Housings (in Addition To Cell Casing) Patents (Class 250/239)
  • Patent number: 10762811
    Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 1, 2020
    Assignee: International Business Machines Corporation
    Inventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Jason J. Bjorgaard, Thomas W. Liang, John R. Dangler
  • Patent number: 10764658
    Abstract: Aspects of the present disclosure are directed toward a system and apparatuses for calibrating metering circuitry. An example system includes a first adapter including a plurality of receptacles proximally arranged in a circular manner on a first surface of the first adapter, the plurality of receptacles configured and arranged to be connected to endpoint controlling circuitry configured and arranged to communicate over the power lines or by using a RF communication, characteristics related to power usage of an endpoint device in a PLC network. The system further includes a second adapter including a plurality of electrical contacts disposed on a first surface of the second adapter and a plurality of terminals disposed on a second surface of the second adapter opposite of the first surface. The plurality of terminals can be physically arranged so as to plug into corresponding inputs on meter calibration circuitry.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: September 1, 2020
    Assignee: Landis+Gyr Technologies, LLC
    Inventors: Keith Binggeli, Josiah Dabill
  • Patent number: 10763129
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 1, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • Patent number: 10753805
    Abstract: A radiation shield for near-infrared detectors of the type used in Raman spectroscopic systems comprises a chamber enclosing the detector and a cooling device in thermal contact with the chamber and the detector to reduce the level of unwanted radiation to which the detector would otherwise be exposed. The chamber may include a window in optical alignment with the detector, and the window may include one or more coatings to pass wavelengths in a range of interest or block radiation at wavelengths outside of this range. The shield may be enclosed in an evacuated dewar having a window which may also include one or more coatings to favor the wavelength range.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: August 25, 2020
    Assignee: Kaiser Optical Systems Inc.
    Inventors: Joseph B. Slater, James M. Tedesco, Alfred Feitisch
  • Patent number: 10729001
    Abstract: Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.
    Type: Grant
    Filed: August 29, 2015
    Date of Patent: July 28, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Shaul Branchevsky, Howard E. Chen, Anthony James Lobianco
  • Patent number: 10725313
    Abstract: The lens driving device is provided with a driving unit for OIS, using a driving force of a first voice coil motor to enable an OIS movable unit to swing in a plane orthogonal to the optical axis direction with respect to an OIS fixed unit; a driving unit for AF, using the driving force of a second voice coil motor to enable an AF movable unit to move along the optical axis direction with respect to an AF fixed unit; a supporting unit for OIS, formed of a first elastomeric material, and having a first biaxial hinge structure moveably supporting the OIS movable unit in the plane orthogonal to the optical axis direction; and a supporting unit for AF, formed of a second elastomeric material, and having a second biaxial hinge structure moveably supporting the AF movable unit along the optical axis direction.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: July 28, 2020
    Assignee: MITSUMI ELECTRIC CO., LTD.
    Inventor: Masayoshi Sugawara
  • Patent number: 10707277
    Abstract: The disclosure is related to creating different functional micro devices by integrating functional tuning materials and creating an encapsulation capsule to protect these materials. Various embodiments of the present disclosure also related to improve light extraction efficiencies of micro devices by mounting micro devices at a proximity of a corner of a pixel active area and arranging QD films with optical layers in a micro device structure.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: July 7, 2020
    Assignee: VueReal Inc.
    Inventor: Gholamreza Chaji
  • Patent number: 10698133
    Abstract: The photoelectric sensor includes a light projecting part emitting light, a light receiving part receiving light, a housing housing the light projecting part and the light receiving part, a setting part receiving an input operation from outside to set a threshold value, and an adjustment part receiving an input operation from outside to finely adjust the set threshold value. The housing includes a front surface having a light projecting/receiving surface allowing light from the light projecting part and light to the light receiving part to pass, a rear surface located on a side opposite to the front surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. The adjustment part is provided on the inclined surface.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 30, 2020
    Assignee: OMRON Corporation
    Inventors: Hirotaka Nakashima, Kazunari Komai
  • Patent number: 10665490
    Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho
  • Patent number: 10649159
    Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 12, 2020
    Assignee: Lipac Co., Ltd.
    Inventor: Sang Don Lee
  • Patent number: 10651620
    Abstract: A laser emitting device includes: a laser oscillator; an electrical part; a protection member; and a shutter. The laser oscillator is configured to emit a laser beam in an emitting direction. The protection member is interposed between the laser oscillator and the electrical part to shield the laser oscillator. The shutter is disposed to form a prescribed angle with respect to an optical path of the laser beam emitted from the laser oscillator. The shutter is movable between a first position at which the shutter interrupts the laser beam and a second position at which the shutter does not interrupt the laser beam. When the shutter is at the first position, the shutter damps and reflects the laser beam as a reflected beam. The reflected beam advances toward a space between the laser oscillator and the protection member. The reflected beam forms the prescribed angle with respect to the shutter.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 12, 2020
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventor: Mitsuo Hirota
  • Patent number: 10644192
    Abstract: A method of manufacturing a light-emitting device includes measuring a light distribution of a light-emitting element, sealing the measured light-emitting element by a sealing material including a phosphor, and curing the sealing material by heat treatment. An emission angle dependence of emission chromaticity of the light-emitting device is controlled by setting a degree of settling of the phosphor in the sealing material according to the measured light distribution of the light-emitting element.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 5, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Koji Fukagawa, Takashi Terayama
  • Patent number: 10636714
    Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 28, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Eiichirou Kishida
  • Patent number: 10625567
    Abstract: Embodiments include a vehicle comprising a mirror assembly attached to a vehicle side and including an air temperature sensor for measuring a first temperature value; a wireless transceiver for receiving a second temperature value from a wireless network; and a processor configured to, upon determining that the first temperature value is greater than the second temperature value, cause the mirror assembly to move to a first position relative to the vehicle side. Another embodiment includes a method of correcting air temperature reading in a vehicle, the method comprising obtaining a first temperature measurement from an air temperature sensor located in a mirror assembly attached to a vehicle side; obtaining a second temperature measurement from a wireless network; and upon determining that the first temperature measurement is greater than the second temperature measurement, causing the mirror assembly to move to a first position relative to the vehicle side.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 21, 2020
    Assignee: Ford Global Technologies, LLC
    Inventor: Aed M Dudar
  • Patent number: 10620040
    Abstract: To make a display in a photoelectric switch easy to see for a user. A photoelectric switch includes a housing having a substantially rectangular parallelepiped shape. A display is attached to a first surface of the outer surface of the housing. A control board is housed on the inside of the housing. A controller is mounted on the control board. The first surface includes a hole-like or cutout-like opening section for allowing a signal cable to pass from the outside to the inside of the housing. The signal cable electrically connects the control board disposed on the inside of the housing and the display disposed on the outside of the housing. A cover member includes a window section for exposing a display region of the display and covers a non-display region of the display. The cover member is provided outside the housing.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 14, 2020
    Assignee: Keyence Corporation
    Inventors: Choryon Oh, Kenji Kojima
  • Patent number: 10623614
    Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.
    Type: Grant
    Filed: September 15, 2018
    Date of Patent: April 14, 2020
    Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.
    Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
  • Patent number: 10605999
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10593823
    Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: March 17, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Hideyuki Utsumi, Yuki Tanuma
  • Patent number: 10574870
    Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: February 25, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Long-Fei Zhang, Shin-Wen Chen, Kun Li, Xiao-Mei Ma
  • Patent number: 10546888
    Abstract: The present disclosure relates to a solid-state imaging device package that enables capturing of higher-quality images, a method of manufacturing the solid-state imaging device package, and an electronic apparatus. The solid-state imaging device package includes: a solid-state imaging device chip that converts light taken in by a lens into an electrical signal; an interposer substrate that secures the solid-state imaging device chip; a frame having a frame structure that encloses the solid-state imaging device chip and prevents emission of unnecessary light onto the light receiving surface of the solid-state imaging device chip; and a protective glass that protects at least the solid-state imaging device chip from external environments, and transmits light. A raised bank structure is formed on the adhesion surface of the frame in contact with the protective glass, and is formed along the entire circumference of the opening portion of the frame.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: January 28, 2020
    Assignee: SONY CORPORATION
    Inventors: Sumio Hokari, Keiki Fukuda
  • Patent number: 10541263
    Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: January 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-hoon Kim, Ji-chul Kim, Seung-yong Cha, Jae-choon Kim
  • Patent number: 10508935
    Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: December 17, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yung-Yi Chang, Ying-Chung Chen
  • Patent number: 10495077
    Abstract: An energy-storing-type high-pressure electric fuel pump includes an electromagnetic driving apparatus and a plunger sleeve cylinder component. The plunger sleeve cylinder component includes a high-pressure volume, a plunger sleeve having a plunger hole, and a plunger capable of sliding within the plunger hole. A clearance volume of the plunger in the plunger hole is a high-pressure fuel chamber. A clearance volume between the electromagnetic driving apparatus and the plunger sleeve cylinder component forms a low-pressure fuel chamber. Under the action of the electromagnetic driving apparatus, the plunger sleeve cylinder component sucks a fuel in the low-pressure fuel chamber into the high-pressure fuel chamber and pressure-feeds the fuel into the high-pressure volume. The electromagnetic driving apparatus includes an energy storage apparatus, a movable part, and a still part.
    Type: Grant
    Filed: May 4, 2013
    Date of Patent: December 3, 2019
    Assignee: Zhejiang Fai Electronics Co., Ltd.
    Inventors: Daguang Xi, Ping Zhang, Yanxiang Yang, Chengwen Liu
  • Patent number: 10476251
    Abstract: A high-voltage device for receiving a high-voltage cable having a conductor designed to conduct an electrical current and a cable insulation surrounding the conductor, includes an insulation and a waveguide. The insulation includes an at least partly transparent or translucent field control unit from a siloxane polymer which is designed to at least partly surround the cable insulation of the high-voltage cable, the siloxane polymer including, in at least one portion of the field control unit, covalently bonded fluorophores and/or dielectric pigments. The waveguide is arranged such that a light signal caused by a partial discharge in the field control unit can be coupled from the field control unit into the waveguide.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: November 12, 2019
    Assignees: IPH Institut “Prueffeld fuer elektrische Hochleistungstechnik” GmbH, Polymerics GmbH, HPS Berlin GmbH Hochspannungspruefungen & Beratung
    Inventors: Gerd Heidmann, Aniela Leistner, André Leistner, Daniel Siebler, Philipp Rohwetter, Wolfgang Habel, Ronald Plath
  • Patent number: 10466431
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: November 5, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10431551
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 1, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor
  • Patent number: 10423051
    Abstract: A camera module includes a substrate having a first main surface mounted with an image sensor, a second main surface on the reverse side of the substrate from the first main surface in the predetermined direction, and is provided with at least one hole extending from the first main surface in the predetermined direction. The camera module further includes a holder which has a boss inserted from the first main surface into the at least one hole, and holds at least one lens. The camera module further includes a fixing part made of adhesive that is cured into an anchor shape. The fixing part fixes the boss inside the at least one hole.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: September 24, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroyuki Tahara, Takehiro Ueda, Kazuo Sibukawa, Atsuki Kamatani, Yoshiyuki Hotta
  • Patent number: 10417895
    Abstract: Disclosed is a method and a device for improving the safety of a maritime platform, installed at sea or navigating at sea, including an observation of sea waves striking the maritime platform, an operation of the maritime platform being controlled via a control system. The method and device are suitable for: —acquiring elevation values of the surface of the sea at a plurality of points, making it possible to characterize at least one group of sea waves, a sea wave being likened to a wave defined by a period and an amplitude, —calculating at least one characteristic quantity of each group of waves, —comparing the calculated characteristic quantity to a hazard threshold, —if the comparison indicates the hazard threshold is crossed, raising an alert intended for the control system.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: September 17, 2019
    Assignee: NAVAL GROUP
    Inventors: Céline Drouet, Xavier Dal Santo, Nicolas Cellier
  • Patent number: 10411431
    Abstract: Laser systems are provided with a semiconductor laser having an emission face, a drive circuit adapted to supply electric energy to the semiconductor laser to cause the semiconductor laser to emit a beam; a user input system adapted to sense a user input action; a controller adapted to control the drive circuit based upon the sensed user input action; a housing within which the laser is positioned and having an opening with a window through which the semiconductor laser can emit the beam. The semiconductor laser is positioned to emit the beam through the window and the emission face of the semiconductor laser is sized to cause a divergence in the beam to create a patterned emission with a predetermined shape without passing the beam through beam shaping optics.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: September 10, 2019
    Assignee: LMD Power of Light Corporation
    Inventors: Susan Houde-Walter, Brian L. Olmsted, Jeffrey W. Mock, John A. Kowalczyk, Jr., Jeffrey D. Tuller
  • Patent number: 10404882
    Abstract: An image sensor unit includes a light condenser that collects light from an object to be read, an image sensor that receives the light collected by the light condenser and outputs an image, and a housing that houses the light condenser and the image sensor. The housing includes a plurality of spacer attachment portions to which a first spacer that keeps a distance between the housing and a mount member can be detachably attached and for which distances between the housing and the mount member in a state where the attached first spacer abuts against the mount member differ from each other.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: September 3, 2019
    Assignee: CANON COMPONENTS, INC.
    Inventor: Takeshi Sugiyama
  • Patent number: 10400102
    Abstract: In various aspects, the disclosure relates to thermally conductive thermoplastic compositions comprising a polymer matrix, an impact modifier composition having a chemically reactive impact modifier, and, optionally, a chemically non-reactive impact modifier, and a thermally conductive filler. The disclosed thermally conductive thermoplastic compositions exhibit good thermal conductivity and improved impact and ductile properties.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: September 3, 2019
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V
    Inventors: Yun Zheng, Huanbing Wang, Yaqin Zhang, Xiaodong He
  • Patent number: 10396783
    Abstract: An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: August 27, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Hsun-Wei Chan
  • Patent number: 10381036
    Abstract: Systems and methods of laser bias calibration are presented. A preamplifier circuit may include a laser voltage monitor circuit and a laser bias control circuit configured to automatically adjust an output laser bias threshold voltage based on a monitored laser voltage. The laser bias control circuit may include a first differentiator circuit, a second differentiator circuit, and a threshold detection circuit. The preamplifier circuit may be utilized in a heat assisted magnetic recording device.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: August 13, 2019
    Assignee: Seagate Technology LLC
    Inventors: Todd Michael Lammers, Abdelkrim Tatah, Tim Rausch, Robert Matousek
  • Patent number: 10373995
    Abstract: Techniques for fabricating an image sensor chip having a curved surface include placing a bending substrate on a first surface of an imaging sensor chip. The first surface of the imaging sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes bending the bending substrate so as to impart forces on the image sensor chip to produce a curved imaging sensor chip. A second surface of the curved imaging sensor chip may be adhered to a backside substrate. The second surface is opposite the first surface. The bending substrate may be removed from the first surface of the imaging sensor chip.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: August 6, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventor: Brian K. Guenter
  • Patent number: 10345613
    Abstract: A lens driving apparatus with a lens portion having at least one lens, a base portion on which an image sensor detecting light coming through said lens portion can be fixed, a driving portion capable of relatively moving said lens portion in a vertical direction to a light axis of said lens portion and in a parallel direction to the light axis of said lens portion with respect to said base portion, and at least three suspension wires connecting a focus portion including said lens portion and said base portion so as to allow a relative movement. The suspension wires are arranged outside a magnet of said driving portion along the vertical direction to the light axis.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: July 9, 2019
    Assignee: TDK TAIWAN CORPORATION
    Inventors: Chao-Chang Hu, Fu-Yuan Wu, Yi-Lang Chan
  • Patent number: 10338087
    Abstract: A housing of a photoelectric sensor has a front surface having a light projecting/receiving surface, a rear surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. On the top surface, a teach button that receives an input operation from outside to set a threshold value and an indicator that displays a detection result of the object being detected are provided in order from the side of the inclined surface. On the inclined surface, an adjustment button that receives an input operation from outside to finely adjust the threshold value is provided. A distance between the teach button and the adjustment button is larger than a distance between the teach button and the indicator.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: July 2, 2019
    Assignee: OMRON Corporation
    Inventors: Hirotaka Nakashima, Kazunari Komai
  • Patent number: 10337994
    Abstract: According to one embodiment, a measuring device for a sample liquid includes a container which stores the sample liquid, the container including a transparent or translucent optical component with an inclined surface to be brought into contact with the sample liquid, an optical sensor provided on a bottom of the container, which detects light from the sample liquid, and a measurement module which measures a concentration of a specific substance contained in the sample liquid, or a liquid height or liquid volume of the sample liquid based on a detected signal of the optical sensor.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: July 2, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kaita Imai, Shouhei Kousai, Yosuke Akimoto, Michihiko Nishigaki, Yutaka Onozuka, Miyu Nagai
  • Patent number: 10312276
    Abstract: An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 4, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Chih Chien, Wei-Feng Lin
  • Patent number: 10303259
    Abstract: Various of the disclosed embodiments present depth-based user interaction systems facilitating natural and immersive user interactions. Particularly, various embodiments integrate immersive visual presentations with natural and fluid gesture motions. This integration facilitates more rapid user adoption and more precise user interactions. Some embodiments may take advantage of the particular form factors disclosed herein to accommodate user interactions. For example, dual depth sensor arrangements in a housing atop the interface's display may facilitate depth fields of view accommodating more natural gesture recognition than may be otherwise possible. In some embodiments, these gestures may be organized into a framework for universal control of the interface by the user and for application-specific control of the interface by the user.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: May 28, 2019
    Assignee: YouSpace, Inc.
    Inventors: Ralph Brunner, Andrew Emmett Seligman, Hsin-Yi Chien, John Philip Stoddard, Po-Jui Chen, Elon Sharton-Bierig, Sierra Justine Gaston, Vivi Brunner
  • Patent number: 10290091
    Abstract: A filament inspection system is disclosed that gathers empirical data on the physical and chemical properties of filament. The illustrative embodiments need only a single video camera and two mirrors to image all of the exterior surfaces of one or more filaments simultaneously. These images can be used to analyze the physical properties of the filament. Furthermore, the illustrative embodiments need only a simple electrical network to gather empirical data on the permittivity of each segment of filament, which gives insights into the chemical properties of the filament. For example, embodiments of the present invention are particularly well suited for inspecting fiber-reinforced thermoplastic filament, and variations in the number, dispersion, wetting, and length of the fibers are all observable in variations in permittivity.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: May 14, 2019
    Assignee: Arevo, Inc.
    Inventors: Saeed Heysiattalab, Chandrashekar Mantha, Mohammad Dadkhah Tehrani, Michael Peter Thompson
  • Patent number: 10274688
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: April 30, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10263538
    Abstract: A semiconductor device according to an embodiment includes a transistor including a first electrode, a second electrode, and a gate electrode, an electric resistance being electrically connected to the gate electrode, a diode including an anode being electrically connected to the first electrode and a cathode being electrically connected between the electric resistance and the gate electrode, and a capacitor being connected in parallel with the electric resistance.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: April 16, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kentaro Ikeda
  • Patent number: 10257509
    Abstract: System and method for performance characterization of multi configuration near eye displays includes: a mirror; a lamp; a beamsplitter; a collimating and reflective lens for collimating light reflected from the beamsplitter and reflecting it back towards an image sensor having a view finder; a field-of-view (FOV) aperture to project light from the lamp onto the DUT through the objective lens; a video viewfinder digital camera for capturing an virtual image of the DUT; a spectroradiometers for performing spectroradiometric measurements on a captured image of the defined measurement area to characterize the performance of the DUT; and a controller circuit for characterizing performance of the DUT based on the spectroradiometric measurements.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: April 9, 2019
    Assignee: GAMMA SCIENTIFIC INC.
    Inventors: Richard L. Austin, Erik Stauber, Brian C. Drews
  • Patent number: 10249549
    Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: April 2, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromitsu Hongo, Takahiro Sumi, Masaaki Hanao, Kazuo Kishida
  • Patent number: 10236312
    Abstract: The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: March 19, 2019
    Assignee: SONY CORPORATION
    Inventor: Yusuke Mada
  • Patent number: 10230876
    Abstract: A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: March 12, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie ZHAO, Feifan Chen, Liang Ding, Nan Guo, Ye Wu, Heng Jiang
  • Patent number: 10205069
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: February 12, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • Patent number: 10190905
    Abstract: An optical sensor arrangement comprises an optical barrier which is placed between a light-emitting device and a photodetector. Herein the light-emitting device and the photodetector are arranged on a first plane and are covered by a cover. The photodetector exhibits an active zone. The optical barrier exhibits an extent along a first principal axis, which is pointing parallel to the line connecting the centers of the light-emitting device and the photodetector. Herein the extent is greater than a dimension of the active zone. The optical barrier is designed to block light emitted by the light-emitting device that otherwise would be reflected by the cover by means of specular reflection and would reach the photodetector. The optical barrier is designed to pass light emitted by the light-emitting device and scattered on or above an outer surface of the cover.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: January 29, 2019
    Assignee: ams AG
    Inventors: Yu Wang, David Mehrl, Greg Stoltz, Kerry Glover, Tom Dunn
  • Patent number: 10132677
    Abstract: The present disclosure relates to an optical sensing accessory, an optical sensing device, and an optical sensing system. An optical sensing accessory, an optical sensing device, or an optical sensing system comprises a plurality of optical sensor modules and other electronic modules to achieve multi-site measurement. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory, an optical sensing device, or an optical sensing system and comprise the optical sensor module and other electronic modules to have further applications.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: November 20, 2018
    Assignee: Taiwan Biophotonic Corporation
    Inventors: Chang-Sheng Chu, Yu-Tang Li, Yeh-Wen Lee, Chih-Hsun Fan, Lung-Pin Chung, Jyh-Chern Chen, Shuang-Chao Chung
  • Patent number: 10096726
    Abstract: A photovoltaic solar cell, including an N-side layer proximate to a first planar surface and a P-side layer proximate to a second planar surface that is opposite to the first planar surface, is formed from a circular wafer substrate. An N-side conductive contact is electrically coupled with the N-side layer, and a P-side conductive contact electrically coupled with the P-side layer. The P-side conductive contact and the N-side conductive contact are each disposed proximate to the first planar surface, the circular wafer substrate includes an edge exclusion zone, and the P-side contact is disposed within or proximate to the edge exclusion zone.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: October 9, 2018
    Assignee: Space Systems/Loral, LLC
    Inventors: Bao Hoang, Samuel Geto Beyene