Abstract: A line-up clamp unit is powered by a diesel engine which drives a hydraulic pump for operating hydraulic equipment in the unit. The unit includes a line-up clamp which has front shoes, rear shoes and expanding copper back-up tiles. Drive wheels are deployed by a hydraulic cylinder and operated by a hydraulic drive motor. A group of aligning assemblies are electrically operated and fiction to extend L-shaped members to beyond the diameter of the pipe being welded so that the unit can be automatically positioned at the end of a pipe section. A control box includes a radio receiver for receiving control signals and producing corresponding electric control commands for operating the line-tip unit. A remote control radio transmitter has operating, mechanisms, including push buttons and toggle switches, for operating the line-up unit, including the engine, drive motor, brakes, line-up clamp and aligners.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.

Abstract: A clamp post holder has a mounting portion for mounting on a wire bonding machine, and a clamp post holding portion, which holds a clamp post. The mounting portion and post holding portion are separated by a slot except for a connecting portion. A screw passes through a threaded hole in the clamp post holding portion into the slot, with its end abutting the mounting portion. By turning the screw, the clamp post holding portion is pulled away from the mounting portion, thereby moving the clamp post. This allows fine adjustment of the positioning of a clamp member on the clamp post.

Abstract: A low shock work transport system for moving workpieces into a pressure vessel without significant vibrations or mechanical shocks. The pressure vessel has two opposing ends with a sealable port in each of the opposing ends. A vessel rail is contained entirely within the pressure vessel with the two ends of the rail adjacent the ends of the pressure vessel. A movable rail is adjacent each end of the pressure vessel. Each movable rail is movable between a first position in which one end of the movable rail is within the pressure vessel and contiguous with the adjacent end of the vessel rail, and a second position in which the one end of the movable rail is outside the pressure vessel such that the sealable ports can be sealed. The workpieces are moved by sliding them over the upper surfaces of the rails.

Abstract: A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: A method of engineering a process line for fabricating an assembly from a plurality of subassemblies generated from various workpieces is provided, which includes the steps of providing a plurality of standardized task stations, determining at least first and second templates, with each template comprising a defined set of task stations for producing a subassembly, and combining at least the first and second templates in a predetermined alignment to form the process line to fabricate the assembly.

Abstract: A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the hot plates (3, 4, 5, 6, 7, 8) for preheating and full heating are moved downward, and a warp inhibiting body (27) is moved upward. Further, a shutter (34) for shutting off heat is inserted between the film-like printing body (2) and the full heating hot plates (6, 7). Further, at this time, a cold blast is blown to the shutter (34) for shutting off the heat.

Abstract: Novel prefabricated modular structural members for use in low cost construction of relatively small residential, institutional and commercial buildings with high degrees of resistance to damage by fire, hurricanes, earthquakes, moisture, etc., are disclosed. A structural member of this class basically consists of two spaced shell panels and an intermediate core. The core is a triangulated wire frame composed of a plurality of zig-zag shaped wire trusses having their sets of top and bottom apexes anchored to associated sets of longitudinal and transverse chords and the respective proximate inside faces of the shell panels. A fixture is provided which includes posts for holding the wires before they are welded. The posts and a coupling member such as a welding gun can move with respect to each other to form the joints between the wires.

Abstract: A multi-functional welding platform is disclosed. The multi-functional welding platform has a box body at a base thereof. The rear side thereof is installed with a power input end, a power regulator, a high voltage discharging plate, a power output end, etc. A lower side of the platform is installed with an air inlet space. A rear side of the space has a fan. A plurality of air inlet holes are distributed on the platform and filtering material is placed therein. Other than providing the general device for welding, harmful gas or metal smoke enters into the air inlet holes on the platform and then is filtered and then exhausted from the fan so that the operators will not breath harmful gas.

Abstract: The present invention provides a sealing system for implementing an optimum temperature profile for solder melting and improving productivity, and a sealing method therefor. The present invention comprises a sealing machine for superimposing a pre-soldered cap onto a package on which an electronic device element is mounted, a multi-clip for receiving and holding a plurality of sets of the packages and caps superimposed by the sealing machine in batch, and a sealing furnace for heating the plurality of sets held in batch by the multi-clip, and generating a plurality of electronic devices in batch by melting the previously applied solder and sealing the plurality of sets of packages and caps. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved.

Abstract: A means that permits the simultaneous brazing of coiled palladium alloy elements of a hydrogen purifier to a common base that allows the serial interconnecting of subassemblies in an axial orientation.

Abstract: A continuous controlled atmosphere brazing system includes a dry-off oven for driving off moisture from materials to be brazed, a pre-heat section for pre-heating the material and a brazing furnace for brazing the materials. Heated gas produced in the pre-heat section and the brazing furnace is conveyed along a flowpath to the chamber of the dry-off oven to provide substantially the sole source of heat for the oven. The flowpath for the heated gas is defined by a series of tubes in communication with each component of the brazing system and intermediate manifolds disposed between components. The discharge mouths of the tubes open into the oven chamber at the suction side of recirculation fans operating within the oven. The overall temperature of the oven can be regulated by controllably mixing ambient air with the heated gas in relation to the oven temperature.

Abstract: With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached the height H, the fixing of the pick-up tool is released so that the pick-up tool moves downwards from the upper limit position and presses the semiconductor chip onto the adhesive. After a predetermined time after releasing the fixing of the pick-up tool, the bondhead is raised and moved away. With a bondhead particularly suited for the method, the pick-up tool and the bondhead are connected by means of a chamber to which compressed air and/or vacuum can be applied so that, to a large extent, the movement of the pick-up tool can be controlled.

Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.

Abstract: A car side panel assembly line capable of increasing a productivity by shortening an operation time and having a set station ST2, a welding station ST3, and a next operation station ST4 disposed in series in this order, comprising a set carriage 91 having, thereon, a set jig 91 capable of holding the side panel W in upright attitude from the side and installed reciprocatingly between the set station ST2 and the welding station ST3 and a frame carriage 81 having a lower frame 80 and an upper frame 81, capable of holding, between both frames 80, 81, the side panel W in upright attitude through clamp members (821, 822, 823, 831, 832, 833) mounted on the frames 80, 81, installed reciprocatingly between the welding station ST3 and the next operation station ST4, and allowing to exchange the side panel W with the set carriage 91.

Abstract: A multi-functional welding platform is disclosed. The multi-functional welding platform has a box body at a base thereof. The rear side thereof is installed with a power input end, a power regulator, a high voltage discharging plate, a power output end, etc. A lower side of the platform is installed with an air inlet space. A rear side of the space has a fan. A plurality of air inlet holes are distributed on the platform and filtering material is placed therein. Other than providing the general device for welding, harmful gas or metal smoke enters into the air inlet holes on the platform and then is filtered and then exhausted from the fan so that the operators will not breath harmful gas.

Abstract: A welding apparatus for plastic work pieces has two welding tables arranged next to one another. A propulsion device displaces the welding tables. The propulsion device has a drive motor and a propulsion rod assembly. The propulsion rod assembly has spatially separated double arm levers with two lever arms in each case. The two lever arms are each mounted in a rotatable manner on an axis of rotation and are in a mechanical state of rotary connection with one another. One set of lever arms is kinematically connected to one welding table and the other lever arms are kinematically connected to the other welding table. During rotary movement of the double arm levers, the welding tables are moved toward one another in one direction of rotation, and away from one another in the other direction of rotation.

Abstract: A preliminary assembly system for joining a body side panel and a floor panel of an automotive vehicle in a loose-fit hemming joint state by bending a claw piece extending from a main body of one of the panels to hold the other of the panels, prior to welding. The preliminary assembly system comprises a die to be in contact with a back-side surface of the main body of one of the panels in a region forming a loose-fit hemming joint section. Additionally, a main bending blade is provided to be movable to approach the die to bend the claw piece until the loose-fit hemming joint state is established. The main bending blade is moved to approach the die by a movement amount which is mechanically determined relative to a surface of the other of the panels during formation of the loose-fit hemming joint section.

Abstract: A boom control system having rotational and elevation control of the boom. The boom is utilized in a welding apparatus utilizing a conduit to deliver the welding material to the work piece. The elevation of the boom may be adjusted by discrete steps, with a positive method of retaining the boom at a desired elevation. The desired elevation is determined by the operator as that elevation which will keep the conduit or carrier from contacting the hard surface of the floor and the work piece. The rotation may be accomplished by any well known method such as a turntable on which the elevation mechanism is mounted.

Abstract: A strip joining apparatus is provided wherein a time which a line is stopped is shortened, a number of installation spaces is decreased and precise notching may be performed.

Abstract: A multi-axis machine method and apparatus for the control of the motion of a material processing device is disclosed. The device has supply element and the apparatus has a supply co-ordination element. The motion of the processing device can be co-ordinated with the motion of the apparatus such that the loading or twisting forces on the supply element is substantially reduced. The supply co-ordination element includes an angle drive mechanism and rotator housing assembly. An angle drive mechanism for setting the angle of a processing device, the mechanism includes a linear actuator connected to a rod and the rod is pivotally connected at a first end to the actuator and connected at a second end to a device support, the actuator being connected to the rod such that movement of the actuator causes the rod to move the processing device relative to the device support, in the device support.

Abstract: A front floor panel (31) and a first small component such as a second cross member (35) to be assembled to a surface thereof, with the first small component at the bottom side are positioned and set into a locator jig (29) at a part setting station (S), a moving stage (27) is moved to a welding station (T), and the front floor panel (31) and first small component are welded. A handling robot (55) reverses the front floor panel 31 front-to-rear, the moving stage (27) is caused to retreat to the part setting station (S), and a second small component such as a front floor reinforcement (41) to be assembled to the rear surface of the front floor panel (31) is positioned in locator jig (29), the moving stage (27) being moved to the welding stage and the reversed front floor panel (31) being positioned in a locator jig (29), after which the front floor panel (31) and second small component are welded together.

Abstract: A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The second ball mount cell is parallel to and a mirror image of the first ball mount cell. The first ball mount cell and the second ball mount cell can be run by a single operator located between them. In one embodiment of the invention, the BGA ball mount line with dual in-line mounters is implemented in three phases to provide a smooth transition. In the first phase, a proto-line is set-up with a first ball mount cell, a loading cell, a diverter cell, and an unloading cell, to optimize the first ball mount cell. In the second phase, a reflow oven and a flux cleaner are added to form a production line. In the third phase, a second ball mount cell is added to form a BGA ball mount line with a dual in-line mounter.

Abstract: A weld gun cylinder and piston assembly includes a common center end wall interposed between two cylinders. The common center end wall functions as a manifold with bores extending therethrough. The manifold houses two spool valves. The spool valves control the passage of pneumatic pressure through passages of the manifold to and from the cylinders to extend and retract two piston rods for controlling jaws and a weld tip on a robotic arm.

Abstract: A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.

Abstract: An improved pitch and roll mechanism is disclosed herein which provides for increased flexibility, stability, and accuracy of motion in positioning a miniaturized electronic component in a flip chip bonding system. The pitch and roll mechanism generally includes a pitch axis assembly comprising a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned pitch axis bearing surfaces. In addition, a roll axis assembly, mounted at a right angle, or perpendicularly, to the pitch axis assembly, is provided. The roll axis assembly typically includes a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned roll axis bearing surfaces. The curvatures of the pitch and roll axis bearing surfaces are such that a single, coincident center of rotation for both the pitch and roll axis assemblies is created.

Abstract: In a method of manufacturing multiple kinds of products in an arbitrarily selected order in one manufacturing apparatus, the rate of operation of the welding robots to be disposed in each of assembly lines for each of parts is improved, the cost for equipment investment is reduced, and the time required to introduce a new kind of motor vehicle into the manufacturing apparatus is shortened, whereby the productivity is improved. The manufacturing apparatus is made up of: a plurality of part assembly lines for assembling a plurality of parts; a combining station for tack-welding these parts to thereby assemble a product; and a reinforce-welding line for reinforce-welding the product. The number of welding points for welding each of the parts in the respective assembly lines is made equal to one another for all kinds of vehicles. Those welding points of each of the parts which fall short of a required number of welding points are welded in the reinforce-welding line.

Abstract: A general-purpose jig is provided which includes a base, a locational holding device mounted on the base and having a tripod robot that includes three expansion actuators, and a clamp attached to the locational holding device. The position of the clamp can be changed by changing the length of each of the expansion actuators, depending upon an object to be held, according to a command from a control device. The locational holding device may further include a three-axis rotary unit located between the clamp and the tripod robot. The posture of the clamp can be kept constant by controlling the three-axis rotary unit while the clamp is being moved by the expansion actuators.

Abstract: A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.

Abstract: The present invention comprises a process system and a process method for mounting electrical components on leadframes. An endless conveyor belt is used for this purpose, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and locked relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A weld gun cylinder and piston assembly includes a common center end wall interposed between two cylinders. The common center end wall functions as a manifold with bores extending therethrough. The manifold houses two spool valves. The spool valves control the passage of pneumatic pressure through passages of the manifold to and from the cylinders to extend and retract two piston rods for controlling jaws and a weld tip on a robotic arm.

Abstract: A clamping device for a motor vehicle production line has, on both sides of a transport apparatus for rough car bodies, ways on a common base frame leading underneath the transport apparatus for one side carriage each which can run separately on one side of the transport apparatus. The side carriage bears only the side members of one side of the transport apparatus. Clamping means serve to connect the side carriages with the base frame whenever the side carriages are in the working position.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: A welding device includes a number of welding members disposed on a bases and a frame slidably supported in the base for supporting wires to be welded together. A moving device may move the frame between the welding members for allowing the wires to be welded together by the welding members. A removing device may remove the wires from the frame after the wires are welded together. An elevating device may elevate the frame for allowing the other frame to be moved through the frame and for allowing the other wires to be welded together by the welding members.

Abstract: A conveyor support for integrated circuits in an on-line oven, including a mechanism for driving and guiding the elements to be soldered while maintaining a lower surface of one of said elements in direct contact with a wall of the oven.

Abstract: An assembling apparatus assembling a body side of an automotive vehicle, comprises: a moving body provided in a transfer line; a clamp member provided on the moving body for fixing and positioning a body side outer in an upright position in such a manner that a roof rail end of the body side outer is an upper portion and the side sill end of the body side outer is a lower portion; and a welding robot disposed in a side of the transfer line, the welding robot assembling the body side by welding the body side outer positioned by the clamp member.