Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.

Abstract: The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.

Abstract: A street light has a pole of at least 6 feet in length, and has an electrical socket attached to an end of the pole. The socket includes a body having an interior, and a cover positioned on the body to cover the interior of the body. The cover has a ring-shaped openings providing passage into the interior of the body. Resiliently mounted electrical contactors are each positioned in the interior of the body and adjacent to one of the ring-shaped openings in the cover. A central bore extends through the body, and a ledge is positioned at the end of the bore to extend radially outward. The socket is connectable to a mating plug to mechanically and electrically connect a street light or other device to the pole. The street light can include sensors that are connectable using a similar socket and plug.

Abstract: In one aspect, embodiments of the invention are directed to a multi-pole rotor of a variable-flux memory motor (VFMM) that includes: a rotor core; and a plurality of poles. Each of the poles includes: one or more soft rotor magnets; a first ferrous wedge; and a second ferrous wedge. The one or more soft rotor magnets are disposed between the first and second ferrous wedges in a circumferential direction of the rotor.

Abstract: An image forming apparatus comprises a light-emission unit, a reflecting member, a light-receiving unit, a detection unit, a ventilation unit configured to send air to the reflecting member, and a control unit. The control unit adjusts at least one of an operation duration and an airflow rate of the ventilation unit, in accordance with a detection signal outputted by the light-receiving unit when a sheet is not at a position where light crosses a conveyance path.

Abstract: A photoelectric sensor capable of suppressing breakage of a cable connected to a case body is provided. The photoelectric sensor includes a case body having an accommodation space which accommodates at least one of a light projecting portion and a light receiving portion therein, and a cable which accommodates a cord connected via a control portion to at least one of the light projecting portion and the light receiving portion, and a concave portion recessed toward an inside of the case body is provided in an outer surface of the case body, and the cable is mounted in the concave portion.

Abstract: In one aspect, embodiments of the invention are directed to a multi-pole rotor of a variable-flux memory motor (VFMM) that includes: a rotor core; and a plurality of poles. Each of the poles includes: one or more soft rotor magnets; a first ferrous wedge; and a second ferrous wedge. The one or more soft rotor magnets are disposed between the first and second ferrous wedges in a circumferential direction of the rotor.

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Abstract: Aspects of the present disclosure are directed toward a system and apparatuses for calibrating metering circuitry. An example system includes a first adapter including a plurality of receptacles proximally arranged in a circular manner on a first surface of the first adapter, the plurality of receptacles configured and arranged to be connected to endpoint controlling circuitry configured and arranged to communicate over the power lines or by using a RF communication, characteristics related to power usage of an endpoint device in a PLC network. The system further includes a second adapter including a plurality of electrical contacts disposed on a first surface of the second adapter and a plurality of terminals disposed on a second surface of the second adapter opposite of the first surface. The plurality of terminals can be physically arranged so as to plug into corresponding inputs on meter calibration circuitry.

Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.

Abstract: A radiation shield for near-infrared detectors of the type used in Raman spectroscopic systems comprises a chamber enclosing the detector and a cooling device in thermal contact with the chamber and the detector to reduce the level of unwanted radiation to which the detector would otherwise be exposed. The chamber may include a window in optical alignment with the detector, and the window may include one or more coatings to pass wavelengths in a range of interest or block radiation at wavelengths outside of this range. The shield may be enclosed in an evacuated dewar having a window which may also include one or more coatings to favor the wavelength range.

Abstract: The lens driving device is provided with a driving unit for OIS, using a driving force of a first voice coil motor to enable an OIS movable unit to swing in a plane orthogonal to the optical axis direction with respect to an OIS fixed unit; a driving unit for AF, using the driving force of a second voice coil motor to enable an AF movable unit to move along the optical axis direction with respect to an AF fixed unit; a supporting unit for OIS, formed of a first elastomeric material, and having a first biaxial hinge structure moveably supporting the OIS movable unit in the plane orthogonal to the optical axis direction; and a supporting unit for AF, formed of a second elastomeric material, and having a second biaxial hinge structure moveably supporting the AF movable unit along the optical axis direction.

Abstract: Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: The disclosure is related to creating different functional micro devices by integrating functional tuning materials and creating an encapsulation capsule to protect these materials. Various embodiments of the present disclosure also related to improve light extraction efficiencies of micro devices by mounting micro devices at a proximity of a corner of a pixel active area and arranging QD films with optical layers in a micro device structure.

Abstract: The photoelectric sensor includes a light projecting part emitting light, a light receiving part receiving light, a housing housing the light projecting part and the light receiving part, a setting part receiving an input operation from outside to set a threshold value, and an adjustment part receiving an input operation from outside to finely adjust the set threshold value. The housing includes a front surface having a light projecting/receiving surface allowing light from the light projecting part and light to the light receiving part to pass, a rear surface located on a side opposite to the front surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. The adjustment part is provided on the inclined surface.

Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

Abstract: A laser emitting device includes: a laser oscillator; an electrical part; a protection member; and a shutter. The laser oscillator is configured to emit a laser beam in an emitting direction. The protection member is interposed between the laser oscillator and the electrical part to shield the laser oscillator. The shutter is disposed to form a prescribed angle with respect to an optical path of the laser beam emitted from the laser oscillator. The shutter is movable between a first position at which the shutter interrupts the laser beam and a second position at which the shutter does not interrupt the laser beam. When the shutter is at the first position, the shutter damps and reflects the laser beam as a reflected beam. The reflected beam advances toward a space between the laser oscillator and the protection member. The reflected beam forms the prescribed angle with respect to the shutter.

Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: A method of manufacturing a light-emitting device includes measuring a light distribution of a light-emitting element, sealing the measured light-emitting element by a sealing material including a phosphor, and curing the sealing material by heat treatment. An emission angle dependence of emission chromaticity of the light-emitting device is controlled by setting a degree of settling of the phosphor in the sealing material according to the measured light distribution of the light-emitting element.

Abstract: To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.

Abstract: Embodiments include a vehicle comprising a mirror assembly attached to a vehicle side and including an air temperature sensor for measuring a first temperature value; a wireless transceiver for receiving a second temperature value from a wireless network; and a processor configured to, upon determining that the first temperature value is greater than the second temperature value, cause the mirror assembly to move to a first position relative to the vehicle side. Another embodiment includes a method of correcting air temperature reading in a vehicle, the method comprising obtaining a first temperature measurement from an air temperature sensor located in a mirror assembly attached to a vehicle side; obtaining a second temperature measurement from a wireless network; and upon determining that the first temperature measurement is greater than the second temperature measurement, causing the mirror assembly to move to a first position relative to the vehicle side.

Abstract: To make a display in a photoelectric switch easy to see for a user. A photoelectric switch includes a housing having a substantially rectangular parallelepiped shape. A display is attached to a first surface of the outer surface of the housing. A control board is housed on the inside of the housing. A controller is mounted on the control board. The first surface includes a hole-like or cutout-like opening section for allowing a signal cable to pass from the outside to the inside of the housing. The signal cable electrically connects the control board disposed on the inside of the housing and the display disposed on the outside of the housing. A cover member includes a window section for exposing a display region of the display and covers a non-display region of the display. The cover member is provided outside the housing.

Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.

Abstract: A lens module with compact appearance includes a circuit board, an image sensor, a package bracket, an optical filter, and a lens unit. The circuit board defines a first receiving groove for receiving the image sensor. The circuit board has electronic components and gold fingers on one surface. Metallic wires are arranged on edges of a surface of the image sensor. The package bracket is integrally formed on the circuit board to wrap the electronic components, the gold fingers, and the metallic wires therein. The optical filter is connected to surface of the package bracket facing away from the circuit board. The lens unit includes a hollow lens holder and a lens mounted in the lens holder. The lens holder is connected to the surface of the mounting frame facing away from the circuit board.

Abstract: The present disclosure relates to a solid-state imaging device package that enables capturing of higher-quality images, a method of manufacturing the solid-state imaging device package, and an electronic apparatus. The solid-state imaging device package includes: a solid-state imaging device chip that converts light taken in by a lens into an electrical signal; an interposer substrate that secures the solid-state imaging device chip; a frame having a frame structure that encloses the solid-state imaging device chip and prevents emission of unnecessary light onto the light receiving surface of the solid-state imaging device chip; and a protective glass that protects at least the solid-state imaging device chip from external environments, and transmits light. A raised bank structure is formed on the adhesion surface of the frame in contact with the protective glass, and is formed along the entire circumference of the opening portion of the frame.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

Abstract: An energy-storing-type high-pressure electric fuel pump includes an electromagnetic driving apparatus and a plunger sleeve cylinder component. The plunger sleeve cylinder component includes a high-pressure volume, a plunger sleeve having a plunger hole, and a plunger capable of sliding within the plunger hole. A clearance volume of the plunger in the plunger hole is a high-pressure fuel chamber. A clearance volume between the electromagnetic driving apparatus and the plunger sleeve cylinder component forms a low-pressure fuel chamber. Under the action of the electromagnetic driving apparatus, the plunger sleeve cylinder component sucks a fuel in the low-pressure fuel chamber into the high-pressure fuel chamber and pressure-feeds the fuel into the high-pressure volume. The electromagnetic driving apparatus includes an energy storage apparatus, a movable part, and a still part.

Abstract: A high-voltage device for receiving a high-voltage cable having a conductor designed to conduct an electrical current and a cable insulation surrounding the conductor, includes an insulation and a waveguide. The insulation includes an at least partly transparent or translucent field control unit from a siloxane polymer which is designed to at least partly surround the cable insulation of the high-voltage cable, the siloxane polymer including, in at least one portion of the field control unit, covalently bonded fluorophores and/or dielectric pigments. The waveguide is arranged such that a light signal caused by a partial discharge in the field control unit can be coupled from the field control unit into the waveguide.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: Systems and methods for visual identification of semiconductor dies are described. In some embodiments, a method may include: receiving a semiconductor wafer having a plurality of dies and printing a unique visual identification mark on each of the plurality of dies. In other embodiments, a method may include receiving an electronic device comprising a die and a package surrounding at least a portion of the die and reading, from the electronic device, a unique visual identification mark that encodes a Cartesian coordinate of the die relative to a reference point on a semiconductor wafer.

Abstract: A camera module includes a substrate having a first main surface mounted with an image sensor, a second main surface on the reverse side of the substrate from the first main surface in the predetermined direction, and is provided with at least one hole extending from the first main surface in the predetermined direction. The camera module further includes a holder which has a boss inserted from the first main surface into the at least one hole, and holds at least one lens. The camera module further includes a fixing part made of adhesive that is cured into an anchor shape. The fixing part fixes the boss inside the at least one hole.

Abstract: Disclosed is a method and a device for improving the safety of a maritime platform, installed at sea or navigating at sea, including an observation of sea waves striking the maritime platform, an operation of the maritime platform being controlled via a control system. The method and device are suitable for: —acquiring elevation values of the surface of the sea at a plurality of points, making it possible to characterize at least one group of sea waves, a sea wave being likened to a wave defined by a period and an amplitude, —calculating at least one characteristic quantity of each group of waves, —comparing the calculated characteristic quantity to a hazard threshold, —if the comparison indicates the hazard threshold is crossed, raising an alert intended for the control system.

Abstract: Laser systems are provided with a semiconductor laser having an emission face, a drive circuit adapted to supply electric energy to the semiconductor laser to cause the semiconductor laser to emit a beam; a user input system adapted to sense a user input action; a controller adapted to control the drive circuit based upon the sensed user input action; a housing within which the laser is positioned and having an opening with a window through which the semiconductor laser can emit the beam. The semiconductor laser is positioned to emit the beam through the window and the emission face of the semiconductor laser is sized to cause a divergence in the beam to create a patterned emission with a predetermined shape without passing the beam through beam shaping optics.

Abstract: In various aspects, the disclosure relates to thermally conductive thermoplastic compositions comprising a polymer matrix, an impact modifier composition having a chemically reactive impact modifier, and, optionally, a chemically non-reactive impact modifier, and a thermally conductive filler. The disclosed thermally conductive thermoplastic compositions exhibit good thermal conductivity and improved impact and ductile properties.

Abstract: An image sensor unit includes a light condenser that collects light from an object to be read, an image sensor that receives the light collected by the light condenser and outputs an image, and a housing that houses the light condenser and the image sensor. The housing includes a plurality of spacer attachment portions to which a first spacer that keeps a distance between the housing and a mount member can be detachably attached and for which distances between the housing and the mount member in a state where the attached first spacer abuts against the mount member differ from each other.

Abstract: An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.

Abstract: Systems and methods of laser bias calibration are presented. A preamplifier circuit may include a laser voltage monitor circuit and a laser bias control circuit configured to automatically adjust an output laser bias threshold voltage based on a monitored laser voltage. The laser bias control circuit may include a first differentiator circuit, a second differentiator circuit, and a threshold detection circuit. The preamplifier circuit may be utilized in a heat assisted magnetic recording device.

Abstract: Techniques for fabricating an image sensor chip having a curved surface include placing a bending substrate on a first surface of an imaging sensor chip. The first surface of the imaging sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes bending the bending substrate so as to impart forces on the image sensor chip to produce a curved imaging sensor chip. A second surface of the curved imaging sensor chip may be adhered to a backside substrate. The second surface is opposite the first surface. The bending substrate may be removed from the first surface of the imaging sensor chip.

Abstract: A lens driving apparatus with a lens portion having at least one lens, a base portion on which an image sensor detecting light coming through said lens portion can be fixed, a driving portion capable of relatively moving said lens portion in a vertical direction to a light axis of said lens portion and in a parallel direction to the light axis of said lens portion with respect to said base portion, and at least three suspension wires connecting a focus portion including said lens portion and said base portion so as to allow a relative movement. The suspension wires are arranged outside a magnet of said driving portion along the vertical direction to the light axis.

Abstract: A housing of a photoelectric sensor has a front surface having a light projecting/receiving surface, a rear surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. On the top surface, a teach button that receives an input operation from outside to set a threshold value and an indicator that displays a detection result of the object being detected are provided in order from the side of the inclined surface. On the inclined surface, an adjustment button that receives an input operation from outside to finely adjust the threshold value is provided. A distance between the teach button and the adjustment button is larger than a distance between the teach button and the indicator.

Abstract: According to one embodiment, a measuring device for a sample liquid includes a container which stores the sample liquid, the container including a transparent or translucent optical component with an inclined surface to be brought into contact with the sample liquid, an optical sensor provided on a bottom of the container, which detects light from the sample liquid, and a measurement module which measures a concentration of a specific substance contained in the sample liquid, or a liquid height or liquid volume of the sample liquid based on a detected signal of the optical sensor.

Abstract: An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.

Abstract: Various of the disclosed embodiments present depth-based user interaction systems facilitating natural and immersive user interactions. Particularly, various embodiments integrate immersive visual presentations with natural and fluid gesture motions. This integration facilitates more rapid user adoption and more precise user interactions. Some embodiments may take advantage of the particular form factors disclosed herein to accommodate user interactions. For example, dual depth sensor arrangements in a housing atop the interface's display may facilitate depth fields of view accommodating more natural gesture recognition than may be otherwise possible. In some embodiments, these gestures may be organized into a framework for universal control of the interface by the user and for application-specific control of the interface by the user.

Abstract: A filament inspection system is disclosed that gathers empirical data on the physical and chemical properties of filament. The illustrative embodiments need only a single video camera and two mirrors to image all of the exterior surfaces of one or more filaments simultaneously. These images can be used to analyze the physical properties of the filament. Furthermore, the illustrative embodiments need only a simple electrical network to gather empirical data on the permittivity of each segment of filament, which gives insights into the chemical properties of the filament. For example, embodiments of the present invention are particularly well suited for inspecting fiber-reinforced thermoplastic filament, and variations in the number, dispersion, wetting, and length of the fibers are all observable in variations in permittivity.

Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Abstract: A semiconductor device according to an embodiment includes a transistor including a first electrode, a second electrode, and a gate electrode, an electric resistance being electrically connected to the gate electrode, a diode including an anode being electrically connected to the first electrode and a cathode being electrically connected between the electric resistance and the gate electrode, and a capacitor being connected in parallel with the electric resistance.

Abstract: System and method for performance characterization of multi configuration near eye displays includes: a mirror; a lamp; a beamsplitter; a collimating and reflective lens for collimating light reflected from the beamsplitter and reflecting it back towards an image sensor having a view finder; a field-of-view (FOV) aperture to project light from the lamp onto the DUT through the objective lens; a video viewfinder digital camera for capturing an virtual image of the DUT; a spectroradiometers for performing spectroradiometric measurements on a captured image of the defined measurement area to characterize the performance of the DUT; and a controller circuit for characterizing performance of the DUT based on the spectroradiometric measurements.