Abstract: Methods and associated apparatus are disclosed for use in mounting particles on and de-mounting particles from a substrate having an array of tacky and non-tacky areas. The particles can be either electrically conducting or electrically non-conducting. Selection of electrically conducting particles is preferred. The substrate having an array of tacky and non-tacky areas can either be electrically non-conducting (e.g., a dielectric substrate) or electrically-conducting. The methods involve use of first and second electrode plates with the substrate therebetween, the plates having applied thereto a direct current potential, which potential in preferred embodiments is reversed in polarity for a number N of cycles. Methods and articles are disclosed using an electrically conductive surface adjacent the tacky and non-tacky areas to minimize static buildup on the particles and tacky and non-tacky areas.

Abstract: Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.

Abstract: A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and is formed, at its predetermined positions, with a plurality of through-holes for attracting the solder balls thereto, respectively, with the solder ball attracting mask having a principal face engageable with the solder balls and a rear face engageable with the suction apparatus such that the through-holes extend through the solder ball attracting mask from the principal face to the rear face, the through-holes each including a funnellike attraction area for attracting the solder ball thereto, which reduces its diameter gradually from the principal face towards the rear face up to a suction port and a suction hole which has a diameter larger than that of the suction port and extends from the suction port to the rear face so as to define a suction space.

Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr; 1, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: The present invention provides a sealing system for implementing an optimum temperature profile for solder melting and improving productivity, and a sealing method therefor. The present invention comprises a sealing machine for superimposing a pre-soldered cap onto a package on which an electronic device element is mounted, a multi-clip for receiving and holding a plurality of sets of the packages and caps superimposed by the sealing machine in batch, and a sealing furnace for heating the plurality of sets held in batch by the multi-clip, and generating a plurality of electronic devices in batch by melting the previously applied solder and sealing the plurality of sets of packages and caps. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved.

Abstract: With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.

Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.

Abstract: Large vibration tool, vibrating at ultrasonic frequency, especially for applications in the welding, joining or cutting of materials, especially thermoplastics, in cleaning or emulsifying by the activation of a liquid medium, in gas spraying or in shot blasting by blasting any kind of medium, made in the form of a circular sonotrode hollowed out at its center so as to produce a cavity allowing a shape approaching that of a bell to be obtained,

Abstract: A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.

Abstract: The present invention relates to an electrical terminal implementation device that fabricates individual terminals, positions the terminals at their point of use, and connects the terminals to the subject components. The present device may also include apparatus for attaching the terminals to a component, testing the connection between the terminal and the component, coating the terminals with flux, shaping the terminals, and burnishing the component. More specifically, the present invention includes a terminal feeder by which integrated terminals are fed into the device. The integrated terminals are directed from the feeder toward a punch by a selector assembly. Before an individual terminal is cut from the integrated terminals by the punch, a loader assembly grips the individual terminal. Once separated from the integrated terminals, the individual terminal is moved by the loader assembly to the positioner assembly.

Abstract: A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.

Abstract: A retaining device for holding at a place a workpiece such as a lead frame including a pair of first slits formed so as to surround the bonding window opened in the retainer. Furthermore, second slits are formed so as to extend to the outside from the end portions of the first slits, thus forming first connecting areas; and third slits are formed on the outside of the second slits so as to be perpendicular to the first connecting areas, thus forming second connecting areas.

Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.

Abstract: A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder is disclosed. The nozzle device further includes a nozzle having a moving member assembled to the inside of the holder shaft, and moved in an upward or downward direction due to a pressure of air flown through the holder shaft, for picking up or placing a parts.

Abstract: A reflow apparatus includes at least one heating unit. Each of the at least one heating unit includes an air blower for circulating air; a partition for defining an air circulating path; at least a first slit heater and a second slit heater for heating a workpiece with the circulating air, the workpiece having a first surface and a second surface; and a furnace housing for accommodating the workpiece. The air blower includes a first fan for blowing the air toward the first surface of the workpiece, a second fan for blowing the air toward the second surface of the workpiece, and a motor for rotating the first fan and the second fan. The first fan and the second fan are provided in correspondence with the at least the first slit heater and the second slit heater.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.

Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

Abstract: A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion.

Abstract: The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used for creating the permanent electrical connection between each high power semiconductor chip and the high power hybrid module. The soldering reflow process is used to attach each SMT component to the high power hybrid module. The automated high power hybrid modules assembling process yields the high power hybrid modules with excellent thermal properties.

Abstract: So as to confirm bonding precision for assuring accurate bonding, a precision confirmation substrate composed of a transparent sheet member and a precision confirmation chip composed of a transparent sheet member are used; and a precision confirmation substrate positioning component for positioning and fixing the precision confirmation substrate is provided on a bonding station, the precision confirmation chip is held by suction to a tool and disposed above the precision confirmation substrate, images of the precision confirmation substrate and precision confirmation chip are detected by an optical probe, the precision confirmation substrate and precision confirmation chip are moved and positioned relative to each other, the precision confirmation chip is then placed on the precision confirmation substrate, and the superimposed precision confirmation substrate and precision confirmation chip are again detected by the optical probe.

Abstract: The heating surface of an iron member is contacted to the upper surface of an electronic part such as a semiconductor chip to be mounted on a wiring substrate. Then solder electrode sections (solder balls) on the electronic part are dissolved so that the electronic part is soldered to a cupper foil pattern on the wiring substrate. And only the electronic parts necessary to be soldered are heated at a uniform heating temperature without influencing the periphery. Moreover, the iron member is moved by a moving head (iron head), and the wiring substrate is placed on a moving table to be moved. A semiconductor chip is mounted at a predetermined position on the wiring substrate by the movement of the iron member and the semiconductor substrate. The iron member is provided with a function of holding the semiconductor chip by attracting it, and thus the iron member has a function of a soldering apparatus and a function of a chip mounter.

Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract: An end effector has a tower with non-stacked spatulas. Tolerance stacking is avoided by making grooves in the tower relative to a common reference surface, and mounting the spatulas in such grooves. The grooves are provided in separate planar walls of the tower. The walls intersect to enhance the structural properties of the tower. The tower has a dual-purpose clamp formed integrally with one wall for use in assembling the tower and the spatulas, and for mounting the completed end effector in a load lock. The spatula may carry a wafer during various operations, e.g., semiconductor processing, material deposition and etching systems, or in flat panel display processing systems. The carrying of the wafers is notwithstanding vibration of equipment for performing the manufacturing operations, which vibration is primarily in a range of frequencies.

Abstract: The present invention provides an apparatus and methods for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.

Abstract: A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.

Abstract: The present invention comprises a process system and a process method for mounting electrical components on leadframes. An endless conveyor belt is used for this purpose, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and locked relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: An mounting apparatus for mounting an electrical component onto a substrate of an electrical assembly. The mounting apparatus employs a compensating element to facilitate the component mounting operation. The compensating element includes a spring member and a damping member. The spring member applies an optimal contact pressure for securely mounting said component without damaging the component. The damping element acts to damp the spring member during so as to effectively reduce a spring force that acts on the mounting apparatus during the component delivery stage.

Abstract: An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: The invention relates to a method for the temperature regulation of components, for example semiconductor circuits, printed circuit boards and the like, in which the components are conveyed on carriers through an inlet slot into a temperature-regulating housing provided with temperature-regulating members and are conveyed out through an outlet slot opposite the inlet slot. The carriers are accommodated by a magazine in the housing, which magazine is provided with adjacently arranged holders and, after the first holder has been loaded, is displaced progressively in one direction from a starting position into successive accommodating positions in which the individual holders of the magazine are loaded one after the other.

Abstract: A conveyor support for integrated circuits in an on-line oven, including a mechanism for driving and guiding the elements to be soldered while maintaining a lower surface of one of said elements in direct contact with a wall of the oven.

Abstract: A feed unit for moving parts over short distances has a four-bar chain forming a translating solid parallelogram having two parallel rigid opposite legs, one of which constitutes a base leg, connected to one another by elastic elements and a piezoelectric stack translator extending between and flexibly connected to the rigid legs for articulation relative to the rigid legs and oriented at an angle of incidence (&agr;) with respect to a base leg that is greater than 90° and less than 45°.

Abstract: In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.

Abstract: A fixture containing a plurality of parallel optical fibers is aligned using a solder circuit that is itself mounted on the surface. The fixture is positioned on the circuit so as to be in contact with a quantity of solder. With the solder in the molten state, the fixture is aligned with respect to an element receiving light output from the optical fibers, and the alignment is secured by allowing the solder to solidify with the fixture immobilized.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead. frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Flux may be applied to precise areas of the parts at a flux station, and the flux station may include a rough part locator that roughly locates a part indexed into the flux station and a precise part locator that precisely locates the part. The flux station may further include a guide rail for supporting the part and a mechanism for raising and lowering the guide rail. The flux station may include a flux sprayer for applying flux to the part, where the flux sprayer includes an air valve, a flux valve, and a controller coupled to activate and deactivate separately the air valve and the flux valve. The controller may activate the air valve before activating the flux valve and deactivate the flux valve before deactivating the air valve.

Abstract: The precise solder paste application process makes use of mask registration apertures that are formed in the printed circuit board and that are adapted to receive a component solder paste mask that conforms to the conductor pattern of the component to be replaced. The component solder paste mask comprises a mask that has formed therein apertures that correspond to the pattern of solder paste that is to be applied to the printed circuit board surface mount pads to correspond to the conductors of the component. The component solder paste mask includes registration features that mate with the registration apertures formed in the printed circuit board to thereby ensure precise placement of the component solder paste mask over the area of the printed circuit board that receives the replacement component.

Abstract: A mounting device for use with a printed circuit board solder machine having a pair of conveyors, where the printed circuit board is disposed between the conveyors for transport through the solder machine includes a body having a top and bottom portion. The top portion of the body includes structure for connecting the body to one of the pair of conveyors. The body is breakable when a predetermined pressure is exerted on the body to prevent damaged devices from interfering with the operation of the solder machine. Structure is further provided on the body for grasping a printed circuit board.