Work Portion Comprises Electrical Component Patents (Class 228/49.5)
  • Publication number: 20150076214
    Abstract: A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.
    Type: Application
    Filed: February 28, 2012
    Publication date: March 19, 2015
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Seigo Kodama, Noriaki Iwaki, Shuichi Hirata, Masato Suzuki
  • Publication number: 20150034700
    Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 5, 2015
    Applicant: Semigear Inc
    Inventor: Jian Zhang
  • Patent number: 8796597
    Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: August 5, 2014
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Min-Ill Kim, Jong-Gi Lee, Kwang-Yong Lee, Ki-Kwon Jeong
  • Patent number: 8770463
    Abstract: A head gimbal assembly (HGA) carrier comprises a body; an HGA mounting location on the body to mount an HGA mounting member to the body; and an adjustable protective bar coupled to the body, the adjustable protective bar being moveable from a first position to a second position to provide access to an HGA mounted on the HGA mounting member.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: July 8, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: Wachira Puttichaem, Udom Konyong
  • Publication number: 20140166730
    Abstract: The present invention relates to an ultrasonic soldering tool for soldering wires to a solder tab of an electrochromic device located between the layers of an insulated glass unit. The soldering tool includes an ergonomically designed handle and soldering tip head to increase operator comfort during use while also providing features to ensure that the surface of the insulated glass unit is not contacted by the soldering tip. One embodiment of the invention provides an automatic feed soldering tool which may have a soldering tip with a trough to create an ideal solder joint. The invention also includes a clamp for securing a wire to a substrate in a correct position while serving as a guide for the soldering tool to provide further protection from errant contact between the soldering tip and the insulated glass unit. The invention also includes a method of creating an ideal solder joint.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 19, 2014
    Applicant: SAGE ELECTROCHROMICS, INC.
    Inventors: Cliff Taylor, Reul Bernhard, Neil L. Sbar
  • Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • Patent number: 8701966
    Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 22, 2014
    Assignee: Apple Inc.
    Inventors: Michael Nikkhoo, Amir Salehi
  • Patent number: 8651359
    Abstract: A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: February 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Jae-Woong Nah
  • Patent number: 8651354
    Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: February 18, 2014
    Assignee: Orthodyne Electronics Corporation
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • Patent number: 8622278
    Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: January 7, 2014
    Assignee: Intel Corporation
    Inventors: Victor Alvarez, Scott K. Buttars, Steven R. Vandervoort, Shijiang He
  • Patent number: 8622276
    Abstract: In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the packaging substrate can be made smaller than the dimension of the sum of the thickness of the semiconductor chip and the thickness of the melted solder by allowing a part of the bottom surface of the chip positioning piece to become always, or substantially always, in contact with the upper surface of the packaging substrate owing to the weight of the chip positioning jig itself. As a consequence, the semiconductor chip does not slip aside out of the opening of the chip positioning piece. Therefore, the semiconductor chip can be positioned accurately on the packaging substrate.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: January 7, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Hideaki Takahashi
  • Patent number: 8561878
    Abstract: Techniques for linear cell stringing are disclosed. In some embodiments, a plurality of sets of solar cells are linearly positioned, a plurality of tabbing ribbon segments are placed in contact with the plurality of sets of solar cells, and the plurality of sets of solar cells and corresponding plurality of tabbing ribbon segments are soldered together to form a plurality of solar cell strings. In some cases, the plurality of solar cell strings is substantially simultaneously formed in parallel.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: October 22, 2013
    Assignee: Banyan Energy, Inc.
    Inventors: David Sheldon Schultz, John Hunter Mack, Kenneth Evan Rakestraw
  • Patent number: 8556154
    Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: October 15, 2013
    Assignee: Wistron Corporation
    Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
  • Patent number: 8556155
    Abstract: A solder paste mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: October 15, 2013
    Assignee: Compal Information (Kunshan) Co., Ltd.
    Inventor: Jin-Bao Xu
  • Publication number: 20130256387
    Abstract: A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.
    Type: Application
    Filed: February 12, 2013
    Publication date: October 3, 2013
    Applicant: Fujitsu Limited
    Inventors: Yoshiyuki HIROSHIMA, Naoki Nakamura, Akiko Matsui, Tetsuro Yamada, Takahiro Ooi, Kohei Choraku
  • Patent number: 8517245
    Abstract: An automatic soldering machine adapted for soldering cables with electronic products includes a main frame module, a man-machine control interface, a sliding tray located in front of the man-machine control interface, a loading tool slidably disposed in the sliding tray, a feeding module close to a bottom of the sliding tray, a removing module located between the man-machine control interface and a reforming module, a container, a loading tool combination module located above the sliding tray, a spraying module located in rear of the sliding tray, and a loading tool reflow module mounted on a rear of the main frame module. The man-machine control interface is connected with and controls the loading tool, the feeding module, the removing module, the reforming module, the loading tool combination module, the spraying module and the loading tool reflow module for realizing an automatic soldering process of the electronic products and the cables.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: August 27, 2013
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ai-Jun Yan, Wei Wang, Wen-Zhi Xia
  • Publication number: 20130186941
    Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
    Type: Application
    Filed: January 24, 2013
    Publication date: July 25, 2013
    Applicant: Apple Inc.
    Inventor: Apple Inc.
  • Publication number: 20130134209
    Abstract: A circuit board carrier comprises an upper and a lower covers that construct a space for accommodating a circuit board. The upper cover has a recess, and an inner portion of the recess has two positioning elements symmetrically arranged. The positioning elements are movable in a push-and-pull motion. An inner wall of the recess has position limiting elements arranged at four corners thereof. The limiting elements are located between the inner wall of the recess and the positioning elements for confining the motion of the limiting elements and eliminating an effect of product tolerance on manufacturing the board. The carrier implements Y-axis and Z-axis confinement, avoids vibration occurred when the board passes an oven, and avoids a sliding error occurred due to human operations, by springs and pressing bulks fastened to bottom surfaces of the positioning elements and down pressing spring structure disposed below the upper cover.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Applicant: Cheng Uei Precision Industry Co., LTD.
    Inventor: LI-HSUAN LU
  • Publication number: 20130119112
    Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.
    Type: Application
    Filed: November 5, 2012
    Publication date: May 16, 2013
    Applicant: DENSO CORPORATION
    Inventor: DENSO CORPORATION
  • Publication number: 20130115752
    Abstract: An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring.
    Type: Application
    Filed: November 7, 2011
    Publication date: May 9, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Yi-Li Hsiao
  • Publication number: 20130068823
    Abstract: A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.
    Type: Application
    Filed: March 6, 2012
    Publication date: March 21, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Hiroshi MAKI, Masayuki MOCHIZUKI, Yukio TANI, Takehito MOCHIZUKI
  • Publication number: 20130068826
    Abstract: A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.
    Type: Application
    Filed: March 9, 2012
    Publication date: March 21, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Hiroshi Maki, Masayuki Mochizuki, Yukio Tani, Takehito Mochizuki
  • Publication number: 20130071956
    Abstract: With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.
    Type: Application
    Filed: August 15, 2012
    Publication date: March 21, 2013
    Applicant: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Nobuhisa NAKAJIMA, Fukashi Tanaka, Hiroshi Maki
  • Publication number: 20120318850
    Abstract: A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier.
    Type: Application
    Filed: October 25, 2011
    Publication date: December 20, 2012
    Applicant: WALSIN LIHWA CORPORATION
    Inventors: Wei-Cheng LOU, Ming-Tang Chen, Ting-Yu Chou, Jung-Kun Wu, Chung-I Chiang
  • Patent number: 8317077
    Abstract: A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: November 27, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien Ling Hwang, Ying-Jui Huang, Cheng-Chung Lin, Chung-Shi Liu
  • Publication number: 20120292375
    Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.
    Type: Application
    Filed: August 3, 2012
    Publication date: November 22, 2012
    Applicant: International Business Machines Corporation
    Inventors: Pascal P. Blais, Paul F. Fortier, Kang-Wook Lee, Jae-Woong Nah, Soojae Park, Robert L. Toutant, Alain A. Warren
  • Patent number: 8297487
    Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: October 30, 2012
    Assignee: Pillarhouse International Limited
    Inventor: Alexander James Ciniglio
  • Patent number: 8274161
    Abstract: A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a loading station and ending up at an unloading station after various melting and vacuuming of chip/substrate components has been stepwise indexed through those various chambers to the final joining thereof.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: September 25, 2012
    Assignee: SemiGear Inc
    Inventors: Jian Zhang, Chunghsin Lee
  • Patent number: 8252678
    Abstract: A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers.
    Type: Grant
    Filed: December 31, 2010
    Date of Patent: August 28, 2012
    Assignee: SemiGear, Inc
    Inventor: Jian Zhang
  • Patent number: 8240541
    Abstract: Provided are an apparatus and a method for mounting a semiconductor chip. The semiconductor chip mounting apparatus includes a flux reservoir, a flux reservoir moving unit, a wafer support part, a wiring board support part, a transfer head, and a mounting head. The flux reservoir includes an accommodation recess in an upper surface to accommodate flux. The flux reservoir moving unit linearly moves the flux reservoir. The wafer support part is adjacent to a moving path of the flux reservoir and supports a wafer including a semiconductor chip. The wiring board support part is adjacent to the moving path and supports a wiring board. The transfer head picks up and places the semiconductor chip in the accommodation recess. The mounting head picks up the semiconductor chip from the accommodation recess and mounts the semiconductor chip on the wiring board through a surface mount process.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: August 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Juhyun Lyu
  • Patent number: 8240539
    Abstract: The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute a cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: August 14, 2012
    Assignee: Panasonic Corporation
    Inventors: Kazushi Higashi, Tatsuo Sasaoka, Shinji Ishitani
  • Patent number: 8231044
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: July 31, 2012
    Assignee: Orthodyne Electronics Corporation
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • Patent number: 8220691
    Abstract: There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: July 17, 2012
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventor: Yoshihisa Kajii
  • Patent number: 8210417
    Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: July 3, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Naoki Akiyama, Masahiko Sugiyama, Hajime Furuya
  • Patent number: 8209858
    Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: July 3, 2012
    Assignee: Infineon Technologies AG
    Inventors: Roland Speckels, Karsten Guth
  • Patent number: 8196798
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: June 12, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • Publication number: 20120132697
    Abstract: In some examples, an electrode plate K is conveyed to a gap 230 of a pair of stacking drums 210 and 220 with a conveying section 100. In synchronization with conveyance of the electrode plate K, the drums 210 and 220 feed a pair of separators S each formed into a predetermined shape with the separators S adhering to corresponding peripheral surfaces of the pair of drums 210 and 220. While feeding the electrode plate K forward in a generally horizontal manner, the separators S are sequentially stacked on both surfaces of the electrode plate K in synchronized with rotations of the drums 210 and 220, and both edge portions of the separators S are welded.
    Type: Application
    Filed: February 18, 2011
    Publication date: May 31, 2012
    Applicant: KYOTO SEISAKUSHO CO., LTD.
    Inventors: Yasuhiro YANO, Manabu YAMASHITA
  • Patent number: 8186563
    Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: May 29, 2012
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Takashi Usuba, Hirokazu Ichikawa, Toshihiko Mutsuji
  • Patent number: 8186041
    Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: May 29, 2012
    Assignee: Rantec Power Systems, Inc.
    Inventors: Kurt Walker, Paul J. Schmidt
  • Patent number: 8181842
    Abstract: The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device being characterized in that the above-mentioned cover is shaped in such a way that, on the above-mentioned end surface of the cylindrical body, the circular peripheral part of the above-mentioned cover exerts a compressive stress, after brazing, on substantially the whole contact area between the end surface of the cover and the end surface of the cylindrical body.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: May 22, 2012
    Assignee: Schneider Electric Industries SAS
    Inventors: Hans Schellekens, Marie-Fran├žoise Devismes, Dominique Mazzucchi, Olga Kozlova
  • Patent number: 8151448
    Abstract: A component placement apparatus includes: a tray storing device having slots for storing trays, a tray transporting device for transporting a tray from the tray storing device to a pickup area, a controller for controlling the transport of the trays into and out of the tray storing device, and at least one component pickup and placement device for picking-up a component in a tray located in the pickup area and placing the component on a substrate. The tray storing device includes first and second parts located proximal and distal the pickup area, respectively. The first part stores trays (i) from which at least one component may be removed and/or (ii) that are expected to be needed at the pickup area in the short term. The second part stores trays, which are empty, full, or are not expected to be needed in the pickup area in the short term.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 10, 2012
    Assignee: Assembleon N.V.
    Inventors: Adrianus Johannes Petrus Maria Vermeer, J. T. A van De Ven
  • Publication number: 20120061451
    Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.
    Type: Application
    Filed: November 21, 2011
    Publication date: March 15, 2012
    Inventor: Alexander James Ciniglio
  • Publication number: 20120045869
    Abstract: A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.
    Type: Application
    Filed: August 23, 2010
    Publication date: February 23, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael A. Gaynes, Jae-Woong Nah
  • Publication number: 20120031955
    Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
    Type: Application
    Filed: February 10, 2011
    Publication date: February 9, 2012
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventor: Ken Pham
  • Patent number: 8091760
    Abstract: The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: January 10, 2012
    Assignee: KIOTO Photovoltaics GmbH
    Inventors: Ingram Eusch, Rudolf Frank, Armin Kogler
  • Publication number: 20110315743
    Abstract: In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.
    Type: Application
    Filed: August 22, 2011
    Publication date: December 29, 2011
    Applicant: SHINKAWA LTD.
    Inventors: Yusuke MARUYA, Nobuyuki AOYAGI
  • Patent number: 8066172
    Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: November 29, 2011
    Assignee: Pillarhouse International Limited
    Inventor: Alexander James Ciniglio
  • Publication number: 20110278348
    Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.
    Type: Application
    Filed: January 26, 2010
    Publication date: November 17, 2011
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takashi Sugihara, Takashi Usuba, Hirokazu Ichikawa, Toshihiko Mutsuji
  • Patent number: 8047418
    Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 1, 2011
    Assignees: Fujitsu Ten Limited, Sensbey Co., Ltd.
    Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita
  • Patent number: 8020744
    Abstract: A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: September 20, 2011
    Assignee: LANXESS Corporation
    Inventors: Timothy A. Palmer, Robert R. Cunningham