Methods Patents (Class 250/307)
  • Patent number: 10846846
    Abstract: According to one aspect of the present invention, a pattern inspection apparatus includes: a first sub-pixel interpolation processing circuitry configured to calculate a pixel value of a reference image corresponding to a position of each pixel of the inspection target image by performing an interpolation process using at least one pixel value of the reference image for each shift amount while variably and relatively shifting the inspection target image and the reference image by the unit of a sub-pixel using the reference image corresponding to the inspection target image; and an SSD calculation processing circuitry configured to calculate a sum of squared difference between each pixel value of the inspection target image and a corresponding pixel value of the reference image subjected to a filter process for the each shift amount.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: November 24, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Masataka Shiratsuchi, Riki Ogawa, Hideaki Hashimoto, Kazuhiro Nakashima, Ryoichi Hirano, Hideo Tsuchiya, Chosaku Noda
  • Patent number: 10830715
    Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski
  • Patent number: 10830733
    Abstract: Disclosed herein are a method and apparatus for scanning a multilayer material using magnetism. The apparatus for scanning a multilayer material includes at least one measurement head for exciting a mixed magnetic field on a multilayer specimen using at least one excitation solenoid coil and detecting detection signals from the multilayer specimen using a detection solenoid coil, a movement controller for moving any one of the at least one measurement head and a stage on which the multilayer specimen is placed in order to detect detection signals for all parts of the multilayer specimen, and a signal controller for generating two excitation signals having different frequencies in order to generate the mixed magnetic field and for generating a scanning result for the multilayer specimen by collecting the detection signals.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 10, 2020
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hyo-Bong Hong, Jae Chan Jeong, Seung-Min Choi, Chang-Beom Kim
  • Patent number: 10832890
    Abstract: To automatically repeat an operation of isolating a sample piece, which is formed by processing a sample with an ion beam, and transferring the sample piece to a sample piece holder, a charged particle beam device includes a computer configured to perform control so that, without rotating a needle with which the sample piece is fixed to the sample piece holder, a deposition film deposited on the needle is irradiated with a charged particle beam from a charged particle beam irradiation optical system.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: November 10, 2020
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Masato Suzuki, Satoshi Tomimatsu, Makoto Sato, Tatsuya Asahata
  • Patent number: 10825644
    Abstract: Charged particle microscopes having an optimized performance across multiple modes of operation are disclosed herein. More specifically, the disclosure includes improved charged particle microscopes that increase and/or optimize the performance of the microscope in both a standard mode of operation and a Lorentz mode of operation. The charged particle microscopes include an extra transfer lens between a corrector and the traditional transfer lens which allows for the flexibility to optimize performance in both the standard mode of operation and the Lorentz mode of operation. For example, in a Lorentz mode of operation, improved charged particle microscope according to the present disclosure can be used to tune the C5 aberration, while hardly affecting defocus and/or CS aberrations. Additionally, the inclusion of the extra transfer lens provides the charged particle microscopes disclosed herein with an extra degree of freedom with which to zero defocus and total CS and C5.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: November 3, 2020
    Assignee: FEI Company
    Inventor: Alexander Henstra
  • Patent number: 10823681
    Abstract: A system and a method for imaging a surface defect on an object are provided. The system includes an actuator, a sensor assembly connected to the actuator, and a processor configured to control the actuator and the sensor assembly. The sensor assembly includes at least one sensor configured to capture at least one image of the object. The processor is configured to control the actuator and the sensor assembly to identify the actuator and the sensor assembly, a region of a region of interest associated with the surface defect using an using an image of the object and to repeatedly identify at least one subsequent region of interest associated with the surface defect using at least a preceding region of interest such that the surface defect is identified according to a predetermined criterion.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: November 3, 2020
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Wenyu Chen, Wei Xiong, Jia Du, Jierong Cheng, Teck Sun Marcus Wan
  • Patent number: 10818471
    Abstract: A charged particle beam apparatus includes an irradiation system that supplies a converged charged particle beam to a sample and scans the sample with the charged particle beam, an imaging optical system that images the energy generated in the sample, a detection system that detects an image formed by the imaging optical system with an avalanche photodiode array, and a control unit that changes a pixel to be operated in a Geiger mode among pixels configuring the avalanche photodiode array according to movement of an irradiation range of the energy.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: October 27, 2020
    Assignee: Hitachi High-Tech Corporation
    Inventor: Takahiro Jingu
  • Patent number: 10811216
    Abstract: A method for automatically aligning a scanning tunneling electron microscope (STEM) for acquiring precession electron diffraction (PED) mapping data includes the generation of an incident electron beam aligned with a STEM optic axis and focused on a sample region. A non-inclined signal is acquired of the spatial distribution from the sample region, by scanning the aligned incident beam across multiple discrete locations and acquiring a signal associated with each location. The method can further include the inclination of the incident electron beam to a fixed inclination angle relative to the optic axis and then acquiring an inclined signal spatial distribution from the sample region by scanning the inclined incident beam across the multiple discrete locations while applying a cyclic azimuthal scanning protocol to the inclined beam and acquiring a signal associated with each location.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: October 20, 2020
    Assignees: TESCAN BRNO s.r.o, TESCAN TEMPE, LLC
    Inventors: Stanislav Petras, Bohumila Lencova, Gerd Ludwig Benner, Jon Karl Weiss
  • Patent number: 10790200
    Abstract: A wafer measurement system for measuring a measurable characteristic of a first measurement target formed on a wafer includes: a memory and a processor. The memory is configured to store an image of the wafer, multiple templates each including at least one line, and a measurement program. The processor is accessible to the memory and is configured to execute multiple modules included in the measurement program. The modules include: a template selection module configured to receive the templates and select a measurement template corresponding to a shape of the first measurement target; a template matching module configured to match the measurement template to the first measurement target; and a measurement module configured to measure the measurable characteristic of the first measurement target based on position information of the measurement template.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: September 29, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Bo Shim, Je-Hyun Lee
  • Patent number: 10780523
    Abstract: An AM continuous welding system (AMCWS) is provided. The AMCWS includes a feedstock dispenser that configured to emit feedstock at a designated location, and a heat source configured to heat the feedstock. The AMCWS also includes a first eddy current sensor array that is configured to generate a first plurality of sensor signals while in current-sensing proximity of a re-solidified feedstock segment. A controller is coupled to the first eddy current sensor array and is configured to determine, based on the first plurality of sensor signals, a first characteristic of the re-solidified feedstock segment. The controller determines that the first characteristic is a first undesirable characteristic, and initiates an action based on the first undesirable characteristic.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: September 22, 2020
    Assignee: Lockheed Martin Corporation
    Inventor: Kenneth R. Sargent
  • Patent number: 10784076
    Abstract: The invention relates to a method 3D defect characterization of crystalline samples in a scanning type electron microscope. The method comprises Irradiating a sample provided on a stage, selecting one set of crystal lattice planes of the sample and orienting said set to a first Bragg condition with respect to a primary electron beam impinging on said sample, and obtaining Electron Channeling Contrast Image for an area of interest on the sample. The method is characterized by performing, at least once, the steps of orienting said selected set of crystal lattice planes to a further Bragg condition by at least tilting the sample stage with the sample by a user-selected angle about a first tilt axis, and obtaining by Electron Channeling Contrast Image for a further area of interest.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 22, 2020
    Assignee: FEI Company
    Inventors: Tomá{hacek over (s)} Vystav{hacek over (e)}l, Bohuslav Sed'a, Anna Prokhodtseva
  • Patent number: 10775326
    Abstract: An electron beam inspection apparatus includes an acquisition processing circuitry to acquire surface material information presenting a surface material of the substrate and a value of an acceleration voltage of an electron beam; a sequence determination processing circuitry to determine a scan sequence of a plurality of stripe regions on the basis of the surface material of the substrate and the value of the acceleration voltage, the plurality of stripe regions obtained by virtually dividing an inspection region of the substrate in a stripe shape; a secondary electron image acquisition mechanism including a detector for detecting a secondary electron and configured to scan the plurality of stripe regions of the substrate according to a determined scan sequence and to acquire a secondary electron image of the substrate; and a comparison processing circuitry to compare the secondary electron image with a corresponding reference image.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 15, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Hideo Tsuchiya, Masataka Shiratsuchi, Ryoichi Hirano, Hideaki Hashimoto, Riki Ogawa
  • Patent number: 10763075
    Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: September 1, 2020
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Sarah K. Czaplewski
  • Patent number: 10753854
    Abstract: The high selectivity corrosion sensor system includes: a sensor group including at least one selected from SPR sensors whose sensor surfaces have metallic thin films made of different materials, SPR sensors whose sensor surfaces have functional films made of different materials, and LSPR sensors including different metallic fine particles; a light projector projecting light toward the sensors; a detector detecting, as signal intensities, light beams being from the sensors and corresponding to the light beam intensities; a database in which information on corrosion of a subject metal is accumulated; and an analyzer analyzing a degree of corrosion of the subject metal by pattern recognition based on the signal intensities from the detector and the information in the database.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: August 25, 2020
    Assignee: YAZAKI CORPORATION
    Inventor: Terukazu Kosako
  • Patent number: 10747123
    Abstract: A semiconductor device includes a semiconductor substrate including an in-cell area and a scribe lane defining the in-cell area, a first overlay pattern on the semiconductor substrate, and a second overlay pattern adjacent to the first overlay pattern, wherein the first overlay pattern is a diffraction-based overlay (DBO) pattern and the second overlay pattern is a scanning electron microscope (SEM) overlay pattern.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-sun Kim, Young-sik Park, Min-keun Kwak, Byoung-hoon Kim, Yong-chul Kim, Hyun-jeong Lee, Sung-won Choi
  • Patent number: 10748272
    Abstract: An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a function of a change in depth of shadow (i.e. relative brightness), wherein the depth of shadow depends on the height difference as well as width difference between two features on a semiconductor wafer. In another version of the model, the measurable variable is expressed in terms of a function of a change of a measured distance between two characteristic points on the real image of a periodic structure with respect to a change in a tilt angle of a scanning electron beam.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 18, 2020
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Ishai Schwarzband, Yan Avniel, Sergey Khristo, Mor Baram, Shimon Levi, Doron Girmonsky, Roman Kris
  • Patent number: 10741360
    Abstract: In a method for producing a TEM sample, an object is fastened to an element of an object holder such that a surface to be processed of the object is arranged substantially perpendicularly to an axis of rotation of the element. An ion beam is directed at the surface to be processed at grazing incidence, wherein the element adopts different rotational positions in relation to the axis of rotation, while the ion beam is directed at the surface to be processed.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: August 11, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Josef Biberger, Stefan Lengweiler
  • Patent number: 10727026
    Abstract: A charged particle beam inspection method conducted by disposing a sample on a stage and by performing a first scanning in a first beam scanning area on the sample by using one first charged particle beam out of a plurality of charged particle beams while the stage is moved so that a first inspection of a first inspection unit in the first beam scanning area is performed, and by performing a second scanning in a second beam scanning area on the sample by using one second charged particle beam out of the charged particle beams while the stage is moved so that a second inspection of a second inspection unit in the second beam scanning area is performed.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: July 28, 2020
    Assignee: NuFlare Technology, Inc.
    Inventors: Chosaku Noda, Riki Ogawa
  • Patent number: 10718674
    Abstract: An Impact sensor for detecting strain or strain rate in a composite having one or more sensor nodes using a fracto-mechanoluminescent (FML) material, such as EuD4TEA crystals, encased in an optically transparent material such as PDMS. Optical fibers transmit light emitted by the FML material due to strain experienced by the composite. For honeycomb composites, the transparent material is disposed within cells of the honeycomb composite. A reflective material such as Mylar either surrounds the optically transparent material or lines the cell. The intensity of the light emitted by the FML material is related to the magnitude of strain or strain rate experienced by the composite as well as the distance of the FML material from the surface of the composite that receives the impact. Multiple sensor nodes disposed at different distances from the impact surface can provide a three-dimensional map of damage experienced by the composite.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: July 21, 2020
    Assignee: New Mexico Tech University Research Park Corporation
    Inventors: Donghyeon Ryu, Quinlan James Towler
  • Patent number: 10720302
    Abstract: An electron microscope includes: an optical system including an aberration correction device; and a control unit that controls the aberration correction device, wherein the control unit performs: processing for displaying, on a display unit, an image for designating a direction of aberration in superposition on an aberration pattern representing a state of aberration, processing for specifying the direction of aberration from the image that has been subjected to a rotation operation, and processing for controlling the aberration correction device to cause the aberration correction device to introduce an aberration in the specified direction.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: July 21, 2020
    Assignee: JEOL Ltd.
    Inventors: Shigeyuki Morishita, Takeo Sasaki, Tomohiro Nakamichi
  • Patent number: 10714303
    Abstract: Techniques for high throughput electron channeling contrast imaging (ECCI) by varying electron beam energy are provided. In one aspect, a method for ECCI of a crystalline wafer includes: placing the crystalline wafer under an electron microscope having an angle of less than 90° relative to a surface of the crystalline wafer; generating an electron beam, by the electron microscope, incident on the crystalline wafer; varying an accelerating voltage of the electron microscope to access a channeling condition of the crystalline wafer; and obtaining an image of the crystalline wafer. A system for ECCI is also provided.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: July 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Brent A. Wacaser, Devendra K. Sadana, Stephen W. Bedell
  • Patent number: 10712363
    Abstract: Provided is a scanning probe microscope with which measurement data and a distribution image of differential data of the measurement data can be displayed selectively or together, an edge enhancement image can be obtained, and user convenience is improved. A scanning probe microscope (200) includes: a distribution image calculator (40a) configured to calculate a one-dimensional or two-dimensional first distribution image (201) of measurement data, and a one-dimensional or two-dimensional second distribution image (202) of differential data of adjacent data elements of the measurement data; and a display controller (40b) configured to instruct the distribution image calculator to calculate at least one of the first distribution image or the second distribution image, and to display the calculated distribution image on a predetermined display.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: July 14, 2020
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Masayuki Iwasa, Yoshiteru Shikakura, Shinya Kudo, Toshihiro Ueno
  • Patent number: 10714308
    Abstract: Provided is a measurement method for measuring, in an electron microscope including a segmented detector having a detection plane segmented into a plurality of detection regions, a direction of each of the plurality of detection regions in a scanning transmission electron microscope (STEM) image, the measurement method including: shifting an electron beam EB incident on a sample S under a state where the detection plane is conjugate to a plane shifted from a diffraction plane to shift the electron beam EB on the detection plane, and measuring a shift direction of the electron beam EB on the detection plane with the segmented detector; and obtaining the direction of each of the plurality of detection regions in the STEM image from the shift direction.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: July 14, 2020
    Assignee: JEOL Ltd.
    Inventor: Yuji Kohno
  • Patent number: 10692689
    Abstract: The invention relates to an image capture assembly and method for use in an electron backscatter diffraction (EBSD) system. An image capture assembly comprises a scintillation screen (10) including a predefined screen region (11), an image sensor (20) comprising an array of photo sensors and a lens assembly (30). The image capture assembly is configured to operate in at least a first configuration or a second configuration. In the first configuration the lens assembly (30) projects the predefined region (11) of the scintillation screen (10) onto the array and in the second configuration the lens assembly (30) projects the predefined region (11) of the scintillation screen (10) onto a sub-region (21) of the array. In each of the first and second configurations the field of view of the lens assembly (30) is the same.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: June 23, 2020
    Assignee: VG Systems Limited
    Inventors: Zoran Pesic, Chris Stephens, Austin Day, Bryan Barnard
  • Patent number: 10689763
    Abstract: There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 23, 2020
    Assignee: TECHINSIGHTS INC.
    Inventors: Robert K. Foster, Christopher Pawlowicz, Jason Abt, Ian Jones, Heinz Josef Nentwich
  • Patent number: 10692695
    Abstract: Provided is a cross-section processing observation method capable of easily and accurately forming a cross-section used to observe a sample's inside, and a cross-section processing observation apparatus for cross-section processing. The method includes a design data acquisition step acquiring design data of a three-dimensional structure of a sample having three-dimensional structure, a moving step moving the sample based on coordinate information of the design data, a surface observation step acquiring an observation image of a surface of the sample, a cross-section forming step irradiating the sample's surface with an ion beam to form a cross-section of the three-dimensional structure, a cross-section observation step acquiring an observation image of the sample's cross-section, and a display step displaying image data, among pieces of the design data, of surface and cross section corresponding to respective locations of the surface and the cross section.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 23, 2020
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventor: Xin Man
  • Patent number: 10663414
    Abstract: A method is provided for performing electron diffraction pattern analysis upon a sample in a vacuum chamber of a microscope. Firstly a sample is isolated from part of a specimen using a focused particle beam. A manipulator end effector is then attached to the sample so as to effect a predetermined orientation between the end effector and the sample. With the sample detached, the manipulator end effector is rotated about a rotation axis to bring the sample into a predetermined geometry with respect to an electron beam and diffraction pattern imaging apparatus so as to enable an electron diffraction pattern to be obtained from the sample while the sample is still fixed to the manipulator end effector. An electron beam is caused to impinge upon the sample attached to the manipulator end effector so as to obtain an electron diffraction pattern.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: May 26, 2020
    Assignee: OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED
    Inventor: Frank Willi Bauer
  • Patent number: 10663483
    Abstract: Methods and apparatuses are provided for automatically controlling and stabilizing aspects of a scanning probe microscope (SPM), such as an atomic force microscope (AFM), using Peak Force Tapping (PFT) Mode. In an embodiment, a controller automatically controls periodic motion of a probe relative to a sample in response to a substantially instantaneous force determined and automatically controls a gain in a feedback loop. A gain control circuit automatically tunes a gain based on separation distances between a probe and a sample to facilitate stability. Accordingly, instability onset is quickly and accurately determined during scanning, thereby eliminating the need of expert user tuning of gains during operation.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: May 26, 2020
    Assignee: Bruker Nano, Inc.
    Inventors: Chanmin Su, Jian Shi, Yan Hu, Shuiqing Hu, Ji Ma
  • Patent number: 10658147
    Abstract: A charged particle beam apparatus which automatically prepares a sample piece from a sample, includes: a charged particle beam irradiation optical system configured to perform irradiation of a charged particle beam; a sample stage configured to move, the sample being placed on the sample stage; a sample piece relocation unit configured to hold and transport the sample piece which is separated and picked up from the sample; a holder fixing stage which holds a sample piece holder to which the sample piece is relocated; and a computer which performs positional control in relation to a target object based on a template and positional information which is obtained from an image of the target object, the template being generated based on an absorption current image of the target object which is acquired using the irradiation of the charged particle beam.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: May 19, 2020
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Makoto Sato, Satoshi Tomimatsu, Atsushi Uemoto, Tatsuya Asahata
  • Patent number: 10658148
    Abstract: System and method for Ultrafast Electron Diffraction (UED) and Microscopy (UEM) configured to image atomic motion in real time with sub-femtosecond temporal resolution. Presented methodology utilizes the interaction of the pump optical pulse with the initial electron pulse that has been gated with the gating optical pulse. The initial electron pulse is generated in the electron microscope by the pulse of auxiliary light. In one case, the pump and gating pulses have attosecond duration and are duplicates of one another. The use of attosecond optical pulse (with frequency spectrum extending over two octaves in the visible and flanking spectral ranges) for optical gating of a pulse of electrons.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: May 19, 2020
    Assignee: ARIZONA BOARD OF REGENTS OF BEHALF OF THE UNIVERSITY OF ARIZONA
    Inventor: Mohammed Tharwat Hassan Mohammed
  • Patent number: 10649189
    Abstract: A device for imaging the surfaces of a sample having topography with the aid of confocal microscopy, in particular confocal Raman and/or fluorescence microscopy, comprising a first light source, in particular a laser light source for generating excitation radiation, in particular Raman radiation and/or fluorescence radiation and a second light source, wherein the first laser light source emits radiation in a first wavelength range and the second light source emits radiation in a second wavelength range, wherein the first wavelength range and the second wavelength range do not overlap.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: May 12, 2020
    Assignee: WITEC Wissenschaftliche Instrumente Und Technologie GMBH
    Inventors: Olaf Hollricher, Wolfram Ibach, Peter Spizig, Detlef Sanchen, Gerhard Volswinkler
  • Patent number: 10629405
    Abstract: An electron beam device suitable for observing the bottom of a deep groove or hole with a high degree of accuracy under a large current condition includes: an electron optical system having an irradiation optical system to irradiate a first aperture with an electron beam emitted from an electron source and a reduction projection optical system to project and form an aperture image of the first aperture on a sample, detectors to detect secondary electrons emitted by irradiating the sample with the electron beam through the electron optical system. An image processing unit generates a two-dimensional image from detection signals obtained by irradiating the sample while the electron beam scans the sample two-dimensionally by scanning deflectors of the electron optical system. Further, generates a reconstructed image by deconvoluting electron beam intensity distribution information of an ideal aperture image of the first aperture from the generated two-dimensional image information.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: April 21, 2020
    Assignee: HITACHI, LTD.
    Inventors: Yasunari Sohda, Momoyo Enyama, Megumi Kimura, Koichi Hamada
  • Patent number: 10629411
    Abstract: (Task) To repeatedly perform an operation of extracting a sample piece formed by processing a sample with an ion beam and of transferring the extracted sample piece to a sample piece holder. (Problem Solving Means) A charged particle beam apparatus includes a computer that sets a shaping processing region including a bottom portion of sample piece in a thickness direction of the sample piece corresponding to a depth direction at the time of processing a sample after a needle holds the sample piece, and controls a focused ion beam irradiation optical system to irradiate the shaping processing region with a focused ion beam to thereby shape the sample piece.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: April 21, 2020
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Satoshi Tomimatsu, Tatsuya Asahata, Makoto Sato, Masato Suzuki
  • Patent number: 10629409
    Abstract: A method of preparing a specimen in a dual-beam charged particle microscope having: an ion beam column, that can produce an ion beam that propagates along an ion axis; an electron beam column, that can produce an electron beam that propagates along an electron axis, comprising the following steps: Providing a precursor sample on a sample holder; Using said ion beam to cut a furrow around a selected portion of said sample; Attaching a manipulator needle to said portion, severing said portion from the rest of said sample, and using the needle to perform a lift-out of the portion away from the rest of the sample, particularly comprising: Configuring the manipulator needle to have multiple degrees of motional freedom, comprising at least: Eucentric tilt ? about a tilt axis that passes through an intersection point of said ion and electron axes and is perpendicular to said electron axis; Rotation ? about a longitudinal axis of the needle; Whilst maintaining said portion on said needle, using said ion bea
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: April 21, 2020
    Assignee: FEI Company
    Inventors: Frantisek Vaske, Tomáŝ Vystavêl, Daniel Bosák
  • Patent number: 10618080
    Abstract: A system for removing debris from a surface of a substrate, the system including a cantilever arm and a tip supported by the cantilever arm. The tip has a proximal portion and a distal portion such that the tip is supported by the cantilever arm via the proximal portion. The system further includes at least one nanofibril attached to the distal portion of the tip, and the at least one nanofibril is configured to elastically deform against or around the debris or the surface of the substrate.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: April 14, 2020
    Assignee: Bruker Nano, Inc.
    Inventor: Tod Robinson
  • Patent number: 10615002
    Abstract: Processes may be performed with a plurality of FIB-SEM systems. A first process group includes recording an image with the electron beam column, depositing material with supply of a process gas, and performing ion beam etching. A second process group includes performing a sample exchange, exchanging a reservoir of a gas source for the process gas, and verifying an image that was recorded with the electron beam column. The processes of the second group are prioritized. The FIB-SEM systems are actuated to work through processes contained in process lists. If in a plurality of FIB-SEM systems processes of the second group are to be performed simultaneously, an instruction based on the prioritization is output to the user.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 7, 2020
    Assignee: Carl Zeiss Microscopy GmbH
    Inventors: Josef Biberger, Ralph Pulwey
  • Patent number: 10607845
    Abstract: Methods and systems for direct atomic layer etching and deposition on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform atomic layer etch and atomic layer deposition, expressing pattern with selected 3D-structure. Reducing the number of process steps in patterned atomic layer etch and deposition reduces manufacturing cycle time and increases yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding columns, and support superior, highly-configurable process execution and control.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: March 31, 2020
    Inventors: Kevin M. Monahan, Theodore A. Prescop, Michael C. Smayling, David K. Lam
  • Patent number: 10598605
    Abstract: An automated tablet tooling inspection system (100) for inspecting defects in tablet tooling's including upper punch, lower punch and die. The system (100) comprising of a base plate (101), a punch holder (102), a punch stopper (103), a die holder (104), a LM rail and carriage assembly (105), a LED Micrometer (107) to measure parameters of said tablet tooling, a Laser sensor or con focal sensor (108) to measure parameters of said tablet tooling and a control unit. The automated tooling inspection and system (100) reduces the inspection time of said tablet tooling by minimizing manual intervention; wherein said manual intervention is reduced by eliminating the requirement of changing configuration of said system (100) when a different type of tablet tooling is inspected such as TSM/Euro, B, D, BD, BB and BBS and the like.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: March 24, 2020
    Assignee: PACIFIC TOOLS PVT. LTD.
    Inventor: N. Velayutham
  • Patent number: 10585104
    Abstract: The production and use of semiconducting nanopost arrays made by nanofabrication is described herein. These nanopost arrays (NAPA) provide improved laser ionization yields and controllable fragmentation with switching or modulation capabilities for mass spectrometric detection and identification of samples deposited on them.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: March 10, 2020
    Assignees: The George Washington University, UT-Battelle, LLC
    Inventors: Akos Vertes, Bennett N. Walker, Jessica A. Stolee, Scott T. Retterer
  • Patent number: 10572825
    Abstract: In one example, the present disclosure describes a device, computer-readable medium, and method for inferring the presence of an occluded entity in a video captured via drone. For instance, in one example, a video is obtained. The video is captured by a drone monitoring a field of view of a scene. It is determined, based on a combination of statistical reasoning and contextual modeling of the video, that an occluded entity is likely to be present, but not entirely visible, in the field of view. A signal is sent to the drone to instruct the drone to adjust its orientation to make the occluded entity more visible.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: February 25, 2020
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventor: Raghuraman Gopalan
  • Patent number: 10571675
    Abstract: Methods and systems for temporal compressive sensing are disclosed, where within each of one or more sensor array data acquisition periods, one or more sensor array measurement datasets comprising distinct linear combinations of time slice data are acquired, and where mathematical reconstruction allows for calculation of accurate representations of the individual time slice datasets.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: February 25, 2020
    Assignee: Integrated Dynamic Electron Solutions, Inc.
    Inventor: Bryan Reed
  • Patent number: 10559448
    Abstract: A method of using a Transmission Charged Particle Microscope comprising: A specimen holder, for holding a specimen; A source, for producing a beam of charged particles; An illuminator, for directing said beam so as to irradiate the specimen; An imaging system, for receiving a flux of charged particles transmitted through the specimen and directing it onto a sensing device; A controller, for controlling at least some operational aspects of the microscope, in which method the sensing device is chosen to be an EELS/EFTEM module comprising: An entrance plane; An image plane, where in EELS mode an EELS spectrum is formed and in EFTEM mode an EFTEM image is formed; A slit plane between said entrance plane and image plane, where in EFTEM mode an energy dispersed focus is formed; A dispersing device, between said entrance plane and slit plane, for dispersing an incoming beam into an energy-dispersed beam with an associated dispersion direction; A first series of quadrupoles between said dispersing device and sli
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 11, 2020
    Assignee: FEI Company
    Inventors: Alexander Henstra, Peter Christiaan Tiemeijer
  • Patent number: 10559450
    Abstract: The present invention enlarges a range of movement of field of view by beam deflection with a simple deflector configuration and suppresses deterioration of a signal electron detection rate caused by the beam deflection. A scanning electron microscope according to the present invention is provided with a first deflection field setting module that sets plural deflectors to move a scanning area on a specimen by a primary electron beam to a position deviated from an axis extended from an electron source toward the center of an objective lens and a second deflection field setting module that sets the plural deflectors so that trajectories of signal electrons are corrected without changing the scanning area set by the first deflection field setting module. The control unit controls the plural deflectors by adding a setting value set by the second deflection field setting module to a setting value set by the first deflection field setting module.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: February 11, 2020
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Noritsugu Takahashi, Yasunari Sohda, Akira Ikegami, Yuta Kawamoto
  • Patent number: 10559447
    Abstract: A charged particle apparatus including a charged particle source unit; a blanking electrode unit that blanks a charged particle beam launched from the charged particle source unit; a deflecting electrode unit that deflects the charged particle beam; an objective lens unit that converges the charged particle beam deflected by the deflecting electrode unit and radiates the charged particle beam to a surface of a sample; a secondary charged particle detection unit that detects a secondary charged particle generated from the sample; a signal processing unit that processes a signal obtained by detecting the secondary charged particle; and a control unit that corrects a transient signal when the blanking of the charged particle beam is turned off by the blanking electrode, such that an image with no distortion can be obtained even when the blanking electrode is operated to turn on and off at a high speed.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: February 11, 2020
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Ryo Kadoi, Wen Li, Kazuki Ikeda, Hajime Kawano, Hiroyuki Takahashi
  • Patent number: 10559074
    Abstract: A sample observation device images a sample placed on a movable table by irradiating and scanning the sample with a charged particle beam of a microscope. A degraded image having poor image quality and a high quality image having satisfactory image quality which are acquired at the same location of the sample by causing the charged particle microscope to change an imaging condition for imaging the sample are stored. An estimation process parameter is calculated for estimating the high quality image from the degraded image by using the stored degraded image and high quality image. A high quality image estimation unit processes the degraded image obtained by causing the charged particle microscope to image the desired site of the sample by using the calculated estimation process parameter. Thereby, the high quality image obtained at the desired site is estimated, and then the estimated high quality image is output.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: February 11, 2020
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Minoru Harada, Yuji Takagi, Naoaki Kondo, Takehiro Hirai
  • Patent number: 10550480
    Abstract: There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: February 4, 2020
    Assignee: TECHINSIGHTS INC.
    Inventors: Robert K. Foster, Christopher Pawlowicz, Jason Abt, Ian Jones, Heinz Josef Nentwich
  • Patent number: 10549117
    Abstract: Radiation treatment planning includes determining a number of beams to be directed into a target, determining directions (e.g., gantry angles) for the beams, and determining an energy level for each of the beams. The number of beams, the directions of the beams, and the energy levels are determined such that the beams do not overlap outside the target and the prescribed dose will be delivered across the entire target.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: February 4, 2020
    Assignees: Varian Medical Systems, Inc, Varian Medical Systems International AG.
    Inventors: Reynald Vanderstraten, Eric Abel, Christel Smith, Anthony Magliari, Timo Koponen, Josh Star-Lack
  • Patent number: 10541108
    Abstract: The disclosure is related to a method and apparatus for transmission electron microscopy wherein a TEM specimen is subjected to at least one thinning step by scratching at least an area of the specimen with an SPM probe, and wherein the thinned area is subjected to an SPM acquisition step, using the same SPM probe or another probe.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: January 21, 2020
    Assignee: IMEC VZW
    Inventors: Umberto Celano, Kristof Paredis, Wilfried Vandervorst
  • Patent number: 10529534
    Abstract: Methods and systems for quantifying and correcting for non-uniformities in images used for metrology operations are disclosed. A metrology area image of a wafer and a design clip may be used. The metrology area image may be a scanning electron microscope image. The design clip may be the design clip of the wafer or a synthesized design clip. Tool distortions, including electron beam distortions, can be quantified and corrected. The design clip can be applied to the metrology area image to obtain a synthesized image such that one or more process change variations are suppressed and one or more tool distortions are enhanced.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 7, 2020
    Assignee: KLA-Tencor Corporation
    Inventor: Hari Pathangi Sriraman
  • Patent number: 10529547
    Abstract: A method of operating a Fourier Transform (FT) mass analyzer, which has a plurality of selectable resolving power settings, includes storing an optimized voltage value in association with each one of the plurality of selectable resolving power settings. More particularly, the optimized voltage values for at least two of the selectable resolving power settings differ from one another. When a user selects one of the plurality of selectable resolving power settings, the optimized voltage value that is stored in association therewith is retrieved. At least one voltage setting of the FT mass analyzer is controlled, based on the retrieved optimized voltage value, and an analytical scan is performed at the selected one of the plurality of selectable resolving power settings for a population of ions within the FT mass analyzer.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 7, 2020
    Assignee: THERMO FINNIGAN LLC
    Inventor: Jesse D. Canterbury