Abstract: An imager apparatus and methods are described. An embodiment of an imager module includes a plurality of groups of optical lenses, a lens frame, and at least one associated lens barrel configured to position and hold the plurality of groups of optical lenses. At least one of the groups of optical lenses is movable with respect to at least one other group of optical lenses for achieving optical focus. The imager module includes an integrated circuit (IC) imager die in proximity to the plurality of lenses, the imager die containing at least one image capture microelectronic device. The imager module includes a modular frame assembly that contains a first portion that holds a plurality of lens barrels, each containing one or more focusing lenses, and a second portion that supports the first portion at a specific distance from the substrate being imaged. The lens barrels are each responsive to different wavelengths or bands of wavelengths.

Abstract: A motion-detecting module for combining a light-emitting function and a light-sensing function together includes a chip unit, a cover unit, and a light-guiding unit. The chip unit has a PCB, a light-emitting chip, and an image-sensing chip, and both the light-emitting chip and the image-sensing chip are electrically disposed on the PCB. The cover unit covers the light-emitting chip and the image-sensing chip. The cover unit has a receiving space for communicating the light-emitting chip and the image-sensing chip, a first opening for exposing the light-emitting chip, and a second opening for exposing the image-sensing chip. The light-guiding unit is disposed under the cover unit, and the light-guiding unit at least has a first refraction surface, a second refraction surface, a third refraction surface, a fourth refraction surface, and a reflection surface.

Abstract: A photodetector includes a plurality of photodetecting elements which output electrical signals corresponding to the intensities of light that entered these; a signal processing element which is opposed to the photodetecting elements and is connected to the photodetecting elements via conductive bumps, and into which electrical signals output from the photodetecting elements are input; a resin which has electrical insulation and is filled in at least at the gaps between the photodetecting elements and the signal processing element; and a light shielding member arranged so as to cover the surfaces exposed from the photodetecting elements and the signal processing element in the resin.

Abstract: The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50) having at least one photoelectric conversion portion (1) which is formed on a substrate (10); a sealing material (14); and a connection terminal (3). The optical device comprises an optical window which is an interface between the photoelectric conversion element (50) and an outside of the optical device; and an aperture (6) formed in the sealing material 14, and whose bottom face is the optical window. An entire face of the optical window is exposed to the outside. An optical adjustment element (13) may be formed on the interface. In this case, the interface between the optical adjustment element (13) and the outside is the optical window.

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract: Layered structures such as photosensing arrays include layers in which charge carriers can be transported. For example, a carrier-transporting substructure that includes a solution processing artifact can transport charge carriers that flow to or from it through charge-flow surface parts that are on electrically conductive regions of a circuitry substructure; the circuitry substructure can also have channel surface parts that are on semiconductive channel regions, with a set of the channel regions operating as acceptable switches in an application. Or a first substructure's surface can have carrier-active surface parts on electrode regions and line surface parts on line regions; a second substructure can include a transport layer on carrier-active surface parts and, over it, an electrically conductive layer; to prevent leakage, an open region can be defined in the electrically conductive layer over the line surface part and/or an electrically insulating layer portion can cover the line surface part.

Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Abstract: A direct attach optical receiver module and a system and method for testing the direct attach optical receiver module are provided. An optical receiver module may include an optical detector and an integrated circuit with an integrated amplifier circuit and at least one integrated capacitor. In one example, the optical detector may be physically attached to the integrated circuit and the output port of the optical detector may be electrically coupled to the input port of the integrated circuit. In another example, a redistribution layer that includes a tuning inductor may be being physically attached between the optical detector and the integrated circuit.

Abstract: An image forming apparatus that forms an image on a recording medium includes a sensor including a light emitting element configured to emit light and a light receiving element configured to receive light emitted from the light emitting element. A sensor actuator is configured to cause a transition between a first state where the light emitted from the light emitting element is received at the light receiving element and a second state where the light emitted from the light emitting element is not received at the light receiving element in response to a recording medium being detected. A light shield is coupled to the sensor actuator and configured to cover at least a part of the sensor and to prevent light other than light emitted from the light emitting element from entering the light receiving element in the second state.

Abstract: Optical sensors containing reduced amounts of cross talk, as well as methods for making and using such sensors are described. The sensors contain a light absorption coating that is placed on a portion of the external surface of the optical sensor near the detector. This absorption coating reduces the amount of cross talk by reducing the amount of light reflected inside a transparent package of the sensor. As well, the coating can also reduce the amount of ambient and/or stray light that enters the sensor. The coating adds little cost or complexity to the manufacturing process for the sensors, yet reduces the cross talk without substantially increasing the size of the sensor or without increasing any reliability risks. Other embodiments are also described.

Abstract: A photoelectric conversion element unit for use in an imaging apparatus including a photoelectric conversion element package containing a photoelectric conversion element, a wiring substrate where the photoelectric conversion element package is mounted on the first surface and an electronic component related to the photoelectric conversion element is mounted on a rear side of the first surface, and a support board attached to an attachment point in the imaging apparatus where the photoelectric conversion element package is fixed, wherein an opening smaller than an external form of the photoelectric conversion element package is formed in the support board, and the electronic component mounted on the wiring substrate is provided within the opening.

Abstract: The invention relates to a solar tracker characterized by having photovoltaic panels arranged in spaced rows at different levels and two slopes, favoring their ventilation and the expansion of the frame; the panels being fixed by means of yokes and clips to a support (3) anchored to the H-shaped frame (4) resting on swivelling supports of a tower having little height supporting the entire structure, its tilt being variable by means of a tension device, the side longitudinal beams (4a) being extendible to house more rows of panels (1) since the remaining structural components, tower, bearings, column and base have been oversized for that purpose.

Abstract: The invention includes at least one swingable elastic locking bar mounted on the chassis of the scanner, and the end of the elastic locking bar is provided with a contact member having a low friction coefficient, and let the contact member on the elastic locking bar contact the top cover of the frame body of the scanner. Thus, the chassis may be rigidly rested on the top cover or on the glass mounted on the top cover to move, thereby providing a good scanning effect of an arbitrary angle. The swingable action of the elastic locking bar may efficiently absorb the tolerance produced during fabrication and assembly of the top cover and the bottom housing of the frame body of the scanner, thereby assuring stability of the optical travel path.

Abstract: In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse.

Abstract: A safety sensing system includes an apparatus for use in a doorway having a powered door slidable for closure of the doorway. The apparatus includes radiation transmitters and/or receivers for providing a curtain of detection beams across the doorway, and is formed as a composite structure that includes: a fixative member connectable by securing means to a side of the doorway at a door frame, the fixative member including a first portion of a mating connection means; and, a housing containing a plurality of the transmitters and/or receivers along its length, and including a second portion of the mating connection means for attaching the sealed housing to the fixative member. The mating connection means allows the housing to be removed and replaced while the fixative member remains in situ.

Abstract: Photo control devices include a housing having a light transmissive portion. A photosensor is positioned in the housing to receive light passing through the light transmissive portion of the housing. A relay electrically coupled to the photosensor is responsive to a level of light detected by the photosensor. The photosensor includes a light sensitive silicon photo cell and an electronic circuit. The electronic circuit is coupled to the silicon photo cell and the relay and includes a field effect transistor (FET) including a zener diode therein between a source and a drain of the FET. The silicon photo cell may be a photodiode and/or a phototransistor. The relay may be a thermal switch including a heater resistor.

Abstract: An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.

Abstract: An optical scanning device with a dustproof function includes a shell defining a first receiving room and a second receiving room communicating with the first receiving room through an open window defined on the shell for scanning light beams passing therethrough. An optical scanning module is mounted in the first receiving room. A glass platform is located on the second receiving room at a position facing the open window for insulating the first receiving room from the outside of the shell. A correcting plate is stuck on the bottom of the glass platform. Such structure of the optical scanning device enables the glass platform to be firstly assembled with the shell in a dustless chamber, which prevents the suspending dust from falling in the first receiving room and attaching to the optical scanning module during the subsequent assembly process and ensures the scanning quality of the optical scanning device.

Abstract: An optical navigator sensor for sensing an image of an object comprises a substrate, a laser diode, an optical sensor device and a housing. The optical sensor device and the laser diode are fixed on the base plate and covered by the housing. The housing guides the light emitted from the laser diode to the object and guides the light reflected from the object to the optical sensor device.

Abstract: An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.

Abstract: The method of making an optoelectronic module (10, 20), which includes a first light source circuit (5) and a second photoreceptor circuit (6) for picking up light from the first light source circuit reflected on an external surface. A first moulding (20) with an encapsulation material is made on one part of a lead frame (10) having several conductive paths (12) and an external frame (11) connecting all of the conductive paths. A first light source circuit (5) is placed on one portion of a first conductive path (13) of the lead frame that is not covered by the first moulding. A second photoreceptor circuit (6) is placed on one portion of a second conductive path (14) of the lead frame not covered by the first moulding. A through opening (21) is also made in the first moulding (20) between the external frame (11) and the location of the first light source circuit (5) to give access to the first connecting path (13) and to a third connecting path (15) for the first light source circuit.

Abstract: A door handle apparatus for a vehicle, opening and closing a vehicle door, the door handle apparatus includes an informing portion for visually informing a state of the vehicle door, including a locking/unlocking state thereof, to a user by a decorative light, which is a visible light, an operation detecting portion for optically detecting an active-direct operation to the door handle apparatus by the user based on changes in an detection light, and an optical waveguide for transmitting the decorative light and the detection light, which is inputted from a first end portion of the optical waveguide, to a second end portion of the optical waveguide, the optical waveguide functioning as the informing portion by leaking the decorative light on a transmission path so as to be outwardly emitted and as the operation detecting portion by outputting the detection light from the second end portion of the optical waveguide.

Abstract: The image pickup apparatus includes: an image pickup device including a pixel region and an electrode; an electric board including the image pickup device arranged to cover an opening and a connection pattern arranged in the vicinity of an edge portion of the opening, in which a first adhesive is applied between the image pickup device and the electric board from the outer edge of the image pickup device at least to an electric connection portion between the connection pattern and the electrode and applied annularly with a first band along an outer edge of the image pickup device; and a protective cover fixed by a second adhesive so as to cover the opening on the other surface of the electric board, wherein the second adhesive is applied annularly with a second band so that the first band width overlaps within the second one.

Abstract: A camera module having an inner wall installed and a method for forming the camera module are disclosed. The camera module includes a lens; a sensor component for sensing light gathered by the lens; and a fixing module, for fixing the lens. The fixing module includes an inner wall that is installed on the sensing component. The inner wall of the fixing module protects a sensing region of an image sensor from unwanted matter resulting from manufacturing or from the outside environment.

Abstract: A seal assembly for an optical sensor employed in a high temperature environment is disclosed which includes an elongated metal guide tube having a distal end portion defining an open distal end and an inner rear wall, a sapphire window disposed within the distal end portion of the metal guide tube, the sapphire window having a rear end surface abutting the inner rear wall of the distal end portion of the metal guide tube, and a platinum mounting sleeve for securing the sapphire window to the metal guide tube, the platinum mounting sleeve having one portion joined to the metal guide tube and another portion joined to the sapphire window.

Abstract: An optical pickup apparatus comprising: a photo detector configured to receive light reflected from a medium; a housing mounted with the photo detector; and a projecting portion projecting from the housing, the projecting portion including a displacement preventer configured to prevent displacement of the photo detector or an adhesive relative to the housing, the displacement preventer including a fixing portion formed to extend along a plurality of directions, the photo detector being provided on the housing by applying the adhesive to the displacement preventer.

Abstract: A heat dissipation method for a projector includes measuring a first temperature at an intake vent of a projector, measuring a second temperature at an outlet vent of the projector, controlling a heat sink of the projector based on the first temperature when the second temperature is smaller than a predetermined value, and controlling the heat sink of the projector based on the second temperature when the second temperature is larger than the predetermined value.

Abstract: An illuminance detecting component includes: a supporting substrate including a substrate body made of silicon, and pads provided on an upper surface of the substrate body; a plurality of light receiving elements connected electrically to the pads and receiving light irradiated from an outside, the plurality of light receiving elements being arranged in array fashion on the upper surface side; external connection terminals connected electrically to the light receiving elements; and a translucent member provided on the substrate body. In the illuminance detecting component, an airtight space in which the plurality of light receiving elements are accommodated is formed between the translucent member and the substrate body.

Abstract: A mobile phone with night vision function includes a body (1) and a night vision module (4). The body (1) includes a display (2), a keypad (3), and a storage module (5). The night vision module is disposed at a top end of the body, and includes a lens module (41), an IR (infrared) emitter (42) and an IR detector. The storage module is provided in a sidewall of the body. The night vision module can detect IR radiation and provide information of an IR image. The information of the IR image can be displayed on the display of the body or be saved in the storage module. The mobile phone with night vision function can be used for night vision, illuminating, and photographing at night.

Abstract: The present invention provides a high dynamic performance mounting technique that is suitable for mounting sensor elements in adverse environments. According to one aspect, the present invention includes a kinematic mounting technique for a movable secondary mirror in an optical sensor. According to another aspect, the invention includes a mounting structure that provides deterministic alignment of a sensor element over multiple positions. According to another aspect, the invention includes a mounting technique with high dynamic performance yet minimizes sensor obscuration. According to another aspect, the invention includes a mounting technique that decouples actuator stiffness and mounting accuracy from the overall dynamic stiffness and alignment accuracy of a movable secondary mirror in an optical sensor.

Abstract: An ambient light sensor system is provided for sensing ambient light and light in the area in front of a motor vehicle, wherein the ambient light sensor system includes a light guide element arranged behind a transparent surface of the motor vehicle and at least two sensors arranged on the light guide element.

Abstract: An imaging device and method of fabricating the same is disclosed. The imaging device may include an imaging sensor base, an image detector and a multilayer board. The imaging sensor base has a bonded hub having uniform flatness. The mounting hub sized to fit into a receptacle in the multilayer board. The image detector sized to match a size of the imaging sensor base and bonded to a top surface of the imaging sensor base. The imaging device may also include a readout integrated circuit (ROIC) sized to substantially match the size of the imaging sensor base and disposed on the image detector. A plurality of equi-spaced flexures and receptacles for receiving the plurality of flexures may also be used to maintain positional stability and minimize thermal strain.

Abstract: An encoder arrangement of a direct current motor, having an encoder housing, an encoder disk, a circuit board arranged perpendicular in reference to an motor shaft with an optic sensor encompassing the encoder disk in a U-shaped manner, and a connection plug aligned parallel to the motor shaft. The encoder arrangement allows a simple, economical, reliable, and precise assembly, requiring little construction space, and protecting the encoder arrangement from contaminations. The circuit board is provided with accepting slots for connectors, with contact surfaces of the circuit board being arranged partially around the accepting slots and an electric contact is made between the connectors and the contract surfaces. The encoder housing comprises an encoder housing ring and an encoder housing lid. The encoder housing ring is provided with a radial recess, which is arranged in the area of the connector plug.

Abstract: A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

Abstract: A video projector (1) comprises a projection lens (18) which projects an image on a screen (S), a zoom ring (19) which varies a magnification ratio of the projection lens (18), a drive wheel (32) which is partially protruded from a bottom face of a housing (2), and a plurality of gears (310, 311, 312) that constitutes a power transmission mechanism (31) between the drive wheel (32) and the zoom ring (19). When the video projector (1) is moved in an anteroposterior direction to the screen with rotating the drive wheel (32), the zoom ring (19) is turned in conjunction with the rotation of the drive wheel (32) through the power transmission mechanism (31). Since the magnification ratio of the projection lens (18) is varied with the turning of the zoom ring (19), the size of the image projected on the screen is varied without a direct operation of the zoom ring (19) by a user.

Abstract: Systems, methods and apparatus are provided through which in some implementations a portable digital X-ray detector includes a modular handle that is removeable from a housing of the detector, the modular handle includes component(s) that perform functions that are specific to a number of portable digital X-ray detectors, such as data communication with external devices and/or power conditioning, and the housing of the detector includes the pixel array and component(s) that perform functions that are common to the pixel array. In some implementations, the modular handle includes an interface to the housing to support data communications and/or power supply with the component(s) in the housing and the housing also includes an interface that operably couples to the modular handle.

Abstract: Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

Abstract: An imaging device and a method for aligning an image sensor within the imaging device are disclosed. The imaging device comprises a housing and an image sensor assembly including a header and an image sensor mounted to the header. The header of the image sensor assembly is coupled to the housing. Means for aligning the image sensor with respect to the header are provided. Means for aligning the header with respect to the housing of the imaging device are also provided. A distance separating the image sensor alignment means and the header alignment means is pre-determined such that a distance between the image sensor and the housing of the imaging device is pre-determined.

Abstract: At least one exemplary embodiment is directed to a sensor for measuring the distance between the sensor and a measuring surface, which includes a light-emitting element and a plurality of light-receiving elements. The light-receiving elements are arranged so that the light axes thereof do not cross one another.

Abstract: The an optical communication module associated with the present invention comprises a semiconductor substrate, a light emitting element mounted on said semiconductor substrate to output light for transmission (transmitted light), a light receiving element mounted with an adhesive resin on said semiconductor substrate to convert light received (received light) to an electric signal and a wavelength filter to branch out the received light guided to said light receiving element and the transmitted light output from said light emitting element. A groove for an optical path, through which the received light passes to be guided to said light receiving element and a first protective groove formed around said groove for an optical path to block said adhesive resin from intruding into said groove for an optical path are formed on said semiconductor substrate.

Abstract: An exemplary image sensor package includes a substrate, an imaging area, a circuit layer and two passive components. The substrate has a first surface and a second surface, which are opposite to each other. An image sensing area is formed on the first surface of the substrate and a circuit layer is formed on the second surface of the substrate. The passive components opposite to the image sensing area are soldered to the circuit layer of the second surface.

Abstract: A mechanical joint having at least first and second joint elements arranged in contact with each other. A first surface of the first joint element abuts a second surface of the second joint element and is at least partially provided with at least one optically emitting module. The respective abutting second surface of the second element is provided, at least in part, with at least one optically receiving module.

Abstract: An image sensor and a method for fabricating the same are provided. The image sensor includes color filter layers having a photonic crystal for color separation. Since transmittance of the color filter layers is higher than that of a pigment or dye of an organic material and can easily be controlled in an unnecessary wavelength region, the image sensor having high sensitivity and good color reproduction can be fabricated.

Abstract: A solid-state image pickup device including a substrate having a first face and a second face which serves as an opposite face of the first face; a solid-state image pickup element having a plurality of electrodes and a light sensing part, an opposite face of the light sensing part being bonded to the first face via a bonding agent; a plurality of wires formed over the face, first ends of the wires serving as external electrode terminals; and a connection part for electrically connecting the electrodes to the wires, wherein an endless-shaped contraction frame formed of resin larger in thermal expansion coefficient than the substrate and image pickup element is bonded to and formed on surface of the substrate located outside the light sensing part so as to surround the light sensing part, and a light sensing face of the light sensing part is warped.

Abstract: An optical trace detecting module includes a light-pervious plate, a light source, an optical sensor, an imaging lens, and an optical path diverting element. The light-pervious plate contacts an object and allows the object to move on a surface thereof. The imaging lens is disposed between the light-pervious plate and the optical sensor. The optical path diverting element is disposed between the imaging lens and the optical sensor. A sensing light projected from the light source is refracted to the optical sensor under the guide of the optical path diverting element.

Abstract: An image projection apparatus includes: an imaging portion that takes an image of an object; an optical element that is disposed halfway on an optical path between the object and the imaging portion, and that branches the optical path; a projection portion that projects image light onto the object through the optical element; a dust prevention cover that includes an opening on an optical axis between the object and the optical element, and that covers at least the optical element to protect the optical element from dust; and a transparent dust prevention member that is provided in the dust prevention cover to close the opening, and that has a reflection surface preventing reflection light, which is obtained by receiving the image light from the projection portion and reflecting the image light, from being incident on an entrance pupil of the imaging portion.

Abstract: A motion-detecting module includes a PCB, a light-emitting unit, and a light-sensing unit. The light-emitting unit is electrically disposed over the PCB. The light-sensing unit has a light-sensing die electrically disposed on the PCB and a package cover covered on the light-sensing die, and the package cover has a through hole corresponding to the light-sensing die and a transparent element disposed in the through hole. The present invention does not need extra package protection body of the prior art for protecting the light-sensing die during the transport of the light-sensing module. The present invention use original package cover to prevent the light-sensing die from being damaged by external force, and the original package cover shelters the light-sensing die from extra stray light.

Abstract: A portable electronic device capable of assuming an open configuration and a closed configuration comprises a primary light sensor and a secondary light sensor. When the portable electronic device is in the open configuration, a light sensor signal is selected from the primary light sensor, and when the portable electronic device is in the closed configuration, a light sensor signal is selected from the secondary light sensor.

Abstract: Disclosed is an image inputting apparatus including: a base; a sensor main body coupled with the base so as to be able to move in a vertical direction on the base; a switch provided on either one of an upper surface side of the base or a lower surface side of the sensor main body; and a convex part provided on another one of the upper surface side of the base or the lower surface side of the sensor main body at a position facing to the switch.

Abstract: An image sensor package includes a cover glass, an image sensor chip, and a reflecting layer. The cover glass includes a first surface and a second surface at opposite sides thereof. The image sensor chip includes a silicon layer formed on the second surface of the cover glass, a plurality of pixel regions formed on a third surface of the silicon layer facing away from the cover glass, and a plurality of bumps formed on the third surface of the silicon layer, the bumps capable of electrically connecting the image sensor chip to a circuit board. The reflecting layer covers the pixel regions of the image sensor chip.