Abstract: A wire bonding apparatus for semiconductor devices have a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position, an optical means disposed above the supporting block and used for recognizing the pattern of the workpiece held on the supporting block, a storage means for prestoring each level of the workpiece so that the positions of not less than two places intended for recognition on the workpiece having difference in level conforms to the focal point of the optical means, and a control unit for controlling the drive for driving the supporting block, moving the workpiece to the position stored in the storage means and stopping the workpiece at that position.

Abstract: A point-to-point soldering apparatus applies solder to predetermined points on a workpiece in response to control signals from a control circuit. The apparatus includes a heat source moveable to first locations adjacent to the solder points in response to control signals from the control circuit and a solder material source moveable to second locations adjacent to the solder points independently of the heat source in response to control signals from the control circuit. The heat source is mounted on a first robotic positioner and the material source is mounted on a second robotic positioner for independent movement and positioning. A user-programmable controller executes preset soldering routines in which the heat source and material source are positioned adjacent to solder points and commanded to apply heat and solder in accordance with the soldering routines.

Abstract: A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test.

Abstract: A wire bonding apparatus has an image pickup unit for obtaining image data of an image frame of a square area encompassing wire bond objects including electrode pads of an IC chip and corresponding inner leads of a lead frame. The image of the square area is picked up at the bonding station where the bonding operation is executed. The image data is transmitted to an image processing unit, which detects the position of each of inner leads and electrode pads and calculating deviations of position of each of wire bond objects from corresponding design position stored in a memory unit. A control unit controls XY-table based on the deviations to align a bonding tool to each of the bonding points of the wire bond objects. In the case of lead frames, tape carriers or ceramic packages, the accuracy of wire bonding can be improved without being affected by deformation of the inner leads due to transportation, thermal deformation thermal expansion, or vibration remaining in the image pickup unit.

Abstract: A method for connecting a wire lead between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device includes providing a bonding tool having a working end formed with at least a pair of grooves of different length, holding one end of the wire lead to the pin of the semiconductor device in one of said grooves and bonding it, and holding the other end of said wire to the chip in the other of said grooves an bonding it. The grooves have different lengths to allow for different wire spans across the bonded connection areas, on the chip and the pins.

Abstract: A wire bonder for electrically coupling an integrated circuit die to associated wiring traces is disclosed. In one aspect of the invention, the wire bonder includes a pair of ultrasonic transducers. A capillary holder is connected between the transducers to support a capillary having a bonding wire suitable for electrically connecting an integrated circuit die pad to a lead on an associate wiring trace. A signal generator applies drive signals to the transducers to mechanically bond a bonding wire to at least one of an integrated circuit die pad and a wiring trace. The signal generator is arranged to permit independent actuation of the transducers at frequencies suitable for ultrasonic welding. The signal generator means includes a controller for controlling the timing of the drive signals. With this arrangement, the direction of ultrasonic energy applied during welding may be varied by adjusting the relative timing of actuation of the transducers.

Abstract: The capillary for ball bonding for forming a bump on the electrode pad of a semiconductor device includes a pressing member having a bore therein for supplying a metal wire, and a leveling member. The pressing member presses the ball-like end of the metal wire against the electrode pad in order to secure the ball-like end to the electrode pad under pressure. The leveling member makes the bump formed on the electrode pad to a predetermined height. According to the method of forming a bump using the capillary, first, a ball is formed at the end of the metal wire supplied from the bore. A first portion of the bump is formed by moving the capillary downwards and by securing the ball-like end to the electrode pad under pressure by the pressing member. A second portion of the bump is formed on the first portion by supplying the metal wire while the capillary is moved.

Abstract: A wire bonding apparatus including a wire-cutting clamper and an electrical wire connection clamper which is installed above the wire-cutting clamper, the electrical wire connection clamper being electrically connected, selectively via a switch, to an electric torch power supply and a power supply used for detecting faulty wire connections.

Abstract: Optoelectronic devices often comprise an optoelectronic semiconductor element such as a diode laser fastened on a carrier. The desired path of a beam of radiation from or to such an element often implies that such an element has to be fastened on the carrier at a certain, for example right angle. As a result, a contact surface of such an element also encloses an angle with another contact surface which lies on the carrier. In a method according to the invention, one of the two contact surfaces is provided with a wire which has a free end, and after fastening of the diode laser or photodiode the free end of the wire is fastened on the other contact surface. One wire connection can suffice and no auxiliary block is necessary with this wire connection method in two steps. Preferably, the wire having the free end is provided on the element.

Abstract: An wire bonding apparatus for forming ball and stitch bonds includes a bond head (42) having a shaved capillary (20), a carrier (43) for holding the bond head (42), a bearing (44) on which the carrier (43) is mounted, and a bearing table (46) on which the bearing (44) is mounted. The bearing table (46) and bearing (44) provide rotary movement about a z axis for the capillary (20). An x-y table (48) on which the carrier bearing table (46) is mounted provides movement in x and y directions for the capillary (20). A fixed work holder (50) supports a semiconductor die (11) and a leadframe (52) adjacent the capillary (20). The relative rotation provided between shaved capillary (20) and work holder (50) provides proper orientation of the capillary (20) with respect to leadframe (52) to form high quality stitch bonds on leadframe (52) while permitting fine pitch ball bonds to be formed on the semiconductor die (11).

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close for example to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test.

Abstract: The present invention provides a wire bonder and its method that is able to automatically inspect whether an initial ball set with a keyboard has been formed.Ball formed on the end of a wire fed from capillary is placed on lead by driving of a bonding head, and the diameter of that ball is measured by photographing that ball by a camera after bonding a portion of the wire to which ball is connected.

Abstract: A semiconductor device (10) has a lead-on-chip (LOC) configuration. Leads (24) of the device have central portions (36) which are electrically coupled to peripheral bond pads (14) by conductive wires (30). Inner portions (38) of the leads extend from the central portions toward centerline A--A for improved adhesion and to provide an internal clamping area (41) which stabilizes the leads during wire bonding. In one embodiment, tie bar (22) of leadframe (16) is used to distribute power across semiconductor chip (12). The leadframe may also include chip alignment features (50) and tape alignment features (52) to align chip (12) and insulating tape (18) to the leadframe, respectively.

Abstract: A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).

Abstract: A wire bonding apparatus and method which enable fully automatic wire bonding between a connecting electrode on a circuit board and an external lead terminal while saving space to prevent enlargement of the package size.

Abstract: An electric stud gun positioning apparatus is attachable to a collar of a stud gun and has making parts for aligning and orienting the stud relative to a part on which the stud is to be welded.

Abstract: A bonding head for an ultrasonic bonding machine comprises a wedge operatively associated with an ultrasound transducer by means of which an electrically conducting wire can be pressed against a contact surface of an electrical or electronic component and bonded thereto by ultrasonic excitation of the wedge. A wire clamp is located adjacent to and ahead of the wedge and can be moved back and forth by drive means in the direction of the wire being fed to the wedge. The wedge can be moved up and down together with the wire clamp and its drive means in a direction substnatially perpendicular to the contact surface. The bonding head as a whole is also disposed so that it can be swung about an axis perpendicular to the contact surface. The drive means for wire clamp comprises a translational drive which can move the wire clamp exactly parallel to the direction of the wire being fed to the wedge.

Abstract: A wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made adjacent bond. This design maintains the structural integrity needed to produce acceptable wedge bonds.

Abstract: An apparatus for bonding such as wire bonding or inner lead bonding comprises a holding unit for holding an object to be bonded, a supporting unit for mounting thereto the holding unit, a driving unit for moving upwardly and downwardly the supporting unit, and a drive control circuit for controlling the driving unit in accordance with stored information about operations of the supporting member. The bonding apparatus includes a control unit for changing a gain characteristic of the drive control circuit from a high gain characteristic to a low gain characteristic while the holding unit is caused to descend before this holding unit is contacted onto a bonding surface.

Abstract: An apparatus for performance of cutting and welding operations includes an enclosure which encloses a drive motor and which supports a drive wheel and an idler wheel for driving the enclosure along a track. A first support rod projects from the enclosure and a second support rod is adjustably mounted on the first support rod. A torch for cutting and welding is adjustably mounted on the second support rod and a variety of linear and curved tracks are provided, thereby facilitating performances of cutting and welding operations on a range of workpiece configurations.

Abstract: A method is presented for stitch bonding wires to bonding pads on integrated circuit dies by using a tilted bonding capillary tip to prevent damaging the dies. The capillary tip has a face surface about the opening of the capillary. The face surface makes a face angle with respect to a capillary axis. The capillary tip is positioned in proximity to a bonding pad, and the tip is tilted by an angle less than the face angle. An end of a bonding wire is then stitch bonding to the bonding pad without damaging passivation layers on the integrated circuit die which surround the bonding pad. An apparatus permitting ball bonding and stitch bonding at a plurality of angular orientations is also disclosed. The invention should be particularly useful for electrically connecting integrated circuit dies to each other in multi-chip packages (MCP's).

Abstract: A wire clamper used in a wire bonding apparatus including a pair of open/close clamping arms and a pair of clamping elements provided at terminal ends of the clamping arms so as to clamp a bonding wire in between, and at least one of the clamper arms is opened and closed by the electric strain or magnetic strain effect of a piezoelectric element. In addition, a clamping load adjustment screw is installed at the root end of the wire clamper so that it can set an initial clamping load of the clamping elements.

Abstract: A wire bonding apparatus has a sealed casing having an opening which can be opened and closed, a device for gas-tightly dividing the casing into first and second chambers, a sealing device that is movable for communicating the two chambers with each other, a device for supplying an inert gas into the first chamber, a device for supplying oxygen gas or ozone gas into the second chamber, a device for connecting an electrode of the substrate to an electrode of the semiconductor chip via the wire in the first chamber, a device for generating glow discharge in the second chamber, and a device for transporting the substrate between the first and second chambers. Wire bonding is immediately performed after impurities are removed from the electrodes by electrical discharge.

Abstract: A soldering device includes a tube (1) for delivering a source of heating energy such as gas which is slidingly mounted in a chamber (52) such as a piston cylinder so that only the tube needs to be moved in order to move the heat source up and down with respect to a workpiece. Likewise, in a solder dispenser, the solder is supplied through a rigid tube (33) which may be slidingly mounted in a cylinder (52). The two may be used together in a combined soldering device/dispenser.

Abstract: An improved fine pitch bonding tool for use in automatic gold ball bonders for bonding fine gold wires onto closely spaced pads on semiconductors comprises a cylindrical body portion which fits into an ultrasonic transducer and is provided with a bottle-neck working tip on the other end of the body portion for bonding fine gold wires. The working tip is provided with a wire hole diameter less than 1.4 times the diameter of the fine wire to be bonded and is further provided with a chamfer diameter on the working tip which is less than 2.5 mils across. The total tip diameter on the working tip is less than 6 mils and the working face which comprises an annular ring between the chamfer diameter and the tip diameter is provided with a face angle of approximately 22 degrees plus or minus 3 degrees. Even though the bonding tool has a smaller area working face, it has been found to produce second bonds whose pull strength is equal to prior art capillary bonding tools having larger tip diameters and working faces.

Abstract: A multi-level fine wire tensioning apparatus is provided for use in high speed automatic wire bonders. The tensioning apparatus which surrounds the fine wire is mounted close to the bonding capillary and is adapted to apply one of a plurality of tension forces on the wire depending on the phase of the bonding cycle. The tensioning apparatus comprises a housing containing an aspirating tube which applies tension to the fine wire that is threaded through the tube. A controller is coupled to a high speed selector which connects one of a plurality of different level vacuum or pressure sources to the tensioning apparatus which in turn applies different tension forces to the fine wire in the capillary.

Abstract: A wiring apparatus includes a preprocessing unit for splitting a starting portion of splitting coated parallel twin wires composed of two coated single wires joined together in parallel form and fed from a wire rounding member into the two coated single wires and removing a part of a coating of each of the coated single wires split, and a bonding unit for separately bonding portions of the two coated single wires from which coatings have been removed to two terminals provided on a body on which the coated parallel twin wires are to be arranged.

Abstract: An automated wire bonding tool for interconnecting circuit pads on microelectronic circuit devices and substrates. A single application of the bonding tool spans both bond sites with the wire being held under the bond tool and gripped at both ends while bonding the wire to both bond sites simultaneously and with high placement accuracy.

Abstract: In the first operating unit, the bonding gap and the loop length of the bonding wire are calculated from the first and second bonding points. In the second operating unit, the length of the oblique line of the bonding wire, and the angle made between the oblique line and a line connecting the inner lead and the bed together are calculated from the bonding gap, the loop length, and the loop height. In the automatic operating unit, the reverse height, i.e. the distance by which the capillary is moved upward from the bonding pad position, the reverse amount, i.e. the distance by which the capillary, already ascended to the reverse height, is moved to the opposite side of the bonding position, and the capillary ascending amount, i.e. the distance by which the capillary, already moved by the reverse amount, is moved to the highest position of the capillary from the upper surface of the semiconductor chip are calculated from the length of the oblique line, the angle, and the loop height.

Abstract: A welding tip roller guide for supporting a welding tip at a predetermined distance from a corner or other area of a work piece. The guide includes a pair of wheels which allow the device to travel along a corner formed by two adjoining materials. The guide further includes an integral height adjustment mechanism and a pair of guide wheels both to facilitate quick height adjustment of the welding tip and to provide improved lateral stability, respectively.

Abstract: An improved soldering machine for automatically soldering links of a chain is provided in which the links are disposed adjacent to one another and define link junctions where the improved soldering machine holds the chain in position to enable the link junctions to be soldered. A soldering device applies solder paste to the chain at the link junctions by feeding the solder paste through a hollow needle having a needle tip wherein the needle tip traverses a predetermined path and contacts the chain over a portion of that predetermined path. The improvement consists of a heater which traverses a cyclical path which is dependent upon the position of the needle tip and heats the solder applied to the chain over a portion of that cyclical path.

Abstract: A wire clamper for wire bonding apparatuses including a pair of clamping arms provided with clamping elements at the terminal ends of the clamping arms that are opened and closed by the electrostrictive strain effect or magnetstrictive strain effect of a piezoelectric element, and a temperature compensation component is connected to the piezoelectric element so as to correct the fluctuation in the clamping load in the clamping elements that are caused by temperature changes in the clamper.

Abstract: A wire bonder system comprising mounting a tool for ultrasonic bonding onto a transducer and the tool is protruded from the transducer with its bonding side to supply the high frequency electric power to the transducer. The protruded length of the tool is adjusted so as to avoid the length protruded from the transducer to minimize the high frequency electric power.

Abstract: A method is provided for electrically connecting between first and second bonding portions of a workpiece by a metal wire which is provided with a meltable insulating coating and held by a bonding tool. The method comprises causing the bonding tool to press an end of the wire against the first bonding portion of the workpiece for bonding thereto, and causing the bonding tool to press an intermediate portion of the wire against the second bonding portion of the workpiece for bonding thereto. Before bonding to the second bonding portion, the wire intermediate portion is heated to a temperature higher than a melting point of the insulating coating but lower than that of the wire.

Abstract: An apparatus for forming circular weld joints includes a support frame, a motor having a primary drive shaft, a secondary drive shaft coupled to the primary drive shaft, and a hub mounting plate affixed to the support frame. A floating hub assembly is included and a chuck which is coupled to the secondary drive shaft and has at least one radially offset receiving bore. A MIG-type welding tip is rotated in a circular path upon activation of the motor to form a circular weld. Stabilizing guide members and depth guides are provided which extend outwardly from a support frame to ensure proper positioning of the welding tip during the weld forming operation.

Abstract: A capillary-retaining structure for an ultrasonic horn used in a wire bonding apparatus including a stress relief hole formed inside of a capillary attachment hole that is opened at an end portion of the ultrasonic horn. Thus, the capillary retention by the ultrasonic horn is stabilized, and the vibrational characteristics of the ultrasonic horn are also stabilized, thus improving overall bondability in wire bonding. The same effect can be obtained by setting the thickness of a portion between the end surface of the horn and the capillary attachment hole to be thin or by utilizing a bold and nut combination to hold the capillary.

Abstract: An improved cutting apparatus and method used in a wire scribing device, said cutting apparatus having a cutter blade attached to a wiring head, and having a z-axis actuator for precisely controlling the movement of the cutter blade in the z-direction. A gauge height finder, attached to the wiring head determines a distance between the wiring head and the substrate, wherein the determined distance is used to control the z-axis actuator for lowering the cutter blade so as to precisely cut the conductor on the surface of the substrate. Furthermore, the cutting apparatus may include a cutter bracket attached to the wiring head, having a preloaded spring fixed thereto. Wherein this spring is preloaded to a preset force and wherein the spring is positioned above the cutter blade so that an upward force on the cutter blade is transmitted to the spring.

Abstract: An apparatus for applying interconnect bumps to an integrated circuit comprising a wedge bonder assembly (10) including a bonding tool (14) adapted to be selectively moved relative to the integrated circuit (42) and to transmit ultrasonic force to bond wire or ribbon (62) located between the bonding tool (14) and the integrated circuit (42) to the integrated circuit and form an interconnect bump (63), the bonding tool (14) defining a passage (44) through which wire or ribbon (50) is passed to be brought into contact with the integrated circuit (42) and an edge (38) positioned and adapted to weaken wire or ribbon (50) as the bonding tool (14) is moved to the point at which the bonding tool (14) is closest to the integrated circuit (42), the wedge bonder assembly being adapted to move the bonding tool (14) so as to separate the interconnect bump (63) from the wire or ribbon (50) proximal of the bump.

Abstract: The present invention is directed to a welding nozzle position manipulator. The manipulator consists of an angle support to which the remaining components of the device are attached either directly or indirectly. A pair of pivotal connections attach a weld nozzle holding link to the angle support and provide a two axis freedom of movement of the holding link with respect to the support angle. The manipulator is actuated by a pair of adjusting screws angularly mounted to the angle support. These screws contact a pair of tapered friction surfaces formed on the upper portion of the welding nozzle holding link. A spring positioned between the upper portions of the support angle and the holding link provides a constant bias engagement between the friction surfaces of the holding link and the adjustment screws, so as to firmly hold the link in position and to eliminate any free play in the adjustment mechanism.

Abstract: An ultrasonic bonding apparatus including a piezoelectric element which transmit a vibration via the electric strain or magnetic strain effect to a capillary which is mounted to a non-resonant bonding arm, a microcomputer which outputs frequency data and amplitude data and an open-loop control circuit which includes a memory in which output waveform data is stored, a programmable frequency generator which varies the frequency according to the frequency data from the microcomputer and outputs a memory address switching signal, a first D/A converter which determines the amplitude in accordance with the amplitude data from the microcomputer, and a second D/A converter which applies output voltage or current to the piezoelectric element based upon the output waveform data at an address stored in the memory and selected by the address switching signal which is sent from the programmable frequency generator and upon the amplitude determined by the first D/A converter.

Abstract: A wire bonding apparatus for semiconductor devices has a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position, an optical means disposed above the supporting block and used for recognizing the pattern of the workpiece held on the supporting block, a storage means for prestoring each level of the workpiece so that the positions of not less than two places intended for recognition on the workpiece having difference in level conforms to the focal point of the optical means, and a control unit for controlling the drive for driving the supporting block, moving the workpiece to the position stored in the storage means and stopping the workpiece at that position.

Abstract: In a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.

Abstract: A self-propelling apparatus, suitable for use in automatic horizontal position welding of a large-sized square steel column such as architectural steel column, has a welder unit, travelling rollers and a seam tracking device. The travelling rollers are magnet-based rollers (1, 1') which are so arranged to hold the upper surface of the steel column and are mounted on a mounting plate (7). The mounting plate (7) is connected to the seam tracking device (6) through a rotational pivot (8) which is preloaded by a spring (9). The spacing between the travelling magnet rollers (1, 1') preferably ranges between 100 and 200 mm.

Abstract: A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.

Abstract: Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding tool on second bond and at the time the fine wire breaks from second bond. The monitoring circuit determines if the wire clamps are initiated and when and if the electronic flame-off control is fired. Logic circuit in the WBMS determine if wire tail after second bond is of a proper length to make a ball on the wire tail and if not, what remedial measures must be made to avoid damage to the semiconductor device being bonded.

Abstract: A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire held by the clamping arms, the overall weight of the wire clamper can be small, a quick clamping action is secured and the clamping force which is easily adjustable can be steady at a set value.

Abstract: A bonding apparatus comprising a bonding tool, means for driving the bonding tool, means for detecting an amount of crushing of a bonding portion during bonding, means for calculating a rate of change of the amount of crushing detected by the amount-of-crushing detecting means, means for setting a target value, which is inputted from an external source, of the amount of crushing of the bonding portion, and means for controlling the driving means. When the rate of change of the amount of crushing calculated by the calculating means is smaller than a predetermined value, the controlling means compares the amount of crushing detected by the amount-of-crushing detecting means with the target value. When the amount of crushing detected by the amount-of-crushing detecting means is smaller than the target value, the controlling means discriminates that the bonding is being performed in a satisfactory manner and hence should be continued.

Abstract: A method and apparatus for wire bonding bond pads formed on semiconductor dice to the lead fingers of a semiconductor leadframe are provided. Using an automated wire bonding apparatus two (or more) adjacent dice attached to the leadframe are wire bonded using a single indexing step for the leadframe. The wire bonding apparatus includes a heat block for heating the two adjacent dice, and a clamp for clamping the two adjacent dice to the heat block for wire bonding. A bonding tool of the wire bonding apparatus is moved to successively wire bond the two adjacent dice. The method of the invention is suitable for DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF semiconductor packages.

Abstract: A bonding apparatus including a motor, a cam, a capillary, and a biasing means. The motor rotates both ways, the cam on the output shaft of the motor is rotated by the motor, and the capillary is moved downwardly when the motor and cam rotate forward. The biasing means urges the cam to rotate in a reverse direction in order to prevent the capillary from moving downwardly when the power of the bonding apparatus is turned off for some reason.