Methods Patents (Class 250/307)
  • Patent number: 11211222
    Abstract: Automatic alignment of the zone axis of a sample and a charged particle beam is achieved based on a diffraction pattern of the sample. An area corresponding to the Laue circle is segmented using a trained network. The sample is aligned with the charged particle beam by tilting the sample with a zone axis tilt determined based on the segmented area.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: December 28, 2021
    Assignee: FEI Company
    Inventors: John J. Flanagan, Nathaniel Kurtz, Ashley Tilson, Phillip Parker
  • Patent number: 11211271
    Abstract: Systems and methods are provided for determining defects in a semiconductor structure sample that is prepared for analysis by microscopy. A semiconductor structure sample preparation and analysis system includes a semiconductor structure sample that includes a structure, a protective capping layer on the structure, and a gap filler material on the protective capping layer. A microscopy apparatus acquires an image of the semiconductor structure sample. Sample defect recognition circuitry determines the presence of a defect in the semiconductor structure sample based on the acquired image.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: December 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Hung, Jang Jung Lee
  • Patent number: 11199401
    Abstract: A method of evaluating a region of a sample that includes a first sub-region and a second sub-region, adjacent to the first sub-region, the region comprising a plurality of sets of vertically-stacked double-layers extending through both the first and second sub-regions with a geometry or orientation of the vertically-stacked double layers in the first sub-region being different than a geometry or orientation of the vertically-stacked double layers in the second region resulting in the first sub-region having a first milling rate and the second sub-region having a second milling rate different than the first milling rate, the method including: milling the region of a sample by scanning a focused ion beam over the region a plurality of iterations in which, for each iteration, the focused ion beam is scanned over the first sub-region and the second sub-region generating secondary electrons and secondary ions from each of the first and second sub-regions; detecting, during the milling, at least one of the generat
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: December 14, 2021
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventor: Yehuda Zur
  • Patent number: 11177112
    Abstract: The present invention proposes a pattern measurement tool characterized by being provided with: a charged-particle beam sub-system having a tilt deflector; and a computer sub-system which is connected to the charged-particle beam sub-system and which is for executing measurement of a pattern on the basis of a signal obtained by said charged-particle beam sub-system, wherein the charged-particle beam sub-system acquires at least two signal profiles by scanning beams having at least two incidence angles, the computer sub-system measures the dimension between one end and the other end of the pattern on the basis of the at least two signal profiles, calculates the difference between the two measurements, and calculates the height of the pattern by inputting the difference value determined by said calculation into a relational formula indicating the relation between the height of the pattern and said difference value.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: November 16, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Satoru Yamaguchi, Kei Sakai, Makoto Suzuki, Ryota Watanabe
  • Patent number: 11170255
    Abstract: Methods and systems for training a machine learning model using synthetic defect images are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a graphical user interface (GUI) configured for displaying one or more images for a specimen and image editing tools to a user and for receiving input from the user that includes one or more alterations to at least one of the images using one or more of the image editing tools. The component(s) also include an image processing module configured for applying the alteration(s) to the at least one image thereby generating at least one modified image and storing the at least one modified image in a training set. The computer subsystem(s) are configured for training a machine learning model with the training set in which the at least one modified image is stored.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: November 9, 2021
    Assignee: KLA-Tencor Corp.
    Inventors: Ian Riley, Li He, Sankar Venkataraman, Michael Kowalski, Arjun Hegde
  • Patent number: 11170976
    Abstract: In one embodiment, a multi-beam writing method includes acquiring a plurality of pieces of position deviation data corresponding to a plurality of parameter values of a parameter that change position deviation amount of each beam of multi-beam irradiated on a substrate, calculating a plurality of pieces of reference coefficient data corresponding to each of the plurality of pieces of position deviation data, calculating coefficient data corresponding to a parameter value at an irradiation position of the multi-beam on the substrate using the plurality of pieces of reference coefficient data corresponding to the plurality of parameter values, modulating an irradiation amount of each beam of the multi-beam for each shot using the coefficient data, and writing a pattern by irradiating the substrate with each beam of at least a part of the multi-beam having the modulated irradiation amounts.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: November 9, 2021
    Assignee: NuFlare Technology, Inc.
    Inventor: Hiroshi Matsumoto
  • Patent number: 11164719
    Abstract: Disclosed herein is a method comprising: depositing a first amount of electric charges into a region of a sample, during a first time period; depositing a second amount of electric charges into the region, during a second time period; while scanning a probe spot generated on the sample by a beam of charged particles, recording from the probe spot signals representing interactions of the beam of charged particles and the sample; wherein an average rate of deposition during the first time period and an average rate of deposition during the second time period are different.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 2, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Yixiang Wang, Frank Nan Zhang
  • Patent number: 11158482
    Abstract: A multi-beam particle microscope includes a multi-beam particle source, an objective lens, a detector arrangement, and a multi-aperture plate with a multiplicity of openings. The multi-aperture plate is between the objective lens and the object plane. The multi-aperture plate includes a multiplicity of converters which convert backscattered electrons which are generated by primary particle beams at an object into electrons with a lower energy, which provide electrons that form electron beams detected by the detector arrangement.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: October 26, 2021
    Assignee: Carl Zeiss MultiSEM GmbH
    Inventors: Dirk Zeidler, Stefan Schubert
  • Patent number: 11127562
    Abstract: Disclosed herein are systems and methods for pulsing electron beams and synchronizing the pulsed electron beam with scanning a sample at a plurality of scan locations. An example method at least includes pulsing an electron beam to form a pulsed electron beam having a pulse period, moving the pulsed electron beam to interact with a sample at a plurality of locations, the interaction at each of the plurality of locations occurring for a dwell time, and synchronizing data acquisition of the interaction of the pulsed electron beam with the sample based on the pulsing and the translating of the electron beam, wherein the dwell time is based on a derivative of the pulse period.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: September 21, 2021
    Assignee: FEI Company
    Inventors: Erik Rene Kieft, Bert Henning Freitag
  • Patent number: 11101101
    Abstract: Methods and systems for implementing laser-based phase plate image contrast enhancement are disclosed herein. An example method at least includes forming at least one optical peak in a diffraction plane of an electron microscope, and directing an electron beam through the at least one optical peak at a first location, where the first location determines an amount of phase manipulation the optical peak imparts to an electron of the electron beam.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: August 24, 2021
    Assignee: FEI Company
    Inventors: Bart Buijsse, Bas Hendriksen, Pleun Dona
  • Patent number: 11094501
    Abstract: A secondary charged particle imaging system comprising: a backscattered electron detector module, wherein the backscattered electron detector module is rotatable between a first angular position and a second angular position about an axis.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: August 17, 2021
    Assignee: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
    Inventors: Matthias Firnkes, Florian Lampersberger, Stefan Lanio
  • Patent number: 11073535
    Abstract: A scanning probe microscope includes a case, an actuator, at least one elastic body, and a probe. The actuator includes a piezoelectric scanner having a cylindrical shape and a sample holder. The piezoelectric scanner is disposed inside the case to be coaxial with the case such that the first end is fixed to the bottom portion. The sample holder is provided at a second end of the piezoelectric scanner. At least one elastic body is disposed so as to be sandwiched between the case and at least one of the piezoelectric scanner and the sample holder.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: July 27, 2021
    Assignee: Shimadzu Corporation
    Inventor: Masato Hirade
  • Patent number: 11069509
    Abstract: The backside of a planar view lamella is prepared from a sample extracted from a workpiece. The sample includes multiple device layers and a substrate layer. After removing at least a part of the substrate layer covering a final device layer to obtain a sample surface, a region of interest (ROI) relative to the sample surface is alternately scanned with an electron beam and spontaneously etched until the final device layer within the ROI is exposed. One or more device layers may be removed from the sample backside after the final device layer is exposed to obtain the backside of the planar view lamella.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: July 20, 2021
    Assignee: FEI Company
    Inventors: James Clarke, Brian Routh, Jr., Micah LeDoux, Cliff Bugge
  • Patent number: 11067486
    Abstract: Aspects and embodiments relate to electron microscopy sample preparation apparatus; and a method of preparing an electron microscopy sample. Aspects and embodiments provide electron microscopy sample preparation apparatus. The apparatus comprises a support holder configured to receive an electron microscopy sample support, the electron microscopy sample support configured to receive a fluid sample. The apparatus comprising a gas outlet configured to direct a flow of gas towards a surface of the electron microscopy sample support to adjust fluid supported by the electron microscopy sample support. Aspects and embodiments recognise that in order to be successfully imaged, a specimen must be adequately prepared for imaging. Successful and reproducible preparation of an electron microscopy sample or specimen may be key to obtaining useful results from microscopy techniques.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: July 20, 2021
    Assignee: United Kingdom Research and Innovation
    Inventors: Meindert Hugo Lamers, Rafael Fernandez-Leiro, Joshua Firman
  • Patent number: 11060990
    Abstract: A semiconductor measurement device includes an electrode provided in a semiconductor sample, and a probe contactable with the semiconductor sample. A driver moves a contact position of the probe with respect to the semiconductor sample. A power supply applies electric power between the probe and the electrode. A measurement operation portion measures a current flowing via the semiconductor sample between the probe and the electrode as a voltage applied between the probe and the electrode is changed, the measurement operation portion measuring the current flowing for each of plural measurement points of a surface of the semiconductor sample while causing the probe to scan the measurement points, or while sequentially bringing the probe into contact with the measurement points. A display displays a relationship between the voltage and the current measured at each of the measurement points.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: July 13, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Jun Hirota, Tsukasa Nakai, Masako Kobayashi, Kazunori Harada
  • Patent number: 11054409
    Abstract: In a method for automated determination of the relative position (x/y/z) between a first hole (27) on a first microsystem component (11), which is preferably provided with a first channel (44) opening in the first hole (27), and at least one second hole (29) on a second microsystem component (12), which is preferably provided with a second channel (45) opening in the second hole (29), the two microsystem components (11, 12) lie in a liquid medium (41) at least in the region (25, 26) of the holes (27, 29). Under the supervision of a control device (15) controlled by a computer (22), the first and second microsystem components (11, 12) are displaced relative to one another into different relative positions (x/y/z). Electrical signals (37) are delivered to one of the two microsystem components (12, 12) and are recorded on the other of the two microsystem components (11, 12) as measurement values (38) which depend on the relative position of the two microsystem components (11, 12) with respect to one another.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: July 6, 2021
    Assignee: Multichannel Systems MCS GmbH
    Inventors: Timm Danker, Elke Guenther
  • Patent number: 11043369
    Abstract: A sample analyzer includes a voltage source that applies a voltage to a sample. A laser irradiator irradiates the sample with a laser beam. A detector detects a particle emitted from the sample. An operation device specifies the material of the particle detected by the detection device, by mass spectrometry of the particle and analyzes the structure of the sample. The operation device calculates a ratio in structure between model information indicating the structure of the sample, which is prepared in advance, and analysis information indicating the structure of the sample, which is obtained by the mass spectrometry, and applies the ratio to the analysis information so as to correct the analysis information.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: June 22, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Akira Kuramoto, Teruyuki Kinno
  • Patent number: 11035766
    Abstract: A method includes introducing a fluidic sample into a void volume of a porous material, bringing the porous material into contact with a hydrophilic substrate compatible with a cryogenic Transmission Electron Microscope, separating the porous material from the substrate, and transferring a portion of the sample from the porous material to the substrate between their contact and separation.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: June 15, 2021
    Assignee: NANOSOFT, LLC.
    Inventors: Michael Godfrin, Michael Franzblau
  • Patent number: 11035804
    Abstract: X-ray imaging and classification of volume defects within a three-dimensional structure includes identifying one or more volume defects within a three-dimensional structure of a sample and acquiring, with a transmission-mode x-ray diffraction imaging tool, one or more coherent diffraction images of the one or more identified volume defects. The process includes classifying the one or more volume defects within a volume of the three-dimensional structure based on the one or more coherent diffraction images, and training an additional optical or electron-based inspection tool based on the one or more classified defects.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: June 15, 2021
    Assignee: KLA Corporation
    Inventors: Richard W. Solarz, Oleg Khodykin, Bosheng Zhang, Steven R. Lange
  • Patent number: 11024020
    Abstract: The present document describes methods and systems for the automatic inspection of material quality. A set of lights with a geometric pattern is cast on a material to be analyzed. Depending on the material being inspected, same may act as a mirror and the reflected image is captured by a capture device, or the light passes through the material being inspected and the image is captured by a capture device. Defects in the material can be detected by the distortion caused by same in the pattern of the reflected image or passing through. Finally, software is used to identify and locate these distortions, and consequently the defects in the material. This classification of defects is carried out using artificial intelligence techniques.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: June 1, 2021
    Assignee: Autaza Tecnologia S.A.
    Inventors: Jorge Augusto de Bonfim Gripp, Enivaldo Amaral de Souza, Renan Padovani, Carlos Yuji Sakuramoto
  • Patent number: 11022786
    Abstract: A handling apparatus for handling a measuring probe of a scanning probe microscope is disclosed. The measuring probe has a probe body and a probe tip which is coupled with the probe body by a cantilever. The handling apparatus includes a receiving device for receiving the measuring probe at a receiving area, a guide structure, in which the measuring probe is guidable while at the same time the probe body is at least partially limited and the cantilever and the probe tip are supported without contact, and a transport device for transporting the measuring probe from the receiving area along the guide structure to a target area.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: June 1, 2021
    Assignee: Anton Paar GmbH
    Inventors: Norbert Pinno-Rath, Gernot Leuprecht, Daniel Koller
  • Patent number: 11024480
    Abstract: Various methods and systems are provided for aligning zone axis of a sample with an incident beam. As one example, the alignment may be based on a zone axis tilt. The zone axis tilt may be determined based on locations of a direct beam and a zero order Laue zone in the diffraction pattern. The direct beam location may be determined based on diffraction patterns acquired with different incident angles.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: June 1, 2021
    Assignee: FEI Company
    Inventor: Zhenxin Zhong
  • Patent number: 11014992
    Abstract: The present invention relates to chimeric chemical compounds which are used to recruit antibodies to cancer cells, in particular, prostate cancer cells or metastasized prostate cancer cells. The compounds according to the present invention comprise an antibody binding terminus (ABT) moiety covalently bonded to a cell binding terminus (CBT) through a linker and optionally, a connector molecule.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: May 25, 2021
    Assignee: YALE UNIVERSITY
    Inventors: David Spiegel, Ryan Murelli, Andrew Zhang
  • Patent number: 11017525
    Abstract: A semiconductor pattern detecting apparatus is provided.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyung Ahn, Souk Kim, Joon Seo Song, Young Hoon Sohn, Yu Sin Yang
  • Patent number: 11010914
    Abstract: An image processor includes an accepting unit that accepts designation of at least part of a three dimensional microscope image data, and an image generator that generates three dimensional magnified image data based on the designation. In the image processor, the image generator may sequentially output a first magnified image based on at least part of data of the three dimensional magnified image data, and a second magnified image based on the at least part of data of the three dimensional magnified image data which has at least part of data different from the first magnified image.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: May 18, 2021
    Assignee: NIKON CORPORATION
    Inventors: Toshiya Okabe, Ichiro Sase, Ryosuke Komatsu, Yutaka Sasaki, Miroslav Svoboda, Martin Sajdl, Jiri Sonsky
  • Patent number: 11002759
    Abstract: A scanning probe microscope includes a cantilever structure; and a metallization layer on the cantilever structure. The cantilever structure and the metallization layer expand and contract at equivalent rates upon thermal loading. The cantilever structure and the metallization layer may include matching coefficient of thermal expansion levels. The cantilever structure may include SiN. The metallization layer may include 50 nm of Ti. The metallization layer may include 50 nm of Cr. The metallization layer may include 5 nm of Ti and 45 nm of Ge. The cantilever structure may include no thermally-induced deflections.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 11, 2021
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Darin J. Sharar, Adam A. Wilson
  • Patent number: 11002692
    Abstract: The disclosure relates to a method of examining a sample using a charged particle microscope. The method comprises the steps of detecting using a first detector emissions of a first type from the sample in response to the beam scanned over the area of the sample. Then, using spectral information of detected emissions of the first type, at least a part of the scanned area of the sample is divided into multiple segments. According to the disclosure, emissions of the first type at different positions along the scan in at least one of said multiple segments may be combined to produce a combined spectrum of the sample in said one of said multiple segments. In an embodiment, a second detector is used to detect emissions of a second type, and this is used to divide the area of the sample into multiple regions. The first detector may be an EDS, and the second detector may be based on EM. This way, EDS data and EM data can be effectively combined for producing colored images.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 11, 2021
    Assignee: FEI Company
    Inventors: Tomas Tuma, Jan Hradil, Petr Hlavenka
  • Patent number: 10991542
    Abstract: The purpose of the present invention is to provide a charged particle beam device which adjusts brightness and contrast or adjusts focus and the like appropriately in a short time even if there are few detected signals. Proposed as an aspect for achieving this purpose is a charged particle beam device provided with: a detector for detecting charged particles obtained on the basis of irradiation of a specimen with a charged particle beam emitted from a charged particle source; and a control unit for processing a signal obtained on the basis of the output of the detector, wherein the control unit performs statistical processing on gray level values in a predetermined region of an image generated on the basis of the output of the detector, and executes signal processing for correcting a difference between a statistical value obtained by the statistical processing and reference data relating to the gray level values of the image.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: April 27, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Ryota Watanabe, Yuko Sasaki, Kazunari Asao, Makoto Suzuki, Wataru Mori, Minoru Yamazaki
  • Patent number: 10978269
    Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: April 13, 2021
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Po Tsung Hsieh, Chung Jen Chung, Shih Wen Tseng, Chiu Hua Huang, Tzu Hsin Chen, Ya Wen Tsai
  • Patent number: 10971325
    Abstract: In a device for observing a semiconductor wafer, a positional relationship between an in-wafer region and a background region in an imaging field of view is not constant when an outer peripheral portion of the wafer is imaged, which results in an increase in the quantity of calculation in defect detection and image classification processing and makes it difficult to efficiently perform defect observation and analysis. There is provided a defect observation system for a semiconductor wafer, and the system includes: a stage on which the semiconductor wafer is placed and which is movable in an XY direction, an imaging unit that is configured to image a portion including an edge of the semiconductor wafer, and an image output unit that is configured to, with respect to a plurality of images obtained by imaging, output images in which edges of the wafer are substantially in parallel among the plurality of images.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 6, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Minoru Harada, Yuji Takagi, Naoaki Kondo, Takehiro Hirai, Yohei Minekawa
  • Patent number: 10957513
    Abstract: An electron microscope includes: an electron detector which detects electrons emitted from a specimen upon irradiation of the specimen with an electron beam; an X-ray detector which detects X-rays emitted from the specimen upon irradiation of the specimen with the electron beam; and a processor which generates a three-dimensional element map based on output signals from the electron detector and the X-ray detector. The processor performs processing for generating a electron microscopic image based on the output signal from the electron detector, processing for generating a three-dimensional image of the specimen based on the electron microscopic image, processing for generating a two-dimensional element map based on the output signal from the X-ray detector, and processing for generating the three-dimensional element map by projecting the two-dimensional element map on the three-dimensional image.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: March 23, 2021
    Assignee: JEOL Ltd.
    Inventor: Shinichi Katagiri
  • Patent number: 10955369
    Abstract: Mask inspection apparatuses and/or mask inspection methods are provided that enable quick and accurate inspection of a registration of a pattern on a mask while a defect of the mask and the registration of the pattern are inspected simultaneously. The mask inspection apparatus may include a stage configured to receive a mask for inspection; an e-beam array including a plurality of e-beam irradiators configured to irradiate e-beams to the mask and detectors configured to detect electrons emitted from the mask; and a processor configured to process signals from the detectors. A defect of the mask may be detected through processing of the signal and registrations of patterns on the mask may be inspected based on positional information regarding the e-beam irradiators.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: March 23, 2021
    Inventors: Hyon-Seok Song, In-Yong Kang, Il-Yong Jang
  • Patent number: 10957608
    Abstract: A wafer topography measurement system can be paired with a scanning electron microscope. A topography threshold can be applied to wafer topography data about the wafer, which was obtained with the wafer topography measurement system. A metrology sampling plan can be generated for the wafer. This metrology sampling plan can include locations in the wafer topography data above the topography threshold. The scanning electron microscope can scan the wafer using the metrology sampling plan and identify defects.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: March 23, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: Arpit Yati, Shivam Agarwal, Jagdish Saraswatula, Andrew Cross
  • Patent number: 10955366
    Abstract: An electron diffraction apparatus measures an overall structure of a crystal of a specimen by electron diffraction. An NMR apparatus measures a local structure of the crystal by NMR measurement. An analysis apparatus combines the overall structure and the local structure to specify a structure of the crystal.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 23, 2021
    Assignees: JEOL Ltd., RIKEN
    Inventors: Koji Yonekura, Yusuke Nishiyama
  • Patent number: 10948426
    Abstract: The density difference of particle beam irradiation with two optical statuses is produced utilizing a diffraction effect, within the same field of vision, such that a diffraction grating manufactured with a material which passes through a particle beam is provided on the upper side of a specimen and on the lower side of the irradiation optical system. Further, a region wider than the opening region of the diffraction grating is irradiated with the particle beam to produce the density difference of the particle beam emitted to the specimen, by superposing the particle beam, Bragg-diffracted with the opening region, and the particle beam, transmitted through the outer peripheral part of the opening region without being diffracted, with each other, and emitting the beam to the specimen.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: March 16, 2021
    Assignee: RIKEN
    Inventors: Ken Harada, Keiko Shimada, Kodai Niitsu
  • Patent number: 10928740
    Abstract: A three-dimensional calibration structure for measuring buried defects on a semiconductor device is disclosed. The three-dimensional calibration structure includes a defect standard wafer (DSW) including one or more programmed surface defects. The three-dimensional calibration structure includes a planarized layer deposited on the DSW. The three-dimensional calibration structure includes a layer stack deposited on the planarized layer. The layer stack includes two or more alternating layers. The three-dimensional calibration structure includes a cap layer deposited on the layer stack. One or more air gaps are formed in the layer stack following deposition of the cap layer. The three-dimensional calibration structure includes one or more holes formed into at least one of the cap layer, the layer stack, or the planarized layer.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: February 23, 2021
    Assignee: KLA Corporation
    Inventors: Philip Measor, Robert M. Danen
  • Patent number: 10928336
    Abstract: A method for x-ray based evaluation of a status of a structure of a substrate, the method may include acquiring an electron image of a region of the substrate, the region comprises the structure; acquiring an x-ray image of the structure; and evaluating the status of the structure, wherein the evaluating is based at least on a number of x-ray photons that were emitted from the structure.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: February 23, 2021
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventor: Dror Shemesh
  • Patent number: 10914695
    Abstract: Methods for analyzing an accumulation of particles on a filter membrane involve analyzing comprise the particle accumulation in an optical analysis system using a light microscope, and then analyzing the particle accumulation in an SEM-EDX analysis system using a scanning electron microscope and energy-dispersive X-ray spectroscopy. In order to simplify and accelerate the testing of the filter membrane both in the optical analysis system and in the SEM-EDX system, the filter membrane is subject to a preparation which includes: (i) fixing the particles to the filter membrane, (ii) coating the particle accumulation with an electrically conductive coating which is produced from a conductivity solution that contains an ionic liquid, and (iii) holding the filter membrane flat or pulling the filter membrane taut.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: February 9, 2021
    Assignee: JOMESA MESSYSTEME GMBH
    Inventors: Johann Metzger, Jörn Lepelmeier, James Ju
  • Patent number: 10910959
    Abstract: An apparatus is provided. The apparatus includes a bidirectional comb drive actuator. The apparatus may also include a cantilever. The cantilever includes a first end connected to the bidirectional comb drive actuator and a second end connected to an inner frame. In addition, the cantilever may include first and second conductive layers for routing electrical signals. Embodiments of the disclosed apparatuses, which may include multi-dimensional actuators, allow for an increased number of electrical signals to be routed to the actuators. Moreover, the disclosed apparatuses allow for actuation multiple directions, which may provide for increased control, precision, and flexibility of movement. Accordingly, the disclosed embodiments provide significant benefits with regard to optical image stabilization and auto-focus capabilities, for example in size- and power-constrained environments.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 2, 2021
    Assignee: MEMS Drive, Inc.
    Inventors: Xiaolei Liu, Roman Gutierrez, Matthew Ng, Guiqin Wang
  • Patent number: 10910194
    Abstract: A charged particle beam device includes a charged particle source which emits a charged particle beam radiated on a sample; a condenser lens system which has at least one condenser lens focusing the charged particle beam at a predetermined demagnification; a deflector which is positioned between a condenser lens of a most downstream side and a charged particle source in the condenser lens system, and moves a virtual position of the charged particle source; and a control unit which controls the deflector and the condenser lens system. The control unit controls the deflector to move the virtual position of the charged particle source to a position of suppressing a deviation, which is caused by a change of the demagnification of the condenser lens system, of a center trajectory of the charged particle beam downstream of the condenser lens system.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: February 2, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventor: Shuhei Yabu
  • Patent number: 10908179
    Abstract: The present document describes a device for measuring and/or modifying surface features and/or sub-surface features on or below a surface of a sample. The system comprises a sample carrier, one or more heads, and a support structure. The support structure comprises a reference surface for providing a positioning reference. The heads are separate from the sample carrier and the support structure, and the device further comprises a pick and place manipulator arranged for positioning the heads at respective working positions. The manipulator comprises a gripper and an actuator for moving the gripper, wherein the actuator is arranged for providing a motion in a direction transverse to the reference surface. The gripper is arranged for engaging and releasing the respective heads from the transverse motion. The document also describes a method of measuring and/or modifying surface features on a surface of a sample.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 2, 2021
    Assignee: NEDERLANDSK ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    Inventor: Hamed Sadeghian Marnani
  • Patent number: 10903041
    Abstract: The present disclosure relates to a pattern measuring method to appropriately measure a height and a depth of a pattern having a high aspect ratio. The method includes measuring a width between a first pattern and another pattern formed on a wafer; calculating a value regarding an azimuth angle of a signal emitted from the wafer; and calculating height information from a portion between the first pattern and the other pattern to an upper portion of a pattern based on the measured width between the first pattern and the other pattern, the value regarding the azimuth angle, the value regarding an elevation angle, and relationship information thereof.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 26, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Uki Ikeda, Shunsuke Mizutani, Makoto Suzuki
  • Patent number: 10903044
    Abstract: A method of evaluating a region of a sample that includes an array of holes separated by solid portions. The method includes positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB); injecting a deposition gas onto the sample; scanning, with a first charged particle beam, a portion of the sample that includes a plurality of holes in the array of holes to locally deposit material within the plurality of holes in the scanned portion from the deposition gas; and milling, with the FIB column, the portion of the sample that includes the plurality of holes in which the material was locally deposited.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: January 26, 2021
    Assignee: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Alon Litman, Konstantin Chirko, Yehuda Zur
  • Patent number: 10903038
    Abstract: With strength of an objective lens set to first strength, a first scanned image of a sample is produced. The strength of the objective lens is set to second strength. A rotation amount difference of a charged particle beam between the case where the strength is set to the first strength and the case where the strength is set to the second strength is specified. At the second strength, with a scanner controlled such that the rotation for canceling the rotation amount difference is supplied to the charged particle beam, a second scanned image of the sample is produced. Based on a relative positional relationship between the first and second scanned images, a deflector is controlled such that positions of the first and second scanned images coincide with each other.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: January 26, 2021
    Assignee: Shimadzu Corporation
    Inventor: Takehiro Ishikawa
  • Patent number: 10896802
    Abstract: Disclosed herein are example embodiments for performing microscopy using microscope systems that combine both scanning-electron-microscope-cathodoluminescence (SEM-CL) microscopy and focused-ion-beam ion-induced optical emission (FIB-IOE) microscopy. Certain embodiments comprise operating a microscopy system in a first microscopy mode in which an electron beam interacts with a sample at a sample location and causes first-mode photons and electrons to be emitted, the first-mode photons including photons generated through a cathodoluminescence process; and operating a microscopy system in a second microscopy mode in which an ion beam interacts with a sample at the sample location and causes second-mode photons to be emitted, the second-mode photons including photons generated through an ion-induced luminescence process and photons generated through an atomic de-excitation process.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 19, 2021
    Assignee: FEI Company
    Inventors: Mostafa Maazouz, Galen Gledhill, Garrett Budnik, Jorge Filevich
  • Patent number: 10890852
    Abstract: Embodiments of the present disclosure are related to systems and methods for autofocusing an imaging apparatus in real-time during substrate scanning to pattern a substrate that includes a photoresist formed over one or more patterned materials. Displays of varying sizes can be fabricated using digital photolithography systems. The digital photolithography systems discussed herein, which may be referred to as imaging systems, use one or more exposure sources, including solid state emitter devices, for operations including patterning photoresists. Signal classifiers are used to perform shape and pattern recognition to determine whether signals received during substrate scanning are from a top photoresist surface or from sub-surface layers. One or more parameters of the imaging apparatus can be adjusted or maintained based on the signal analysis.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: January 12, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Rashid M. Sallak
  • Patent number: 10883934
    Abstract: An optical sensor apparatus is disclosed. The apparatus comprises: a sample holder, configured to hold a sample, in operation; a probe, comprising an arrangement of luminescent quantum dots; an optical source, configured to optically excite the luminescent quantum dots; an optical detector, configured to read optical signals from the quantum dots; and a circuit. The circuit is connected to the optical detector and configured to determine correlations between optical signals read by the optical detector. The probe is positioned or positionable relatively to, e.g., at a distance from, the sample, such that optical signals transmitted by each of the quantum dots are influenced by the sample, in operation. The present invention is further directed to related methods of operation and fabrication methods.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: January 5, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Rainer F. Mahrt, Gabriele Raino, Thilo H. C. Stoeferle
  • Patent number: 10884228
    Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: January 5, 2021
    Assignee: KLA-Tencor Corporation
    Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
  • Patent number: 10876900
    Abstract: Systems and methods for measuring temperature in an environment by creating a first beam having an energy of about 50 mJ/pulse, and a pulse duration of about 100 ps. A second beam is also created, having an energy of about 2.3 mJ/pulse, and a pulse duration of about 58 ps. The first beam and the second beam are directed into a probe region, thereby expressing an optical output. Properties of the optical output are measured at a sampling rate of at least about 100 kHz, and temperature measurements are derived from the measured properties of the optical output. Such systems and methods can be used to measure temperature in environments exhibiting highly turbulent and transient flow dynamics.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: December 29, 2020
    Inventors: James R. Gord, Sukesh Roy, Paul S. Hsu, Naibo Jiang, Mikhail N. Slipchenko
  • Patent number: 10872407
    Abstract: A method of detecting defects includes: obtaining a gray-scale image of a substrate to be detected; obtaining a gray-scale difference g between different regions in the gray-scale image; calculating an estimated value of a film thickness difference d between the different regions in the gray-scale image according to the gray-scale difference g; and determining whether the substrate to be detected is qualified according to the estimated value of the film thickness difference d.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: December 22, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhengdong Xi, GyuHyun Lee, Chaoqiang Liu, Jianhong Wang, Jinshun Wang