Abstract: An optical receptacle includes a first optical surface, a second optical surface, and an annular first cylindrical part disposed to surround a second central axis of the second optical surface. The first cylindrical part includes a first inner surface with a circular shape in a cross section perpendicular to the second central axis, and a second inner surface disposed on a second optical surface side than the first inner surface and provided with a circular shape in the cross section perpendicular to the second central axis. A diameter of the first inner surface is greater than a diameter of the second inner surface, and a length of the second inner surface in a direction along the second central axis is 0.5 to 4.0 mm.

Abstract: Stacked devices and methods of fabrication are provided. Die-to-wafer (D2W) direct-bonding techniques join layers of dies of various physical sizes, form factors, and foundry nodes to a semiconductor wafer, to interposers, or to boards and panels, allowing mixing and matching of variegated dies in the fabrication of 3D stacked devices during wafer level packaging (WLP). Molding material fills in lateral spaces between dies to enable fan-out versions of 3D die stacks with fine pitch leads and capability of vertical through-vias throughout. Molding material is planarized to create direct-bonding surfaces between multiple layers of the variegated dies for high interconnect density and reduction of vertical height. Interposers with variegated dies on one or both sides can be created and bonded to wafers. Logic dies and image sensors from different fabrication nodes and different wafer sizes can be stacked during WLP, or logic dies and high bandwidth memory (HBM) of different geometries can be stacked during WLP.

Abstract: A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.

Abstract: An imaging apparatus includes an image capturing element configured to convert an image obtained through an imaging lens, into an electronic signal, an image capturing element holder configured to hold the image capturing element, a base member configured to tiltably support the image capturing element holder, a driving member configured to tilt the image capturing element holder to incline the image capturing element relative to a surface orthogonal to an optical axis of the imaging lens, and a sealing member configured to seal a gap between the base member and the image capturing element holder, wherein the sealing member deforms by the tilting of the image capturing element holder.

Abstract: An optical keyswitch includes a keycap, a support mechanism, and a switch module. The support mechanism is disposed below the keycap and configured to support the keycap moving upward and downward, the support mechanism comprising a first frame and a second frame, the first frame having a sliding end. The switch module includes a circuit board, an emitter, and a receiver, the emitter and the receiver are electrically connected to the circuit board, and the emitter emitting an optical signal to the receiver. When the keycap is pressed, the first frame is driven by the keycap to slide substantially parallel to the circuit board and block the optical signal with the sliding end, so the switch module is triggered to generate a triggering signal.

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.

Abstract: A portable radiological cassette includes a scintillator, a photosensitive slab, the scintillator and the photosensitive slab forming a panel, the panel having a front face intended to receive the incident x-ray and a rear face opposite the front face, an electronic circuit board, a mechanical protection housing, wherein the panel and the electronic circuit board are disposed, comprising a top face and a bottom face; wherein the top face of the mechanical protection housing comprises: a first layer of rigid material, a second layer of rigid material, the second layer of rigid material being in contact with the front face of the panel, a layer of cellular material disposed between the first and the second layers of rigid material.

Abstract: An image processing device includes a first substrate, a second substrate, a third substrate provided with a power source circuit, and a casing storing the first substrate, the second substrate, and the third substrate, in which the first substrate has a first surface and a second surface, and is provided between the third substrate and the second substrate in a first direction orthogonal to the first surface, a light receiving element is provided on the second surface, the second substrate has a third surface, a fourth surface, and an opening, the third surface faces the second surface, and the opening is provided to overlap the light receiving element in the first direction, a light emitting element is provided on the fourth surface to surround the opening, and the power source circuit is provided on the third substrate not to overlap the light receiving element in the first direction.

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of electrical connection members electrically connecting the sensor chip to the substrate, a supporting adhesive layer formed on the sensor chip, and a light-permeable sheet disposed on the supporting adhesive layer. Each of the electrical connection members includes a head solder disposed on a connecting pad of the sensor chip, a wire having a first end and a second end, and a tail solder. The first end of the wire extends from the head solder so as to connect the second end onto a soldering pad of the substrate, and the wire has a first bending portion arranged adjacent to the head solder. The head solder and the first bending portion of each of the electrical connection members are embedded in the supporting adhesive layer.

Abstract: Photoelectric conversion apparatus includes semiconductor layer in which first photoelectric converters are arranged in light-receiving region and second photoelectric converters are arranged in light-shielded region, light-shielding wall arranged above the semiconductor layer and defining apertures respectively corresponding to the first photoelectric converters, and light-shielding film arranged above the semiconductor layer. The light-shielding film includes first portion extending along principal surface of the semiconductor layer to cover the second photoelectric converters. The first portion has lower surface and upper surface. The light-shielding wall includes second portion whose distance from the semiconductor layer is larger than distance between the upper surface and the principal surface. Thickness of the first portion in direction perpendicular to the principal surface is larger than thickness of the second portion in direction parallel to the principal surface.

Abstract: The present disclosure provides a semiconductor fabrication apparatus. The semiconductor apparatus includes a processing chamber; a substrate stage provided in the processing chamber and being configured to secure and rotate a semiconductor wafer; a gas injector configured to inject a chemical to the processing chamber; a window attached to the gas injector; and an adjustable fastening device coupled with the gas injector and the window.

Abstract: An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.

Abstract: Described is an oxygen permeable layer for detection of molecular oxygen, wherein the layer has a carrier material in which at least one particle is comprised, wherein the carrier material is polyvinylidene fluoride or a copolymer of polyvinylidene fluoride, and the particle comprises a polymer or a copolymer, wherein the polymer or copolymer of the particle has a chemically covalently bonded indicator compound for detection of molecular oxygen. In addition, a multilayer system for detection of molecular oxygen is described. Also described are a method for producing the layer, and the use of the layer or of the multilayer system for detection of molecular oxygen.

Abstract: An imaging device may include a plurality of single-photon avalanche diode (SPAD) pixels. The SPAD pixels may be overlapped by microlenses to direct light incident on the pixels onto photosensitive regions of the pixels and a containment grid with openings that surround each of the microlenses. During formation of the microlenses, the containment grid may prevent microlens material for adjacent SPAD pixels from merging. To ensure separation between the microlenses, the containment grid may be formed from material phobic to microlens material, or phobic material may be added over the containment grid material. Additionally, the containment grid may be formed from material that can absorb stray or off-angle light so that it does not reach the associated SPAD pixel, thereby reducing crosstalk during operation of the SPAD pixels.

Abstract: A detector including a detector membrane comprising a semiconductor sensor and a readout circuit, the detector membrane having a thickness of 100 micrometers or less and a curved surface conformed to a curved focal plane of an optical system imaging electromagnetic radiation onto the curved surface; and a mount or substrate attached to a backside of the detector membrane. A maximum of the strain experienced by the detector membrane is reduced by distribution of the strain induced by formation of the curved surface across all of the curved surface of the detector membrane, thereby allowing a decreased radius of curvature (more severe curving) as compared to without the distribution.

Abstract: An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate.

Abstract: An electrical power unit or electronic data unit includes an outer housing, a circuit board positioned inside the outer housing, a frame inserted inside the outer housing, and a face plate fitted over the outer housing. The circuit board supports, for example, a high voltage AC electrical receptacle, a low voltage DC electrical receptacle, and a switch, each of which is electrically connected to the circuit board. The frame defines a plurality of outlet openings for receiving respective one of the AC electrical receptacle, the DC electrical receptacle, and the switch. The face plate defines outer receptacle openings that align with respective outlet openings of the frame to provide access to the respective AC electrical receptacle, DC electrical receptacle, and switch.

Abstract: A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first transparent plate, an image sensor, and a first plastic member. The base assembly includes a substrate having a main body that includes a metal material. The first transparent plate is located on the first side of the base assembly. The image sensor is located on the second side of the base assembly and adjacent to the main body, wherein the first side is opposite the second side. The substrate is disposed between the image sensor and the first transparent plate. The first plastic member is connected to the base assembly. The image sensor is surrounded by the first plastic member. When the photosensitive module receives light, the light passes through the first transparent plate and an opening of the main body sequentially to the image sensor.

Abstract: Methods of fabricating optical devices with high refractive index materials are disclosed. The method includes forming a first oxide layer on a substrate and forming a patterned template layer with first and second trenches on the first oxide layer. A material of the patterned template layer has a first refractive index. The method further includes forming a first portion of a waveguide and a first portion of an optical coupler within the first and second trenches, respectively, forming a second portion of the waveguide and a second portion of the optical coupler on a top surface of the patterned template layer, and depositing a cladding layer on the second portions of the waveguide and optical coupler. The waveguide and the optical coupler include materials with a second refractive index that is greater than the first refractive index.

Abstract: An optical sensing device is provided. The optical sensing device includes a first optical sensor and a filter layer. The first optical sensor is configured to receive a first optical signal. The filter layer covers the first optical sensor, and is configured to filter out the first optical signal when the first optical signal is incident on the filter layer at an incident angle not within a specific range.

Abstract: A MEMS board assembly, a LiDAR system including the same, and a method for making the same are disclosed. The exemplary MEMS board assembly includes a MEMS board having a plurality of through holes and a mount having a plurality of threaded holes. The MEMS board assembly further includes a plurality of spring-loaded posts each formed by fitting a spring into a respective post. The plurality of spring-loaded posts are fitted into the plurality of threaded holes of the mount. The MEMS board assembly also includes a plurality of screws fitting the MEMS board to the mount by reaching into the plurality of threaded holes of the mount through the plurality of through holes in the MEMS board and the plurality of spring-loaded posts. The MEMS board touches the plurality of spring-loaded posts at the plurality of through holes in the MEMS board corresponding to the plurality of threaded holes of the mount respectively.

Abstract: An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: A skin measurement apparatus for emitting a plurality of lights for photographing an image of the skin. A skin measurement apparatus includes an ultraviolet ray emitting device; a white light emitting device; a focus lens enabling incident light, which is an ultraviolet ray emitted by means of the ultraviolet ray emitting device and a white light emitted by means of the white light emitting device reflected off the skin and transmitted, to pass therethrough; and an emission control device for controlling the ultraviolet ray emitting device and the white light emitting device such that the ultraviolet ray and the white light can be emitted together. The emission control device adjusts the strength of the white light on the basis of white light control information from the outside.

Abstract: A sensor device has a metal sensor housing with a housing base coupled to a frame base of a metal optical frame. A device mounting plate is orthogonal to the frame base. A securing device secures an optical communication device to the device mounting plate. A barrel mounting channel has first and second sidewalls, each extending obliquely to the frame base and defining a linear translation pathway along the frame base for a metal lens barrel. A fastener secures the metal lens barrel to the first and second sidewalls. A glass lens is in contact with three protrusions extending outward from an inner annular surface of the lens barrel. The optical communication device is configured to be in optical communication with the lens and is secured in a particular position in a translation plane mutually defined by the device mounting plate and the optical communication device.

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm?a?1 mm, and 0.2 mm?c?1.5 a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Abstract: A proximity sensor includes: a transmitter unit for transmitting a light signal; a receiver unit for receiving the light signal reflected by an object to determine a proximity status of the object; and a housing defining a first enclosed accommodation space for accommodating the receiver unit, wherein the portion of the housing which defines the first enclosed accommodation space has a sealed light passage made of a light-transmissible material such that the receiver unit is capable of receiving the light signal reflected by the object through the light passage. The housing can further include a second enclosed accommodation space for accommodating the transmitter unit.

Abstract: A lens module reducing flare and having no dark edges includes a bracket and a sensor. The bracket includes a supporting portion, a first receiving groove, and a second receiving groove. The supporting portion is formed at a junction between the first receiving groove and the second receiving groove. The supporting portion comprises an arc surface. The sensor is received in the first receiving groove. The sensor includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The arc surface faces the sensor. A center of a circle of the arc surface falls within the non-photosensitive area. Light reflected by the arc surface falls outside the sensor.

Abstract: An image sensor package is provided. The image sensor package comprises a package substrate, and an image sensor chip arranged over the package substrate. The integrated circuit device further comprises a protection layer overlying the image sensor chip having a planar top surface and a bottom surface lining and contacting structures under the protection layer, and an on-wafer shield structure spaced around a periphery of the image sensor chip. The height of the image sensor package can be reduced since a discrete cover glass or an infrared filter and corresponding intervening materials are no longer needed since being replaced by the build in protection layer. The size of the image sensor package can be reduced since a discrete light shield and corresponding intervening materials are no longer needed since being replaced by the build in on wafer light shield structure.

Abstract: A small scale and low cost spectral sensing system designed primarily for multi-component fluids that provides a compact, low cost platform for analyzers or chemical sensors with limited number of optical and mechanical components featuring a light source, an optical interface with the sample, and a custom detector (multi-element). A single detector element has a specific wavelength, defined by a filter that can be used to select and measure specific chemical compounds. Multiple detector elements are combined to create a multi-channel detector capable of measuring a broad range of wavelengths from ultraviolet (UV) to near and mid-infrared wavelengths. The fabricated sensor can be configured for almost any class of material including gases, vapors, and liquids, with extension to solids. This is linked to the use of the custom detectors featuring filters tailored to specific substances in a broad spectral range from the UV to infrared.

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a method for fabricating a ceramic device can include forming a plurality of conductive features on or through a selected layer along a boundary between a first region and a second region, each conductive feature extending into the first region and the second region. The method can also include forming an assembly that includes the selected layer and one or more other layers. The method can further include separating the first region and the second region along the boundary such that each of the first region and the second region forms a side wall, the side wall including exposed portions of the conductive features, the exposed portions capable of forming electrical connection with a conductive shielding layer.

Abstract: In some embodiments, a sensor package includes: a substrate including a sensing area; a terminal portion disposed on a side of the sensing area of the substrate and including at least one terminal connected to the outside; a first outer wall disposed on the substrate and including a main wall surrounding at least some outer portions of the sensing area; at least one wire patterned and disposed on the substrate and configured to connect the sensing area and the terminal portion to each other; and a cover disposed on the first outer wall to correspond to the sensing area. Part of the main wall is disposed between the sensing area and the terminal portion, and the main wall includes an opening through which the at least one wire passes. Other embodiments may be disclosed and/or claimed.

Abstract: The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

Abstract: A photovoltaic system is formed as a window that is constructed of at least one polymer layer that is filled or decorated with metal nanoparticles and a window frame that includes one or more photovoltaic cells. The metal nanoparticles have a shape and size such that they display surface plasmon resonance frequencies in the near-infrared and/or the near-ultraviolet. The near-infrared and/or the near-ultraviolet radiations are scattered such that they are transmitted parallel to the face of the window to the photovoltaic cells, where an electrical current is generated.

Abstract: A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.

Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a carrier having a pedestal with a support surface, applying a liquid joining material with filler particles to the support surface of the pedestal and applying a radiation emitting semiconductor chip with a mounting surface, which is larger than the support surface of the pedestal to the liquid joining material such that the joining material forms a joining layer between the support surface of the pedestal and the mounting surface of the semiconductor chip and the joining material at least partially fills only a recess, which is limited by a part of the mounting surface projecting beyond the support surface.

Abstract: An IC integrated structure for an optical mouse of the invention comprises a bracket configured for being connected with a PCB, an LED wafer for emitting light, a main control IC wafer and an optical lens; wherein the LED wafer and the main control IC wafer are respectively mounted at two ends of a terminal surface inside a bracket frame, the LED wafer and the main control IC wafer are connected with the PCB by the bracket, and the optical lens is mounted above the LED wafer and the main control IC wafer; a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer, and a through hole configured for transmitting light is formed in the light shield.

Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.

Abstract: A new apparatus and method within a portable Mudlogging gas detection system that determines the total amounts and various composition of an incoming mix of gases extracted from drilling fluid. The Mudlogging system consists of at least one electronic computing device, at least one infrared interferometer, and at least one other device for detecting gasses extracted from the drilling fluid. The Mudlogging system may switch from the primary gas detection means to a secondary gas detection means upon detection of a non-recoverable fault of the first gas detection means.

Abstract: An exemplary wearable brain interface system includes a headgear configured to be worn on a head of a user, a plurality of photodetector units configured to attach to the headgear, and a master control unit coupled to each of the photodetector units and configured to control the photodetector units by directing a photodetector of each photodetector unit to detect photons of light.

Abstract: An optoelectronic assembly may include a PCB and an optical lens. The PCB includes a top surface where at least a portion of the top surface includes a first material with a first thermal property. The optical lens includes a lens frame and an optical portion positioned within the lens frame. The lens frame is coupled to the top surface of the PCB. The lens frame includes a second material with a second thermal property, the second material being different from the first material. The optical portion positioned includes a third material with a third thermal property, the third material being different from the first material and the second material. The third material is optically transparent.

Abstract: An obstacle notification apparatus of the embodiment is mounted in a vehicle, and includes a probing result acquiring section that sequentially acquires reception intensity of a reflected wave corresponding to a probing wave reflected back by an object, the reflected wave being received by a probing wave transmitting and receiving apparatus transmitting the probing wave in a traveling direction of the vehicle and receiving the reflected wave; an obstacle determining section that determines whether or not an obstacle, which is an object presence of which a driver of the vehicle is to be notified of, is present in the traveling direction of the vehicle, by using the reception intensity of the reflected wave acquired by the probing result acquiring section; a notification processing section that performs a notification process for notifying the driver of the presence of the obstacle based on determination of the presence of the obstacle by the obstacle determining section; an image data acquiring section that ac

Abstract: Various embodiments disclosed herein include a folded flex circuit board that may be used in a camera module. In some embodiments, the folded flex circuit board may include a base portion and one or more tab portions that extend from the base portion. In various examples, the folded flex circuit board may be folded such that the tab portion(s) form at least a portion of one or more sides of a camera module. According to some embodiments, the folded flex circuit board may be configured to provide electrostatic discharge (ESD) protection to the camera module.

Abstract: A detection unit that detects smoke contained in a gas by radiating detection light toward a detection space for detecting smoke, and an inner labyrinth for inhibiting ambient light from entering the detection space, the inner labyrinth being provided to cover an outer edge of the detection space are included, the detection unit includes a light emitting unit that radiates the detection light and a light receiving unit that receives the detection light radiated by the light emitting unit, and at least a part of a side surface of the inner labyrinth on a side of the detection space is formed in a flat shape capable of inhibiting the detection light reflected by the inner labyrinth from entering a field of view RV of the light receiving unit in the detection space.

Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: A sensor device for deploying in an environmental field having macroorganisms and for performing environmental monitoring, features a sensor body and an antifouling device or guard. The sensor body includes at least one instrument or sensor configured to sense to one or more environmental conditions in the environmental field and provide signaling containing information about the one or more environmental conditions sensed. The antifouling device or guard couples to the sensor body, covers part of the at least one instrument or sensor, and protects a covered part of the at least one instrument or sensor from the macroorganisms.

Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Abstract: Provided are a fixed-focus photographing module, a manufacturing method thereof, and a focusing device and method thereof. The focusing method includes: pre-assembling an optical lens assembly in a lens assembly holder, wherein the optical lens assembly is exposed at the exterior of the lens assembly holder, and the optical lens assembly is located in a photosensing path of a photosensing component assembled in a circuit board to form a pre-assembled photographing module; performing, by the pre-assembled photographing module, a photographing operation to obtain a testing image; adjusting, according to the testing image, a relative position between the optical lens assembly and lens assembly holder until the pre-assemble photographing module outputs a clear image as required; and fixing the optical lens assembly and the lens assembly holder to complete a focusing operation and obtain an assembled fixed-focus photographing module.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.