Abstract: A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bonding wire to the wedge. Securement means are integrally formed with the guide body for releasably mounting the guide. The securement means are formed such that movement of the guide body with respect to the bonding head allows its release.

Abstract: An ultra low mass wire clamp for operating at a very high speed where acceleration and deceleration forces exceeding thirty times the forces of gravity includes a wire clamp body portion having a machined recess therein for mounting a first fixed jaw in an exact reference position. A cantilever arm connected to and extending from the body portion has a second machine recess therein for receiving and mounting a second movable jaw in an exact position juxtaposed the fixed jaw so that the faces of the jaws are in exact parallel when mounted in their respective recesses. There is further provided an adjustment screw which engages the movable jaw or the movable actuator so as to adjust the fail safe zero voltage clamping force between jaws which is designed to maintain a clamping force on a wire under power failure conditions.

Abstract: In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

Abstract: The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.

Abstract: A wire bonding machine has a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.

Abstract: A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.

Abstract: A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive wire patterns formed on the upper surface and an opposite lower surface of the circuit board body for electrically connecting the semiconductor chip; and via holes perforating through the circuit board body for connecting the conductive wire patterns. The pattern layer further includes bonding leads formed at one end of the conductive wire patterns and connected to the semiconductor chip by bonding wires for electrical connection between the semiconductor chip and the circuit board, and earth terminals formed outside of the die pad region and connected to a device for clamping the circuit board during electrical connection between the semiconductor chip and the circuit board by wire bonding.

Abstract: In an apparatus known as a wire bonder, a new type of one-piece joint element (20) is used as the articulated link (G) between a support unit (pivoting rocker 30) and a bonding unit (10) that carries a capillary (12). One or more such joint elements (20) define a virtual pivot axis (A2) for the unit (10), which lies outside the unit and thus provides a passage in the apparatus wide enough for relatively wide workpieces (chips 1 on substrate 2). A joint element (20a) is made in one piece and has at least two elastically flexible blades (22a) converging toward each other relative to a symmetry plane (S), and the blades are connected to each other by two rigid sections (23a, 24a). One of the rigid sections (23a) is attached to (and removable from) the support unit (30), the other (24a) is attached to (and removable from) the bonding unit (10), so that the joint element (20) is easy to fit or exchange.

Abstract: A welding device is disclosed having an elongated actuator arm which is secured to a main post by a cross arm. The cross arm is both slidably and pivotally mounted to the main support post and also pivotally and slidably secured to the actuator arm by an arcuate link. An elongated linkage bar extends through the actuator arm and a welding gun is attached to one end of the linkage bar. An elongated handle is perpendicularly secured to the linkage bar at its other end adjacent the opposite end of the actuator arm so that movement of the handle simultaneously moves the welding gun. The handle, furthermore, includes a hand grip at each end and the linkage bar is secured to the handle at a position closely adjacent one of the hand grips and thus at a position between the center of the handle and one of the hand grips.

Abstract: A novel low mass transducer for bonding machines comprises a transducer generator which mounts on or is coupled to a bonding tool of the type used for ball bonding, wedge bonding and TAB bonding. The preferred embodiment transducer comprises a magnetostrictive or piezoelectric element which mount on the outside surface of the bonding tools used in a bonding operation, thus eliminating convention transducers which also serve as a bonding tool holder. The present invention bonding tool serves as the base or mount for a transducer made in the form of a sleeve or tube which mounts on or couples to the bonding tool. The novel transducer/bonding tool or transducers also serve as a sensor which can monitor the quality of a bond while it is being made.

Abstract: An apparatus for continuously feeding the wire to a wire cutting apparatus. The present invention provides a pair of mandrels provided in an in-line configuration and provided on a turntable. An active coil is loaded onto one of the mandrels while a idle coil is loaded onto the other mandrel. As the wire is being pulled to the wire cutting apparatus from the active coil the tail end of the active coil is bent into abutting relationship with the lead end of the idle coil and welded together. As a result, when the active coil is exhausted, the pulling force of the cutting machine enables the carousel to rotate so that the idle coil assumes the active position and the new coil can be loaded onto the now idle coil for a continuous feed of wire to the wire cutting apparatus.

Abstract: In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

Abstract: In a case of ultrasonic bonding of a bonding wire to a metal pad provided on a semiconductor substrate, the vibration amplitude of a tip end of the bonding tool is set to be smaller than the film thickness of the metal pad, and the vibration frequency of the bonding tool is set to be higher than 70 kHz. According physical damage, such as cracks produced in a portion beneath the metal pad, can be prevented.

Abstract: A fine pitch capillary bonding tool for making ball bonds having a consistent bonded ball size even though the air balls may vary in diameter is provided. The convential shaped bonding tool is provided with a novel ball constraining recess in the working tip. When an air ball is bonded it is forced into the constraining recess which has a shoulder portion for exerting a downward bonding force. The ball being bonded extrudes vertically into the constraining recess without laterial extrusion which would create mashed balls of varying diameter.

Abstract: A micropositioner affording the ability to precisely move the tip of an ultrasonic bonding tool relative to a miniature workpiece such as a microcircuit includes a pantograph-like input manipulator mechanism coupled by a single ball joint coupling to a follower mechanism which supports an ultrasonic transducer support housing from which a transducer and bonding tool attached thereto protrudes. In the preferred embodiment, the input manipulator includes a longitudinally outwardly protruding control arm having a control knob at the outer longitudinal end thereof, for grasping between the thumb and fingers of a human operator. The control arm is coupled to the outer lateral end of a four-bar parallelogram linkage comprising part of a pantograph mechanism, while the inner lateral end of the pantograph mechanism is pivotably connected through vertically and horizontally disposed pivot support bearings to a support structure.

Abstract: This method and apparatus for wire bonding allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Abstract: A remote controlled welding and cutting carriage, with an automated positioning arm, to facilitate welding and cutting of flat and curved surfaces including plate and pipe without the use of track, band or similar carriage positioning or guidance mechanisms. Multiple motor driven precision ground magnetic wheel sets align and propel the carriage across a surface. Precision maintenance of magnetic wheel position is facilitated by use of spring steel axles which resist distortion from impacts. A separate magnetic wheel set alignment adjustment is provided to correct magnetic wheel set positioning. The system of motor driven magnetic wheel sets permits the carriage, or carriages, to transport cutting and welding materials required for welding and cutting around the complete circumference of a pipe or other surface regardless of orientation or slope.

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described.

Abstract: A multiple-tool ball bonder includes a first tool (50, 150) and a second tool (52, 152) mounted on a single head (82, 182) requiring only one vision system (78, 178), one positioning system (68, 168), and one computer system (56, 228). The ball bonder (44, 144) allows for the single head (82, 182) to create interconnections between semiconductor devices (10, 148) and lead frame fingers (12, 148) in a first direction with the first tool (50, 150) and the second tool (52, 152) allows interconnections in a second direction (40) without requiring additional equipment or processing runs.

Abstract: There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract: A wire bonding apparatus comprises an X-Y table for placing thereon a die pad, on which a rectangular semiconductor chip with a plurality of first bonding pads is mounted, and a package component with a plurality of second bonding pads, a bonding tool for bonding, using a wire, each of the first bonding pads to a corresponding one of the second bonding pads, the bonding tool being movable between a reference position and a bonding level in a Z-direction, a camera system having an auto-focusing function for detecting the Z-directional position of each of the first and second bonding pads, thereby creating Z-directional data concerning the first and second bonding pads, a bonding level computer for calculating bonding levels of the bonding tool on the basis of the Z-directional position data, a bonding sequence computer for determining the motion sequence of the bonding tool on the basis of the calculated bonding levels, and a position/load control selector for selecting, on the basis of the determined motion s

Abstract: A bonding tool for use in tape automated bonding and wedge bonding of gold and gold plated leads or wires to contact pads of electronic devices is fabricated of Aluminum Oxide ceramic without electrically conductive metallic binders. The bonding tool has a microscopically rough surface that is brought into compressive contact with the gold leads or wires and manipulated ultrasonically or thermosonically in order to form a molecular bond between the gold lead or wire and the contact pad of the electronic device. The Aluminum Oxide ceramic bonding tool is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions and is not readily abraded by the gold leads.

Abstract: When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: In a wire-bonding machine and method that uses a covered wire, discharge electrodes comprise a pair of discharge electrodes for covering-film removal, in which the upper and lower surfaces of electromagnetic parts used as discharge terminals are held by two insulating parts, and a discharge electrode for ball formation, which is movable together with one of the pair of discharge electrodes for covering-film removal.

Abstract: A single-point bonder is provided ultrasonically bonding lead fingers extending along different directions onto a semiconductor chip with satisfactory reliability. The bonder contains a first bonding tool for bonding a first set of lead fingers onto a semiconductor chip using a first ultrasonic vibration along a first direction, and a second bonding tool for bonding a second set of lead fingers onto the chip using a second ultrasonic vibration along a second direction different from the first direction. Preferably, the first bonding tool has a first ultrasonic horn for transmitting the first ultrasonic vibration. The second bonding tool has a second ultrasonic horn for transmitting the second ultrasonic vibration. The first and second horns extend along the first and second directions, respectively. The first and second ultrasonic vibrations are parallel to the longitudinal directions of the first and second horns, respectively.

Abstract: So as to prevent improper wire feeding, a vibration applying device such as an electromagnetic means, etc., is provided which applies a vibration to a spool when the spool is rotated in order to feed out a wire from the spool.

Abstract: In a wire bonding apparatus used in manufacturing, for instance, semiconductor devices, a cover is attached to a detection image intake section of the camera mirror tube of a camera which detects the bonding points of a semiconductor workpiece, and the cover covers an area where a variation in air density occurs between the detection image intake section of the camera mirror tube and the semiconductor workpiece.

Abstract: An alignment method for ultrasonic wire bonders of the type using capillary ball type and wedge type bonding tools utilizes a bonding tool construction having an elongated shank angle obliguely At any desired azimuthal angle from the lower working face of a tool tip. This angular offset allows a workpiece to be positioned laterally to place a desired wire bond site on an integrated circuit or other such workpiece in precise alignment with a target image in the field of view of a television camera or other optical imaging device viewing the location of a desired bond site along the line of action of the tool tip. Because of the angular offset construction of the bonding tool, the line of site of the imaging device is coincident with the line of action of the tool tip eliminating parallax errors and permitting viewing of the bond site continuously during motion of the tool tip along its line of action.

Abstract: The present invention discloses a wire bonder that does not require bonding tool replacement to be performed by an experienced worker, is not bothersome and can be completed in an extremely short time, while also enabling time management of the degree of wear of the bonding tool and so forth to be performed reliably, so as to realize improved work efficiency and yield, as well as being able to demonstrate various other effects. In addition, the present invention also discloses a bonding arm and bonding tool that contribute to the achieving of these effects. The above effects are obtained by adding a tool replacement device that removes a used bonding tool (capillary) installed in a bonding arm and installs a new bonding tool. In addition, the above effects are obtained with respect to the bonding arm and bonding tool by forming a tapered surface that guides their mutual insertion.

Abstract: The present invention discloses a wire guiding apparatus and wire guiding method that automatically guide a wire supplied from a wire feeding device through the insertion holes of at least a wire clamp and bonding tool using a guiding jig.

Abstract: A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, and a face on the end of the capillary tip extending away from the hole at multiple angles of increasing magnitude.

Abstract: A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is available. The apparatus includes a supporting structure, a mechanism for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage, The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.

Abstract: A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding wire is installed, a first transferring portion installed to the frame to make the other end of the transducer ascend so that the capillary for wire bonding ascends, a second transferring portion installed on the X, Y table in front of the first transferring portion to, thereby, make the other end of the transducer ascend during bonding, and a first location detecting portion installed to the frame and the X, Y table to detect an amount of movement in the X and Y directions so that energy loss according to the driving of a head portion can be reduced.

Abstract: An electrode of a chip and an electrode of a substrate are connected by a wire drawn out from a lower end of a capillary tool. When the wire accidentally gets into the capillary tool and thus is not drawn out from the lower end of the capillary tool, a suction unit is operated to automatically draw out the wire from within the capillary tool using a suction force. A cutter is provided in the suction unit for cutting the sucked wire such that the wire of a given length remains to be drawn out from the lower end of the capillary tool.

Abstract: A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.

Abstract: An ultrasonic wirebonding assembly, consisting of an actuator producing vibrations at an ultrasonic frequency and a tip transmitting such vibrations to a bonding wire atop a terminal to which the wire is to be bonded, is moved among positions on a circuit chip where wirebonding operations are to occur by means of a linkage. The linkage consists of first and second drive arms, each of which is pivoted on a single stationary shaft, a drive link pivoted on the second drive arm, and a connecting link extending between the drive link and the first drive arm, being pivoted at each end. Each arm is independently driven using a motor having a coil moving over an arcuate permanent magnet. The wirebonding assembly is driven vertically, downward in a direction of engagement with the workpiece and upward in a direction of disengagement with the workpiece, on the drive link by means of a linear motor.

Abstract: Improved ultrasonic wire bonders, and improvements to ultrasonic wire bonding transducers that are used with such ultrasonic wire bonders. The improvements to the ultrasonic wire bonding transducer includes driver-node mounting of the transducer and a clamping arrangement for a bonding tool in the transducer. The driver-node mounting of the transducer is achieved by mounting it in the ultrasonic bonder such that a 3/4--wavelength distance is created between a mounting bracket of the transducer and a distal end of the transducer at which the bonding tool is disposed. As a result, vibrational problems caused by the transducer not being located at the node are eliminated. The driver-node mounting aspect of the present invention provides a shorter overall transducer and concentrates the mass at the driver end for less tool impact, and reduces manufacturing variables related to achieving a one-half wavelength distance between the driver node and the transducer node.

Abstract: To provide an ultrasonic bonding machine in which a resonator is arranged horizontally or vertically while it is supported at both ends and a resonator for use in the same. The interface Wa is placed on the mount 13 arranged in a stationary state in a lower portion of the working space 2 open in forward, right and left directions, the resonator 7 is moved down by the pressure mechanism 3 from above, and the interface Wa is pressure-held properly between the bonding working portion 11 and the mount 13 while it is in a stationary state and bonded with vibration energy of a vertical ultrasonic wave. The resonator 7 is assembled by interconnecting the ultrasonic horn having the bonding working portion 11 and two boosters having support portions by means of screws in such a manner that they are coaxial with one another, thereby facilitating exchange of each element. In addition, the resonator can be arranged vertically while it is supported at both ends in the front of the main body.

Abstract: A welding device is disclosed having an elongated actuator arm which is secured to a main support post by a cross arm. The cross arm is both slidably and pivotably mounted to the main support post and also pivotably and slidably secured to the actuator arm to enable a wide range of movement for the actuator arm. An elongated linkage bar extends through the actuator arm and a welding gun is attached to one end of the linkage bar. A handle is secured to the linkage bar adjacent the opposite end of the actuator arm so that movement of the handle simultaneously moves the welding gun. A second lever is also secured to the linkage bar at a midpoint along the actuator arm such that movement of the lever also moves the welding gun in the same fashion as the handle.

Abstract: A novel pull strength tester is incorporated into an automatic wire bonder for performing pull strength tests during production bonding operation. The pull strength tester is provided with a control for automatically applying increments of pull force on a fine wire after making a bond. The control senses the elongation of the fine wire as a result of the force applied and is capable of terminating the pull test at a predetermined threshold value or continuing to increase the force until a break occurs. After each increase in force, a continuity circuit determines if the wire has broken at the bond or the bond has lifted off the bonding target. The system employs the information to determine if a proper bond was made and/or if a short tail was made which could affect the subsequent attempt to form a proper ball for a subsequent first bond.

Abstract: A welding apparatus is provided which includes a rail member 5 installed along a side and a corner portion of a steel frame post, a pinion 46 mounted to a horizontally movable shifting member 50 such that even at the corner portion of the steel frame post 1 the pinion 46 is constantly held in mesh engagement with a rack 6 disposed on a side of the rail member 5, and a position holding roller 57 for guiding the shifting member 50 in a horizontal direction so that the distance between the rack 6 and the pinion 46 is kept constant. During the movement of the carriage, the distance between the rack and the pinion is kept constant to enable welding operations to be performed in succession with respect to side and corner portions of the steel frame post. Therefore, after a face-to-face welding operation at one side is completed, such a welding operation at the other side may be carried out without the necessity of removing the carriage from the rail member.

Abstract: In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

Abstract: A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle so as to guide the gas to the bonding wire.

Abstract: A welding mechanism for build up of a conical surface includes a base assembly with a base gear fixedly mounted thereto, and a slide rail assembly rotatable about a base axis. The slide rail assembly includes a slide rail positionable parallel to the conical surface, a slide carriage moveable along the slide rail, carrying a welding torch, a rotatable lead screw in threaded engagement with the slide carriage, and a carriage gear rotatable with the lead screw and engaged with the base gear. Rotation of the slide rail assembly moves the torch on the slide carriage circumferentially along the conical surface, and, simultaneously, rotation of the slide carriage assembly, by inter-engagement of the carriage and base gears, causes the slide carriage to move along the slide rail carrying the torch radially along the conical surface, the torch moving in a spiral path, about the base axis, along the surface.

Abstract: A novel high-speed capillary/wedge bonding tool is provided for use on an automatic fine wire bonder which has either a rotating bonding head or a workstation which rotates relative to the bonding head. The novel working tip of the novel bonding tool is provided with two closely spaced parallel sides having substantially zero degree cone angle when viewed from the side. The bonding tool is further provided with a substantially rectangular shaped wedge foot which extends between a segment of the chamfer diameter and a segment of the tip diameter when viewed from the front. In the preferred embodiment, the novel chamfer recess in the novel capillary/wedge bonding tool is elongated so that balls bonded at first bond are more narrow in width than in length and occupy approximately the same area as prior art high speed gold ball bonds. The novel rectangular wedge shape foot produces second mashed wedge wire bonds which are as robust as, and/or stronger than prior art mashed wedge wire bonds.

Abstract: A wire bond station has a platform (32) in cavity (31) of the work station heater block (30) on which a lead frame die mount pad (33) is placed during wire bonding to semiconductor chip mounted on the die mount pad. The platform (32) is of a dimension such that the edges of the die mount pad (33) extend out from the platform (32) so that irregularities (34) on the edges of the die mount pad (33) do not support the die mount pad (33) above the platform (32).

Abstract: A capillary tube (1) for bonding wire (5) has a bore (3) and a cross section in a direction normal to the bore having a long dimension and a short dimension in a direction normal to the long dimension. The bond is made to bond pads (9) using the capillary tube by bonding a wire to one bond pad while the capillary is oriented with the long dimension (25 to 27 or 35 to 37) in a first direction and bonding a wire to a die immediately adjacent the one bond pad with the capillary which can be oriented with the long dimension in the same direction or in a direction normal to the first direction, as may be required.

Abstract: An ultrasonic horn of a bonding apparatus quipped with a bonding tool attached to one end of the horn and a vibration-generating source such as an electrostrictive strain element, magnetostrictor, etc. attached to a bonding arm that supports the bonding horn. The ultrasonic horn is further provided with a vertical vibration adjuster which adjusts the vertical component of the vibration of the ultrasonic horn, and the vertical vibration adjuster includes a projection, recess, etc. provided at the end of the horn.