Kakutani
  • Patent number: 7020942
    Abstract: A portable boring and welding machine includes a tool shaft adapted to mount tools for boring and welding workpieces. The shaft extends along an axis and is driven by an electric motor. The motor and the shaft are connected by a helical gearwheel and worm pair, the helical gearwheel being connectable to the tool shaft, and the worm being connected to a drive shaft of the motor itself.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: April 4, 2006
    Assignee: Sir Meccanica S.r.L.
    Inventor: Massimo Siracusa
  • Patent number: 6921011
    Abstract: The invention relates to a work piece holder with top mounted robot which optimizes floor space for a work piece positioner and a robot. In general, the work piece positioner assembly and the top mounted robot is supported on a base frame. Attached to the base frame, is a first superstructure and a second superstructure which supports a work piece positioner and the top mounted robot. Above the first superstructure and second superstructure is a frame structure fixed in the unitary assembly to the first superstructure and the second superstructure. Attached to the frame structure is a robot stand and a robot. Due to the unique shape of the work piece holder with top mounted robot, the floor space of the combined robot and work piece positioner is significantly reduced, and the overall cost of the system is reduced.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: July 26, 2005
    Assignee: GSG, LLC
    Inventors: Jan C. Mangelsen, Jason J. Kelsick, John P. Christen
  • Patent number: 6871772
    Abstract: A wire bonding apparatus with a bonding head that includes an ultrasonic transducer having a capillary at its tip end, piezo-electric elements that form a pair of complementary action type extension and retraction driving elements which cause the ultrasonic transducer to move with respect to a transducer holder, an impact detection sensor, and a Z motor which drives the transducer holder. The piezo-electric elements are arranged so that when one of them is driven to extend, the other is driven to retract. When the impact detection sensor detects that the capillary is lowered by the Z motor and comes into contact with a bonding object (semiconductor chip), the driving of the Z motor is stopped, and the piezo-electric elements are driven to the directions of extension and retraction in a complementary manner, thus swinging the ultrasonic transducer and moving the capillary upward.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: March 29, 2005
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Yutaka Kondo
  • Patent number: 6863206
    Abstract: A bonding apparatus including an ultrasonic horn having a capillary, a horn holder holding the ultrasonic horn, a swing arm rotatably supporting the horn holder on horn holder supporting shafts, and auxiliary arms which are rotatably supported by auxiliary arm supporting shafts and rotatably supported by connecting shafts on the horn holder. The horn holder supporting shafts are disposed above a hypothetical center of an imaginary horizontal line extending from the tip end of the capillary, the auxiliary arm supporting shafts are disposed in the back of the horn holder supporting shafts and at the same height as the horn holder supporting shafts, and the connecting shafts are disposed at an intersection of an extension of an imaginary line connecting the tip end of the capillary and the horn holder supporting shafts and an extension of an imaginary line connecting the hypothetical center and the auxiliary arm supporting shafts.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: March 8, 2005
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Yasushi Suzuki
  • Patent number: 6786392
    Abstract: An object is to reduce impact load applied on a bonding subject at the time of wire contact detection and achieve a stable and highly precise fabrication of a bonding ball so as to shorten the bonding time. A wire bonding arm comprises: a Z driving shaft supported by a Z-axis base capable of swinging via a first shaft; and a low pressurizing shaft with a smaller inertia than that of the Z driving shaft having a capillary, which is supported on one end of the Z driving shaft to be capable of swinging via a second shaft. The capillary is brought down by the Z driving shaft to the position of the height right before an initial ball comes to contact with a first bonding point. Then, only the low pressurizing shaft is driven at low speed to be brought down while holding the Z driving shaft in position. At the point where the initial ball comes in contact with the first bonding point, a prescribed weight and ultrasonic vibrations are applied for bonding it to the first bonding point.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: September 7, 2004
    Assignee: NEC Electronics Corporation
    Inventor: Jun Nogawa