Abstract: An object is to reduce impact load applied on a bonding subject at the time of wire contact detection and achieve a stable and highly precise fabrication of a bonding ball so as to shorten the bonding time. A wire bonding arm comprises: a Z driving shaft supported by a Z-axis base capable of swinging via a first shaft; and a low pressurizing shaft with a smaller inertia than that of the Z driving shaft having a capillary, which is supported on one end of the Z driving shaft to be capable of swinging via a second shaft. The capillary is brought down by the Z driving shaft to the position of the height right before an initial ball comes to contact with a first bonding point. Then, only the low pressurizing shaft is driven at low speed to be brought down while holding the Z driving shaft in position. At the point where the initial ball comes in contact with the first bonding point, a prescribed weight and ultrasonic vibrations are applied for bonding it to the first bonding point.

Abstract: An automated welding system utilizing integrally mounted robots within a self-contained and repositionable work station. One or more work tables are shuttled between loading and welding stations. The robot is mounted directly adjacent the operating stage, thereby drastically reducing the required floor space. The robot arm is designed to be programed to replicate a desired welding operation in an automated fashion.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.

Abstract: A capillary threading tool is used to thread bond wire through the capillary tool of a wire bond machine. The capillary threading tool includes a handle that is grasped to manipulate a body portion into a gap between the upper end of the capillary tube and the lower end of a guide tube that is positioned above the capillary tube. The body portion includes a guide surface that is placed in contact with the wire bond machine, and a vertical slot extending from the guide surface that terminates in a closed end having an inclined surface. The length of the slot is selected to position the lower edge of the inclined surface above the end of the capillary tube so the bond wire can be threaded into the capillary tube simply by forcing the end of the wire on the inclined surface.

Abstract: There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member. The second member is movable in an axial direction relative to the first member between a first position, in which the second member extends from the first member, and a second position, in which the second member is retracted from the first position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component when the second member is in its first position. A second interface is formed between the first and second members.

Abstract: A welding apparatus for plastic work pieces has two welding tables arranged next to one another. A propulsion device displaces the welding tables. The propulsion device has a drive motor and a propulsion rod assembly. The propulsion rod assembly has spatially separated double arm levers with two lever arms in each case. The two lever arms are each mounted in a rotatable manner on an axis of rotation and are in a mechanical state of rotary connection with one another. One set of lever arms is kinematically connected to one welding table and the other lever arms are kinematically connected to the other welding table. During rotary movement of the double arm levers, the welding tables are moved toward one another in one direction of rotation, and away from one another in the other direction of rotation.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: A stroke and pressure adjusting device is used for the soldering process of a soldering machine which has a driving device for driving a soldering device of the soldering machine to solder, and the driving device has a driving shaft on which the stroke and pressure adjusting device is attached. The stroke and pressure adjusting device comprises a thread sleeve mounted on the driving shaft of the driving device, a slider mounted on the thread sleeve, and a spring mounted between the slider and the driving device, wherein the distance between the thread sleeve and the driving device is adjustable so as to adjust the stroke of the driving device, the distance between the slider and the driving device is adjustable and the distance between the slider and the driving device is adjustable so as to adjust the elastic force generated by the spring, thereby adjusting the operating pressure of the driving device.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.

Abstract: An ultrasonic vibration bonding tool comprising a square bar-like horn body, bonding working portions projecting from the upper and lower surfaces of the horn body at the central maximum vibration amplitude point, and crooked support portions projecting from front and rear surfaces of the horn body at the two minimum vibration amplitude points which are separate the same distance from the bonding working portions on both sides. Proper bonding can be carried out with this ultrasonic vibration bonding tool.

Abstract: Method and apparatus for supplying a protective cover gas during ball formation on a wire bonding machine to permit the use of wire formed from metals which may react with air, such as copper or aluminum.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: A small-sized motor is employed by a driving unit of a welding equipment wherein the inner diameter of a rotary shaft of the motor can be reduced as much as possible, and the entire length of the driving unit is reduced. The driving unit of a welding equipment is provided with a pressure application shaft. The pressure application shaft is driven by a motor including a hollow rotary shaft, a screw shaft fixed inside the rotary shaft, and a nut provided integrally with or substantially integrally with the pressure application shaft, the nut being screwed with a screw provided on the screw shaft. The rotary shaft of the motor is substantially coaxially positioned with the screw shaft. Outer diameters of the nut and pressure application shaft are respectively smaller than an inner diameter of the rotary shaft to form a direct moving guide part.

Abstract: A friction stir weld system for welding and weld repair has a base foundation unit connected to a hydraulically controlled elevation platform and a hydraulically adjustable pin tool. The base foundation unit may be fixably connected to a horizontal surface or may be connected to a mobile support in order to provide mobility to the friction stir welding system. The elevation platform may be utilized to raise and lower the adjustable pin tool about a particular axis. Additional components which may be necessary for the friction stir welding process include back plate tooling, fixturing and/or a roller mechanism.

Abstract: A micro-manipulator apparatus for precisely positioning the tip of an ultrasonic bonding tool or similar implement relative to a work piece includes a pantograph-like input manipulator mechanism coupled by a downward depending ball joint coupling to the rear end portion of a tool support plate comprising part of a follower mechanism.

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Abstract: In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

Abstract: By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A wire bonding machine having a wire clamp comprised of a platinum group metal such as iridium, rhodium, ruthenium, or osmium so as to minimize corrosion due to micro sparking.

Abstract: A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.

Abstract: A system and method for wiring electronic components in a three-dimensional manner. The wiring system includes a means for temporarily placing components on a substrate, a means for directly or indirectly connecting electrodes of the components together with wires, a means for removing the temporarily-placed components from the substrate, and a means for rearranging the components in a three-dimensional manner. The movable section permits the means for bonding to bond the wires to the components from any direction in the three-dimensional space. The means for directly or indirectly connecting the electrodes of the components together with wires includes a means for placing a wiring-branch pad in a space between the electrodes of the components to be indirectly connected together, and a means for bonding the electrodes of the components to the wiring-branch pad.

Abstract: In a die-bonding machine for picking up a number of semiconductor pellets arranged in the form of a pellet array, one by one, to place a picked-up semiconductor pellet on a predetermined position, when an estimated X-direction coordinate position of the semiconductor pellet to be picked up in relation to the pellet supporting and displacing mechanism is assumed as being "x" by considering a center point of the pellet supporting and displacing mechanism as the origin of the coordinates in the X direction, the pellet supporting and displacing mechanism and the pellet picking-up and carrying mechanism are displaced so that an X-direction coordinate position PX of the pick-up position takes a position expressed by the following equation (1) and an X-direction coordinate position CX of the center point of the pellet supporting and displacing mechanism takes a position expressed by the following equation (2):PX=Ax (1)CX=-(1-A)x (2)where 0<A<1.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A method of assembling a plurality of semiconductor chips is provided. A portion of a semiconductor wafer containing the plurality of chips is provided. Each of the plurality of chips has a contact pattern area including a pattern of contacts on a surface of the chip. A respective section of a dielectric interposer is assembled to each respective one of the plurality of chips individually, without detaching the plurality of chips from the portion of the semiconductor wafer. Each section of interposer has a plurality of bonding pads near an outer periphery of the section, so that each bonding pad lies near the contact pattern area of the corresponding one of the plurality of chips. Each bonding pad is wire bonded to a respective one of the contacts on the front surface of the corresponding one of the plurality of chips.

Abstract: The horn of an ultrasonic transducer is applied with ultrasonic waves from an ultrasonic converter in such a way that standing ultrasonic waves develop in the lengthwise direction of the horn. A flange is arranged on the horn at the location of a node of the ultrasonic waves. The length of the flange is so aptly dimensioned that standing ultrasonic waves develop in the flange, when it can freely oscillate, which also have nodes. Drill holes are attached in this node so that the ultrasonic transducer is attachable to an ultrasonic welding device, in particular a wire bonder, by means of screws.

Abstract: An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.

Abstract: In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.

Abstract: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions.

Abstract: A bonding apparatus comprising a capillary through which a wire passes, a torch electrode that makes a substantially horizontal pivotal movement so as to be brought under the capillary, and a rotary motor that drives the torch electrode, thus allowing the torch electrode to have any desired range of movement so as to provide superior working characteristics.

Abstract: A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.

Abstract: A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

Abstract: A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device cna be produced at a low cost.

Abstract: A wire bonding machine having a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame.

Abstract: A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is elimina

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A pressure welding apparatus for pressure-welding an electric wire quickly and surely to a pressure welding terminal in a double-sided solderless connector according to various wire-diameters. A plurality of applicators having various wire pressure welding blades and connector support blades are arranged radially and rotatively around a rotary shaft for enabling to select the pressure welding blade and the support blade by rotary operation of the applicator. A plurality of applicators are arranged symmetrically with respect to the double-sided solderless connector. The pressure welding blade and the support blade with a mechanism movable in up and down directions are arranged opposite to each other on both sides of the solderless connector for enabling to pressure-weld an electric wire to one side of the solderless connector by the pressure welding blade, while the other side of the solderless connector is supported by the support blade.

Abstract: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions.

Abstract: In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-"on"/power-"off" combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.