Abstract: Provided are a power conversion device and a system using the same, which can reduce loss of each semiconductor element in a power conversion circuit and enable high efficiency of a device controlled by the power conversion device. The power conversion device includes a direct current (DC) power source; and a full-bridge circuit having first upper and lower arms having an upper element and a lower element and second upper and lower arms having an upper element and a lower element, in which the first upper and lower arms and the second upper and lower arms are electrically connectable to a device, and ON resistances of the upper element of the first upper and lower arms and the lower element of the second upper and lower arms are smaller than ON resistances of the lower element of the first upper and lower arms and the upper element of the second upper and lower arms.

Abstract: Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly.

Abstract: Cryogenic sample analysis systems are provided that can include: a system housing in direct physical contact with an environment about the system; a sample platform within the system housing; and a resonance frequency insulating assembly operatively engaged between the sample platform and the housing. Cryogenic sample analysis systems are also provided that can include: a system housing in direct physical contact with an environment supporting and surrounding the system; a sample platform within the system and operationally coupled to a coldhead of the system; and an insulating assembly operatively engaged between resonance frequencies generated by the environment and/or the coldhead, the insulating assembly comprising a suspended mass.

Abstract: A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Abstract: A semiconductor device includes a semiconductor substrate, a first diffusion region formed in the semiconductor substrate, a semiconductor element formed in the first diffusion region, and a channel formed in the first diffusion region to receive a cooling fluid.

Abstract: One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component, a lid sealed to the base, the lid including a fillport, and the fillport hermetically sealed by light irradiation.