Packaging, Interconnects, And Markings For Semiconductor Or Other Solid-state Devices (epo) Patents (Class 257/E23.001)
E Subclasses
- Internal lead connections, e.g., via connections, feedthrough structures (EPO) (Class 257/E23.011)
- Consisting of lead-in layers inseparably applied to semiconductor body (EPO) (Class 257/E23.012)
- Consisting of soldered or bonded constructions (EPO) (Class 257/E23.023)
- Flexible arrangements, e.g., pressure contacts without soldering (EPO) (Class 257/E23.078)
- For integrated circuit devices, e.g., power bus, number of leads (EPO) (Class 257/E23.079)
- Arrangements for heating (EPO) (Class 257/E23.081)
- Cooling arrangements using Peltier effect (EPO) (Class 257/E23.082)
- Mountings or securing means for detachable cooling or heating arrangements; fixed by friction, plugs or springs (EPO) (Class 257/E23.083)
- Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (EPO) (Class 257/E23.087)
- Complete device being wholly immersed in fluid other than air (EPO) (Class 257/E23.095)
- Involving transfer of heat by flowing fluids (EPO) (Class 257/E23.097)
- Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (EPO) (Class 257/E23.101)
Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) (Class 257/E23.116)
- Including external interconnections consisting of multilayer structure of conductive and insulating layers inseparably formed on semiconductor body (EPO) (Class 257/E23.142)
- Including internal interconnections, e.g., cross-under constructions (EPO) (Class 257/E23.168)
- Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (EPO) (Class 257/E23.169)
- Characterized by shape of container or parts, e.g., caps, walls (EPO) (Class 257/E23.181)
- Characterized by material of container or its electrical properties (EPO) (Class 257/E23.191)
- Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (EPO) (Class 257/E23.193)