Abstract: An underground mine communications upgrade comprises an independent VHF-UHF band to MF band repeater-transceiver translator (RTT) and loop antenna added to a conventional miner's cap-lamp and helmet. VHF/UHF band communications with nearby conventional handsets are translated to medium frequency (MF band) communications that couple mine-wide to copper-core life-lines in all the entries. Such life-lines also do well supporting ultra low frequency (ULF), through-the-earth (TTE) communications with the surface above. Roof mounted borehole MF band ULF RTT's are coupled to the dual-frequency life-lines and bridge the MF band communications on the life-lines with the ULF communications on the life-lines. The MF band radio traffic primarily consists of digital packetswitch communications.

Abstract: Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein. One or more optical component devices are disposed within the respective cavities in a predetermined arrangement. A cover is disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical component devices within their respective cavities. The cover, which may be glass, is configured to transmit light within the predetermined spectrum of wavelengths.

Abstract: An imaging mechanism and an endoscope apparatus include: an image sensor including a sensor face and a plurality of input/output leads, a holding member having a sensor contact face, a circuit board that is secured to an outer face of an opposite side of the holding member to the sensor contact face, and a contact-point part disposed on a side face of the circuit board intersecting with a mount face, and in a region where the outline of the circuit board is inside the outline of the holding member. At least one of the holding member and the circuit board includes a relay wiring part which the contact-point part and at least one of the input/output leads are electrically connected to.

Abstract: Described herein are systems and devices for mitigating multi-path interference in optical time-of-flight systems. An input surface is configured with a pattern comprising predominately low albedo material and a plurality of decimated high albedo features. The low albedo material is configured to minimize reflectance of light emitted by an emitter. The high albedo material is configured to reflect more of the light than the low albedo material. The low and high albedo materials, or an additional material, may be used to provide a high albedo material in visible light wavelengths, configured for use as a projection surface.

Abstract: A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

Abstract: A mount assembly for a vehicle component includes an attachment device configured to attach to a vehicle interior component. The attachment device defines an aperture and includes a vehicle attachment portion, an interior wall, and an exterior wall. A rearview device is configured to operably connect to the exterior wall of the attachment device. An accessory device is configured to operably connect to the interior wall of the attachment device.

Abstract: Disclosed is a luminaire including a luminaire housing, a lamp or ballast disposed at least partially within the luminaire housing, a first control input disposed at least partially internal to or integral with the luminaire housing, a second control input disposed external to the luminaire housing, and connection components configured to associate the lamp or ballast with the first control input and the second control input.

Abstract: A light fixture includes a fixture body, a shroud, and a power or communication receptacle is provided. The fixture body is configured to support a light emitter. Additionally, the shroud is disposed on the fixture body and is arranged to at least partially conceal the light emitter. The power or communication receptacle is disposed on the fixture body in a location at least partially concealed by the shroud.

Abstract: Manufacturing optical devices (e.g., for cameras) includes providing and allocating mount elements to lens modules wherein the mount elements are to be arranged within the optical devices to define a fixed separation distance between the lens modules and the image sensor plane. The mount elements have variable mount FFL sections by means of which the geometrical distance between the lens module and the image sensor plane is adjusted for each lens module, individually or in groups dependent on the optical properties of the lens modules, to compensate the variation of the lens module values among the lens modules, so that the focal planes of the lens modules falls into the image sensor plane.

Abstract: A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.

Abstract: Disclosed herein is a camera module including: a lens barrel in which one or more lenses are installed; a housing accommodating the lens barrel; a printed circuit board coupled with a bottom of the housing and having an image sensor with a light receiving portion mounted thereon; a window film having a window formed therein to define an incident area of light incident on the image sensor; and an infrared ray blocking member blocking an infrared ray in the light incident on the image sensor.

Abstract: A camera module includes an imaging sensor, a conductive member, a plate-like member, and a sealing member. The imaging sensor includes a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and a drive section driving the lens. The conductive member is connected to the drive section for supply of power to the drive section. The plate-like member is provided with the imaging sensor and the conductive member. The sealing member is formed by sealing the imaging sensor and the conductive member, the conductive member being exposed at a connection part for connection to the drive section, the imaging sensor being exposed at the light-receiving surface.

Abstract: Describes a device which embodies a method of providing a periodic test light-source beam directed at a nephelometric turbidimeter's scattered-light detector window to detect any film build-up on the scattered-light detector's optical surfaces by means of a change in reading from a previous reading.

Abstract: An AOC assembly comprising two printed circuit boards (PCB) (63), a board holder (61) and two heat conducting covers (64) with integrated head spreader. Each of the two PC boards has a lower edge (632) extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting shell would dissipate heat from the active electronic components on the PCB.

Abstract: A checking device of an SMT placement machine for checking positions of LEDs mounted on a circuit board includes a shell, a light source and an imaging module. The shell is used for covering the LEDs and the circuit board to be checked. The shell includes an opening and an atomized reflecting layer facing the LEDs. The opening is defined for exposing the LEDs through the shell to the imaging module whereby images of the LEDs can be taken by the imaging module and positions of the LEDs can be checked thereby. The atomized reflecting layer is formed on an inner surface of the shell. The light source is covered by the shell and faces the atomized reflecting layer. The imaging module is aligned with the opening.

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract: Techniques and configurations are provided for packaging optoelectronic devices. In particular, a lid component of an optoelectronic device is provided, and the lid component is configured to cover active components of the optoelectronic device. An optically transparent wall is also provided. The optically transparent wall is coated with an anti-reflective material and configured to interface with a section of the lid component. The optically transparent wall is joined with the section of the lid component such that the optically transparent wall and the lid provide a seal for the active components of the optoelectronic device. Additionally, the lid component has a top surface and a plurality of side surfaces that are coupled to the top surface. An optically transparent wall coated with an anti-reflective material adhesively joins to the top surface and one or more side surfaces.

Abstract: Non-symmetrically located lenses are employed with semiconductor devices comprising optically active regions which are non-symmetrically located on a surface thereof. The optical axes of the lenses are aligned with the centers of the optically active regions. Wafer-level assemblies of semiconductor devices and lenses may be fabricated, mutually secured with the non-symmetrically placed lenses aligned over the non-symmetrically placed optically active regions, and singulated to form packages, such as image sensor packages. Related methods, and systems incorporating devices with non-symmetrically placed optically active regions and aligned lenses are also disclosed.

Abstract: An electrically controlled dimmable window for aircraft includes a controller and power that eliminates the need for wiring connections to on-board systems. The controller is integrated into the sidewall in which the window is mounted. Power for controlling the window is derived from an energy harvesting device that generates power by converting thermal gradients, motion/vibration or light energy present near the window. The integrated controller includes passenger controls for adjusting the opacity of the window, power conditioning circuitry, an electrical power storage device such as a battery, a processor and a radio receiver. The window can be remotely controlled by a cabin attendant from a central controller that transmits window control signals to the radio receiver.

Abstract: A detector apparatus is configured to receive light and generate electrical signals. The detector apparatus includes a housing, a detector disposed in the housing and a cooling component disposed in the housing. The cooling component electrically insulates the detector with respect to the housing or is part of an insulator electrically that insulates the detector with respect to the housing.

Abstract: The present invention is directed to a flame detection device comprising a flame signal receiver (1), a flame signal passage (11) and a flame signal transmitting mechanism, characterized in that, the flame signal passage (11) passes through a furnace shell (12) into inner of the furnace and comprises an outside-furnace passage portion (11a) and an inside-furnace passage portion (11b); wherein a pressure-resistant optical mechanism (10) is arranged at the outermost end of the outside-furnace passage portion, said pressure-resistant optical mechanism hermetically and transparently separate the flame signal receiver from the flame signal passage; and wherein the inside-furnace passage portion (11b) is provided with a cooling mechanism (19).

Abstract: The imaging apparatus holds an imaging element that converts a subject image that has been formed by an imaging optical system to an electric signal by a holding member. An optical member is disposed more toward the subject side than the imaging element and is installed on the holding member. A sealing member that is formed by an elastic material encloses the light receiving surface of the imaging element as a countermeasure for dust protection. A position restricting member provided on the sealing member carries out positioning by being inserted between the outer peripheral edge portion of the optical member and the holding member in a direction perpendicular to the optical axis of the imaging optical system.

Abstract: A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member.

Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.

Abstract: An accessory mounting system for mounting an electronic device at a windshield of a vehicle includes a bracket. The bracket is configured to mount at an interior surface of the vehicle windshield. The bracket includes an attaching structure configured to attach the bracket at the interior surface of the vehicle windshield. The bracket may include a support frame coupled to an attaching structure and to an adjustable support of an interior rearview mirror assembly. The support frame may have a set off portion set off from the interior surface of the windshield to accommodate an electronic device between the windshield and the set off portion.

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess. The main body of the protecting member forms at least one containing recess. A combining component for combining the rod lens array and the protecting member is disposed within the containing recess.

Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.

Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.

Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Abstract: An optical sensor apparatus includes an optically transmissive structure having planar first, second, and third faces, two or more light sources located outside the structure adjacent the first face, and a photodetector array located outside the prism adjacent the first face. The structure, light sources, and photodetector array are configured such that light from the light sources that is totally internally reflected at an optical interface between the prism and a sample outside the structure proximate the second face is reflected at the third face and incident on a portion of the photodetector array that depends on a refractive index of the sample. The light sources are positioned with respect to the structure and photodetector array such that the totally internally reflected light from each light source corresponds to a different range of refractive index of the sample and maps to a corresponding portion of the photodetector array.

Abstract: According to one embodiment, a solid state imaging device includes a first SiGe layer provided at an uppermost layer of a photoelectric conversion layer from the viewpoint of an incident light side, and a second SiGe layer provided under the first SiGe layer in the photoelectric conversion layer and having a higher Ge concentration than the first SiGe layer.

Abstract: An optical module includes a light-receiving element configured to convert an incident optical signal to an electric signal. The light-receiving element includes a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface, and a second semiconductor layer. The light-receiving element also includes an electrode part disposed on a top of the mesa part and a wiring part that covers a part of a side surface of the mesa part. The optical module includes a lens configured to condense an optical signal from an optical fiber onto the light reception surface. The wiring part is disposed at a position based on an intensity distribution of the optical signal on the light reception surface.

Abstract: Packaged light detector semiconductor devices (PLDSDs), methods for manufacturing PLDSDs, and systems including a PLDSD are described herein. In an embodiment, a PLDSD includes a light detector die having a surface including an active photosensor region, and a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region. A molding material forms the non-imaging optical concentrator and encapsulates at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator. The non-imaging optical concentrator concentrates light from the entrance aperture toward the exit aperture and onto the active photosensor region.

Abstract: A device for imaging system warp correction includes an object including an imaging phantom, the object being configured for placement of the imaging phantom adjacent a scanning interface of a detector, and a mounting cap coupled to the object and configured to be secured to the detector to establish the placement of the imaging phantom adjacent the scanning interface of the detector. The mounting cap includes a plurality of alignment features configured to align the object and the mounting cap.

Abstract: A solid-state imaging apparatus includes a first substrate that includes a plurality of photoelectric conversion units, a second substrate that includes at least a part of a readout circuit configured to read signals based on electric charges of the plurality of photoelectric conversion units and a peripheral circuit including a control circuit, and a wiring structure that is disposed between the first substrate and the second substrate and includes a pad portion electrically connected to the peripheral circuit via a draw-out wiring and an insulating layer. The wiring structure has, at least at a part thereof, a seal ring disposed in such a way as to surround the photoelectric conversion units and the peripheral circuit.

Abstract: A camera module including a particle trap. The particle trap may be disposed in the camera module and may be operable to prevent particles from obstructing an optical path defined between a lens assembly and an image sensor. The particle trap may include a particle getter to retain particles in contact with the particle trap. The camera module may be operative to move the lens assembly so as to provide focus on the image sensor for objects at various distances from the camera module. The movement of the lens assembly may be a source of particles retained by the particle trap.

Abstract: A comprising a ground mount, a reflector assembly comprising a mirror and a frame rigidly connected to the mirror, a drive assembly configured to rotate the reflector assembly with respect to the ground mount about a predetermined angular range, and a mounting mechanism configured to connect the drive assembly to the reflector assembly and comprising a shaft connected to the drive assembly, where the drive assembly is configured to rotate the shaft about a longitudinal axis of rotation, an attachment for connecting the frame to the shaft at a fixed angle about the longitudinal axis; and a clamp for connecting the shaft to the frame.

Abstract: The invention in some aspects relates to radiometers and related methods of use. In some aspects of the invention, methods are provided for determining a circumsolar profiles at external locations of interest, e.g., at a solar power generation system installation site.

Abstract: An optical-electrical converting device includes a printed circuit board (PCB), a light emitting module, a light receiving module, an optical coupling lens, and a locating frame positioned on the PCB. The PCB has two first locating elements. The optical coupling lens includes a first converging lens and a second converging lens. The locating element has two second locating elements. The two first locating elements and the two second locating elements cooperate to position the locating frame on the PCB. The locating element further has two third locating elements. The optical coupling lens has two fourth locating elements. The two third locating elements and the two fourth locating elements cooperate to position the coupling lens on the locating frame, and thus the first converging lens is aligned with the light emitting module, and the second converging lens is aligned with the light receiving module.

Abstract: An optical detecting apparatus, which comprises: a detecting surface; a first light source, for providing light parallel to the detecting surface; an image sensor, for detecting an object close to the detecting surface, to generate object image data; and an object location determining apparatus, for computing location information of the object according to the object image.

Abstract: A photo detection device, which is disposed in a vehicle, includes a first photo detection element that detects light and a first signal processing unit that performs a predetermined process based on a detection result of the first photo detection element. The photo detection device also includes a first board on which the first photo detection element is mounted and a second board on which the first signal processing unit is mounted. Additionally, the photo detection device includes a holding member that holds the first board and the second board and a housing that accommodates the holding member. The holding member holds the first board and the second board such that the second board is arranged in a second plane different from a first plane in which the first board is arranged.

Abstract: Disclosed herein is a solid-state imaging device including: a photoelectric conversion section configured to have a charge accumulating region of a first conductivity type formed in a semiconductor layer; a pixel having the photoelectric conversion section and a pixel transistor; a pixel region in which a plurality of the pixels are arranged; an epitaxially grown semiconductor layer of the first conductivity type formed on an inner wall part of a trench disposed in the semiconductor layer at least between adjacent ones of the pixels within the pixel region; and a pixel separating section configured to separate the charge accumulating regions of the adjacent ones of the pixels from each other, the pixel separating section being formed on the inside of the semiconductor layer of the first conductivity type.

Abstract: A low-cost, compact, high-reliability optical sensor device has an optical sensor element mounted in a package comprised of a light shielding glass lid substrate, a part of which has a light filter function, adhered to a light shielding glass substrate having a cavity. In a through hole in the light shielding glass lid substrate, glass having a function of absorbing infrared light and transmitting visible light by its own property is embedded. The light shielding glass substrate is made of glass having light shielding property as its own property.

Abstract: An encoder includes a first substrate including a point light source that emits light onto reflective slits formed on a disc and a light-receiving element that receives light emitted from the point light source and reflected by the reflective slits, a second substrate onto which the first substrate is mounted, a lustrous connecting portion configured to electrically connect the first substrate and the second substrate, and a covering material configured to cover the connecting portion in the manner that the point light source and the light-receiving element are exposed.

Abstract: A semiconductor device includes one or more transistor cells mounted on a first conductive type silicon carbide (SiC) substrate, wherein each of the transistor cells includes a second conductive type wall region formed on a first surface of the SiC substrate, a first conductive type source region formed in the wall region, a gate electrode formed with a gate insulating film; a source electrode formed in such a way as to be brought into contact with the source region, and a drain electrode formed on a second surface of the SiC substrate. The semiconductor device further includes a second conductive type region located close to an outside of an outermost cell of the transistor cells, the second conductive type region surrounding the wall region and being insulated from both of the gate electrode and the source electrode.

Abstract: Methods and systems for providing electromagnetic protection of optical equipment are disclosed. One assembly includes an optical device and an electromagnetically shielding enclosure including a plurality of shielding surfaces, the enclosure defining an interior volume containing the optical device. The assembly further includes a waveguide beyond cutoff extending through a shielding surface of the electromagnetically shielding enclosure. The assembly also includes a first lens located on a first side of the shielding surface, and positioned and oriented to focus light through the waveguide beyond cutoff. The assembly further includes a second lens located on a second side of the shielding surface opposite the first side, positioned and oriented to receive light transmitted through the waveguide beyond cutoff.

Abstract: A photoelectric switch includes a base having a tubular wall surrounding an axis, and a cover coupled to the base and including a rib unit that cooperates with the tubular wall to confine a rolling chamber. The rib unit has at least one portion overlapping the tubular wall. A light passage extends through the rolling chamber and two diametrically opposite sides of the tubular wall. A photoelectric unit is enclosed by the base and the cover, and includes a light emitter and a light receiver disposed respectively on two opposite ends of the light passage, and a rolling member disposed in the rolling chamber and movable between a blocking position to block the light passage and a non-blocking position to unblock the light passage.

Abstract: An outer part for a device which is attachable thereto as a housing and/or an attachment part, a first reflective surface and a second reflective surface being formed on the outer part so that at least one signal emitted by an optical and/or acoustic source is directly or indirectly deflectable onto at least one detector surface of an optical and/or acoustic detector, an optical path being configured as a cavern or continuous recess in the outer part or as a depression of a boundary surface of the outer part, the optical path having at least one opening via which at least one substance is transferable into the optical path, and the at least one signal being deflectable into the optical path to the second reflective surface which is formed at a second end of the optical path with the first reflective surface at a first end of the optical path.

Abstract: A package structure with a sensor chip having a first substrate with front and back opposing surfaces, a plurality of photo detectors and contact pads formed at the front surface and electrically coupled together, a plurality of first electrical contacts each extending from the back surface and through the first substrate to one of the contact pads, and a plurality of second electrical contacts each extending from the back surface and through the first substrate to the front surface. The liquid crystal lens includes a layer of liquid crystal material, one or more lead patterns adjacent the layer of liquid crystal material, and a plurality of third electrical contacts each extending from one of the one or more lead patterns. The sensor chip is mounted to the liquid crystal lens such that each of the third electrical contacts is electrically connected to one of the plurality of second electrical contacts.

Abstract: A detection device includes: an imaging unit that forms an image of an incident beam on an image detection unit; an emission unit that includes a guided portion that is guided to a guiding portion provided at the imaging unit and guiding an attachment-detachment operation of the guided portion, a positioned portion that is positioned in a positioning portion provided at the imaging unit, and an emission member that emits a beam toward a direction of a transportation path such that a beam reflected from the medium is incident to the imaging unit; and a setting unit that includes a positioned portion that is positioned in a positioning portion provided at the emission unit when a drawing unit is pressure-inserted into the image forming apparatus and a setting surface that sets a position on the medium at which the beam is reflected.