Abstract: An imaging element includes a plurality of pixels that are two-dimensionally arranged and each have a light receiving part including a photoelectric conversion element and a light collecting part that collects incident light toward the light receiving part. Each of the light collecting parts in the plurality of pixels includes an optical functional layer having, in a surface, a specific projection and depression structure depending on the pixel position.

Abstract: Electronic devices may include light sensors. A light sensor may be an ambient light sensor that is mounted adjacent to an aperture in an opaque structure. An ambient light sensor may include active light sensor elements located adjacent to the aperture and inactive light sensor elements located adjacent to the opaque structure. Signal processing circuitry may be interposed between the light sensor elements and a summing circuit that sums light signals from the light sensor elements to form an ambient light signal. The signal processing circuitry may include a switch and an amplifier associated with each light sensor element. The switch associated with each element may be used to selectively activate or inactivate that element. The amplifier associated with each element may be used to amplify the light signal from that element by a gain factor that depends on the location of that element with respect to the aperture.

Abstract: Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.

Abstract: A semiconductor module including a semiconductor chip having a light receiving device formed at a front thereof and a light permeable cover having a front, a back, and a side. The light permeable cover is disposed opposite to the front of the semiconductor chip such that the front of the semiconductor chip is covered by the back of the light permeable cover. The light permeable cover is provided at the outer circumferential region of the front thereof and at the side thereof with a light shielding layer. It is possible to prevent the incidence of unnecessary light from the side of the light permeable cover of a CSP and to easily adjust the distance between a lens and the front of the semiconductor chip within tolerance.

Abstract: In some applications, it may be desirable to position multiple photodetectors at precise locations on a curved focal surface defined by an optical system. To achieve this positioning, the photodetectors may be mounted at desired locations on a flexible substrate that is in a flat configuration. The flexible substrate with mounted photodetectors can then be shaped to substantially conform to the shape of the curved focal surface. This shaping can be accomplished by clamping the flexible substrate between at least two clamping pieces. The curved flexible substrate clamped between the at least two clamping pieces can be positioned relative to the optical system such that the photodetectors are positioned at desired three-dimensional locations on the curved focal surface.

Abstract: An imaging device support structure includes a master flange having an opening portion through which an optical axis A passes, an imaging device which is attached to the master flange via the attachment plate and is positioned in the opening portion as viewed in an optical axis A direction, and a shielding member which shields a gap between the master flange and the imaging device in the opening portion. The shielding member is pressed against the opening edge of the first opening portion. The opening edge of the first opening portion has a substantially polygonal shape with corner portions which outwardly protrude.

Abstract: An apparatus for optical signal detection may include a housing in which a channel may be defined to receive an optical fiber in a bent configuration. The channel may have a predetermined radius of curvature to cause optical energy to escape from the fiber when an optical signal is being conveyed in the fiber and be detected at a photodetector arranged at the predetermined radius of curvature.

Abstract: The present invention relates to a light sensor device comprising a substrate (18), a first light sensitive area (14, 15), and a second light sensitive area (12, 13). It is characterized in that a first optical filter device (22) assigned to said first area (14) and adapted to filter the visible light spectrum and a second optical filter device (24) assigned to said second area (12) and adapted to filter the non-visible light spectrum, preferably IR light spectrum, are provided, and said first and second light sensitive areas (12, 14) are fabricated on the same substrate (18) adjacent to each other to form a single integrated sensor component (10). The invention also relates to a lamp device (60) comprising such a light sensor device.

Abstract: An optical readhead for measuring a displacement along a measuring axis direction between the readhead and a scale track comprises an illumination portion configured to output source light to the scale track and a monolithic detector configuration. The monolithic detector configuration comprises: a first track photodetector portion configured to receive scale light from the scale track; a first metal layer; a second metal layer; and a plurality of dummy vias between the first metal layer and the second metal layer. The plurality of dummy vias is arranged to block light transmission along a layer between the first and second metal layers, and the plurality of dummy vias is formed by the same process steps used to fabricate a plurality of active vias used to connect circuit elements on the monolithic detector configuration.

Abstract: The present invention relates to an integrated key using an optical key, in particular, to an integrated key which enables a more subdivided manipulation for the movement to the outside based on a center point, and to perform the operation of rotation and push. An integrated key using an optical sensor of the invention includes a housing which has an accommodation space inside while an upper portion is open; an operation member which has a guide unit which sticks to the housing between an upper end and a lower end of the operation member while a handle is formed in an upper side and a reflection unit is formed at a bottom surface; and an optical sensor which measures one or more of a separation distance with the reflection a rotation of the operation member, and a location coordinate value of the operation member, and outputs a sensing signal according to the measurement.

Abstract: A coating and method of making, using, and applying the coating to protect structures from scratches and/or the undesired collection of slag and/or spatter associated with metal working processes. The coating includes a base layer and a top layer that, when applied, mitigate adhesion of weld slag to the underlying structure. The coating is also transparent such that it does not interfere with the functionality of any indicia associated with the underlying structure or device and also renders the coating suitable for use with photo-reactive or responsive sensors and/or other non-opaque structures—such as goggles, facemasks, and/or shields.

Abstract: A gesture sensing device includes a single light source and a multiple segmented single photo sensor, or an array of photo sensors, collectively referred to herein as segmented photo sensors. A light modifying structure relays reflected light from the light source onto different segments of the segmented photo sensors. The light modifying structure can be an optical lens structure or a mechanical structure. The different segments of the photo sensor sense reflected light and output corresponding sensed voltage signals. A control circuit receives and processes the sensed voltage signals to determine target motion relative to the segmented photo sensor.

Abstract: A method of packaging imager devices and optics modules is disclosed which includes positioning an imager device and an optics module in each of a plurality of openings in a carrier body, introducing an encapsulant material into each of the openings in the carrier body and cutting the carrier body to singulate the plurality of imager devices and optics modules into individual units, each of which comprise an imager device and an optics module. A device is also disclosed which includes an imager device comprising a plurality of photosensitive elements and an optics module coupled to the imager device, the optics module comprising at least one lens that, when the optics module is coupled to the imager device, is positioned a fixed, non-adjustable distance from the plurality of photosensitive elements.

Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.

Abstract: Reference cell (8) for use with a fiber optic probe (1) comprising a base wall (11), upstanding walls (12) each having an optical window (13, 15), and a top wall (14) having a further optical window (16) adapted to allow light to pass to and from a fiber optic probe. The base wall (11) comprises a reflector (19) which reflects incident light from the fiber optic probe back to said probe (1). The top wall (14) has an attachment for receiving an emitting and a receiving end of a fiber optic probe (1). The cell (8) allows use of standard fiber optic probe (1) with other optical equipment when the path length and the probe optical characteristics require validation to international standards. The calibration of the probe (1) is analogous to calibration of laboratory spectrophotometers and can therefore be validated. The device (8) enables probes (1) to be used for applications where precision and accuracy are essential.

Abstract: According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.

Abstract: An optical package having a removably attachable cover and a body is disclosed. The body comprises a ridge whereas the cover comprises a ridge opposing structure. The cover may be form-fitted onto the body defining therein a compartment for receiving an optical sensor. The optical sensor may receive light from an aperture located on the cover. The cover may be secured onto the body through an interlocking structure. Depending on the application, the optical package may further comprise a radiation source, and/or an additional compartment for the radiation source. The optical package may be suitable for navigation sensors, proximity sensors, ambient optical sensors or any other optical devices.

Abstract: An optical connector includes a circuit board, at least one light emitter, at least one light receiver, a shell, and at least two enhancing pins. The circuit board includes a mounting surface. The at least one light emitter and at least one light receiver are mounted on the mounting surface. The shell covers the at least one light emitter and the at least one light receiver. The at least two enhancing pins passes through the shell and are received in the circuit board to fix the shell on the mounting surface.

Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Abstract: An encoder includes a slit array along a first measurement axis, and an optical module capable of relatively moving with respect to the slit array. The optical module comprises a point light source that irradiates the part of the slit array, and a light receiving array comprising a plurality of light receiving elements along a second measurement axis and arranged in positions offset with respect to the point light source. The light receiving elements is receiving light irradiated from the point light source and reflected from the reflection slit. The plurality of light receiving elements comprises respective shapes such that the light receiving element nearer to the point light source comprises a shorter length in a width direction and end parts on an opposite side of the light receiving element with respect to the point light source are arranged side by side in positions along the second measurement axis.

Abstract: Electronic devices may include light sensors. The light sensors may include alignment features. The light sensors may be optically aligned with an aperture in an opaque structure. The opaque structure may be formed from an opaque material or a transparent material with an opaque coating. The light sensor may be mounted in a support structure that has been optically aligned with the aperture. The light sensor or the support structure may include extended portions that are transparent to ultraviolet light. Ultraviolet light may be transmitted through the extended portions to cure adhesive that attaches the light sensor or the support structure to the opaque structure. The light sensor may be optically aligned with the aperture by viewing the aperture through an opening in the support structure, by viewing the alignment features on the light sensor through the aperture or by gathering alignment data using the light sensor during alignment operations.

Abstract: A photoelectric conversion module includes a transmission side photoelectric conversion part for converting an electrical signal into an optical signal, a transmission side circuit board on which the transmission side photoelectric conversion part is mounted on a top surface side of the transmission side circuit board, a reception side photoelectric conversion part for converting an optical signal into an electrical signal, a reception side circuit board on which the reception side photoelectric conversion part is mounted on a top surface side of the reception side circuit board, and a housing. The transmission side circuit board and the reception side circuit board are placed such that a back surface of the transmission side circuit board is opposite to the housing and a back surface of the reception side circuit board is opposite to the housing.

Abstract: A sensor package includes a radiation source and a radiation detector provided on a substrate. A cover member is mounted on or affixed to the substrate over the source and detector. The cover member includes an opaque housing, a first transparent portion provided over the source, a second transparent portion provided over the detector and a transparent insert within the housing and positioned at one of said transparent portions. An opaque protrusion is provided on the housing separating a region associate with the first transparent portion (and radiation source) from a region associated with the second transparent portion (and detector), the protrusion attached to a surface of the substrate.

Abstract: A blade tracking system including a detector having one or more sensors to detect radiation from at least one field of view of the detector, the one or more sensors generating signals based on changes in incident radiation to the one or more sensors as a rotor blade passes the field of view, and a processor to determine a pass time for the rotor blade to pass through the at least one field of view based on the generated signals.

Abstract: An image sensor having a semiconductor substrate, at least two photosites in the substrate and an isolation region between the photosites. The isolation region has a first trench covered by a thin electrically insulating liner and filled with an electrically conductive material, the conductive material has a second trench at least partially filled with an optically isolating material.

Abstract: A display system can include a transparent layer. The transparent layer can include a front and a back. A bevel region can extend from the transparent layer. A panel can be on the back of the transparent layer. A three dimensional optical sensor can be on the back of the bevel region.

Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.

Abstract: An image sensor includes a ceramic base with a cavity therein, the ceramic base including a sidewall forming a conductive layer embedded therein. A protrusion extends from the sidewall toward the center of the cavity. An infrared filter is mounted on the upper surface of the protrusion with a most upper surface of the infrared filter not higher than the upper surface of the ceramic base; and an image unit is mounted on the lower surface of the protrusion with a most lower surface not lower than the lower surface of the ceramic base.

Abstract: Exemplary embodiments can be used in a replicating system to guide source electromagnetic waves, such as infrared (IR) radiation, from an emitter of a reflective-type sensor towards an object held on a support mechanism and to guide reflected electromagnetic waves that are related to the source electromagnetic waves to a receiver of the reflective-type sensor. The height of the support mechanism can be adjusted based on whether the object is detected.

Abstract: Disclosed is a camera module. The camera module includes a lens assembly including a wafer level optics lens (WLO), and a sensor assembly on which the lens assembly is mounted through a surface mount technology (SMT). In the camera module, a lens is directly mounted on a sensor die through the SMT, so that the manufacturing process can be simplified and the manufacturing cost can be reduced. A height of the camera module is lowered, so that a slim camera module can be realized.

Abstract: A packaged optical device includes a package frame having a compartment and an opening, a sensor chip bonded in the compartment, and a non-lens transparency layer embedded in the package frame at the opening and sealing up the opening. This package structure could prevent the sensor chip from adhesion of suspended particles or other contaminations, and simply the assembly process, thereby improving reliability and reducing cost of the packaged optical device.

Abstract: This invention advances the related state-of-the-art by eliminating the physical EO window used by electro-optical imaging infrared seekers for tactical missiles and high-altitude endo-atmospheric interceptors, widely employed in integrated defense systems. This invention increases the probability of intercepting exo-atmospheric ballistic warheads by exo-atmospheric interceptors, and eliminates the existing altitude “gap” of interception, as well as the geographical limitations posed by the mesospheric Noctilucent Clouds. The problem of protecting an imaging EO sensor from aeroheating is solved in this invention by a special purpose device which is enabled immediately after the nose cone ejection event.

Abstract: A detector assembly includes a cap assembly configured to close an end of a detector housing that is configured to contain a sensor therein, the cap assembly has a radially expandable member configured to expand radially within the detector housing and lock the position of the cap assembly relative to the detector housing.

Abstract: An imaging module for imaging, and a reader for and a method of electro-optically reading, a target, include a support, an imaging assembly including a solid-state imager having an array of image sensors on the support for capturing return light over a field of view at a range of working distances from the target along a folded imaging path, and an illuminating assembly on the support for directing illumination light along a folded illuminating path having a length longer than the folded imaging path to uniformly illuminate the target with the illumination light. The longer length of the folded illuminating path enables the illuminating assembly to illuminate the target with more of the illumination light, and also enables the imaging assembly to capture more of the return light for increased imaging/reading performance.

Abstract: A proximity sensor is disclosed. The proximity sensor may be incorporated as part of a water delivery device. A holder which aligns an optical source and sensor of the proximity sensor is disclosed.

Abstract: A leadframe based photovoltaic assembly and method for assembling the same is disclosed. The photovoltaic assembly comprises a first and second mold compounds to effectuate the accurate placement of an optical concentrator above a photovoltaic cell. The photovoltaic assembly is able to be assembled using existing mature semiconductor packaging technologies.

Abstract: An apparatus, system, and method for emission filter. A filter apparatus is presented. In one embodiment, the filter apparatus may be adapted for fluorescence spectroscopy. In a particular embodiment, the filter apparatus comprises a solution. The solution may include a polar protic solvent and an absorbing specimen. Additionally, the filter apparatus may include an adhesive to conform the solution into a solid filter.

Abstract: Described is a radiation dosimeter including multiple sensor devices (including one or more passive integrating electronic radiation sensor, a MEMS accelerometers, a wireless transmitters and, optionally, a GPS, a thermistor, or other chemical, biological or EMF sensors) and a computer program for the simultaneous detection and wireless transmission of ionizing radiation, motion and global position for use in occupational and environmental dosimetry. The described dosimeter utilizes new processes and algorithms to create a self-contained, passive, integrating dosimeter.

Abstract: An FOT module is provided that has a molded cover in which an optical beam transformer is integrally formed. The molded cover includes at least a nontransparent molded part that is secured to a mounting structure, such as a molded leadframe or a PCB, on which at least one active optical device is mounted. The material of which the nontransparent molded part is made has a CTE that matches, or nearly matches, the CTE of the body of the mounting structure. Consequently, exposure of the FOT module to temperature variations will not result in delaminations at the interface of the mounting structure and the nontransparent molded part.

Abstract: The invention provides for a device comprising an apparatus comprising (a) a transmission grating capable of diffracting a photon beam into a diffracted photon output, and (b) an image detector capable of detecting the diffracted photon output. The device is useful for measuring the spatial profile and diffraction pattern of a photon beam, such as a vacuum ultraviolet (VUV) beam.

Abstract: A parallel transceiver includes a constructed array of dice. The constructed array comprises an integer number of dies that each have an integer number of optoelectronic devices arranged on the die. Each die forming the constructed array is attached to a respective tab of a shim that is fixed to a first lead frame. Each tab includes a bridge region and a mounting region. Each die is attached to a respective mounting region of a corresponding tab. When necessary, a laser hammering technique is performed whereby laser generated energy is applied along an axis in the bridge region of the shim to adjust the position of the optoelectronic devices on the die attached to the tab in one or more directions relative to the axis.

Abstract: A projector apparatus includes: an air intake port taking external air into the body of the apparatus; a duct guiding the external air taken in through the air intake port; a filter horizontally disposed in the duct; and a fan supplying the external air to a heat-generating part from underneath after the external air passes through the filter.

Abstract: An optoelectronic position measurement device having a code carrier that carries at least one optically registered position code and that is illuminated with optical radiation from a radiation source. At least one portion of the optical radiation is registered by at least one registration element, by means of which a signal dependent on the position code can be created and a position of the code carrier relative to the registration element can thus be registered. the code carrier is movable relative to the registration element with a degree of freedom. the optical radiation couples into the code carrier and is guided at least partially in a beam path in the interior of the code carrier lying in the extension level of the code carrier. The decoupling of the optical radiation occurs in a decoupling zone such that the registration element is illuminated by a substantially homogenous intensity distribution.

Abstract: Disclosed is an apparatus for tracking and condensing sunlight of a wall installation type which tracks the position of the Sun and efficiently condenses sunlight according to variations of an altitude or orbit of the sun by installing a sunlight condensing device for adjusting an angle onto a wall. An apparatus for tracking and condensing sunlight of a wall installation type, comprises: a wall means 100; a sunlight condensing means 200 for condensing sunlight by forming onto a side surface of the wall means 100; and an opening and closing means 300 for adjusting condensing angle by opening or closing an end of the sunlight condensing means 200.

Abstract: A photoelectric conversion module includes a housing including a first wall and a second wall parallel to each other, a first circuit board and a second circuit board arranged between the first wall and the second wall, a spacer disposed between the first circuit board and the second circuit board, a first dust proofing member for sealing a gap between the first wall and the first circuit board and a gap between the spacer and the first circuit board, and a second dust proofing member for sealing a gap between the second wall and the second circuit board and a gap between the spacer and the second circuit board. The first circuit board includes a first holding portion for holding the first dust proofing member. The second circuit board includes a second holding portion for holding the second dust proofing member.

Abstract: A space-saving scanner assembly and method are disclosed. The scanner assembly can be manufactured with optical scanning components typical of flatbed scanners. The scanner may be enclosed within a housing a substantially vertical source-contact surface with a channel and a flap coupled to the source-contact surface. The flap having a source-backing surface substantially parallel to the source-contact surface of the housing and arranged such that the source-contact surface, the source-backing surface, and the channel form an opening for receiving an edge of a source document to be scanned. The housing and the flap are configured with a number of features, which permit an operator to easily place a source over a platen forming a portion of the source-contact surface. A method for operating a space-saving scanner is also presented.

Abstract: A multi-optical axis photoelectric sensor is provided having a casing that forms an outer shape of each of a projector and an optical receiver. The casing includes a frame body having a front face and two ends opened, a pair of caps to cover both ends of the frame body, and a light transmissive plate to cover the opened front face of the frame body 3. In the inner surfaces of both side plates of the frame body, supports are formed extending along the corresponding side edges of the opening of the front face. Both side edges of the light transmissive plate 6 are supported by the supports, and both ends thereof are supported by the caps. Portions of the caps that support the light transmissive plate 6 include communication portions to communicate with the supports of the frame body 3, and a string-like elastic member is disposed around a closed loop formed by each support and each communication portion.

Abstract: Techniques and architectures for providing a reflective target area of an integrated circuit die assembly. In an embodiment, a reflective bevel surface of a die allows an optical signal to be received from the direction of a side surface of a die assembly for reflection into a photodetector. In another embodiment, one or more grooves in a coupling surface of the die provide respective leverage points for aligning a target area of the bevel surface with a detecting surface of the photodetector.

Abstract: A universal projector interface including a mount interface portion with a plurality of elongate arm assemblies coupled thereto. Each arm assembly is selectively rotatable and translatable relative to the mount interface, and includes a coupling portion. The coupling portion of each arm assembly is selectively shiftable between a first position in which the coupling portion is securely engaged with a projector attachment member on the projector and a second position in which the coupling portion is freely disengageable from the projector attachment member.

Abstract: An accessory system for a vehicle includes a windshield of a vehicle and a receiving structure attached at an in-cabin surface of the windshield. A structure is attached at the receiving structure. With the structure attached at the receiving structure, a cluster of individual sensors resides on or near the in-cabin surface of the vehicle windshield, and the cluster of individual sensors includes a forwardly-viewing camera. At least one of the individual sensors may (a) receive an input via a bus communication and/or (b) deliver an output via a bus communication. With the structure attached at the receiving structure, at least one of the individual sensors may be removable from the structure for service. At least one of the sensors may view through the windshield via a light transmitting aperture established in a light absorbing hiding layer at the windshield.