Abstract: A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

Abstract: A size reduced solid-state imaging apparatus may be provided. The solid-state imaging apparatus may include a wiring substrate having a body having a cavity on an area which a semiconductor chip may be mounted, a lead that may project inward into the cavity from the internal side of the body, and/or a tie bar.

Abstract: The present invention provides a pseudospark switch that overcomes the aforementioned limitations of existing pseudospark switches and proved e-beams for applications such as FELs, pulsed lasers, X-ray machines, and radar. The improvement in e-beam quality is obtained by inductively ionizing gas inside the hollow cathode chamber (HCC), prior to main gap breakdown using a HCC that incorporates a spiral induction coil. The gas in the hollow cathode chamber is ionized by the discharge of an auxiliary capacitor bank through the spiral coil that forms the back surface of the HCC.

Abstract: A detector having a field of view in elevation on the order of one hundred eighty degrees in one plane and three hundred sixty degrees in a perpendicular plane includes a generally hemispherical lens in combination with an optical frustum. The combination directs incident radiant energy within the field of view onto a centrally located sensor.

Abstract: An optical module includes a first optics group, a second optics group, and an image sensor, wherein the first optics group and second optics group are configured to provide an image having a focus and a magnification to the image sensor. In some embodiments of the present invention, a first optics assembly includes a first optics group coupled to a threaded portion of a first lead screw so that translation of the first lead screw results in translation of the first optics group along an axis of the first lead screw, a first actuator for rotating the first lead screw; and a first sensing target configured to permit detection of rotation of the first lead screw.

Abstract: The direct deposit of photoelectric materials onto low-cost prefabricated patterned flexible electrodes provided by the present invention introduces a new design approach that permits the development of innovative lightweight, durable and non-planar sensing systems. By extending single and multi-spectral bioelectronic sensing technology to flexible plastic substrates, the invention offers a number of potential advantages over structurally rigid silicon-based microelectronics (e.g. CMOS) including a reduction in spatial requirements, weight, electrical power consumption, heat loss, system complexity, and fabrication cost.

Abstract: An image pick-up element 1 is mounted on an element mounting part 7 formed with a member whose thermal conductivity is higher than that of an element storing part 3. Inputting and outputting pins 5 for electrically connecting the image pick-up element to a control circuit board 13 for controlling the image pick-up element are provided in a direction that does not interfere with the contact part of the element mounting part 7 and a heat absorbing mechanism 8. Thus, the thermal conductivity of the image pick-up element and the heat absorbing mechanism can be improved and the area of a heat absorbing part can be increased. As a result, the cooling capability of the element is increased so that the image pick-up element can be driven under a condition at higher speed than usual.

Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Abstract: This disclosure describes a temperature controlled photodetector. The disclosed detector can reach a temperature at which responsivity is maximized within a short time and with little wasted power. Furthermore, the photodetector prevents thermal gradients from developing across the detector so that the whole detector region has equivalent responsivity.

Abstract: The present invention provides an image sensor module. The image sensor module has a die formed on a substrate, the die having a micro lens area, a lens holder formed on the substrate and over the die, a lens formed in the lens holder. A filter is formed within the lens holder and between the lens and the die, and at least one passive device formed on the substrate and covered within the lens holder. Conductive bumps or LGA (leadless grid array) are formed on the bottom surface of the substrate.

Abstract: A sunlight-detecting sensor for vehicles is provided including a housing mountable on an inside of either a front window or a rear window. A sunlight sensor is provided on a top of the housing. The sunlight sensor includes a first sensor, a second sensor and a sensor holder. There is a printed circuit board (PCB) mounted between the sunlight sensor and the housing to transmit electrical signals that are proportional to an amount of sunlight measured on the sunlight sensor. There is cover made of transparent material and mounted on the top of the housing, and a blocker provided on the cover between the first and second sensors and inducing differences in amounts of sunlight measured by the first and second sensors when a position of sun is changed by a certain angle from a center of the sensors.

Abstract: In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

Abstract: A transmissive optical encoder is disclosed. The transmissive optical encoder includes a detector, a code wheel, and an emitter. The detector includes an aperture through the detector. The aperture is configured to receive a rotary shaft of a motor. The code wheel is coupled to the rotary shaft of the motor. Rotation of the rotary shaft results in corresponding rotation of the code wheel. The emitter is configured to emit a light signal through the code wheel toward the detector. Rotation of the code wheel results in modulation of the light signal at the detector. Embodiments of the transmissive optical encoder consume relatively little space and facilitate alignment of the emitter and detector.

Abstract: A solid state imaging device having an image area in which a plurality of light receiving pixels is arranged on a semiconductor substrate of a first conductive type is disclosed. The device includes: a plurality of photosensor parts formed by providing on the semiconductor substrate a light receiving area and a photoelectric conversion area both configuring the light receiving pixel; a first well region formed on the opposite side of the light receiving area, having a second conductive type opposite to the first conductive type, and forming an overflow barrier; a second well region of the second conductive type formed in an area except a place corresponding to the photosensor part on the opposite side of the photoelectric conversion area; and a first conductive region formed in an area corresponding to the photosensor part on the opposite side of the photoelectric conversion area.

Abstract: In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.

Abstract: An optical navigator sensor for sensing an image of an object comprises a substrate, a laser diode, an optical sensor device and a housing. The optical sensor device and the laser diode are fixed on the base plate and covered by the housing. The housing guides the light emitted from the laser diode to the object and guides the light reflected from the object to the optical sensor device.

Abstract: A purpose of the present invention is to provide a photoelectric sensor and an emitting device for a photoelectric sensor which can improve resistance to liquids. A purpose of the present invention is also to provide a photoelectric sensor and an emitting device for a photoelectric sensor which can improve productivity.

Abstract: An image reader (A) includes a conductive case (1), a substrate (3) and a plurality of light receiving elements. The image reader (A) further includes a first electrode (10) formed at the case (1) and a second electrode (11) formed on the substrate (3). The case (1) is formed with an accommodation recess (1g), in which a conductive contact member (20) is provided. The conductive contact member (20) is held in contact with the first electrode (10) and the second electrode (11) to electrically connect the two electrodes to each other while separating the first electrode (10) and the second electrode (11) from each other.

Abstract: Microelectronic imagers with integrated optical devices and methods for manufacturing imagers. The imagers, for example, typically have an imaging unit including a first substrate and an image sensor on and/or in the first substrate. An embodiment of an optical device includes a stand-off having a compartment configured to contain the image sensor. The stand-off has a coefficient of thermal expansion at least substantially the same as that of the first substrate. The optical device can further include an optics element in alignment with the compartment of the stand-off. The stand-off can be formed by etching a compartment into a silicon wafer or a wafer of another material having a coefficient of thermal expansion at least substantially the same as that of the substrate upon which the image sensor is formed. The optics elements can be formed integrally with the stand-offs or separately attached to a cover supported by the stand-offs.

Abstract: A photocontrol device includes a housing assembly and a flexible circuit board assembly. The housing assembly defines an enclosure cavity. The flexible circuit board assembly includes a flexible substrate and a photocontrol circuit mounted on the flexible substrate. The circuit board assembly is disposed in the enclosure cavity in a bent position.

Abstract: Eyewear having radiation monitoring capability is disclosed. Radiation, such as ultraviolet (UV) radiation, infrared (IR) radiation or light, can be measured by a detector. The measured radiation can then be used in providing radiation-related information to a user of the eyewear. Advantageously, the user of the eyewear is able to easily monitor their exposure to radiation.

Abstract: A photoelectric conversion element unit for use in an imaging apparatus including a photoelectric conversion element package containing a photoelectric conversion element, a wiring substrate where the photoelectric conversion element package is mounted on the first surface and an electronic component related to the photoelectric conversion element is mounted on a rear side of the first surface, and a support board attached to an attachment point in the imaging apparatus where the photoelectric conversion element package is fixed, wherein an opening smaller than an external form of the photoelectric conversion element package is formed in the support board, and the electronic component mounted on the wiring substrate is provided within the opening.

Abstract: Methods and apparatus for evaluating the quality of a sample of a product, an ingredient, an environment or process by measuring multiple parameters thereof, including light emitted from a reacting sample containing ATP, ADP, alkaline phosphatase or other parameters such as pH, temperature, conductivity, reduction potential, dissolved gases, specific ions, and microbiological count. The apparatus comprises an integrated sample testing device used to collect a sample, mix reagents, react the sample, and collect it in a measurement chamber. The apparatus also comprises an instrument having a photon detection assembly for use with the sample testing device. The instrument can also comprise one or more sensing probes and a communication port to facilitate data collection, transfer and analysis.

Abstract: A rearview assembly of the present invention may include a housing adapted to be mounted to the vehicle, a rearview element disposed in the housing for providing an image to the driver of the rearward view from the vehicle, and a glare sensor positioned to receive light from passing through the rearview element. The glare sensor may be a surface-mounted to a circuit board. An optional secondary optical element may be disposed between the rearview element and the glare sensor. The optional secondary optical element may have an anamorphic lens for providing different fields of view horizontally versus vertically.

Abstract: A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.

Abstract: Methods of forming a filtered photosensor include providing a photosensor and an infrared blocking ink. The infrared blocking ink is printed on the photosensor. Printing the infrared blocking ink may include dipping the photosensor in the infrared blocking ink or spraying and/or brushing the infrared blocking ink on the photosensor. Photo control devices including a photosensor with an infrared blocking ink thereon are also provided.

Abstract: In an optical encoder comprising an optical scale in which a light transmission portion and a light non-transparent portion are arranged and an output pattern obtained by emitting an incident light functions as an optical code, a light source portion and a light detecting portion, the light non-transparent portion is constituted of at least one pair of inclined surfaces which are opposed in such a manner as to become farther away from each other towards the side where the incident light enters and set so that an incident angle of the optical axis of the incident light from the light source should not be smaller than a critical angle of incidence, and the light non-transparent portion is constructed so that the incident light which enters one inclined surface should be totally reflected thereon to enter the other inclined surface and then at least part of the incident light should be reflected on the other inclined surface, and a reflected light which is reflected on the other inclined surface should not enter

Abstract: An accessory mounting system suitable for use in a vehicle includes an assembly adapted for releasable mounting to a receiving structure on the interior surface at a portion of the windshield of the vehicle. A light absorbing layer is at that portion of the windshield and at least partially hides the assembly from view by a viewer external the vehicle who is viewing through the windshield when the assembly is normally mounted to the receiving structure. The light absorbing layer includes a light transmitting portion. At least two accessories are housed by the assembly and one of the two accessories includes a forwardly-viewing camera that views through the light transmitting portion of the light absorbing layer at that portion of the windshield of the vehicle when the assembly is mounted to the receiving structure, and wherein the light absorbing layer comprises a ceramic frit layer.

Abstract: A light measuring apparatus includes a light source configured to emit light to a sample, and a light guide optics system configured to guide light generated as a result of applying the emitted light to the sample, to a photodetector, wherein the light guide optics system is provided in a lightproof unit, and includes optical elements for guiding the generated light to the photodetector, a positioning part for adjusting a position of at least one of the optical elements, and a position detecting part for detecting a position of at least one of the optical elements by an optical method, and the light measuring apparatus comprises a position adjusting part which adjusts the positions of the optical elements by controlling the positioning part and position detecting part, and a light emission control unit which controls operations of starting and stopping light emission of the position detecting part.

Abstract: Photonic crystal (PC) sensors, and sensor arrays and sensing systems incorporating PC sensors are described which have integrated fluid containment and/or fluid handling structures. Sensors and sensing systems of the present disclosure are capable of high throughput sensing of analytes in fluid samples, bulk refractive index detection, and label-free detection of a range of molecules, including biomolecules and therapeutic candidates. The present disclosure also provides a commercially attractive fabrication platform for making photonic crystal sensors and systems wherein an integrated fluid containment structure and a photonic crystal structure are fabricated in a single molding or imprinting processing step amendable to high throughput processing.

Abstract: A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.

Abstract: A sensor device includes a base wall, a plurality of sidewalls cooperating with the base wall to define a receiving space that has an open end, an emitter disposed in the receiving space and having an emitter element to emit a light signal, a receiver disposed in the receiving space and having a receiver element to receive the light signal, a cover body disposed in the receiving space between the emitter and the receiver, a ball chamber formed between inner surfaces of the base wall and the cover body, a ball member disposed movably in the ball chamber, an emitter light passage optically communicating with the ball chamber and the emitter, and a receiver light passage optically communicating with the ball chamber and the receiver. The cover body, the emitter, and the receiver cooperatively close the open end of the receiving space.

Abstract: A radiation detector comprising a plurality of detector elements (1, 2, 3) each having an active region (14, 24, 34) provided for radiation reception and for signal generation, the detector elements being monolithically integrated into a semiconductor body (5) of the radiation detector, a signal that is to be generated in a first detector element being able to be tapped off separately from a signal that is to be generated in a second detector element, and at least one of the active regions being designed for radiation reception in the visible spectral range.

Abstract: A compound-eye imaging device comprises: an optical lens array with integrated multiple optical lenses; a photodetector array for imaging images formed by the optical lenses; and a light shielding block placed between the two arrays for partitioning a space between the two arrays into a matrix of spaces as seen on a plane perpendicular to the optical axis of each optical lens so as to prevent lights emitted from the optical lenses from interfering each other. The light shielding block is formed of flat unit plates of two kinds having different thicknesses and stacked between the optical lens array and the photodetector array. Since the light shielding block is formed of stacked flat unit plates, it is easy to manufacture a light shielding block having apertures with dense structure having a small distance between adjacent apertures, and also easy to adapt to variations in focal length of the optical lenses.

Abstract: A system and/or a method for reads, measures and/or controls intensity of light emitted from a light-emitting diode (LED). The system and/or the method have a light intensity detector adjacent to the LED for reading and/or measuring the intensity of light emitted from the LED. The system and/or the method have a control circuit that may be electrically connected to both the detector and/or the LED for measuring and/or for controlling an intensity of light emitted from the LED. A housing surrounds the light detector and/or the LED. The housing has a pathway that allows only light emitted from the LED to reach the light detector. The LED has a finish and/or a coating that eliminates and/or retards absorption of light by internal components of the LED. The finish and/or the coating eliminates and/or retards reflection of the light by the LED.

Abstract: An assembly may include a wafer and a plate may be mounted on the wafer. The wafer may have image sensor chips and scribe lines demarcating each image sensor chip. The image sensor chip may include an active surface. Chip pads and a micro-lens may be provided on the active surface. A photo-sensitive adhesive pattern may be provided between the plate and a region of the active surface between the chip pads and the micro-lens. An image sensor device implementing an image sensor chip having an individual plate may also be provided.

Abstract: A scanner optical module has a single transmission axle used to support a scanning module (containing a traditional optical device or CIS). The scanning module has a plurality of protrusions (or rollers) slidably (or rotatably) contacting the transparent document platform (view). The scanner optical module has fewer assembled components, a simpler structure, a decreased material cost and production cost, and is modular.

Abstract: An imaging device module includes a circuit mounting layer; a bottom glass layer disposed above the circuit mounting layer; a silicon die disposed above the bottom glass layer; a top glass layer disposed above the silicon layer; and a lens holder disposed above the top glass layer. The silicon die includes an image sensor. The lens holder contains an optical component.

Abstract: A support structure which can hold an image reading apparatus in a vertically placed condition is provided. On a bottom portion of an apparatus main body 1 in such a horizontally placed condition that a document table glass 2 is installed nearly horizontally, a storage portion 1c for storing the support structure is provided, and support structures 31, 32, 33 are released from the storage portion and get into around the side of a document cover 6 and a hinge 7, from the bottom portion, and holds the apparatus main body 1 in a vertically placed condition.

Abstract: An optical disk apparatus includes a printed circuit board; a stator fixed on the printed circuit board; a rotor configured to receive an optical disk thereon, the rotor being rotated by an electromagnetic interaction with the stator; and a sensing part fixed on the printed circuit board and sensing a rotation of the optical disk. Here, the sensing part includes a sensor; a terminal connecting the sensor with the printed circuit board electrically; and a plastic mold fixing the terminal thereto. The optical disk apparatus has a reduced number of components to allow reduced production costs, and has a simple manufacturing process to allow reduced production times and defect rate.

Abstract: This solid-state imaging device comprises a rib integrally formed with a bottom plate. A case for accommodating a solid-state imaging device, which can suppress warping from occurring at the time of molding the case and is less deformable by heat at the time of mounting is provided. The solid-state imaging apparatus is less likely to cause readout errors and the like even when the temperature for use varies, and is highly reliable in operation.

Abstract: An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The chip is mounted on the upper surface, and is electrically connected to the first electrodes. The lens holder has an upper end face, a lower end face, and an opening penetrating through the lens holder. The upper end portion of the opening is formed with an internal thread, and the lower end portion of the opening is formed with a breach. The lens holder is adhered on the upper surface by glue. The photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.

Abstract: Microelectronic imagers with integrated optical devices and methods for manufacturing imagers. The imagers, for example, typically have an imaging unit including a first substrate and an image sensor on and/or in the first substrate. An embodiment of an optical device includes a stand-off having a compartment configured to contain the image sensor. The stand-off has a coefficient of thermal expansion at least substantially the same as that of the first substrate. The optical device can further include an optics element in alignment with the compartment of the stand-off. The stand-off can be formed by etching a compartment into a silicon wafer or a wafer of another material having a coefficient of thermal expansion at least substantially the same as that of the substrate upon which the image sensor is formed. The optics elements can be formed integrally with the stand-offs or separately attached to a cover supported by the stand-offs.

Abstract: A photodetector and method for making the same are disclosed. The photodetector includes a photodetector die mounted on a substrate, an infrared filter, and an encapsulating layer. The infrared filter is positioned over the photodetector, the infrared filter blocking light in an infrared region of the optical spectrum while allowing light in a visible region of the optical spectrum to reach the photodetector die. The encapsulating layer surrounds the photodetector and the substrate, the infrared filter being embedded in the encapsulating layer, which is transparent to light in the visible region.

Abstract: A non-planar frame base for an image sensor.

Abstract: A positioning device includes a housing and a shaft that is able to swivel relative to the housing and at one end of which an element to be positioned is attachable. The positioning device further includes a roller-bearing unit for supporting the shaft with respect to the housing, a swivel drive and a position-measuring device. The shaft is arranged in a manner that it is torsionally stiff, but axially movable relative to the housing via a ring diaphragm secured to the roller-bearing unit and to the housing.

Abstract: An adjustable shroud for use with a detector having an aperture for detecting electromagnetic radiation. The adjustable shroud includes a base element, a cover element and a directional shroud. The cover element and the directional shroud may be adjusted over an aperture of a detector to increase and/or decrease a detection field associated with the detector. The user is easily able to configure the adjustable shroud to block a portion of a detection field associated with the detector to eliminate unwanted environment factors.

Abstract: Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Abstract: A system is provided to monitor a structure within an outer casing of a gas turbine engine. The system may comprise an optical fiber bundle, a fiber bundle palette and a camera palette assembly. The optical fiber bundle may have first and second ends. The first end is adapted to pass through a bore in the outer casing of the gas turbine engine so as to be positioned adjacent the structure within the gas turbine engine casing to be monitored. The fiber bundle palette is adapted to be located outside of the engine casing to receive the second end of the optical fiber bundle. The camera palette assembly comprises a fixture movable relative to the fiber bundle palette and a first camera mounted to the fixture. The first camera is adapted to be positioned adjacent to the second end of the optical fiber bundle so as to receive electromagnetic radiation received by the first end of and transmitted through the optical fiber bundle.