Abstract: A self-centering hub, more particularly for timing discs of encoders, stepping motors, spinning roller drives and the like, comprising a hub plate for fixing timing discs or code carriers and a slotted hub shank for being slipped on to the shaft end of an input or output unit.

Abstract: A tester according to the present invention can conduct a test on optical devices each having a different positional relation between a position of a contact face of an external contact terminal and a direction of light emitted from a semiconductor laser element.

Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.

Abstract: The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Abstract: A photoelectric conversion element package retaining unit includes a photoelectric conversion element package having electrodes formed on a rear surface of a light-receiving surface, a printed circuit board electrically connected to the electrodes, and a retaining member configured to retain the photoelectric conversion element package. The printed circuit board includes a first opening formed in an area corresponding to an inside of the electrodes. The retaining member includes a positioning unit configured to position the photoelectric conversion element package in an axial direction orthogonal to the light-receiving surface by abutting on the photoelectric conversion element package outside the electrodes, and a second opening formed to pour an adhesive into the area corresponding to the inside of the electrodes.

Abstract: An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.

Abstract: An optical proximity sensor adapted to be mounted in a liquid-jet instrument having a spray head for spraying a jet of liquid. The optical sensor evaluates a distance between the sensor and a surface onto which the liquid is to be sprayed.

Abstract: A light sensor protection system and method protects a light sensor system from a laser threat. The light sensor system has a sensor housing which contains optical elements disposed within the sensor housing and at a first end of the housing to converge light rays entering the housing at a focal plane. A focal plane array is disposed within the sensor housing substantially coincident with the focal plane. A means for protecting the light sensor system from a laser threat is disposed within the housing remote from the optical elements, the light rays, and the focal plane array. The method includes the steps of (a) providing a light sensor system as described above; and (b) protecting the light sensor system from a laser threat in the presence of a laser threat or upon a warning thereof with the means for protecting the light sensor system from a laser threat.

Abstract: An image intensifier tube is provided. The image intensifier tube has a microchannel plate (MCP), a photocathode and phosphor screen deposited on a fiber optic substrate. A first spacer is positioned between the microchannel plate and the fiber optic substrate. A second spacer is positioned between the fiber optic substrate and the photocathode. The first and second spacers cooperate to provide a spatial relationship among the MCP, phosphor screen and photocathode for effective operation of the image intensifier tube.

Abstract: One or more problems related to processing workpieces using processes that involve optical radiation are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting optical radiation data representing one or more process conditions used for processing a workpiece. In a further embodiment, the sensor apparatus is also configured for measuring data other than optical radiation.

Abstract: A method for adjusting a scanning module includes the steps of: providing a first fixing force to mount an adjustment assembly, to which an image sensor is attached, onto a base of the scanning module and loosely fixing the adjustment assembly to the base with a first fixing force; adjusting a relative position between the adjustment assembly and the base of the scanning module, and testing a first adjustment result until the first adjustment result is accepted; securing the adjustment assembly to the base of the scanning module with a second fixing force; and removing the first fixing force. The first and second fixing forces come from different sources.

Abstract: A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate; an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate; and a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer.

Abstract: By combining a sensing module having a lens and an image sensor with a carriage module having a mirror set, a reading device of a scanning apparatus is assembled. The sensing module further includes two channels at bilateral sides of the lens and two guiding slots disposed on external sides of the channels. The carriage module further includes two linear tracks corresponding to the channels and two bolt hole pedestals corresponding to the guiding slots. The sensing module is glided on the carriage module when the linear tracks are embedded in corresponding channels, thereby correcting the desired magnification.

Abstract: An integrated circuit package for an image sensor chip includes an integrated heater element. In one embodiment, the integrated circuit package includes a substrate including a first surface disposed to receive an image sensor chip and a second surface having an array of contact terminals formed thereon and a heater element. The heater element has a first terminal and a second terminal coupled to a first contact terminal and a second contact terminal. The heater element is positioned on the first surface of the substrate and underneath the sensor area of the image sensor chip to be assembled in the package. The heater element provides heating of the sensor area of the image sensor chip when a first voltage is applied across the first contact terminal and the second contact terminal. An ESD protection resistor can be coupled between the first terminal and the second terminal of the heater element.

Abstract: An optical sensor for detecting objects within an area to be monitored comprises at least one casing to accommodate optical and electronic components. The at least one casing comprises casing parts. The casing parts are composed of a low-pressure injection molding compound and are formed by a low-pressure injection molding operation.

Abstract: In a camera device of the present invention, a camera module 2 is mounted on a substrate 1 provided in the camera device by use of contact pins 3 for connecting first terminals provided on a backside of the camera module 2 to second terminals provided on the substrate 1. The contact pins 3 have first and second ends, and the first ends are soldered to ones of the first and second terminals and the second ends have contact with the other ones of the first and second terminals, respectively, so that the camera module 2 is electrically connected to the substrate 1, and the contact pins 3 are provided independently. This decreases restrictions on mounting the camera module 2 on the substrate 1, and also makes it possible to provide a camera device, in which the camera module 2 can be easily mounted on the substrate 1.

Abstract: The present invention discloses a structure of image sensor package utilizing a removable protection film. The structure comprises a substrate with a die receiving cavity and inter-connecting through holes. Terminal pads are formed under the inter-connecting through holes and metal pads are formed on an upper surface of the substrate. A die is disposed within the die receiving cavity by an adhesion material. Bonding pads are formed on the upper edge of the die. Bonding wires are coupled to the metal pads and the bonding pads. A protection layer is formed on the micro lens area to protect the micro lens from particle contamination. A removable protection film is formed over the protection layer to protect the micro lens from water, oil, dust or temporary impact during the packaging and assembling process.

Abstract: An optical device and method for making the same is disclosed. The device includes having a circuit element that is located in an opaque enclosure. The circuit element includes a die having an optical integrated circuit mounted on a carrier. The carrier includes a plurality of conductors connected to the optical integrated circuit. The opaque enclosure has a transparent window therein. The carrier is positioned in the enclosure such that light entering the enclosure through the window illuminates the die. The enclosure further includes an aperture through which the conductors protrude from the enclosure. The enclosure is at least partially filled with a layer of optically transparent material that passes light utilized or generated by said optical integrated circuit. The enclosure can be preformed to a higher degree of precision than that obtainable on conventional packaging fabrication lines.

Abstract: A light source and method for controlling the same is disclosed. The light source includes a first component light source that includes N LEDs, a photo-detector, and a light redirector, where N>1. Each LED has a light emitting chip in a package. The light emitting chip emits light in a forward direction and light in a side direction. The light generated in the forward direction is determined by a drive signal coupled to that LED. A portion of the light in the side direction leaves the package. The light redirector is positioned such that a portion of the light in the side direction that leaves the package of each of the LEDs is scattered onto the photo-detector. The photo-detector generates N intensity signals, each intensity signal having an amplitude related to the intensity of the light emitted in the side direction by a corresponding one of the LEDs.

Abstract: A submersible transformer assembly including a housing for holding an electrical transformer and having an aperture in a top panel of said housing for receiving a photocell assembly, the photocell assembly including a photocell positioned above the housing and electrically coupled with a socket held within the aperture by a socket retainer mounted to the underside of the housing top panel below the aperture. A transparent photocell cover or lens is mounted on top of the housing in covering and sealing relationship with the photocell and the aperture. The transformer positioned within the housing is electrically governed by the photocell which switches power to the transformer on and off in response to changes in ambient light conditions.

Abstract: A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.

Abstract: The present invention relates to a photo-detecting apparatus having a structure which can accurately detect light by restraining noises from occurring. The photo-detecting apparatus comprises a first substrate having a surface provided with M×N photodiodes and switches; a second substrate having a surface provided with signal processing parts for processing output signals of the photodiodes; and a third substrate arranged between the first and second substrates. The third substrate has a first surface opposing the first substrate and a second surface opposing the second substrate. In the third substrate, M common wires for connecting the photodiodes to the signal processing parts are arranged on the first surface, whereas bonding pads connected to the respective common wires are arranged on the second surface.

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract: The invention relates to small dimension image recorders, such as an image recorder, comprising a matrix of rows and columns of photosensitive points, arranged on a chip of a generally square or rectangular form with believed corners, characterised in comprising a reading register arranged at the base of the matrix. The register is bent to follow the bevelled corners of the chip and thus comprises a horizontal piece and two oblique pieces. The sensor further comprises means (ZIn) to direct the photosensitive charges form the columns terminating opposite the beveled corners towards the stage of the reister situated in the oblique part along the beveled corners. The above is of application to intraoral dental radiological sensors.

Abstract: A signalling device comprising an emission module operative on the application of battery power from a battery pack for the emission of a signal from at least one electromagnetic radiation emitting element, a battery compartment and a cap for retaining said battery pack in said battery compartment. The cap comprises at least one sensor and a switch for controlling the application of battery power. The switch is actuated when the at least one sensor detects a change in the environment in the vicinity of the device. Alternatively, the switch can be actuated remotely through a wireless interface or via a trip wire.

Abstract: An integrated spectral sensing engine featuring energy sources and detectors within a single package that includes sample interfacing optics and acquisition and processing electronics. The miniaturized sensor is optimized for specific laboratory and field-based measurements by integration into a handheld format. Design and fabrication components support high volume manufacturing. Spectral selectivity is provided by either continuous variable optical filters or filter matrix devices. The sensor's response covers the range from 200 nm to 25 ?m based on various solid-state detectors. The wavelength range can be extended by the use of filter-matrix devices. Measurement modes include transmittance/absorbance, turbidity (light scattering) and fluorescence (emission). On board data processing includes raw data acquisition, data massaging and the output of computed results. Sensor applications include water and environmental, food and beverage, chemical and petroleum, and medical analyses.

Abstract: A light emitting element and a light receiving element are mounted on the upper surface of an insulating substrate to be laterally aligned. A cap including a first hollow portion accommodating the light emitting element, a second hollow portion accommodating the light receiving element, and a connecting portion connecting the first hollow portion and the second hollow portion to each other is provided. The connecting portion is formed with a groove in which an object to be detected is to be placed. The light emitted from the light emitting element passes across the groove to reach the light receiving element. A sealing member made of transparent resin is provided in the first hollow portion to seal the light emitting element. Another sealing member made of transparent resin is provided in the second hollow portion to seal the light receiving element.

Abstract: An image sensor package structure includes a base board, an image sensor and at least a passive component. The base board includes a top surface, a bottom surface and four side surfaces. At least one depression is formed in the border of the top surface and the side surface. The image sensor is mechanically and electrically connected to the base board. The images sensor is installed above the depression. At least a passive component is installed in the depression and electrically connected to the base board.

Abstract: A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Abstract: The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface.

Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Abstract: A visual, rear viewing and rain sensing system for a vehicle comprising a windshield and a button connected to the windshield, with the button having a peripheral body defining an open area in a middle section of the button. The visual, rear viewing and rain sensing system further includes a rain sensor located in the middle section and an interior rearview mirror system connected to the button. The rain sensor is operatively coupled to the windshield independent of the interior rearview mirror system. At least a portion of the rain sensor is no longer operatively coupled to the windshield as the interior rearview mirror system is detached from the button.

Abstract: A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract: A miniaturized electro-optical device having a first zone facing a second zone, a first condenser plate, a second condenser plate arranged in the second zone and smaller than or equal to the first condenser plate, an intermediate space between both zones, with a conductive element arranged therein and which is independent from the side walls and moves thereacross the space depending on voltages present across both plates, two inlet/outlet points for light of an optical circuit, where the conductive element modifies the state of passage of light between the inlet/outlet points, when it is in contact with the stop. The device can be used, for example, as an accelerometer, a tiltmeter, a Coriolis force detector, a microphone, for acoustic applications, for the manufacture of an optical switching matrix, for the projection of images or as a pressure flowrate, temperature, gas, sensor.

Abstract: A cerebral function measuring apparatus houses a light detector in a package that can be set on the head of the subject examinee with light detection elements, amplifiers, and high voltage power supplies sealed in the package. Each amplifier and each high voltage power supply are united into one and covered with a high polymer material with high dielectric strength, and further enclosed by a metallic shield so as to be insulated. The high voltage power supply consists of a very small coil and an integrated circuit to generate a voltage required to drive the light detection element in the package. A removable and safe module type light detector is thus realized.

Abstract: A method for calibrating a sensor in a vehicle, such as a space capsule or other space borne apparatus, uses an expandable integrating sphere. A sensor in the vehicle measures the energy from an electromagnetic energy source within the integrating sphere through a calibration window. The expandable fluid impermeable integrating sphere expands when filled with a fluid, such that when filled with the fluid, its interior is viewable through the calibration window. The system includes a source of fluid to fill the integrating sphere and a fluid regulator coupled to the vehicle to determine when to supply the fluid to the integrating sphere to maintain an appropriate gas pressure level with the integrating sphere.

Abstract: There is disclosed optical encoder apparatus for removable connection with a printed circuit board. In an embodiment, the apparatus includes a light emitting component, a light detecting component, a mounting component for attaching the light emitting component thereon, and another mounting component for attaching the light detecting component thereon, wherein each of the mounting components have a removable connection with the printed circuit board. A method of assembling optical encoder apparatus is disclosed. In an embodiment, the method includes attaching a light emitting component and a terminal of a first mounting component to one another; attaching a light detecting component and a terminal of a second mounting component to one another; attaching a terminal of the first mounting component to a printed circuit board; and attaching a terminal of the second mounting component to the printed circuit board. Other embodiments are also disclosed.

Abstract: A camera including a mount substrate, a detector on a first surface of the mount substrate, a spacer on the mount substrate, the spacer including a hole exposing the detector, a cover on the spacer, the cover covering the hole, the mount substrate, the spacer and the cover together sealing the detector, the cover having a planar surface facing the detector, and an external electrical interconnection for the detector provided outside the sealing, the external electrical interconnection being on a first surface and a second surface, different from the first surface, of the mount substrate, the external electrical interconnection adapted to connect the detector to an electrical contact pad.

Abstract: An image sensor chip package includes a base, a sidewall adhered on peripheries of the base, an image sensor chip adhered on a top face of the base, and a cover adhered with the sidewall. The base includes a top face and a bottom face formed on an opposite side to the top face defining a number of outer pads thereon. The sidewall includes a number of inner pads is disposed on the inner side of the sidewall and corresponding to electrically connect with the corresponding outer pads. The inner pads are disposed on the sidewall to make the base become little. Thus, a volume of the image sensor chip package becomes thinner compare with the conventional image sensor chip package.

Abstract: The soldered connection of an end portion of a cable extending from each element with a main substrate is prevented from being broken. An end portion of a cable t1 extending from a light source element LD that is fixed to a standing frame 2A on a slide base 2 movable back-and-forth in the radial direction of a disk passes through an insertion opening 9 in the slide base 2 to be connected by soldering 8b to a main substrate 3, and an extended portion 15 extending from the peripheral edge of the insertion opening 9 close to the main substrate 3 is formed integrally with the slide base 2, the clearance “?” between the leading end face 15A of the extended portion 15 and the main substrate 3 being set slightly greater than the thickness “d” of the cable t1, so that the cable t1, if tensioned when positioning the light source element LD, is brought into contact with the edge 15a of the leading end face 15A.

Abstract: To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing element 1 of the present invention contains a long plate-shaped metal substrate 16, a long plate-shaped solid-state image sensing element 4 fixed to the surface of the metal substrate 16 via an adhesive layer 18, and bonding pads 6, formed on the surface of the solid-state image sensing element 4, for electrically connecting to the lead frame via bonding wires 14. The adhesive layer 18 contains a first adhesive layer 18a, and a second adhesive layer 18b of a higher modulus of elasticity than the first adhesive layer 18a, and at the regions directly below the bonding pads 6 provided at both end sections in a longitudinal direction of the solid-state image sensing element 4, the metal substrate 16 and the solid-state image sensing element 4 are fixed via the second adhesive layer 18b.

Abstract: A heliostat includes a pedestal, a transmission system, a frame assembly, and a mirror assembly. The frame assembly generally includes a first frame set and a second frame set mounted to the transmission system which is mounted upon the pedestal. Each frame set includes a stackable inner frame assembly and a stackable outer frame assembly. Each stackable inner frame assembly is identical and each stackable outer frame assembly is identical such that a multiple of inner frames and a multiple of outer frames are readily stackable in a nested arrangement for storage and transport.

Abstract: A light receiving apparatus includes a holder made of metal and a light receiving element that is attached to the holder, receives laser light reflected by an information medium, and outputs an electric signal. The light receiving element is constructed of a bare chip, is attached to the holder, and parts of the light receiving element aside from a part on which the laser light is incident are sealed using resin.

Abstract: The present invention provides a low-cost optical assembly with both function of the optical transmission and the optical reception to the single fiber. The optical assembly provides both devices of the light-emitting and the light-receiving. The light-emitting device emits light with the first wavelength to the first direction, while, the light-receiving device provides an optical thin film that reflects the light with the first wavelength incident from the first direction to the second direction different from the first direction, while, transmits the light with the second wavelength that is incident from the second direction to a light-sensitive area formed within the light-receiving device.

Abstract: The optical module includes a sensing member, a main body and an adjustable mechanism. The sensing member includes an optical sensor. The main body guides an external light beam into the optical sensor. The adjustable mechanism is disposed at first edges of the sensing member and the main body for combining the sensing member with the main body and adjusting the relative distance or angle between the optical sensor and the external light beam. The adjustable mechanism includes a first adjustable element and a second adjustable element. The unit adjustable amount of the adjustable mechanism is equal to a difference between a first unit displacement of the first adjustable element and a second unit displacement of the second adjustable element.

Abstract: A circuit substrate is divided into a light emitting circuit substrate 60 and a light receiving circuit substrate 70, and they are disposed in a first casing 21 in a two-tier fashion, and the light emitting circuit substrate 60, which is disposed on an upper side, is overlapped with at least a part of an optical system 40. By this means, it is possible to obtain a wider range mounting surface in a small space, and therefore, it is possible to miniaturize a switch main body. In addition, it is possible to miniaturize the switch main body without miniaturizing the optical system 40 more than necessity, simply by changing a disposal configuration of components other than components of the optical system 40 in the switch main body, and therefore, it is possible to prevent lowering of detection accuracy which goes with miniaturization of the optical system 40, and it is possible to detect an object with high accuracy.

Abstract: The present invention provides an image sensor module having build-in package cavity and the Method of the same. An image sensor module structure comprising a substrate with a package receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate, and a package having a die with a micro lens disposed within the package receiving cavity. A dielectric layer is formed on the package and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Abstract: The measurement head is equipped with the ray selection unit, which is entered by the rays emitted by the light unit under test. These rays enter the passages and are detected by the ray detection unit when they exit the ray selection unit. Said ray detection unit provides signals corresponding to the detected image, which are sent on for further processing. A precise measurement of the light unit is possible using the inventive light tester.

Abstract: A mounting apparatus for an optical sensor, applied to an optical scan module. A screw pile with a filet slot head, a washer and a screw nut are used to mount the base plate of the charged-couple device to the main body. Therefore, it is easy to adjust the skew in the direction parallel to the base plate of the charged-couple device and the depth of focus.