Schottky Barrier To Polycrystalline Semiconductor Material Patents (Class 257/73)
  • Patent number: 5206523
    Abstract: A process is disclosed for producing microporous crystalline silicon which has a band-gap substantially increased relative to that of normal crystalline silicon. This process involves the preparation of quantum wires of silicon by means of a chemical attack method carried out on silicon that has been doped such that it conducts electricity substantially via the effective transport of electric charge by means of so-called holes. The microporous crystalline silicon thus produced is in the form of a discrete mass having a bulk-like, interconnected crystalline silicon structure of quantum wires whose band-gap is greater than normal crystalline silicon. Because of this increased band-gap this microporous crystalline silicon may be used as an active element in applications such as tandem solar cells.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: April 27, 1993
    Inventors: Ulrich M. Goesele, Volker E. Lehmann
  • Patent number: 5173761
    Abstract: A method and apparatus for contructing diamond semiconductor structures made of polycrystalline diamond thin films is disclosed. The use of a polycrystalline diamond deposition on a substrate material provides an advantage that any substrate material may be used and the ability to use polycrystalline diamond as a material is brought about through the use of an undoped diamond layer acting as an insulating layer which is formed on a boron-doped layer. Because of the structure, ion implantation can be employed to reduce the ohmic contact resistance. The ion implantation also provides that the entire structure can be made using a deep implant to form a channel layer which allows the insulating gate structure to be formed as an integral part of the device. The buried channel can be doped through the use of several implantation steps through the insulating undoped layer.
    Type: Grant
    Filed: January 28, 1991
    Date of Patent: December 22, 1992
    Assignee: Kobe Steel USA Inc., Electronic Materials Center
    Inventors: David L. Dreifus, Kumar Das, Koichi Miyata, Koji Kobashi