Abstract: A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic transducer 6, the bonding tool 2 being arranged to press the wire 8 against the contact surface of the electrical or electronic component 10, and monitoring the deformation of the wire 8. The level and duration of the supply of ultrasonic energy and optionally the magnitude of the bonding force are continuously controlled during the bonding process in response to the deformation of the wire, in a closed loop system.

Abstract: A multi heater block of a wire bonder including a multi heater block of such a wire bonder in which one heater may be used in various kinds of packages having different paddle size.

Abstract: Apparatus and a method for orienting individual bonding sites of a lead frame having a plurality of bonding sites includes a universal work station in a work holder. The work holder comprises a gripper mechanism which is mounted on a transverse rail or bar for grasping a lead frame at an edge portion thereof while exposed in a supply magazine. The jaws of the gripper mechanism are pivoted in a horizontal direction which permits the exposed edge of the lead frame to be aligned parallel to a reference plane in a theta orientation direction. While oriented in the theta orientation direction, the lead frame is moved precisely to the window of the work station of the work holder where it is clamped by the top plate and lower plate of the work station before being subsequently bonded.

Abstract: A method for ball-bonding thin film structures. The bonding characteristics of a thin-film electrode structure are measured, before the actual bonding step, by pressing a ball (of a material similar to that of the bonding wire) against an electrode by a bonding capillary, and then measuring the resultant indentation of the electrode. The depth of this test indentation of the electrode has a good correlation with the bondability.

Abstract: In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly below a desired tail length S, and then the capillary and the clamp are moved up slowly 12 so that the clamp is closed to cut the wire and then moved up fast 13 and slowly 14 again.

Abstract: A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.

Abstract: This invention relates to an apparatus for manufacturing a semiconductor device, which has an auxiliary bonding stage in the vicinity of a wafer stage so that when a wire is disconnected during a bonding operation of a ball bump by wire bonding, the wire can be easily restored to the normal state without using an IC chip on a wafer, and a method of manufacturing a semiconductor device, which comprises the steps of moving a capillary above the auxiliary bonding stage after wire disconnection occurs, pulling out the wire from the capillary above the auxiliary bonding stage, forming a ball at a distal cut end of the wire which is pulled out, and performing ball bump bonding on an electrode of an IC chip placed on the wafer stage with the wire formed with the ball at its distal cut end.

Abstract: A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head and camera control unit detect locations of a first bonding pad formed on a first semiconductor chip and a second bonding pad formed on a second semiconductor chip. The program research unit calculates amounts of shift of the detected locations of the first and second bonding pads from reference locations thereof. The microcomputer corrects locations of first and second bonding points and those of first and second cutting points in accordance with the calculated amounts of shift. The control circuit and servo drive unit control the first and second bonding points and the first and second cutting points based on the corrected locations.

Abstract: The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of a metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a mixed gas of (1) a combustible gas and (2) a temperature controlling gas for lowering the combustion temperature of the mixture; and removing the insulator coating material from the coated wire at a bonding part of the coated wire, so as to denude the surface of a metal wire, by the use of flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch.

Abstract: A device for incorporation in a wire bonding machine for monitoring the supply of wire from a wire supply spool to a bonding wedge. The device includes a mount (12) for rotatably mounting a wire supply spool (1); a guide wheel (7) mounted on a lever (8), which lever (8) can be deflected between a first position to which it is biassed by a spring (10) and a second position at which it activates sensor (A); and a motor (3) for driving the wire supply spool (1), which motor (3) is started by the sensor (A) when the sensor is activated by the lever (8). The device further comprises a means for stopping the motor (3) when a predetermined amount of wire (6) has been supplied. The wire (6) passes over the guide wheel (7) between the wire supply spool (1) and the bonding wedge so that the consumption of wire during a bonding cycle causes deflection of the lever (8) from its first position to its second position.

Abstract: A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be connected to a bonding head support. The wire clamp jaw mounting arm serves as a fixed lever to which is attached a first fixed flat surface clamping jaw and also serves as a mount to which a second and pivotal jaw is positioned juxtaposed the first jaw. A force mounting spring is also mounted on the mounting arm for applying a unidirectional force to one end of the second pivotal jaw to bias the pivotal jaw in a normally open or normally closed position.

Abstract: A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is passed. The bonding arm is provided with a piezoelectric element which transmits a vibration to the capillary via its electric strain effect or magnetic strain effect so that the capillary performs wire bonding. With the use of the piezoelectric element that is provided near the capillary, vibrational energy loss can be minimal, and the frequency and amplitude of the vibration can be changed during each bonding operation.

Abstract: A method for conveying a continuous semiconductor lead frame strip includes a guide rail for conveying a lead frame, the guide rail being divided into three portions having a vertically movable central guide rail portion opposite a heat block and fixed first and second guide rail portions on opposite sides of the central portion. The accuracy of conveyance of the strip is not decreased by the vertical movement of the central guide rail. Clamp claws grasping and conveying the strip at each fixed guide rail portion operate within the respective fixed guide rail portions and do not move vertically with the central guide rail.

Abstract: In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the metal wire is disconnected by a clamp. The width of a collapsed portion of the wire on the aluminum pad can be reduced to 1.5 times or less the wire diameter.

Abstract: A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for guiding a bonding wire, and at least one electrode, which is allocated to the head piece of the capillary tube, for producing a spark transfer, by which spark transfer a bonding-wire endpiece which projects from the head piece is melted to form a bonding-wire sphere, the bonding-wire sphere being uniformly shaped and arranged concentrically with respect to the bonding wire or with respect to the bonding-wire endpiece by providing at least two or more electrodes which are distributed uniformly on the circumference with respect to the head piece or to the bonding-wire endpiece and are in each case effectively connected to an independent power unit, which is constructed as a current source, it being possible to activate the power units from a single control unit.

Abstract: A fully-populated Pin Grid Array (PGA) is vacuum-chucked to a pedestal, without mechanical clamping. The pedestal includes a cylindrical shaft having a vacuum passageway extending its length, and a vacuum reservoir block mounted atop the shaft, and an alignment/fixture plate mounted atop the vacuum reservoir block. The alignment/fixture plate is provided with holes extending partially through the plate, at least about its periphery, for receiving the outermost rows/columns of pins of the PGA, while maintaining a vacuum seal. In one embodiment, a central portion of the alignment/fixture plate is provided with a large through-opening for receiving the remaining pins of the PGA. In another embodiment, the central portion of the alignment/fixture plate is provided with a plurality of individual through holes corresponding to the remaining pins of the PGA. In this manner, the PGA is held securely and well aligned within a wire bonder, while avoiding damaging the pins.

Abstract: A method and apparatus are provided for making a continuous wire bond (139) around an angle of a workpiece (101). A pivotal stage (110) having clamp assembles (104, 107) are mounted onto a base (102). A workpiece (110) is placed and secured in clamp assemblies (104, 107). A first wire bond site on a first surface is selected and formed. Workpiece (110) is pivotally rotated to a second surface position at an angle to the first surface where a second wire bond site is selected and formed, thereby making a continuous wire bond from the first selected site to the second selected site.

Abstract: The present invention provides a wire bonder and its method able to reliably and efficiently perform non-contact detection of the misattachment of wires spread between the pads of various types of bonded components and a lead without damage to said bonded component. The present invention is equipped with a clamp provided above a capillary through which is passed a wire, a toroidal coil provided above the capillary without making contact with the wire, a high frequency oscillator that generates a high frequency to the toroidal coil, and a differentiation circuit that detects whether the wire connected to the bonded component is misattached, so that the present invention is able to detect whether the wire to be connected to the bonded component is misattached by this differentiation circuit. Alternatively, the toroidal coil is provided within a path that forms a loop between a clamping device, that performs cutting of the wire, and a bonding stage, without making contact with the line that composes said path.

Abstract: In a wire bonding method and apparatus for connecting first and second bonding points by a wire, a wire clamper, that is made up of an immovable member and a movable member which is driven by a linear motor, is used. The linear motor is actuated so that the clamper first acts in a direction of clamping, then the power to the linear motor is switched off or the linear motor is actuated so that the clamper acts in a direction of releasing, and then the linear motor is actuated in the direction that the clamper clamps the wire, thus moving the movable member.

Abstract: The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to a real-time feedback circuit. The feedback circuit transmits a force adjustment signal to a z-motion actuator to adjust the force applied to the bond site.

Abstract: In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which locates an opposite side of pivotal point of the arm holder from the capillary. The linear sensor detects the gap between the arm holder and the bonding head frame when the arm holder pivots, thus determining the bonding surface level of a workpiece by the capillary which comes into contact with the workpiece.

Abstract: The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed of tungsten carbide. The foot portion can have an aperture therethrough for feeding of wire to be welded.

Abstract: A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.

Abstract: A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said bumps to leads of a film carrier, and a process of outer lead bonding for bonding the leads to a circuit board after punching said film carrier. The bumps are formed by plating means or by stud bump means using a capillary tool. In another aspect of the invention there is provided an apparatus by which it is possible to form the bumps and to perform the inner lead bonding in a single apparatus. The capillary tool for forming the inner lead bonding and a pressing tool for the inner lead bonding are replaceably and selectively mounted to be held on a horn. Also, there are provided a pickup head for moving the chip furnished in a chip feeding unit to the chip stage and a moving table for moving the chip stage.

Abstract: In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.

Abstract: Methods and apparatus for joining conveyed steel pieces in a hot rolling mill are disclosed. A joining apparatus having a series of fusing torches extending laterally across the steel path is used, either before a rough rolling stage or between rough rolling and finish rolling. The fusing torches which operate at the side edges of the pieces to be joined are controlled to have independent movement by a controller, in such a way that the time elapsing between fusing and pressing together of portions at the lateral edges of the join line does not exceed a critical time for regrowth of oxide scale. Various mounting and control techniques for the fusing torches are proposed, including the possibility of two independently-driveable sets the controller can base its control of the torches on steel strip width information obtained from the processing path.

Abstract: A linear, direct-drive microelectronic bonding apparatus (10) provides a bondhead mounting plate (20), a stationary magnetic circuit (21), a moving coil (22), a primary wire clamp housing (23), a transducer mount (24), and a high frequency ultrasonic transducer (25) (above 100 kHz), and a capillary (26). Bondhead assembly (16) is configured to present a collective axial wire path bore (27) along which wire (12) is fed to bond site (28) for forming microelectronic bond interconnections at bond site (28). In accordance with the invention, collective wire path bore (27) provides a protected method of feeding wire (12) to bonding site (28), while magnetic circuit (21) and moving coil (22) provide actuation in a substantially linear downward direction towards the bonding site. In contradistinction, prior art bonding strokes, rather than being substantially linear, are arc-like due to the capillary and transducer being perpendicular to one another.

Abstract: A heat block of a wire bonding machine including an inner lead heating part for bonding each one end of wires to each inner lead of a lead frame, a chip heating part for bonding the other ends of the wires to a semiconductor chip, and a differentially heating member for heating the inner lead heating part of the heat block at a relatively higher temperature than that of the chip heating part of the heat block. The heat block of this invention provides advantage in that the chip heating part is heated at a proper heating temperature, at which temperature the semiconductor chip is not injured, while the inner lead heating part is heated at a relatively higher temperature than that of the chip heating part, thereby considerably improving the bonding effect at the bonding portions between the wires and the inner leads of the lead frame owing to the relatively higher heating temperature of the inner lead heating part than that of the chip heating part.

Abstract: An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits (14). In preferred embodiments a bond end (30) on gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies from about 100 kHz to about 125 kHz. The ultrasonic energy is imparted to the bonding interface (32) via transducer (18) and capillary (16). The transducer (18) is modified in length and tool clamp point (40) is sited on transducer (18) so that the high frequency ultrasonic energy is at the antinodal point in its application to interface (32) and thus is optimized. In preferred embodiments of the process, the ultrasonic energy is applied at about 114 kHz. In this fashion, the bond formed between bond end (30) and bond pad (28) is optimized in terms of shear strength, bonding time and processing temperatures.

Abstract: The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.

Abstract: A wire bonding device which comprises a height detector that detects the surface height of a semiconductor pellet, a position detector that detects the two-dimensional position of the semiconductor pellet, and a bonding head controller that controls a bonding tool, which changes the search height for the bonding operation according to the surface height of the semiconductor pellet detected by the height detector, to thereby make the bonding load constant and stabilize the ahdesive strength of the wire in the wire bonding.

Abstract: A method for welding copper to a ferrous alloy is provided in which an end of the copper wire, either in a single conductor form or a plurality of strands, is exposed to an electrical discharge to form a globule that is generally spherical. The globule is formed by a melting and rapid resolidification of the copper conductor. The generally spherical globule is then placed in contact with a generally flat surface of a ferrous allow terminal. Very slight pressure is provided to avoid deforming the spherical copper globule as a current is passed through both the globule and the ferrous alloy terminal.

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

Abstract: A clamp device for clamping inner leads of a lead frame includes a clamp fixing plate having a working opening and a plurality of inner lead clamps each made of a plate spring and fixedly mounted to an upper surface of the clamp fixing plate. Each of the inner lead clamps has at an inner end thereof a vertical pressing portion normal to the clamp fixing plate upper surface and extending downward into the working opening of the clamp fixing plate and is adapted to press a group of inner leads. The pressing portion of each inner lead clamp may have a plurality of uniformly spaced cut-out portions so that inner leads are clamped individually. A plurality of spaced bolt holes may be formed around the peripheral edges of the working opening. In this case, a compression coil spring is fitted around a bolt received in each bolt hole between the clamp fixing plate and each corresponding inner lead clamp.

Abstract: In a wire bonding method in which a capillary is raised from a first bonding point after bonding and then moved in a direction opposite to a second bonding point, thus making a reverse action, such a reverse action is made in a circular-arc shape around a neck part of the wire at the first bonding point. Thus, an ideal wire-looping is accomplished, thus preventing wire damage which could be caused by reverse actions.

Abstract: An improved tool for ultrasonic wire bonding, and a novel method by which the tool may be semi-automatically threaded with bonding wire are disclosed. The overall exterior shape of the tool is that of an elongated rectangular cross-section bar having at the lower end thereof a tapered, smaller cross-section tip. The tip includes a flattened front toe section for applying ultrasonic energy to wire and a bonding pad, and an upawardly angled oblique lower face rearward of the toe section. A wire guide hole through the tip that has a longitudinal axis that slopes upward at a steeper angle than the oblique lower face has an exit opening in the lower oblique face, just rearward of the front toe section. The guide hole has an enlarged opening in the rear face of the tip. An elongated straight shallow groove formed in a side wall of the tip extends obliquely downwards from the rear face to front face of the tip.

Abstract: A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.

Abstract: An apparatus for conveying a continuous semiconductor lead frame strip includes a guide rail for conveying a lead frame, the guide rail being divided into three portions having a vertically movable central guide rail portion opposite a heat block and a fixed first and second guide rail portions on opposite sides of the central portion. The accuracy of conveyance of the strip is not decreased by the vertical movement of the central guide rail. Clamp claws grasping and conveying the strip at each fixed guide rail portion operate within the respective fixed guide rail portions and do not move vertically with the central guide rail.

Abstract: An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits. In preferred embodiments gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies above about 100 kHz causing the interface temperature required for adequate bonding to be greatly reduced. Heating element (19) applies thermal energy to interface (32) via capillary (16) and transducer (18). Therefore, according to the invention, less thermal energy is required from heater block (22) which is heating interface (32) via IC (14) and leadframe (15). In this fashion, leadframe (15) is maintained at a lesser temperature than in the prior art. Since leadframe (15) is at a lesser temperature, it can be plated with a material having a lower melting point (e.g. tin or solder). In preferred embodiments, leadframe (15) is substantially plated with tin (melting point 185.degree. C.

Abstract: A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer raising-and-lowering cam and a downward movement of the heater block and frame retainer via a spring force. When the heater block is raised and approaches its upper limit position, the frame retainer is raised by this upward motion of the heater block, thus positioning the lead frame at a standard bonding level.

Abstract: A wire bonder processes an angle sensor which detects, without making contact, the angle of rotation of a bonding arm provided so as to be allowed to freely oscillate centered on a shaft supported by a head base, and is able to easily determine the amount of movement of a bonding tool and a distance to a bonding stage.

Abstract: The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.

Abstract: The present invention method is carried out with a programmable automatic wire bonder having a linear drive motor. The wire bonder is programmed to bond loose lead frame leads at a second bond position in a novel manner. The lead frame lead to be bonded at second bond is clamped in a work holder that leaves the ends of the lead frame leads loose above the bonding mandrel of the work holder but restrained to a predetermined floating zone that is established within a predetermined distance above the bonding mandrel. The bondig tool is programmed to engage the loose lead frame lead at second bond at a predetermined velocity which permits the bonding tool to simultaneously exert an impact force on the wire to be bonded and to clamp the loose lead frame lead.

Abstract: A bump electrode having a protrusion is formed. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin-sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.

Abstract: A bonding head for an automatic wire bonding machine, comprises a flame-off electrode which is adapted to be lifted away from an operative position in which it is used to form a ball on the end of the bonding wire, and a capillary through which the bonding wire is supplied to the flame-off electrode. The capillary is also adapted to apply pressure and ultrasonic energy to the wire when it is in contact with the surface to which it is to be bonded. The flame-off electrode is adapted to be lifted away from the operative position by movement of the bond head from a flame-off position to a bonding position.

Abstract: To provide the necessary vertical motion of a wire- bonding head (20) mounted on a flexural pivot (16), a wire-bonding machine (10) includes an actuator comprising a permanent magnet (56) mounted on the flexural pivot (16) and extending into the central passage (49) of a ferromagnetic sleeve (46) in which two oppositely wound coils (50 and 52) are mounted. The magnetic force resulting from current flow through the coils (50 and 52) causes the head assembly (18) to pivot about the flexural-pivot axis (16) and thus cause the magnet (56) to move out of symmetry with respect to the ferromagnetic sleeve (46). The resultant attraction between the permanent magnet (56) and the ferromagnetic sleeve (46) tends to counteract the resistance of the flexural pivot (16) to pivotal displacement from a rest position but does not additionally reduce the stiffness of the flexural pivot to other, undesired modes of motion.

Abstract: In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to the semiconductor device and then a bonding tool is rotated 90 degrees so that inner leads of another pair of inner lead rows are bonded. An ultrasonic bonding apparatus that uses such a method includes a rotary shaft that has the bonding tool at the bottom and is rotated 90 degrees (or any desired angle) via rollers that are mounted eccentrically on the rotary shaft. When the rollers are moved back and forth via a cylinder assembly, the rotary shaft that is eccentric with the rollers is rotated and rotated back 90 degrees, thus making it possible to perform the bonding of inner leads arranged along the square opening of a tab tape by restraining the horn only twice.

Abstract: Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device are broken by a breaking unit, and a defect mark is applied on the defective semiconductor device by a defective mark putting unit in response to the defect signal, the defect mark applying unit applying the defect mark on an area other than an area to be covered with sealing material.

Abstract: A wire bonder and wire bonding method where there is repeatedly calculated the dislocation dy of the end of a capillary, based on the oscillation an elevation angle of a bonding arm which performs oscillating motion, on the end of which said capillary is provided. As a result of controlling the driving of an XY table based on the dislocation dy, the position of the end of the capillary is successively corrected so that the end of said capillary is positioned on a straight line which connects a first bonding point and a second bonding point.

Abstract: In a lead frame retainer mount used in, for example, wire bonding machines, tapered edges are formed on opposite ends of a frame retainer, and a frame retainer carrier which carries the frame retainer and tapered sections which engage with one of the tapered edges of the frame retainer are formed in the frame retainer holder. In addition, a fastening assembly which fastens the frame retainer to the frame retainer holder includes a handle mounted on the frame retainer holder and a clamp which is raised and lowered by a spring when the handle is turned so as to press against the other tapered edge of the frame retainer. Thus, replacement of the frame retainer can be accomplished very easily and in a short amount of time.