Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract: An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.

Abstract: A light sensor apparatus includes a support surface. A wall is located adjacent to and spaced apart from the support surface. A light aperture is defined by the wall. A light sensor is coupled to the support surface by an extendable member, whereby the extendable member is operable to adjust the distance between the support surface and the light aperture such that the light sensor is located adjacent the light aperture. The light sensor apparatus may be used to align an ambient light sensor on an information handling system with a light aperture defined by a cover wall on the information handling system chassis such that the light aperture can remain relatively small while still allowing the required amount of light to reach the light sensor in order for the light sensor to function.

Abstract: An accessory mounting system suitable for mounting a plurality of accessories at a windshield portion within the interior cabin of a vehicle includes a housing adapted for releasable mounting to a receiving structure on the interior surface of the windshield of the vehicle, and at least two accessories housed by said housing. One of the accessories comprises a forwardly-viewing camera, which views through the windshield of the vehicle when said housing is mounted to said receiving structure. The other of the accessories may be selected from the group consisting of: (a) a vehicle altitude sensor, (b) a vehicle incline sensor, (c) a headlamp sensor, (d) a geographic positioning satellite (GPS) transmitter, (e) a geographic positioning satellite (GPS) receiver, (f) an antenna, (g) a rain sensor, (h) a microphone, and (i) a compass sensor.

Abstract: In a spread illuminating apparatus, at least one point light source is disposed at an end wall of an outer frame member, and a subassembly is constituted by a light conductor plate and an inner frame member via first joint means. The subassembly has interface surfaces to make contact with the end wall of the outer frame member, a light inlet face of the light conductor plate is positioned to recede from the interface surface by a predetermined dimension, the first joint means each includes a elastic member to press the light conductor plate toward the interface surfaces, and the subassembly is jointed to the outer frame member via second joint means each constituted by an elastic member to press the interface surfaces toward the end wall of the outer frame member.

Abstract: A safety system for mining equipment is provided having a proximity-based system with a marker field generator in an explosion-proof housing. The generator has a resonant circuit with an inductive reactance that is provided by a ferrite rod wound with an electrical conductor. Also provided is an RF receiver to receive information about the strength of the generated marker field from a sensing device used by a worker. The system provides for a personal alert device, carried by personnel to be kept at a safe distance from the mining machine, the personal alert device being capable of detecting the marker field. Also disclosed is a geosteering system that stops the cutting of a continuous miner when the cutter reaches an interface between a mineral being mined and an adjacent formation that is not to be mined.

Abstract: An optical module includes: an optical element; a support member for supporting the optical element; a lid member that seals the optical element with respect to the support member; a sealing member that is provided to bond the lid member with the supporting member; and a case with a lens provided such that the lens is disposed on an optical path of light oscillated by the optical element, wherein the case with the lens is opposed in an optical axis direction of light passing through the lens to and in contact with the supporting member.

Abstract: An optical conduction unit (U) has a configuration in which one portion (Sb) and another portion (58a) of an optical conduction body (5) are mated in mutually orthogonal x, y directions with first and second fitting means (64), (64a) of the first member (60A) of a reflector (6). A portion (65b) and another portion (65c) of the second member (60B) of the reflector (6) are mated in the x, y directions with the third and fourth fitting means (64b), (64c) of the first member (60A). With such a configuration, the reflector (6) and optical conduction body (5) can be reliably assembled so that they cannot be easily separated.

Abstract: A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.

Abstract: A concave curved surface 95 is formed on a light inputting surface 93 of a light emitting lens 43, and a convex curved surface 96 is formed on a light emitting surface 94. Only laser light close to an optic axis A is inputted to the concave curved surface 95, and a spread angle is enlarged, and thereby, it is possible to make intensity distribution more uniform, and to reduce an error on the occasion of comparing a received light amount of reflected light with a threshold value, and therefore, even if a light receiving surface is small, it is possible to detect an object with high accuracy.

Abstract: A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.

Abstract: An image sensor may be constructed as an imager die onto which is adhered an optical spacer. The imager die and optical spacer may be supported by a dam-and-fill construction which allows light to pass through the optical spacer and onto the imager die. The image sensor may generate control signals for use in a variety of automatic vehicle equipment controls and may be incorporated into an automotive vehicle such as by inclusion into a rearview mirror assembly.

Abstract: A sensor for detecting moisture on a pane includes a coupler having prisms arranged in coupling areas for coupling light from a transmitter into the pane at an input angle and prisms arranged in decoupling areas for decoupling light reflected from the pane to a receiver at a corresponding output angle. The prisms in the coupling areas have prism surfaces perpendicular to the input angle and the prisms in the decoupling areas have prism surfaces perpendicular to the output angle. Each prism includes a prism flank. The prism flanks in the decoupling areas may be arranged parallel to the output angle. Some of the prism flanks in the decoupling areas are opaque or roughened. Alternatively, some of the prism flanks in the decoupling areas are tilted from running parallel to the output angle. Alternatively, some of the prism flanks in the decoupling areas include at least one additional superimposed prism.

Abstract: A method and system for determining the lateral position of an edge of a web are disclosed. The system includes an array of light transmitting elements and a corresponding array of lenses and an array of light receiving elements and a corresponding array of lenses. The light transmitting elements are each paired with a light receiving element and the light transmitting elements each transmit a beam of light energy towards the corresponding receiving element. The beams of light can be occluded by a web passing between the transmitting elements and the receiving elements, thereby reducing the light received by the receiving elements. The receiving elements can generate a signal that is proportional to the amount of they receive, and a controller can be used to determine the lateral position of an edge of the web in response to the signals generated by the receivers. A compensation light beam can be employed to enable the controller to compensate for several factors that can affect measurement accuracy.

Abstract: An imaging device includes an image sensor provided at an imaging position of a photographing optical system, at least one optical element provided in front of the image sensor, a hermetically-sealing holding member which hermetically seals and integrally holds the image sensor and the optical element, a support member which supports the hermetically-sealing holding member and is prevented from tilting relative to an optical axis of the photographing optical system, and an angle-adjusting device which allows the hermetically-sealing holding member to tilt relative to the support member so as to change the tilt angle of the image sensor and the optical element with respect to the optical axis of the photographing optical system upon assembly.

Abstract: A photodetector module that can achieve impedance matching and power saving. A photodetector (11) and an amplifier (12) for amplifying an electric signal from the photodetector (11) are mounted on a stem (14). A dielectric plate (18) is arranged between the stem (14) and a flexible substrate (20). To transfer an electric signal from the amplifier (12) to the substrate (20), a lead pin (15d) is provided to pass through the stem (14) and the dielectric plate (18). The output of the amplifier (12) includes a capacitance component, and the output impedance of the amplifier (12) is higher than the impedance that matches with the substrate (20). Further, the thickness d of the dielectric plate (18) is such that the inductance component of the lead pin (15d) includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate (20) can be achieved.

Abstract: A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.

Abstract: An improved packaging module of an optical sensor includes a circuit board and an optical sensor module. The optical sensor module comprises a linear optical sensor, and an illuminating unit respectively electronically connected with the circuit board, and a second protective body packaging the linear optical sensor and the illuminating unit. A first protective body covers the linear optical sensor and illuminating unit, the second protective body defines a first aperture corresponding to the linear optical sensor and a second aperture corresponding to the illuminating unit. A first light pipe set at the first aperture and a second light pipe set at the second aperture, the linear optical sensor, illuminating unit, first protective body and second protective body are combined integrally, which makes the packaging module process simple, adjustment of the optical sensor module's components achieved automatically, and the space of the optical sensor is reduced.

Abstract: A first housing is provided so as to be able to rotate with respect to a second housing and a first and second openings are provided in the first housing. Within the first housing are provided an image pickup device having a plurality of photosensitive elements therein arranged on one face of a transparent substrate, a surroundings imaging lens system fixed to the first opening and disposed on the side of the transparent substrate of the image pickup device, a fiber collection member fixed to the second opening and bonded to the side of the photosensitive elements of the image pickup device via an adhesion layer, and a light emitting element. In addition, a light absorbing face is formed in a surface of the second housing, which becomes in contact with the first housing.

Abstract: An optical sensor includes a light receiving device disposed in a housing, an exterior filter rotatably mounted to an attachment surface of the housing, and a light intercepting member which rotates along with a rotation of the exterior filter to adjust an amount of light incident on a light receiving surface of the light receiving device. In this optical sensor, the light intercepting member has a rotary shaft fixed at its center, and has a light adjusting mechanism for adjusting the amount of light incident on the light receiving surface of the light receiving device in a range in a direction of rotation around the rotary shaft. Accordingly, the sensitivity of the optical sensor can be arbitrarily adjusted with a high accuracy.

Abstract: Methods and apparatus for evaluating the quality of a sample of a product, an ingredient, an environment or process by measuring multiple parameters thereof, including light emitted from a reacting sample containing ATP, ADP, alkaline phosphatase or other parameters such as pH, temperature, conductivity, reduction potential, dissolved gases, specific ions, and microbiological count. The apparatus comprises an integrated sample testing device used to collect a sample, mix reagents, react the sample, and collect it in a measurement chamber. The apparatus also comprises an instrument having a photon detection assembly for use with the sample testing device. The instrument can also comprise one or more sensing probes and a communication port to facilitate data collection, transfer and analysis.

Abstract: An optical cable backshell connector for an optical cable having a plurality of optical fibers and a protective jacket. The novel backshell connector includes a backshell housing secured to the protective jacket and a mechanism disposed within the housing for converting optical signals from the optical fibers into electrical signals. In an illustrative embodiment, the backshell includes a plurality of receiver subassemblies, each receiver subassembly adapted to receive an optical signal from one of the optical fibers and convert the optical signal to an electrical signal. The backshell also includes an electrical output connector adapted to output the electrical signals to an electronics module. In a preferred embodiment, each receiver subassembly includes a photodiode and a matching circuit integrated into a single package. An optical ferrule is attached to each fiber for coupling the fiber to the receiver subassembly.

Abstract: An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

Abstract: A sensor arrangement, in particular as part of a reflection light barrier, includes a carrier as well as a photodiode, a first light emitting diode for emitting a measuring light beam, and a second light emitting diode for emitting a reference light beam, in particular a reference light beam pulsed offset in time with respect to the measuring light beam, arranged on the carrier, and further includes a light permeable housing enclosing the photodiode and the two light emitting diodes. The second light emitting diode is arranged on the carrier and in the housing such that the reference light emitted by it is essentially not incident on the side of the photodiode but rather is reflected internally in the housing to be incident onto an upper surface of the photodiode.

Abstract: A camera module for capturing an image. The camera module including an image sensor including a die mounted on a substrate, a housing coupled with the substrate to substantially enclose the die, and a dust trap substance adhered to the housing configured to capture and maintain at least one dust particle to decrease movement of dust particles within the housing, which decreases a number of blemishes in the captured image.

Abstract: A solid state imaging device is constituted of an image sensor chip, a circuit board, and an electromagnetic-wave absorber formed of copper. The image sensor chip is constituted of a bare chip, a spacer, and a cover glass. First contact terminals are formed on the bare chip, and second contact terminals and GND wires are formed on the circuit board. When manufacturing, the image sensor chip is mounted at a predetermined position on the circuit board, and the first contact terminals and the second contact terminals are connected with bonding wires. The electromagnetic-wave absorber is formed to cover the bonding wires, while its end contacts to the GND wires.

Abstract: An outside rear-view mirror for a vehicle, which is designed to support an image-detector device is disclosed. The assembly comprises a casing with a reflector fastening device and a detector fastening device configured to mount either a first reflector installed over the detector fastening device, hiding them, or a second reflector, smaller than the first one, leaving the detector fastening device clear and available for the installation of the image detector device in operating conditions.

Abstract: An image sensing module includes: a substrate provided with at least two holes at corners and along edges thereof, a plurality of electrically conductive pads arranged in parallel along the edges of the substrate, a plurality of component mounting areas arranged in parallel on the substrate, a plurality of surface mounting components, each of which is mounted on each of the plurality of component mounting areas, an image sensing component mounted on the substrate and surrounded by the plurality of electrically conductive pads and the plurality of the component mounting areas, a cover provided with at least two positioning posts on one face thereof in correspondence with the holes to form a cavity enclosing the plurality of the electrically conductive pads and the plurality of the component mounting areas, the cover being further provided with at least two holes at corners and along edges on the other face thereof, a window fixed on the cover for isolating the module from its surroundings and allowing light to

Abstract: A shock-absorber structure is mounted in a scanning apparatus including a housing comprised of an upper case and a lower case, and a window transparent board clamped into the lower case. The shock-absorber structure is placed within a slot of the lower case where is clamped a side portion of the window transparent board, and comprises a plurality of resilient elements. The resilient elements are oppositely placed in abutment manner between an inner surface of the slot and the side portion of the window transparent board. The resilient elements respectively have different length so that a multi-stage shock absorption is achieved when the window transparent board successively presses on the resilient elements of different lengths. Collision damages are of the window transparent board thereby prevented.

Abstract: A lens-equipped light-emitting diode device of the present invention includes a lead frame in which an electrode is formed, a light-emitting diode which is mounted on the electrode of the lead frame, an outer peripheral unit which is made of a first resin, which is provided on the lead frame, and in which a hollow portion is formed while an area including at least the light-emitting diode is exposed in the outer peripheral unit, a sealing portion which is made of a second resin filled in the lead frame of the hollow portion of the outer peripheral unit, and which seals the light-emitting diode, and a lens unit made of a third resin laminated and filled in the sealing portion.

Abstract: An optical sensor with an upper surface having a photoelectric conversion device area and connection pads connected to the photoelectric conversion device area thereof; a semiconductor structure which has a plurality of electrodes for external connection; an insulating layer formed on the periphery of the semiconductor structure; and a first wiring formed on at least one of the semiconductor structure and the optical sensor and connecting at least one of the electrodes for external connection of the semiconductor structure to one of the connection pads of the optical sensor.

Abstract: The present invention relates to a photo radiation intensity sensor (1) comprising a housing (2) having a lens (4), and a printed circuit board (7) placed in such way in the housing (2) that one of its edges (37) faces the lens (4), where at least a first and a second sensing element (5a, 5b) are placed at a first side (7?) of the printed circuit board (7), where the first and second sensing elements (5a, 5b) are separated by a first flange (8), serving as a shading element. Further, at least a third sensing element (5?; 5c) is placed at a second side (7?) of the printed circuit board (7), arranged to detect both the direction and the intensity of the radiation source and for producing corresponding output signals. The present invention also relates to a calibration and measurement method.

Abstract: An optical microbench configured to facilitate wafer-level testing of opto-electronic devices is provided. The optical microbench includes an optoelectronic device mounted to a wafer in which the optical microbench is provided. The optical microbench also includes a beam deflector provided in the wafer and disposed along the optical path of the optoelectronic device. The beam deflector is configured to deflect a portion of the optical path to lie along a direction oriented out of the plane of the wafer. The optical microbench further includes an optical feed-through disposed along the optical path between the optoelectronic device and the beam deflector. The optical feed-through is configured to conduct an optical signal between the beam deflector and the optoelectronic device. A method for testing optoelectronic devices at the wafer level is also provided.

Abstract: A motion-activated light fixture having an aimable motion detector with a zonal configuration providing improved monitoring of the region behind the motion detector. In one embodiment the motion detector defines a first plurality of generally forward-looking detection zones for monitoring the region in front of and to the sides of the motion detector, the forward-looking detection zones having a side-to-side coverage angle of at most 180 degrees and having forward zones for monitoring the far region in front of the motion detector. A second plurality of detection zones for monitoring the region behind the motion detector forms a zonal pattern angulated with respect to the zones of the first plurality monitoring the far region. At least some of the detection zones of the second plurality extend generally in the backward direction although in some embodiments the motion detector head must be tilted down through a pre-established offset angle before the angulated zonal pattern begins to look backward.

Abstract: An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.

Abstract: A combination socket and photosensor for measuring and adjusting intensity of a lamp in the socket of the combination socket and photosensor. A socket receives and electrically communicates with the lamp. A photosensor is operatively connected to the socket and measures the intensity of the lamp. A controller electrically communicates with the lamp and the photosensor and contains a feed back loop. The feed back loop electrically communicates with the photosensor and the lamp and compares the intensity of the lamp to a predetermined value and adjusts the intensity of the lamp accordingly.

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract: The present invention is directed to a spectrometer in which the electrical and optical components are connected to one another in a compact construction. A minimal expenditure on assembly and adjustment is achieved through a small quantity of individual parts. The compact spectrometer comprises an entrance slit, an imaging grating, one or more detector elements in rows or matrices, and elements of a controlling and evaluating unit. The detector elements and the entrance slit are arranged on a shared support, the elements of the controlling and evaluating unit being arranged on the free surfaces of the support. The entrance slit and the detector elements and the imaging spherical grating recessed into the spectrometer housing are arranged symmetric to an imaginary center axis of the support. Due to its compact size and the minimized expenditure on adjustment and assembly for its manufacture, the inventive spectrometer has numerous applications.

Abstract: There is described an optical radiation sensor device for detecting radiation in a radiation field. The device comprises a sensor element capable of detecting and responding to incident radiation from the radiation field and a radiation window interposed between the sensor element and the radiation field. The radiation window comprises a non-circular (preferably square) shaped radiation transparent opening. The optical radiation sensor device can be used in a so-called dynamic manner while mitigating or obviating the detection errors resulting from the use of a circular-shaped attenuating aperture and/or angular (even minor) misalignment of the sensor device with respect to the array of radiation sources when multiple such circular-shaped attenuating apertures are used.

Abstract: A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal lengths. The microlenses are arranged in arrays for use in imaging devices.

Abstract: An angular position measuring device includes two assemblies. The first assembly is rotatable with respect to the second assembly about an axis. A coupling is arranged at the second assembly, which has an elastic spring behavior in the direction of the axis. Furthermore, a stopping element is assigned to the angular position measuring device. The angular position measuring device is attachable to a machine part. If coupling is not prestressed, there is a free gap between the machine part and the second assembly, having an extension in the direction of the axis. The stopping element is able to be brought into a stopping position in which at least one region of the stopping element is in operative connection to the second assembly for the limitation of the axial spring motions. A measuring system includes such an angular position measuring device.

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract: A Pb plate and a base board loading electronic components such as a signal processing circuit and a power supply circuit are disposed on a case side so as to decrease the weight and the thickness of a sensor section. Besides, the case has a mechanical strength enough to support the active matrix substrate without deformation. Further, a small-signal amplifier control substrate and a gate driver control circuit substrate are inserted inside the case through slits and electrically connected to the electronic components loaded on the base board.

Abstract: In the optical element fixing method, when optical element 10 is adhesively fixing member 20 by using the optical-curing adhesive, the optical-curing adhesive is applied on at least one of the adhesion sections of the optical element and the adhesive section of the fixing member, and the optical-curing adhesive is irradiated with the light from the light source through the loading jig while the load is being applied to the adhesion fixing section through loading jig 31 made of light-transmissive material.

Abstract: The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in order to envelop the light-sensing chip. Thereby, the present invention not only can clean pollutants completely and promote the yield, but also can reduce the packaging area. In the present invention, the engagement portions may also be formed on the substrate and the light transparent cover so that the alignment can be undertaken easily.

Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Abstract: The invention relates to a semiconductor device (10) comprising a semiconductor element (1), particularly a solid-state image sensor (1), comprising a semiconductor body (11) of which one surface comprises an optically active part (1A) and an optically inactive part (1B) within which electrical connection regions (2) of the optoelectronic semiconductor element (1) are present, while a body (3) is present above the optically active area (1A) of the surface of the semiconductor body (11) comprising an optical component (3B). According to the invention the body (3) comprises an optically transparent foil (3) which is present on the optically active part (1A) of the surface of the semiconductor body (11) and which is attached thereto with an optically transparent adhesive layer (4) and in which the optical component (3B) is formed. The device (10) is very stable, compact and easy to manufacture, that is to say in batches.

Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Abstract: Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.

Abstract: A method and system for tracking attitude of a device includes fixing a two-dimensional array of photosensors to the device and using the array to form a reference frame and a sample frame of images. The fields of view of the sample and reference frames largely overlap, so that there are common imaged features from frame to frame. Sample frames are correlated with the reference frame to detect differences in location of the common features. Based upon detection of correlations of features, an attitudinal signal indicative of pitch, yaw, and/or roll is generated. In the preferred embodiment, the attitudinal signal is used to manipulate a screen cursor of a display system, such as a remote interactive video system (RIVS). However, attitudinal tracking using the invention may be employed in other applications.