Housings (in Addition To Cell Casing) Patents (Class 250/239)
  • Patent number: 11121287
    Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a carrier having a pedestal with a support surface, applying a liquid joining material with filler particles to the support surface of the pedestal and applying a radiation emitting semiconductor chip with a mounting surface, which is larger than the support surface of the pedestal to the liquid joining material such that the joining material forms a joining layer between the support surface of the pedestal and the mounting surface of the semiconductor chip and the joining material at least partially fills only a recess, which is limited by a part of the mounting surface projecting beyond the support surface.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: September 14, 2021
    Assignee: OSRAM OLED GMBH
    Inventor: Ivar Tangring
  • Patent number: 11092481
    Abstract: An IC integrated structure for an optical mouse of the invention comprises a bracket configured for being connected with a PCB, an LED wafer for emitting light, a main control IC wafer and an optical lens; wherein the LED wafer and the main control IC wafer are respectively mounted at two ends of a terminal surface inside a bracket frame, the LED wafer and the main control IC wafer are connected with the PCB by the bracket, and the optical lens is mounted above the LED wafer and the main control IC wafer; a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer, and a through hole configured for transmitting light is formed in the light shield.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 17, 2021
    Assignee: Dongguan Ouyue Electronic Technology Co., Ltd
    Inventor: Jinfang Ou
  • Patent number: 11073615
    Abstract: A proximity sensor module with two sensors, including a package housing, a circuit substrate, an light emitter and a sensing assembly. The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure, and a second accommodation space defined by the second package structure and the partition structure. The light emitter is arranged in the first accommodating space and is disposed on the circuit substrate. The sensing assembly includes a first sensor and a second sensor. The first sensor and the second sensor are arranged in the second accommodating space, and the first sensor is farther from the light emitter than the second sensor.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: July 27, 2021
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: Seng-Yee Chua, Arakcre Dinesh Gopalaswamy, Guang-Li Song
  • Patent number: 11002133
    Abstract: A new apparatus and method within a portable Mudlogging gas detection system that determines the total amounts and various composition of an incoming mix of gases extracted from drilling fluid. The Mudlogging system consists of at least one electronic computing device, at least one infrared interferometer, and at least one other device for detecting gasses extracted from the drilling fluid. The Mudlogging system may switch from the primary gas detection means to a secondary gas detection means upon detection of a non-recoverable fault of the first gas detection means.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 11, 2021
    Assignee: IBALL INSTRUMENTS LLC
    Inventor: Carl Bright
  • Patent number: 11004998
    Abstract: An exemplary wearable brain interface system includes a headgear configured to be worn on a head of a user, a plurality of photodetector units configured to attach to the headgear, and a master control unit coupled to each of the photodetector units and configured to control the photodetector units by directing a photodetector of each photodetector unit to detect photons of light.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: May 11, 2021
    Assignee: HI LLC
    Inventors: Husam Katnani, Ryan Field, Bruno Do Valle, Rong Jin, Jacob Dahle
  • Patent number: 10996409
    Abstract: An optoelectronic assembly may include a PCB and an optical lens. The PCB includes a top surface where at least a portion of the top surface includes a first material with a first thermal property. The optical lens includes a lens frame and an optical portion positioned within the lens frame. The lens frame is coupled to the top surface of the PCB. The lens frame includes a second material with a second thermal property, the second material being different from the first material. The optical portion positioned includes a third material with a third thermal property, the third material being different from the first material and the second material. The third material is optically transparent.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: May 4, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Wenhua Ling, Yuheng Lee
  • Patent number: 10983188
    Abstract: An obstacle notification apparatus of the embodiment is mounted in a vehicle, and includes a probing result acquiring section that sequentially acquires reception intensity of a reflected wave corresponding to a probing wave reflected back by an object, the reflected wave being received by a probing wave transmitting and receiving apparatus transmitting the probing wave in a traveling direction of the vehicle and receiving the reflected wave; an obstacle determining section that determines whether or not an obstacle, which is an object presence of which a driver of the vehicle is to be notified of, is present in the traveling direction of the vehicle, by using the reception intensity of the reflected wave acquired by the probing result acquiring section; a notification processing section that performs a notification process for notifying the driver of the presence of the obstacle based on determination of the presence of the obstacle by the obstacle determining section; an image data acquiring section that ac
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: April 20, 2021
    Assignee: DENSO CORPORATION
    Inventor: Takeshi Koga
  • Patent number: 10958815
    Abstract: Various embodiments disclosed herein include a folded flex circuit board that may be used in a camera module. In some embodiments, the folded flex circuit board may include a base portion and one or more tab portions that extend from the base portion. In various examples, the folded flex circuit board may be folded such that the tab portion(s) form at least a portion of one or more sides of a camera module. According to some embodiments, the folded flex circuit board may be configured to provide electrostatic discharge (ESD) protection to the camera module.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 23, 2021
    Assignee: Apple Inc.
    Inventor: Chih-Jen Chen
  • Patent number: 10950113
    Abstract: A detection unit that detects smoke contained in a gas by radiating detection light toward a detection space for detecting smoke, and an inner labyrinth for inhibiting ambient light from entering the detection space, the inner labyrinth being provided to cover an outer edge of the detection space are included, the detection unit includes a light emitting unit that radiates the detection light and a light receiving unit that receives the detection light radiated by the light emitting unit, and at least a part of a side surface of the inner labyrinth on a side of the detection space is formed in a flat shape capable of inhibiting the detection light reflected by the inner labyrinth from entering a field of view RV of the light receiving unit in the detection space.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 16, 2021
    Assignee: Hochiki Corporation
    Inventor: Tomohiko Shimadzu
  • Patent number: 10937773
    Abstract: There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: March 2, 2021
    Assignee: PIXART IMAGING INC.
    Inventors: Chee-Pin T'ng, Sai-Mun Lee
  • Patent number: 10908000
    Abstract: A sensor device for deploying in an environmental field having macroorganisms and for performing environmental monitoring, features a sensor body and an antifouling device or guard. The sensor body includes at least one instrument or sensor configured to sense to one or more environmental conditions in the environmental field and provide signaling containing information about the one or more environmental conditions sensed. The antifouling device or guard couples to the sensor body, covers part of the at least one instrument or sensor, and protects a covered part of the at least one instrument or sensor from the macroorganisms.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: February 2, 2021
    Assignee: YSI, INC.
    Inventors: Miguel Angel Rojo, Tiffany Lavon Schirmer
  • Patent number: 10908370
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: February 2, 2021
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10903403
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 26, 2021
    Assignee: BRIDGELUX, INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • Patent number: 10897611
    Abstract: Provided are a fixed-focus photographing module, a manufacturing method thereof, and a focusing device and method thereof. The focusing method includes: pre-assembling an optical lens assembly in a lens assembly holder, wherein the optical lens assembly is exposed at the exterior of the lens assembly holder, and the optical lens assembly is located in a photosensing path of a photosensing component assembled in a circuit board to form a pre-assembled photographing module; performing, by the pre-assembled photographing module, a photographing operation to obtain a testing image; adjusting, according to the testing image, a relative position between the optical lens assembly and lens assembly holder until the pre-assemble photographing module outputs a clear image as required; and fixing the optical lens assembly and the lens assembly holder to complete a focusing operation and obtain an assembled fixed-focus photographing module.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: January 19, 2021
    Inventors: Zhenyu Chen, Mingzhu Wang, Xiaojuan Su, Bojie Zhao
  • Patent number: 10879294
    Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: December 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-hoon Kim, Ji-chul Kim, Seung-yong Cha, Jae-choon Kim
  • Patent number: 10868061
    Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: December 15, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Patent number: 10861838
    Abstract: The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: December 8, 2020
    Assignee: SONY CORPORATION
    Inventors: Toshiaki Iwafuchi, Takayuki Ezaki, Tomoshi Oode
  • Patent number: 10848014
    Abstract: In one aspect, embodiments of the invention are directed to a multi-pole rotor of a variable-flux memory motor (VFMM) that includes: a rotor core; and a plurality of poles. Each of the poles includes: one or more soft rotor magnets; a first ferrous wedge; and a second ferrous wedge. The one or more soft rotor magnets are disposed between the first and second ferrous wedges in a circumferential direction of the rotor.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: November 24, 2020
    Assignee: Jacobi Motors LLC
    Inventors: Nicolaus Radford, Mohammadreza Barzegaranbaboli, Akhila Bachapalli, Takashi Nakachi, Chaitanya Ravipalli, Brian Wightman, Shriya Bhatnagar
  • Patent number: 10845046
    Abstract: A street light has a pole of at least 6 feet in length, and has an electrical socket attached to an end of the pole. The socket includes a body having an interior, and a cover positioned on the body to cover the interior of the body. The cover has a ring-shaped openings providing passage into the interior of the body. Resiliently mounted electrical contactors are each positioned in the interior of the body and adjacent to one of the ring-shaped openings in the cover. A central bore extends through the body, and a ledge is positioned at the end of the bore to extend radially outward. The socket is connectable to a mating plug to mechanically and electrically connect a street light or other device to the pole. The street light can include sensors that are connectable using a similar socket and plug.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: November 24, 2020
    Inventor: Ran Roland Kohen
  • Patent number: 10838358
    Abstract: An image forming apparatus comprises a light-emission unit, a reflecting member, a light-receiving unit, a detection unit, a ventilation unit configured to send air to the reflecting member, and a control unit. The control unit adjusts at least one of an operation duration and an airflow rate of the ventilation unit, in accordance with a detection signal outputted by the light-receiving unit when a sheet is not at a position where light crosses a conveyance path.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 17, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsutomu Ishida, Tomonari Inoue, Kenji Abe, Takashi Kuwata, Keita Nakajima, Ko Katahira, Takehito Osada
  • Patent number: 10816393
    Abstract: A photoelectric sensor capable of suppressing breakage of a cable connected to a case body is provided. The photoelectric sensor includes a case body having an accommodation space which accommodates at least one of a light projecting portion and a light receiving portion therein, and a cable which accommodates a cord connected via a control portion to at least one of the light projecting portion and the light receiving portion, and a concave portion recessed toward an inside of the case body is provided in an outer surface of the case body, and the cable is mounted in the concave portion.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: October 27, 2020
    Assignee: OMRON Corporation
    Inventors: Hiroyuki Mizusaki, Tomohiro Tsuji, Jumpei Nakamura, Tsuyoshi Miyata
  • Patent number: 10790712
    Abstract: In one aspect, embodiments of the invention are directed to a multi-pole rotor of a variable-flux memory motor (VFMM) that includes: a rotor core; and a plurality of poles. Each of the poles includes: one or more soft rotor magnets; a first ferrous wedge; and a second ferrous wedge. The one or more soft rotor magnets are disposed between the first and second ferrous wedges in a circumferential direction of the rotor.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: September 29, 2020
    Assignee: Jacobi Motors LLC
    Inventors: Nicolaus Radford, Mohammadreza Barzegaranbaboli, Akhila Bachapalli, Takashi Nakachi, Chaitanya Ravipalli, Brian Wightman, Shriya Bhatnagar
  • Patent number: 10764658
    Abstract: Aspects of the present disclosure are directed toward a system and apparatuses for calibrating metering circuitry. An example system includes a first adapter including a plurality of receptacles proximally arranged in a circular manner on a first surface of the first adapter, the plurality of receptacles configured and arranged to be connected to endpoint controlling circuitry configured and arranged to communicate over the power lines or by using a RF communication, characteristics related to power usage of an endpoint device in a PLC network. The system further includes a second adapter including a plurality of electrical contacts disposed on a first surface of the second adapter and a plurality of terminals disposed on a second surface of the second adapter opposite of the first surface. The plurality of terminals can be physically arranged so as to plug into corresponding inputs on meter calibration circuitry.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: September 1, 2020
    Assignee: Landis+Gyr Technologies, LLC
    Inventors: Keith Binggeli, Josiah Dabill
  • Patent number: 10762811
    Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 1, 2020
    Assignee: International Business Machines Corporation
    Inventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Jason J. Bjorgaard, Thomas W. Liang, John R. Dangler
  • Patent number: 10763129
    Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 1, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
  • Patent number: 10753805
    Abstract: A radiation shield for near-infrared detectors of the type used in Raman spectroscopic systems comprises a chamber enclosing the detector and a cooling device in thermal contact with the chamber and the detector to reduce the level of unwanted radiation to which the detector would otherwise be exposed. The chamber may include a window in optical alignment with the detector, and the window may include one or more coatings to pass wavelengths in a range of interest or block radiation at wavelengths outside of this range. The shield may be enclosed in an evacuated dewar having a window which may also include one or more coatings to favor the wavelength range.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: August 25, 2020
    Assignee: Kaiser Optical Systems Inc.
    Inventors: Joseph B. Slater, James M. Tedesco, Alfred Feitisch
  • Patent number: 10729001
    Abstract: Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.
    Type: Grant
    Filed: August 29, 2015
    Date of Patent: July 28, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Shaul Branchevsky, Howard E. Chen, Anthony James Lobianco
  • Patent number: 10725313
    Abstract: The lens driving device is provided with a driving unit for OIS, using a driving force of a first voice coil motor to enable an OIS movable unit to swing in a plane orthogonal to the optical axis direction with respect to an OIS fixed unit; a driving unit for AF, using the driving force of a second voice coil motor to enable an AF movable unit to move along the optical axis direction with respect to an AF fixed unit; a supporting unit for OIS, formed of a first elastomeric material, and having a first biaxial hinge structure moveably supporting the OIS movable unit in the plane orthogonal to the optical axis direction; and a supporting unit for AF, formed of a second elastomeric material, and having a second biaxial hinge structure moveably supporting the AF movable unit along the optical axis direction.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: July 28, 2020
    Assignee: MITSUMI ELECTRIC CO., LTD.
    Inventor: Masayoshi Sugawara
  • Patent number: 10707277
    Abstract: The disclosure is related to creating different functional micro devices by integrating functional tuning materials and creating an encapsulation capsule to protect these materials. Various embodiments of the present disclosure also related to improve light extraction efficiencies of micro devices by mounting micro devices at a proximity of a corner of a pixel active area and arranging QD films with optical layers in a micro device structure.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: July 7, 2020
    Assignee: VueReal Inc.
    Inventor: Gholamreza Chaji
  • Patent number: 10698133
    Abstract: The photoelectric sensor includes a light projecting part emitting light, a light receiving part receiving light, a housing housing the light projecting part and the light receiving part, a setting part receiving an input operation from outside to set a threshold value, and an adjustment part receiving an input operation from outside to finely adjust the set threshold value. The housing includes a front surface having a light projecting/receiving surface allowing light from the light projecting part and light to the light receiving part to pass, a rear surface located on a side opposite to the front surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. The adjustment part is provided on the inclined surface.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 30, 2020
    Assignee: OMRON Corporation
    Inventors: Hirotaka Nakashima, Kazunari Komai
  • Patent number: 10665490
    Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho
  • Patent number: 10651620
    Abstract: A laser emitting device includes: a laser oscillator; an electrical part; a protection member; and a shutter. The laser oscillator is configured to emit a laser beam in an emitting direction. The protection member is interposed between the laser oscillator and the electrical part to shield the laser oscillator. The shutter is disposed to form a prescribed angle with respect to an optical path of the laser beam emitted from the laser oscillator. The shutter is movable between a first position at which the shutter interrupts the laser beam and a second position at which the shutter does not interrupt the laser beam. When the shutter is at the first position, the shutter damps and reflects the laser beam as a reflected beam. The reflected beam advances toward a space between the laser oscillator and the protection member. The reflected beam forms the prescribed angle with respect to the shutter.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: May 12, 2020
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventor: Mitsuo Hirota
  • Patent number: 10649159
    Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 12, 2020
    Assignee: Lipac Co., Ltd.
    Inventor: Sang Don Lee
  • Patent number: 10644192
    Abstract: A method of manufacturing a light-emitting device includes measuring a light distribution of a light-emitting element, sealing the measured light-emitting element by a sealing material including a phosphor, and curing the sealing material by heat treatment. An emission angle dependence of emission chromaticity of the light-emitting device is controlled by setting a degree of settling of the phosphor in the sealing material according to the measured light distribution of the light-emitting element.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 5, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Koji Fukagawa, Takashi Terayama
  • Patent number: 10636714
    Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 28, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Eiichirou Kishida
  • Patent number: 10625567
    Abstract: Embodiments include a vehicle comprising a mirror assembly attached to a vehicle side and including an air temperature sensor for measuring a first temperature value; a wireless transceiver for receiving a second temperature value from a wireless network; and a processor configured to, upon determining that the first temperature value is greater than the second temperature value, cause the mirror assembly to move to a first position relative to the vehicle side. Another embodiment includes a method of correcting air temperature reading in a vehicle, the method comprising obtaining a first temperature measurement from an air temperature sensor located in a mirror assembly attached to a vehicle side; obtaining a second temperature measurement from a wireless network; and upon determining that the first temperature measurement is greater than the second temperature measurement, causing the mirror assembly to move to a first position relative to the vehicle side.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 21, 2020
    Assignee: Ford Global Technologies, LLC
    Inventor: Aed M Dudar
  • Patent number: 10620040
    Abstract: To make a display in a photoelectric switch easy to see for a user. A photoelectric switch includes a housing having a substantially rectangular parallelepiped shape. A display is attached to a first surface of the outer surface of the housing. A control board is housed on the inside of the housing. A controller is mounted on the control board. The first surface includes a hole-like or cutout-like opening section for allowing a signal cable to pass from the outside to the inside of the housing. The signal cable electrically connects the control board disposed on the inside of the housing and the display disposed on the outside of the housing. A cover member includes a window section for exposing a display region of the display and covers a non-display region of the display. The cover member is provided outside the housing.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 14, 2020
    Assignee: Keyence Corporation
    Inventors: Choryon Oh, Kenji Kojima
  • Patent number: 10623614
    Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.
    Type: Grant
    Filed: September 15, 2018
    Date of Patent: April 14, 2020
    Assignee: NANCHANG O-FILM OPTICAL-ELECTRONIC TECH CO., LTD.
    Inventors: Chengzhe Shen, Jun Feng, Shumin Zhu, Shengyun Zhang, Wenhua Shuai, Dong Tang
  • Patent number: 10605999
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10593823
    Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: March 17, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Hideyuki Utsumi, Yuki Tanuma
  • Patent number: 10574870
    Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: February 25, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Long-Fei Zhang, Shin-Wen Chen, Kun Li, Xiao-Mei Ma
  • Patent number: 10546888
    Abstract: The present disclosure relates to a solid-state imaging device package that enables capturing of higher-quality images, a method of manufacturing the solid-state imaging device package, and an electronic apparatus. The solid-state imaging device package includes: a solid-state imaging device chip that converts light taken in by a lens into an electrical signal; an interposer substrate that secures the solid-state imaging device chip; a frame having a frame structure that encloses the solid-state imaging device chip and prevents emission of unnecessary light onto the light receiving surface of the solid-state imaging device chip; and a protective glass that protects at least the solid-state imaging device chip from external environments, and transmits light. A raised bank structure is formed on the adhesion surface of the frame in contact with the protective glass, and is formed along the entire circumference of the opening portion of the frame.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: January 28, 2020
    Assignee: SONY CORPORATION
    Inventors: Sumio Hokari, Keiki Fukuda
  • Patent number: 10541263
    Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: January 21, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-hoon Kim, Ji-chul Kim, Seung-yong Cha, Jae-choon Kim
  • Patent number: 10508935
    Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: December 17, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yung-Yi Chang, Ying-Chung Chen
  • Patent number: 10495077
    Abstract: An energy-storing-type high-pressure electric fuel pump includes an electromagnetic driving apparatus and a plunger sleeve cylinder component. The plunger sleeve cylinder component includes a high-pressure volume, a plunger sleeve having a plunger hole, and a plunger capable of sliding within the plunger hole. A clearance volume of the plunger in the plunger hole is a high-pressure fuel chamber. A clearance volume between the electromagnetic driving apparatus and the plunger sleeve cylinder component forms a low-pressure fuel chamber. Under the action of the electromagnetic driving apparatus, the plunger sleeve cylinder component sucks a fuel in the low-pressure fuel chamber into the high-pressure fuel chamber and pressure-feeds the fuel into the high-pressure volume. The electromagnetic driving apparatus includes an energy storage apparatus, a movable part, and a still part.
    Type: Grant
    Filed: May 4, 2013
    Date of Patent: December 3, 2019
    Assignee: Zhejiang Fai Electronics Co., Ltd.
    Inventors: Daguang Xi, Ping Zhang, Yanxiang Yang, Chengwen Liu
  • Patent number: 10476251
    Abstract: A high-voltage device for receiving a high-voltage cable having a conductor designed to conduct an electrical current and a cable insulation surrounding the conductor, includes an insulation and a waveguide. The insulation includes an at least partly transparent or translucent field control unit from a siloxane polymer which is designed to at least partly surround the cable insulation of the high-voltage cable, the siloxane polymer including, in at least one portion of the field control unit, covalently bonded fluorophores and/or dielectric pigments. The waveguide is arranged such that a light signal caused by a partial discharge in the field control unit can be coupled from the field control unit into the waveguide.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: November 12, 2019
    Assignees: IPH Institut “Prueffeld fuer elektrische Hochleistungstechnik” GmbH, Polymerics GmbH, HPS Berlin GmbH Hochspannungspruefungen & Beratung
    Inventors: Gerd Heidmann, Aniela Leistner, André Leistner, Daniel Siebler, Philipp Rohwetter, Wolfgang Habel, Ronald Plath
  • Patent number: 10466431
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: November 5, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10431551
    Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 1, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kenneth Michael Butler, Kalyan Chakravarthy Cherukuri, Stephanie Watts Butler, Venkataramanan Kalyanaraman, Hubert Joseph Payne, Yazdi Dinshaw Contractor
  • Patent number: 10423051
    Abstract: A camera module includes a substrate having a first main surface mounted with an image sensor, a second main surface on the reverse side of the substrate from the first main surface in the predetermined direction, and is provided with at least one hole extending from the first main surface in the predetermined direction. The camera module further includes a holder which has a boss inserted from the first main surface into the at least one hole, and holds at least one lens. The camera module further includes a fixing part made of adhesive that is cured into an anchor shape. The fixing part fixes the boss inside the at least one hole.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: September 24, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroyuki Tahara, Takehiro Ueda, Kazuo Sibukawa, Atsuki Kamatani, Yoshiyuki Hotta
  • Patent number: 10417895
    Abstract: Disclosed is a method and a device for improving the safety of a maritime platform, installed at sea or navigating at sea, including an observation of sea waves striking the maritime platform, an operation of the maritime platform being controlled via a control system. The method and device are suitable for: —acquiring elevation values of the surface of the sea at a plurality of points, making it possible to characterize at least one group of sea waves, a sea wave being likened to a wave defined by a period and an amplitude, —calculating at least one characteristic quantity of each group of waves, —comparing the calculated characteristic quantity to a hazard threshold, —if the comparison indicates the hazard threshold is crossed, raising an alert intended for the control system.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: September 17, 2019
    Assignee: NAVAL GROUP
    Inventors: Céline Drouet, Xavier Dal Santo, Nicolas Cellier