Work Portion Comprises Electrical Component Patents (Class 228/49.5)
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Patent number: 8091760Abstract: The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell.Type: GrantFiled: November 30, 2010Date of Patent: January 10, 2012Assignee: KIOTO Photovoltaics GmbHInventors: Ingram Eusch, Rudolf Frank, Armin Kogler
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Publication number: 20110315743Abstract: In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.Type: ApplicationFiled: August 22, 2011Publication date: December 29, 2011Applicant: SHINKAWA LTD.Inventors: Yusuke MARUYA, Nobuyuki AOYAGI
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Patent number: 8066172Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.Type: GrantFiled: August 12, 2010Date of Patent: November 29, 2011Assignee: Pillarhouse International LimitedInventor: Alexander James Ciniglio
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Publication number: 20110278348Abstract: To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B.Type: ApplicationFiled: January 26, 2010Publication date: November 17, 2011Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Sugihara, Takashi Usuba, Hirokazu Ichikawa, Toshihiko Mutsuji
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Patent number: 8047418Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.Type: GrantFiled: December 8, 2006Date of Patent: November 1, 2011Assignees: Fujitsu Ten Limited, Sensbey Co., Ltd.Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita
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Patent number: 8020744Abstract: A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.Type: GrantFiled: February 22, 2010Date of Patent: September 20, 2011Assignee: LANXESS CorporationInventors: Timothy A. Palmer, Robert R. Cunningham
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Publication number: 20110198388Abstract: A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers,Type: ApplicationFiled: December 31, 2010Publication date: August 18, 2011Applicant: Semigear IncInventor: Jian Zhang
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Patent number: 7980444Abstract: An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.Type: GrantFiled: May 8, 2007Date of Patent: July 19, 2011Assignee: Panasonic CorporationInventors: Hiroshi Ebihara, Hiroshi Nasu, Katsuhiko Watanabe, Hiroyuki Kobayashi
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Patent number: 7975898Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.Type: GrantFiled: December 21, 2009Date of Patent: July 12, 2011Assignee: Fujitsu LimitedInventor: Tetsuji Ishikawa
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Publication number: 20110121055Abstract: There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip.Type: ApplicationFiled: November 16, 2010Publication date: May 26, 2011Applicant: SHIBUYA KOGYO CO., LTD.Inventor: Yoshihisa KAJII
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Patent number: 7942305Abstract: A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The pair of soldering arms is moveable and the actuator is controllable to move one soldering arm relative to the other soldering arm.Type: GrantFiled: June 24, 2010Date of Patent: May 17, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Shen-Chun Li, Shou-Kuo Hsu, Yung-Chieh Chen, Hsien-Chuan Liang
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Patent number: 7921552Abstract: A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.Type: GrantFiled: July 20, 2009Date of Patent: April 12, 2011Assignee: Seagate Technology LLCInventors: JoAnn C. Vigil, Robert Gibson-Taylor
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Publication number: 20110049222Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.Type: ApplicationFiled: August 12, 2010Publication date: March 3, 2011Inventor: Alexander James Ciniglio
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Patent number: 7882997Abstract: A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.Type: GrantFiled: July 11, 2005Date of Patent: February 8, 2011Assignee: Pac Tech-Packaging Technologies GmbHInventors: Elke Zakel, Ghassem Azdasht
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Patent number: 7870991Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.Type: GrantFiled: September 6, 2007Date of Patent: January 18, 2011Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20100311234Abstract: A method of manufacturing a semiconductor device is provided. A first bond of a first wire loop is formed. A wire is bonded through a ball to a lead or a chip electrode of a semiconductor chip to form a second bond of the first wire loop and a first bond of a second wire loop. A second bond of the second wire loop is formed. The ball provides a large bonding area, and thus, provides a strong bonding strength.Type: ApplicationFiled: May 28, 2010Publication date: December 9, 2010Inventor: Yukinori Tabira
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Publication number: 20100308103Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.Type: ApplicationFiled: June 8, 2009Publication date: December 9, 2010Applicant: TYCO ELECTRONICS CORPORATIONInventors: GEORGE JYH-SHANN CHOU, ROBERT DANIEL HILTY
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Patent number: 7845539Abstract: There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and mask tables extending from the printing table to edges of the mask and sucking the edges of the mask to bring the edges of the mask into close contact with the board under vacuum.Type: GrantFiled: October 7, 2009Date of Patent: December 7, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Joon Kon Kim, Sang Soon Choi
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Publication number: 20100301101Abstract: A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.Type: ApplicationFiled: July 22, 2010Publication date: December 2, 2010Applicant: SHINKAWA LTDInventors: Kohei Seyama, Yutaka Kondo, Osamu Kakutani, Shigeru Hayata
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Patent number: 7837083Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.Type: GrantFiled: December 16, 2009Date of Patent: November 23, 2010Assignee: WSTP, LLCInventors: John MacKay, Tom Molinaro
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Patent number: 7819301Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.Type: GrantFiled: October 26, 2007Date of Patent: October 26, 2010Assignee: WSTP, LLCInventor: John Mackay
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Patent number: 7789284Abstract: There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.Type: GrantFiled: April 30, 2009Date of Patent: September 7, 2010Assignee: Panasonic CorporationInventors: Hiroshi Ebihara, Hiroshi Nasu, Katsuhiko Watanabe, Hiroyuki Kobayashi
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Patent number: 7752742Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.Type: GrantFiled: August 19, 2008Date of Patent: July 13, 2010Assignee: Flir Systems, Inc.Inventors: Paul Schweikert, William J. Parrish, Andrew Sharpe, Vu L. Nguyen, Marco Scussat
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Patent number: 7677431Abstract: A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.Type: GrantFiled: August 22, 2007Date of Patent: March 16, 2010Assignee: ASM Technology Singapore Pte Ltd.Inventors: Yam Mo Wong, Keng Yew James Song, Ka Shing Kenny Kwan
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Patent number: 7654432Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.Type: GrantFiled: November 26, 2008Date of Patent: February 2, 2010Assignee: WSTP, LLCInventors: John MacKay, Tom Molinaro
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Patent number: 7648056Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.Type: GrantFiled: July 3, 2008Date of Patent: January 19, 2010Assignees: Sony Corporation, Sony Electronics Inc.Inventors: Esteban Arturo Alvarez Serrano, Horman Armando Millán Sánchez
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Publication number: 20100001046Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.Type: ApplicationFiled: July 3, 2008Publication date: January 7, 2010Inventors: Esteban Arturo Alvarez Serrano, Horman Armando Millan Sanchez
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Publication number: 20090288762Abstract: The invention relates to a method for welding a conductor to a conductive film, which is preferably intended for connection to a circuit board support in order to produce a printed circuit board, the depth or diameter of the conductor being preferably larger than the thickness of the conductive film. According to said method, the conductive film is in contact with a thermal isolation plate, at least during the welding process, the thermal conductivity of said plate being lower than that of the conductive film.Type: ApplicationFiled: January 24, 2006Publication date: November 26, 2009Inventor: Markus Wolfel
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Patent number: 7596864Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.Type: GrantFiled: March 15, 2007Date of Patent: October 6, 2009Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: John Chow, Huan Chen, Chih-Min Lin
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Patent number: 7578423Abstract: An assembly for reducing oxidation of a semiconductor device comprises a holding device for securing the semiconductor device to a platform. The holding device includes at least one opening for providing access by a bonding tool to bonding areas where the semiconductor device is to be bonded. A slidable cover covers the holding device and has a slot for providing access by the bonding tool to the bonding areas through the slot. A guiding device is positioned on the slidable cover and is coupled to a pusher which is operative to push the slidable cover to move along a first axis. The pusher is further guided by the guiding device to move relative to the slidable cover along a second axis which is perpendicular to the first axis without pushing the slidable cover to move in the second axis.Type: GrantFiled: June 6, 2008Date of Patent: August 25, 2009Assignee: ASM Technology Singapore Pte Ltd.Inventors: Rong Duan, Zhao Ya Rui, Pei Bei Xu
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Patent number: 7575147Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).Type: GrantFiled: May 8, 2007Date of Patent: August 18, 2009Assignee: Texas Instruments IncorporatedInventors: Jeffrey W. Marsh, R. Tracy White, David L. Hamilton
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Patent number: 7568606Abstract: A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic devices and a conveying track is further provided for conveying electronic devices towards and away from the bonding tool. The device handler includes a rotary platform for holding an electronic device, and which is operable between an orientation wherein the rotary platform is aligned with the conveying track for transferring an electronic device between the rotary platform and the conveying track, and another orientation wherein the rotary platform is aligned with the storage assembly for transferring an electronic device between the rotary platform and the storage assembly.Type: GrantFiled: October 19, 2006Date of Patent: August 4, 2009Assignee: ASM Technology Singapore Pte Ltd.Inventors: Yam Mo Wong, Keng Yew James Song, Ka Shing Kenny Kwan
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Publication number: 20090127321Abstract: A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.Type: ApplicationFiled: November 20, 2007Publication date: May 21, 2009Applicant: CATERPILLAR INC.Inventors: Paul C. Gottshall, Ernesto Nicanor Santillan Guerrero
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Publication number: 20090127316Abstract: One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation. One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.Type: ApplicationFiled: November 15, 2007Publication date: May 21, 2009Applicant: Infineon Technologies AGInventor: Dirk Siepe
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Patent number: 7516878Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: December 27, 2005Date of Patent: April 14, 2009Assignee: Panasonic CorporationInventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Publication number: 20090078743Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.Type: ApplicationFiled: September 20, 2007Publication date: March 26, 2009Inventors: Wing Cheung James HO, Hon Shing Eddie LAW, Kam Hong Kenneth LAM, Wai Lok Ben TO
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Publication number: 20080314964Abstract: A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.Type: ApplicationFiled: August 26, 2008Publication date: December 25, 2008Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventor: Richard Deward Sadler
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Publication number: 20080197169Abstract: A method for providing an electric connection between a wire (12) and a metal surface (10) by pressing a curved and stripped section (11) of the wire towards the metal surface and arranging a brazing pin (14) in close proximity to a concave side of the curved section. Electric power is supplied to the brazing pin in a pinbrazing process until a fluxing agent and a solder material carried by the brazing pin has been released and melted. A brazing gun (18) is electrically connected to a power supply (19), the brazing gun having an opening for holding a brazing pin, and the brazing pin having a circular cross section. A bending tool is used for bending a stripped section of an electric wire to a circular shape, wherein the diameter of the bent wire is adapted to the diameter of the brazing pin, and means are provide for pressing the bent wire against the metal surface while generating an arc between the brazing pin and the metal surface.Type: ApplicationFiled: February 19, 2008Publication date: August 21, 2008Applicant: Safetrack Infrasystems SISAB ABInventor: Johan Bavhammar
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Patent number: 7407085Abstract: Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.Type: GrantFiled: September 22, 2004Date of Patent: August 5, 2008Assignee: Intel CorporationInventors: Jadhav G. Susheel, Daoqiang Lu
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Patent number: 7387229Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: January 22, 2004Date of Patent: June 17, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Patent number: 7347347Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.Type: GrantFiled: October 26, 2004Date of Patent: March 25, 2008Assignee: Fujitsu LimitedInventors: Hidehiko Kira, Shunji Baba, Norio Kainuma, Toru Okada, Takatoyo Yamakami, Yasunori Sasaki, Takeshi Komiyama, Kenji Kobae, Hiroshi Kobayashi
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Patent number: 7344059Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.Type: GrantFiled: September 17, 2004Date of Patent: March 18, 2008Assignee: Donnelly CorporationInventor: William A Johnson
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Patent number: 7306132Abstract: A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.Type: GrantFiled: March 24, 2005Date of Patent: December 11, 2007Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Yoshihiko Seino
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Patent number: 7229000Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.Type: GrantFiled: August 25, 2004Date of Patent: June 12, 2007Assignee: ASUSTeK Computer Inc.Inventors: Peng-Wei Wang, Chun-Hsiung Chiu
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Patent number: 7222773Abstract: There is disclosed a semiconductor bonding apparatus which mounts a semiconductor chip via an elastic member disposed between the semiconductor chip and a mounting substrate, comprising a holding section which holds the semiconductor chip facing the mounting substrate, a translatory gas bearing which is connected to the holding section and which is capable of moving the semiconductor chip in a bonding direction with respect to the mounting substrate, a voice coil motor connected to the translatory gas bearing, a load cell which detects a pressing force to be applied to the elastic member by the holding section, and a driving section which generates a driving signal in accordance with the pressing force detected by the load cell to drive the voice coil motor.Type: GrantFiled: April 20, 2004Date of Patent: May 29, 2007Assignee: Olympus CorporationInventor: Toru Kuboi
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Patent number: 7168609Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.Type: GrantFiled: September 3, 2002Date of Patent: January 30, 2007Assignee: International Business Machines CorporationInventors: Lannie R Bolde, James H Covell, Mark W. Kapfhammer
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Patent number: 7165711Abstract: A substrate that is not lying flat on its substrate tray can present significant process problems when a vacuum pickup attempts to pick up the substrate and fails due to the lack of a proper bond forming between the pickup and the substrate. The substrate left behind on the substrate tray could require human intervention. Intervention slows down the manufacturing process and increases costs. A method and apparatus to ensure that substrates are lying flat when presented to the vacuum pickup pad is disclosed. A plate with protrusions is raised into a substrate tray with holes. The protrusions lift the substrates up off the bottom of the substrate tray and ensure that they are laying flat when presented to the vacuum pickup pad.Type: GrantFiled: April 20, 2004Date of Patent: January 23, 2007Assignee: Texas Instruments IncorporatedInventors: Anthony A. Barretto, Bernardo Abuan, Emory T. Mercado
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Patent number: 7134589Abstract: A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains four guide elements for bearing a holding plate, whereby each guide element has a supporting surface and a bolt that can be moved by means of a drive. In the raised condition of the downholder, the holding plate rests on the supporting surfaces of the four guide elements. In the lowered condition of the downholder, the bolts of the four guide elements press the holding plate against the fingers of the system carrier presented on the heating plate. At least one of the four bolts can be moved separately so that the holding plate can temporarily anchor the system carrier without already pressing all fingers against the heating plate.Type: GrantFiled: September 24, 2004Date of Patent: November 14, 2006Assignee: Unaxis International Trading Ltd.Inventor: Stéphane Balon
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Patent number: 7100813Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.Type: GrantFiled: January 20, 2004Date of Patent: September 5, 2006Assignee: Texas Instruments IncorporatedInventor: Art Bayot
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Patent number: 7040525Abstract: Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.Type: GrantFiled: December 20, 2002Date of Patent: May 9, 2006Assignee: LG.Philips LCD Co., Ltd.Inventors: Sang Seok Lee, Sang Ho Park