Abstract: An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.

Abstract: Various of the disclosed embodiments present depth-based user interaction systems facilitating natural and immersive user interactions. Particularly, various embodiments integrate immersive visual presentations with natural and fluid gesture motions. This integration facilitates more rapid user adoption and more precise user interactions. Some embodiments may take advantage of the particular form factors disclosed herein to accommodate user interactions. For example, dual depth sensor arrangements in a housing atop the interface's display may facilitate depth fields of view accommodating more natural gesture recognition than may be otherwise possible. In some embodiments, these gestures may be organized into a framework for universal control of the interface by the user and for application-specific control of the interface by the user.

Abstract: A filament inspection system is disclosed that gathers empirical data on the physical and chemical properties of filament. The illustrative embodiments need only a single video camera and two mirrors to image all of the exterior surfaces of one or more filaments simultaneously. These images can be used to analyze the physical properties of the filament. Furthermore, the illustrative embodiments need only a simple electrical network to gather empirical data on the permittivity of each segment of filament, which gives insights into the chemical properties of the filament. For example, embodiments of the present invention are particularly well suited for inspecting fiber-reinforced thermoplastic filament, and variations in the number, dispersion, wetting, and length of the fibers are all observable in variations in permittivity.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: A semiconductor device according to an embodiment includes a transistor including a first electrode, a second electrode, and a gate electrode, an electric resistance being electrically connected to the gate electrode, a diode including an anode being electrically connected to the first electrode and a cathode being electrically connected between the electric resistance and the gate electrode, and a capacitor being connected in parallel with the electric resistance.

Abstract: System and method for performance characterization of multi configuration near eye displays includes: a mirror; a lamp; a beamsplitter; a collimating and reflective lens for collimating light reflected from the beamsplitter and reflecting it back towards an image sensor having a view finder; a field-of-view (FOV) aperture to project light from the lamp onto the DUT through the objective lens; a video viewfinder digital camera for capturing an virtual image of the DUT; a spectroradiometers for performing spectroradiometric measurements on a captured image of the defined measurement area to characterize the performance of the DUT; and a controller circuit for characterizing performance of the DUT based on the spectroradiometric measurements.

Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.

Abstract: The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving surface to receive light, and is flip-chip mounted on a base. A joining material is joined to the optical back surface of the imaging element so that a space is formed between the joining material and a back-surface-side member provided on the side of the optical back surface on the opposite side of the imaging element from the light receiving surface. The present technology can be applied to camera modules and the like that capture images, for example.

Abstract: A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Abstract: An optical sensor arrangement comprises an optical barrier which is placed between a light-emitting device and a photodetector. Herein the light-emitting device and the photodetector are arranged on a first plane and are covered by a cover. The photodetector exhibits an active zone. The optical barrier exhibits an extent along a first principal axis, which is pointing parallel to the line connecting the centers of the light-emitting device and the photodetector. Herein the extent is greater than a dimension of the active zone. The optical barrier is designed to block light emitted by the light-emitting device that otherwise would be reflected by the cover by means of specular reflection and would reach the photodetector. The optical barrier is designed to pass light emitted by the light-emitting device and scattered on or above an outer surface of the cover.

Abstract: The present disclosure relates to an optical sensing accessory, an optical sensing device, and an optical sensing system. An optical sensing accessory, an optical sensing device, or an optical sensing system comprises a plurality of optical sensor modules and other electronic modules to achieve multi-site measurement. An optical sensor module comprises a light source, a photodetector, and a substrate. The light source is configured to convert electric power into radiant energy and emit light to an object surface. The photodetector is configured to receive the light from an object surface and convert radiant energy into electrical current or voltage. An optical sensing accessory, an optical sensing device, or an optical sensing system and comprise the optical sensor module and other electronic modules to have further applications.

Abstract: A photovoltaic solar cell, including an N-side layer proximate to a first planar surface and a P-side layer proximate to a second planar surface that is opposite to the first planar surface, is formed from a circular wafer substrate. An N-side conductive contact is electrically coupled with the N-side layer, and a P-side conductive contact electrically coupled with the P-side layer. The P-side conductive contact and the N-side conductive contact are each disposed proximate to the first planar surface, the circular wafer substrate includes an edge exclusion zone, and the P-side contact is disposed within or proximate to the edge exclusion zone.

Abstract: A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.

Abstract: A lens drive apparatus that displaces a lens holder in a direction of an optical axis and a direction orthogonal to the optical axis comprises: an assembly that is formed by assembling the lens holder together with a magnet disposed around the lens holder; a housing that has a base and a cover that are configured to house the assembly; and a planar coil that is attached inside of the housing such that a coil plane thereof facing the magnet is in parallel with the optical axis, the planar coil being configured to displace the assembly in the direction orthogonal to the optical axis in collaboration with the magnet, wherein the base has an aperture having a size greater than a displacement range of the optical axis resulting from displacement of the assembly in the direction orthogonal to the optical axis.

Abstract: An integrated substrate for an anti-shake apparatus defined with an optical axis includes: a substrate, a lens module, an anti-shake apparatus and an image-sensing module. The substrate includes a frame having a predetermined thickness. The frame includes a first surface, a second surface, a first circuit layout, and a second circuit layout. The lens module is located above the substrate on the optical axis. The anti-shake apparatus is furnished between the lens module and the substrate. The image-sensing module has an active side and an inactive side, and the inactive side is furnished onto the second surface. The active side is located on the optical axis in a manner of facing the lens module. The anti-shake apparatus is coupled to the first circuit layout, while the image-sensing module is coupled to the second circuit layout. The first and second circuit layouts comprise a plurality of first and second metal leads, respectively.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: An object detection device includes a first substrate with a laser diode thereon; a second substrate with a photodiode thereon; a holding member holding the first and second substrates; an optical deflector deflecting light projected from the LD to irradiate a target with the deflected light, and deflects light reflected off the target; and a reflecting mirror guiding the reflected light deflected by the optical deflector to the PD. The LD is mounted on a mounting surface of the first substrate to project light mainly in a direction parallel to the mounting surface. The PD is mounted on a mounting surface of the second substrate to receive light coming mainly in a direction perpendicular to the mounting surface. The holding member parallelly holds the first and second substrates such that projection planes of the first and second substrates perpendicular to the mounting surfaces overlap each other.

Abstract: A temperature detection system for railway applications is provided. The system may include at least one infrared (IR) sensing element configured to detect IR signals emitted by a rail or a railcar, and a controller in communication with the at least one IR sensing element. The controller may be configured to receive the IR signals from the at least one IR sensing element, extract IR data corresponding to at least one of a rail and an undercarriage of the railcar from the IR signals, and generate a characteristic thermal profile of at least one of an ambient temperature and a rail temperature based on the IR data.

Abstract: An optical coupling device includes a light-emitting element, a light-receiving element that faces the light-emitting element, a lead frame that has a first surface on which the light-emitting element is provided and a second surface facing the first surface, a first covering material that covers the light-emitting element, a second covering material that covers the first covering material, the light-receiving element, and the lead frame, and a third covering material that covers the second covering material. At least one of first bonding strength between the second covering material and the third covering material and second bonding strength between the second covering material and the second surface is lower than third bonding strength between the first covering material and the second covering material.

Abstract: An optical coupling device includes a primary conductive plate, a light-emitting part, a secondary conductive plate, a light-receiving part, and a first conductive part. The light-emitting part is located on the primary conductive plate, converts an electrical signal to light, and emits the light. The secondary conductive plate is spaced apart from the primary conductive plate, and faces the light-emitting part. The light-receiving part is disposed on the secondary conductive plate to face the light-emitting part, and converts light from the light-emitting part to an electrical signal. The first conductive part is disposed at a side facing the light-emitting part, and has a point on which an electric field generated by a potential difference between the primary conductive plate and the secondary conductive plate is concentrated.

Abstract: The present disclosure relates to a radiation sensor. In one implementation, the sensor may include a radiation detector array having a plurality of pixels; at least two readout connectors having a plurality of contacts, each readout connector being configured for receiving a readout module; a routing circuit having conductors configured for routing electrical signals from each of the plurality of pixels to a corresponding contact of one of the readout connectors. The plurality of pixels is grouped in two or more groups of pixels, at least two pixels of a first group of pixels being separated by at least one pixel from another group of pixels. The routing circuit is configured for leading pixels of the first group of pixels to a first readout connector, and pixels from the other group of pixels to a second readout connector.

Abstract: The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

Abstract: An optical system is for imaging a surface covered with a viscous substance using an illuminating beam having a spectral profile including an imaging waveband to which the viscous substance is transparent. The system includes a support frame, a flattening plate, a light source and a camera. The support frame has a front and a rear end, and has an abutment structure. The flattening plate is transparent to the imaging waveband, and is engageable with the viscous substance to flatten the substance into a substantially flat layer. The light source is operatively coupled to the support frame, and configured to project the illuminating beam towards the surface through the flattening plate. The camera is mounted onto the support frame, is sensitive to light in the imaging waveband, and has a field of view encompassing at least a portion of the surface illuminated by the illuminating beam.

Abstract: A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first surface; providing a first semiconductor chip on the package substrate, the first semiconductor chip having a first surface facing the second surface of the package substrate, a second surface opposite the first surface of the first semiconductor chip, and lateral surfaces extending from the first surface of the first semiconductor chip to the second surface of the first semiconductor chip; providing a molding layer covering the lateral surfaces of the first semiconductor chip and covering the second surface of the package substrate; and providing a plurality of through-molding conductive vias outside the lateral surfaces of the first semiconductor chip. The through-molding conductive vias may be formed before forming the molding layer and may pass through the molding layer.

Abstract: An electromagnetic interference (EMI) shield may include a first shield section configured to be positioned on a first portion of an optical subassembly and a second shield section configured to be positioned on a second portion of the optical subassembly. The first shield section may be configured to contact the second shield section such that the first shield section and the second shield section are held in place when the first shield section and the second shield section are positioned, respectively, on the first portion and the second portion of the optical subassembly.

Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.

Abstract: A measuring unit for measuring a particulate concentration in exhaust gases using scattered light includes a measuring chamber, at least one light source and at least one light sensor, the measuring chamber being situated in the optical path of the light source; and the light sensor records the light scattered by the particulates in the measuring chamber. To detect the intensity of light beam that is relevant for a precise particulate measurement, a monitoring device is provided to detect the intensity of the light beam with the aid of a scattered radiation. The intensity of the light beam is recorded using a monitoring measurement, by ascertaining a scattered radiation and comparing it to a specified reference value for the scattered radiation. With the aid of the comparison, the intensity of the light source is regulated correspondingly and/or the measuring result of the particulate measurement is correspondingly corrected.

Abstract: An optical coupling device includes a power lead with a first portion and a power line portion. A light-emitting element is disposed on the first portion. A ground lead includes a ground line portion and a second portion with a drive circuit disposed thereon. A first input frame in the device includes a first input terminal portion and a first input signal line portion. A second input frame in the device includes a second input terminal portion and a second input signal line portion. The first and second input frames are adjacent to each other and a minimum distance from the first input signal line portion to the first installation portion is greater than a minimum distance from the first input signal line portion to the power line portion.

Abstract: A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.

Abstract: A waterproof connector (10) includes a female housing (30) formed with cavities (31), and female terminals (20) connected to ends of wires (W) are inserted into the cavities (31) from behind. Shorting terminals (50) are accommodated in terminal accommodating portions (40) in a front part of the housing (30) to short adjacent female terminals (20). A one-piece rubber plug (60) is fit into a rear part of the housing (30) and includes through holes (62) through which the wires (W) are to be inserted. A rear holder (70) is mounted into the housing (30) to retain the one-piece rubber plug (60). Recesses (65) are provided on the one-piece rubber plug (60) in areas behind the terminal accommodating portions (40). Compressing protrusions (75) project from the rear holder (70) and are press-fit into the recesses (65) from behind.

Abstract: System and methods for analyzing single molecules and performing nucleic acid sequencing. An integrated device includes multiple pixels with sample wells configured to receive a sample, which when excited, emits radiation. The integrated device includes at least one waveguide configured to propagate excitation energy to the sample wells from a region of the integrated device configured to couple with an excitation energy source. A pixel may also include at least one element for directing the emission energy towards a sensor within the pixel. The system also includes an instrument that interfaces with the integrated device. The instrument may include an excitation energy source for providing excitation energy to the integrated device by coupling to an excitation energy coupling region of the integrated device.

Abstract: Blood oxygenation sensors including high-aspect-ratio photodetector elements are discussed herein. Such high-aspect-ratio photodetector elements may provide improved signal-strength-to-power-consumption performance for blood oxygenation sensors incorporating such photodetector elements as compared with blood oxygenation sensors incorporating, for example, square photodetector elements.

Abstract: A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract: A device is provided for combining two or more separate components of an optical analysis system, to use common entrance and exit apertures for optical measurements across a measurement space such as a stack, combustion chamber, duct or pipeline, in such way that the optical paths from the respective light sources to detectors are substantially the same, enabling multiple optical measurements over a single optical path or closely aligned optical paths with equivalent ambient conditions such as temperature and pressure distribution and background substance concentrations. The device and a set of interconnectable devices forming a modular system are useful, for example, in absorption spectroscopy, such as for measuring the amount fraction of the chemical constituents of a fluid in a measurement volume.

Abstract: This is to provide a photometric apparatus improved in measurement precision by improving the state of light incident to a sensor, which photometric apparatus 1 comprises a photometric sensor 30 into which light which is an object to be measured is incident, a signal processing means for processing a sensor output by the photometric sensor, and optical systems 50, 100, 92, 93 and 150 which introduces external light into the photometric sensor, wherein a columnar fiber rod 100 in which a center axis is provided along a direction perpendicular to a light receiving surface of the photometric sensor is provided at a part of the optical system.

Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module.

Abstract: A light sensing device includes a substrate, a light sensing area on the substrate, and a light shielding layer over the substrate. The light shielding layer does not cover the light sensing area. At least one outgassing hole is formed through the light shielding layer.

Abstract: A vertical cavity surface emitting laser includes: a substrate; a laminated body which is provided over the substrate; and a resin layer which is provided on at least a side surface of the laminated body, wherein the laminated body at least includes a first mirror layer provided over the substrate, an active layer provided over the first mirror layer, and a second mirror layer provided over the active layer, in a plan view, a length of the laminated body in a first direction is greater than a length of the laminated body in a second direction orthogonal to the first direction, and in the plan view, a length of the resin layer in the first direction is greater than a length of the resin layer in the second direction.

Abstract: The subject disclosure is directed towards a curved image sensor that is rotated in one or more rotational directions to compensate for camera movement, e.g., camera shake. In one aspect, sensors such as gyroscopes output camera movement data, which a controller uses to rotate the curved (e.g., hemispherical) image sensor about its center of curvature, e.g., via signals to electrical and/or magnetic movement mechanisms. Image processing may be used by the controller to rotate the image sensor.

Abstract: An integrated substrate for an anti-shake apparatus defined with an optical axis includes: a substrate, a lens module, an anti-shake apparatus and an image-sensing module. The substrate includes a frame having a predetermined thickness. The frame includes a first surface, a second surface, a first circuit layout, and a second circuit layout. The lens module is located above the substrate on the optical axis. The anti-shake apparatus is furnished between the lens module and the substrate. The image-sensing module has an active side and an inactive side, and the inactive side is furnished onto the second surface. The active side is located on the optical axis in a manner of facing the lens module. The anti-shake apparatus is coupled to the first circuit layout, while the image-sensing module is coupled to the second circuit layout. The first and second circuit layouts comprise a plurality of first and second metal leads, respectively.

Abstract: A curved image sensor includes a supporting substrate, a bonding pattern provided over the supporting substrate a sensing substrate provided over the supporting substrate and in contact with the bonding pattern, and having a curved surface receiving incident light, and a fixing pattern provided over the supporting substrate and surrounding a periphery of the sensing substrate.

Abstract: Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.

Abstract: A lens drive apparatus that displaces a lens holder in a direction of an optical axis and a direction orthogonal to the optical axis comprises: an assembly formed by assembling the lens holder together with a conductive body and comprises a circuit that receives supplied power; a shake correction drive section configured to displace the assembly by a shake correction magnet and a shake correction coil disposed at a position facing the shake correction magnet in collaboration with each other; and a position detection section configured to detect a position of the assembly in the direction orthogonal to the optical axis, wherein: the shake correction magnet is disposed around the lens holder, and the shake correction magnet, the shake correction coil and the position detection section are disposed at respective positions shifted in the direction of the optical axis with respect to each other.

Abstract: A solid-state imaging device comprises an image sensor, a circuit board, a support plate, an IR cut filter, a taking lens, a lens holder, and a support barrel. The image sensor is mounted on the circuit board. The circuit board is fixed to the support plate with the image sensor placed inside an opening of a plate body of the support plate. The sides of the image sensor are surrounded by the support plate. The IR cut filter is fixed to the support plate so as to cover the opening. The image sensor is disposed on an exit surface side of the taking lens. The IR cut filter is disposed between the taking lens and the image sensor. A light-shielding layer is formed over entire periphery of an inner wall of the plate body. Harmful rays are blocked by the light-shielding layer.

Abstract: Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.

Abstract: An photoelectric convertor comprises an optical coupler, a circuit board and two restricting posts fixed on the circuit board. The optical coupler defined two restricting grooves passing through its bottom surface and top surface. When the optical coupler is positioned on the circuit board, the two restricting posts are respectively engaged in the two restricting grooves. Each restricting groove has a sidewall opposite to a front surface of the optical coupler.

Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module.

Abstract: An optical coupling assembly includes a circuit board, at least one light emitter, at least one light receiver, and an optical coupling module. The circuit board includes a mounting surface and an alignment groove formed on the mounting surface. The at least one light emitter and at least one light receiver are mounted on the mounting surface. The optical coupling module includes at least two lenses and a positioning member. The positioning member is engaged with the alignment groove, with each of the at least one light emitter and the at least one light receiver being optically aligned with a respective one of the at least two first lenses.