Abstract: A fault detection and classification method is disclosed that uses raw back-focal-plane image data of radiation from a substrate surface, detected by a scatterometer detector, to determine a variation in the raw data and correlate the variation in the raw data with a possible fault in a lithographic apparatus or a process that patterned the substrate surface. The correlation is carried out by comparing the variation in the raw data with known metrology data. Once a fault has been determined, a user may be notified of the fault.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: The orientation of a machine 2 relative to a work-piece 10 is manually controlled by means of an alignment device 4. The device 4 includes a light source 24 rigidly attached to a foot 12 that is resiliently movably attached to the main body 18 of the device. The body 18 of the device 4 houses a light detector 26 for detecting a light beam from the light source 24, the position of the region on the detector 26 illuminated by the beam depending on the orientation of the machine 2 relative to the work-piece 10. The operator is provided with feedback on whether the machine 2 is correctly aligned with a target orientation (usually perpendicular to the surface) and concerning the direction of corrective movement required, if any.

Abstract: An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.

Abstract: In a survey system in which guide light is emitted from the side of a target, and, on the side of a surveying instrument, a telescope is directed roughly toward the target by receiving the guide light so as to shorten the time required for automatic collimation, the automatic collimation of the surveying instrument can be reliably performed by removing guide light reflected by reflective objects such as windowpanes. The target has a guide light remitter that emits guide light The guide light transmitter includes a light source, a polarizing plate that changes light emitted from this light source into linearly polarized light, and a quarter-wave plate that changes this nearly polarized light into circularly polarized guide light The surveying instrument includes a direction detector and a collimation preparing means. The direction detector includes a quarter-wave plate and a polarizing plate.

Abstract: Example embodiments relate to a wafer aligning apparatus and a method thereof. The wafer aligning apparatus may include a first light sensor unit adapted to output light to an edge of a wafer, a second light sensor unit adapted to output light on a marking position of the wafer, and a controller to calculate a wafer aligning value from an edge position value and a marking position value read from the first and the second light sensor units, respectively.

Abstract: A lithography apparatus is provided. The apparatus includes: a stage, a first light source unit, an optical system, an image obtaining means, an image edit means, an LC panel, and a second light source unit. The LC panel is coupled with the optical system and receives a signal of the image edited by the image edit means and displays the received image to perform a photo mask function. The second light source unit provides light used in performing an exposure on the test material using the imaged displayed on the LC panel for a photo mask.

Abstract: An electron beam apparatus including a table which mounts a specimen and is movable in three dimensional directions, an electron beam optical system irradiating an electron beam onto a specimen and for detecting a secondary electron emanated from the specimen by the irradiation of the electron beam, and a surface height detection system for detecting height of the surface of the specimen mounted on the table. A focus control system controls a relative position between a focus position of the electron optical system and the table in accordance with information of the height, and an image processing system obtains an image from the detected secondary electron and processes the obtained image to detect a defect on the surface of the specimen.

Abstract: A method and system position a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. The method generates a metrology laser beam and propagates the metrology laser beam along a propagation path to a metrology laser beam spot on or near a structure to be selectively processed. The method detects a reflection of the metrology laser beam from the structure, thereby generating a reflection signal, and determining, based on the reflection signal, a position of the metrology laser beam spot relative to the structure.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. A metrology laser beam spot is directed to one or more of those structures to be selectively processed (e.g., laser-severable conductive links), and reflections of the metrology laser beam off of those structures to be selectively processed are detected to perform the measurement, determination, or alignment. The processing laser beam can then be accurately directed onto those structures to process them on a selective basis. The various methods and systems thus utilize those structures themselves—rather than relying exclusively on dedicated alignment markers—to perform the measurement, determination, or alignment.

Abstract: A method for optimizing an alignment condition of a lithographic projection apparatus. This method comprises projecting a beam of radiation on a target portion of a substrate and measuring a plurality of diffracted signals emitted by the target portion. This method further comprises calculating a variance for each of the plurality of diffracted signals, such that a plurality of variances of the diffracted signals is determined, and adjusting the alignment condition of the lithographic projection apparatus based on analysis of the plurality of variances.

Abstract: A method for manufacturing a marker structure including line elements and trench elements arranged in a repetitive order includes filling the trench elements with silicon dioxide and leveling the marker structure. A sacrificial oxide layer is grown on the semiconductor surface, and a first subset of the line elements is exposed to an ion implantation beam including a dopant species to dope and change an etching rate of the first subset. The substrate is annealed to activate the dopant species, and the semiconductor surface is etched to remove the sacrificial oxide layer and to level the first subset to a first level and to create a topology such that the first subset has a first level differing from a second level of a surface portion of the marker structure different from the first subset.

Abstract: Apparatus and method for creating 3D imagery of an object using calibration means to transfer data to a reference frame and visibility analysis to determine and resolve occlusion.

Abstract: Techniques for determining wafer stage grid and yaw in a projection imaging tool are described. The techniques include exposing an overlay reticle onto a substrate having a recording media, thereby creating a plurality of printed fields on the substrate. The overlay reticle is then positioned such that when the reticle is exposed again completed alignment attributes are created in at least two sites in a first and a second printed field. The substrate is then rotated relative to the reticle by a desired amount. The overlay reticle is then positioned such that when the reticle is again exposed, completed alignment attributes are created in at least two sites in the first and a third printed field. Measurements of the complementary alignment attribute and a dynamic intra-field lens distortion are then used to reconstruct wafer stage grid and yaw error of the projection imaging system.

Abstract: A method and apparatus for determining lens distortion in a projection imaging tool are described. The techniques include exposing at least one alignment attribute onto a substrate having a recording media. A complementary alignment attribute is also exposed onto the substrate such that the complementary alignment attribute and alignment attribute form a completed alignment attribute. The exposure of the alignment attributes, or the complementary alignment attribute, or both, may be accomplished by multiple sub nominal dose exposures. Intra field distortion of the projection imaging tool is determined from measurements of the exposed completed alignment attributes. The alignment attributes and complimentary alignment attribute may be part of a reticle. The transmission of the alignment attribute may be different than the transmission of the complementary alignment attribute.

Abstract: An apparatus and method measures the gap between one substantially planar object, such as a mask, and a second planar object, such as a substrate. A gapping mark is used for measuring a gap between the first and second plates. The gapping mark includes a first grating on a first surface of a first plate, the first grating having a first uniform period in a first direction. A second grating is located on the first surface of the first plate, the second grating being adjacent to the first grating in the first direction, the second grating having a second uniform period in the first direction. The gapping mark also includes a third grating on the first surface of the first plate, the third grating being adjacent to the first grating in a second direction, the second direction being substantially orthogonal to the first direction, the third grating having the second uniform period in the first direction.

Abstract: A near field analysis apparatus comprising: an irradiation optical system comprising an irradiation-side adjustable optical system for adjusting the position or angle of an optical axis thereof, and irradiating irradiation-side guide light onto an adjustment surface via the irradiation-side adjustable optical system; a light collecting optical system comprising a light-collection-side adjustable optical system for adjusting the position or angle of an optical axis thereof, and irradiating light-collection-side guide light onto the adjustment surface via the light-collection-side adjustable optical system; an irradiation-side adjustment device for adjusting the position or angle of the irradiation-side adjustable optical system such that the spots of the guide light, which are observed at the adjustment surface, match; and a light-collection-side adjustment device for adjusting the position or angle of the light-collection-side adjustable optical system such that the spots of the guide light, which are observe

Abstract: A laser measuring method in a laser measuring system, which comprises a rotary laser system for projecting a laser beam by rotary irradiation and at least one photodetection system having at least one photodetector for receiving the laser beam, comprising a step of emitting at least two fan-shaped laser beams by the rotary laser system, at least one of the fan-shaped laser beams being tilted, a step of receiving the laser beams at least at three known points by the photodetection system, a step of obtaining elevation angles with respect to the rotary laser system based on photodetection signals which are formed when the photodetector receives the laser beam, and a step of measuring an installing position of the rotary laser system based on elevation angles and position data at the three known points.

Abstract: Scanning device (1) for register marks (21, 22, 31, 32) printed onto a substrate (2) travelling into a polychrome printing machine. This device comprises at least one light source (3, 4) enlightening, onto the substrate (2), a lighting area (5) crossed by the register marks (21, 22, 31, 32), an optic (6) which allows obtaining onto a photosensitive element (7) the images of said register marks named as a plurality of portions (8) successively scanned with a certain scanning rate, as well as a microprocessor (9) driving the light of the light source (3, 4) and controlling electric pulses issued by pixels (17) of the photosensitive element (7). The source (3, 4) enlightens the lighting area (5) of the substrate (2) with at least one modulation of its color and/or of its intensity during the simultaneous or sequential scanning of at least two register marks. (21, 22, 31, 32).

Abstract: A tool operates with a guide system to identify the orientation of a tool on a work piece. In one implementation, the tool identifies its orientation with respect to a guide signal supplied by the guide system. In an alternate embodiment, the tool determines its absolute orientation, such as a (x, y) coordinate. The tool includes an action component adapted to alter the work piece, such as a cutting head in a router. A guide detector in the tool detects a position of a guide signal from the guide system. A location detector in the tool receives the position data and employs it to determine the tool's orientation. Based on the detected orientation, the tool decides whether any tool adjustments are necessary. Examples of tool adjustments include the following: adjusting the position of the action component, enabling or disabling the action component, and providing operating indicators to direct a tool operator's use of the tool.

Abstract: A surface position detecting system for detecting surface information related to a substrate. The system includes a single sensor for measuring surface positions at plural locations on the substrate, while relatively scanning the substrate, a discriminating device for discriminating, beforehand, effectiveness/ineffectiveness of the sensor during scanning measurement, on the basis of information related to substrate processing, and a calculating device for calculating, during scanning measurement, the surface information of the substrate on the basis of the surface positions measured by the sensor discriminated as being effective by the discriminating device.

Abstract: An exposure apparatus for exposing a substrate moving in a scan direction to light directed via an original. The apparatus includes a projection optical system configured to image a pattern of the original on the substrate, a substrate stage configured to hold the substrate and to move, and a detector configured to detect a surface position of the substrate, held and moved in the scan direction at a scan speed by the substrate stage, in a direction parallel to an optical axis of the projection optical system over a detection region preset on the substrate.

Abstract: A bearing with an oil film thickness measuring device in which sensor portions at distal ends of four common optical fibers are connected to sensor mounting portions formed at four positions in an axial direction of a bearing body. A lubricating oil containing a fluorescent agent is supplied to a sliding surface of the bearing body. A laser beam generated from a laser beam generator is branched into four beams, which are applied to an oil film on a sliding surface through each of sensor portions. Fluorescence generated by the fluorescent agent in the oil film, passing through a return-route optical fiber, is introduced into a photomultiplier tube, and is detected. Since the fluorescence intensity detected by the photomultiplier tube is proportional to the thickness of oil film, the absolute value of oil film thickness can be measured. In this case, the oil film thickness can be measured at four positions.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements comprise at least two measurements with different polarization states of incident light, each measurement including illuminating eh measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between eth diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: A method for recursively determining alignment of a flight vehicle during flight is provided. The method includes generating data in a reference coordinate frame and in a second coordinate frame at a plurality of points in time during the flight, recursively generating first and second matrices from the data in the reference coordinate frame and the second coordinate frame, and at each point in time, determining an alignment output based on the inverted first matrix and the second matrix.

Abstract: A method of device inspection, the method comprising providing an asymmetric marker on a device to be inspected, the form of asymmetry of the marker being dependent upon the parameter to be inspected, directing light at the marker, obtaining a first measurement of the position of the marker via detection of diffracted light of a particular wavelength or diffraction angle, obtaining a second measurement of the position of the marker via detection of diffracted light of a different wavelength or diffraction angle, and comparing the first and second measured positions to determine a shift indicative of the degree of asymmetry of the marker.

Abstract: An apparatus, system and method for measuring a feature of a three-dimensional object, such as a wafer carrier, are provided. The apparatus is for use with an optical scanner and comprises a mounting structure adapted to be disposed on the scanner. The mounting structure has a calibration mark adapted to be read by the scanner and is adapted to position the object so that it is at a first pre-determined distance from the calibration mark. In one aspect of the present invention, the mounting structure further comprises an alignment surface adapted to abut the object. The alignment surface is disposed at a second pre-determined distance from the calibration mark. In another aspect of the present invention, the alignment surface is adapted to abut the object at a point spaced apart from the scanning surface.

Abstract: A method for aligning a workpiece may include determining a first and second position of a first edge of the workpiece based on a first and a second position of a pickup device. The workpiece may be aligned based on the first and second position of the pickup device. The at least first and second positions of the pickup device may be determined based on an intersection of a laser beam and the workpiece.

Abstract: Noted portions of an image, such as a pin point hole in an isolated area or a pattern contour that forms a continuous boundary area, are clearly displayed by first erasing background noise by acquiring information regarding differences between an image detection signal (pixel) of each scanned position (dot) in matrix form and image detection signals of the surrounding scanned positions, and secondly, by adopting a value that is either a largest or smallest value greater than or equal to zero among a plurality of sets of information on value differences as new image information for the scanned position.

Abstract: In an electronic component mounting apparatus capable of replacing a component placing device with any of plural other component placing devices different in performance, the distance between the center line of a component pick-up portion of a replaced component placing device and the optical axis of a board recognizing camera is calibrated easily and precisely. A movable table is positioned so that a reference mark provided on a base frame to reside in the visual field of a component recognizing camera comes in the visual field of a board recognizing camera and that at the same time, the end of the component pick-up portion of the replaced component placing device comes in the visual filed of the component recognizing camera.

Abstract: A method of reticle inspection, comprising generating a test reticle comprising a plurality of test pattern-features thereon; manufacturing a wafer using the reticle; and determining a transfer of at least one of said plurality of pattern features from said reticle to said wafer. Preferably, a neural network is trained using the determination. Preferably, a reticle is inspected by running detected defects through the neural network to determine if the detected defect has a consequence.

Abstract: A method of selecting a pattern to be measured includes selecting only points from a combination of all factors effecting dimensional fluctuations. For example, fluctuation between wafers, fluctuation in a wafer, and fluctuation in a chip are candidates for measurement points of patterns to be measured. Further, the number of the selected points corresponds to a divisor of the combination of all factors.

Abstract: A material web attribute detection system with the material web having a first side and a second side. The system includes a radiation source located proximate to the first side of the material web and emitting radiation toward the material web, and a radiation detection array located proximate to the second side of the material web and producing a plurality of signals based on the radiation detected from the radiation source. A processor is included which utilizes the plurality of signals to determine a lateral offset and a gap size of the radiation detection array relative to the radiation source. The processor can then compensate for the radiation detection array and radiation source relative misalignment using the plurality of signals, the lateral offset and the gap size.

Abstract: A system and sensor for measuring, inspecting, characterizing, evaluating and/or controlling optical lithographic equipment and/or materials used therewith, for example, photomasks. In one embodiment, the system and sensor measures, collects and/or detects an aerial image (or portion thereof) produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a production-type photomask (i.e., a wafer having integrated circuits formed therein/thereon) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits. A processing unit, coupled to the image sensor unit, may generate image data which is representative of the aerial image by, in one embodiment, interleaving the intensity of light sampled by each sensor cell at the plurality of location of the platform.

Abstract: An object is held on a stage of an equipment, the stage is rotated in order to acquire a detection signal corresponding to a position of an outer peripheral edge of the object, a displacement of the object with respect to an alignment reference position is obtained based on this detection signal, and the stage is subjected to movement control so as to eliminate this displacement, thereby aligning the object.

Abstract: While the alignment beam is focused on a mark on the substrate table, the substrate table is moved substantially perpendicularly to the alignment beam. If the image of the mark moves relative to a reference mark, then the substrate and the alignment beam are not perpendicular. The mark on the substrate table is aligned to a plurality of reference marks. At least two substrate marks are then aligned with a single reference mark. Errors due to the inclination of the alignment beam are eliminated from the expansion and rotation values calculated for the substrate.

Abstract: There is disclosed a laser processing method including moving a mask and a work with respect to each other while emitting a pulse laser a plurality of times, and moving the mask and the work with respect to each other to form respective laser irradiated regions disposed adjacent to one another by irradiating the work with the pulse laser transmitted through openings formed in positions different from one another on the mask, so that boundaries of the laser irradiated regions disposed adjacent to each other contact at least each other.

Abstract: An exposure apparatus has a surface position detection apparatus for measuring the surface position of a measurement area on the surface of a wafer. The surface position detection apparatus scans a shot area on the wafer having a pattern structure and detects the surface position of a measuring point provided within the shot. Prior to detecting the surface position of the measuring points within the shot, drive parameters for the surface position detection apparatus are determined according to a scanning speed employed for the shot in order that a measurement area of the surface position detection apparatus for the measuring points assumes a preset size. The surface position detection apparatus is then driven according to the parameters so determined, measuring the surface position of the measuring point in the shot. The exposure process is then controlled in accordance with the results of those measurements.

Abstract: The arrangement comprises a hot or cool plate (12) that has a substantially planar surface for accommodating the semiconductor substrate and for transmitting heat between the hot or cool plate and the semiconductor substrate, a source (10) of heat or cold that is connected to the hot or cool plate (12) for the purpose of heating or cooling, a device (25) for depositing or lifting the semiconductor substrate (8) onto/from the surface of the hot or cool plate (12). A light source (200) can be used to generate a focused light beam (80), preferably a laser beam, which is detected by a detector (100) with at least one sensor (110–140) after reflection by a wafer (8) deposited on the hot or cool plate (12). A control unit that is connected to the detector (100) for the purpose of evaluating a position of the reflected light beam determines a possible deposition error by comparing the position with one of a wafer (8) deposited with its entire surface on the hot or cool plate (12).

Abstract: A scanning exposure apparatus includes a surface position adjuster for adjusting the surface position of an object with respect to an image plane of a projection optical system, on the basis of a detection by the surface position detector in the projection, a controller for controlling a moving system and the surface position detector to perform a pre-scan measurement of the surface position of the object, prior to the projection, so as to detect an error, related to the detection through the surface position detector, with respect to each of detection points, which error is attributable to a difference in pattern structure at the detection points in the region, the detected error being used for correcting the adjustment by the surface position adjuster in the projection, and an initializing device for initializing the surface position detector in synchronism with the scan motion and the projection, at the position where the surface position detector has started the detection in the pre-scan measurement.

Abstract: Apparatus for correcting positional deviations of at least one area of a subject along one or more subject position axes.

Abstract: A method involves aligning each of two optical components to be joined relative to a common standard, removing the common standard, and joining each of two optical components to each other in alignment.

Abstract: An electron beam apparatus including a table which mounts a specimen and is movable in three dimensional directions, an electron beam optical system irradiating an electron beam onto a specimen and for detecting a secondary electron emanated from the specimen by the irradiation of the electron beam, and a surface height detection system for detecting height of the surface of the specimen mounted on the table. A focus control system controls a relative position between a focus position of the electron optical system and the table in accordance with information of the height, and an image processing system obtains an image from the detected secondary electron and processes the obtained image to detect a defect on the surface of the specimen.

Abstract: Method and apparatus for inspecting articles, such as training pants, by use of multiple zones of irradiation sources whose intensity can be varied from one zone to another to adjust for different thicknesses of materials and the like to provide a clearer image of the various edges and seams.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: Features of the present invention provide an optical layout that can accommodate the relatively strict enclosure requirements for compact component alignment sensor. Specifically, aspects of the present invention provide a single optical component that reduces the degree of divergence, and preferably substantially collimates light from the plurality of divergent light sources prior to entering the sensing field. In this regard, part count is kept low and the physical size of the optical train itself is relatively small.

Abstract: A method and apparatus for determining the dynamic scanning distortion present in lithographic scanners. A special reticle pattern is exposed over the full field that is to be characterized. The wafer is then rotated 90 degrees and one or more exposures over the same field are made. Interlocking alignment structures on the resulting developed wafer are then measured and used to reconstruct the dynamic scanner distortion to within a translation, rotation, and scan skew. Alternative embodiments describe techniques for extracting the repeatable part of the dynamic scan error.

Abstract: An alignment system and method is disclosed, the alignment system and method provide for alignment of at least one component to an optical signal using a neural controller circuit. The neural controller circuit facilitates parallel and sequential alignment of a plurality of components to the optical signal.