Abstract: A disk device includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has rigidity higher than the flexible printed circuit board and is attached to the flexible printed circuit board. The flexible printed circuit board with a first through hole includes a first surface facing the electronic component with a gap, and a second surface opposite the first surface and facing the wall, the first through hole being open to the first surface and the second surface to communicate with the gap. The wall is provided with a second through hole penetrating the wall to communicate with the first through hole.

Abstract: Implants must protect against implant contamination and corrosion of electronics. However, when electrical components are fitted to flexible substrates, failure can occur at electrical connections. An implant comprises: a flexible substrate; a first and second electrical component at a first and second position, electrically connected through an interconnect layer; a first and second component cover, separately encapsulating the first and second component to resist the ingress of body fluids into the component positions; wherein the flexible substrate allows a relative change in disposition between the first component cover and the second component cover. One or more electrodes are provided at a third position. By encapsulating each component separately, the position of force/tension is moved away from the component attachment position to a point somewhere between the component positions. By disposing one or more electrode away from the components, the ingress is further restricted.

Abstract: Techniques and mechanisms for coupling chiplets to microchips utilizing active bridges. The active bridges include circuits that provide various functions and capabilities that previously may have been located on the microchips and/or the chiplets. Furthermore, the active bridges may be coupled to the microchips and the chiplets via “native interconnects” utilizing direct bonding techniques. Utilizing the active bridges and the direct bonding techniques of the active bridges to the microchips and the chiplets, the pitch for the interconnects can be greatly reduced going from a pitch in the millimeters to a fine pitch that may be in a range of less than one micron to approximately five microns.

Abstract: Embodiments that allow both high density and low density interconnection between microelectronic die and motherboard via. Direct Chip Attach (DCA) are described. In some embodiments, microelectronic die have a high density interconnect with a small bump pitch located along one edge and a lower density connection region with a larger bump pitch located in other regions of the die. The high density interconnect regions between die are interconnected using an interconnecting bridge made out of a material that can support high density interconnect manufactured into it, such as silicon. The lower density connection regions are used to attach interconnected die directly to a board using DCA. The high density interconnect can utilize current Controlled Collapsed Chip Connection (C4) spacing when interconnecting die with an interconnecting bridge, while allowing much larger spacing on circuit boards.

Abstract: A display substrate includes a substrate, including a plurality of island portions spaced apart from each other and a plurality of bridge portions connected between the island portions, the substrate having a plurality of openings in regions without the plurality of island portions and the plurality of bridge portions; a layer structure on each of the plurality of island portions and including a light-emitting layer, a common auxiliary layer and a first electrode layer stacked with each other, the layer structure on each of the plurality of island portions forms at least one light-emitting unit. On each of the plurality of island portions, an orthographic projection of the common auxiliary layer on the island portion covers an orthographic projection of the light-emitting layer on the island portion.

Abstract: A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.

Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member may include: a first supporter and a second supporter overlapping with the non-folding portions; and a plurality of supporting units overlapping with the folding portion.

Abstract: The present disclosure provides a display panel and a bonding method of the display panel. Signal lines of a display area of the display panel extend to a bonding area of the non-display area. A conductive adhesive layer is formed in the bonding area. A waterproof adhesive layer is formed in the non-display area of the bonding area near the display area. The conductive adhesive layer includes a conductive-particles doped region and a first insulating rubber material region formed in the conductive-particles doped region near the display area.

Abstract: A display device includes a flexible first substrate including a display part, a bending part at one side of the display part, and a pad part at one side of the bending part; a back film adhered to a portion corresponding to the display part and the pad part on a bottom of the first substrate; a supporting member disposed below a portion of the back film corresponding to the display part, wherein the supporting member is not bent, and wherein the bending part of the first substrate is bent along a side of the supporting member; and a second substrate facing the display part.

Abstract: A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

Abstract: The application relates to a portable electronic device comprising a) a folded substrate carrying components of the device, and b) another, separate component having a fixed outer contour, and c) a housing for enclosing said folded substrate and said separate component, said housing having an inner contour, wherein said folded substrate is folded from a planar substrate along a folding line, said folded substrate exhibiting outer edges comprising a folded edge following said folding line. The application further relates to a method of manufacturing a folded substrate. The object of the present application is to facilitate miniaturization of a portable electronic device, such as a hearing aid. The problem is solved in that the folded substrate is shaped to provide that at least one of said outer edges follow(s) the fixed outer contour of the separate component and/or the inner contour of said housing.

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.

Abstract: A support such as a clamp (310) is configured to releasably hold a patterning device such as a reticle (300) to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate (312) having opposing first (313) and second (315) surfaces, a plurality of burls (316) located on the first surface and configured to contact the reticle, a second substrate (314) having opposing first (317) and second (319) surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements (318) are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

Abstract: The present invention mainly relates to a 3-D packaging structure based on a flexible substrate and a method for manufacturing the same; the method comprises: providing a bendable continuous flexible substrate, determining the shape of the substrate according to the size, the quantity and the shape of dies, and making surface wiring on the substrate to allow interlayer electrical connection; welding dies that are to be packaged onto the bendable continuous flexible substrate; filling the gaps between the dies and the substrate with an underfill; bending the substrates towards the center to allow the peripheral dies to coincide in parallel with the die situated at the center, and bonding the two layers of parallel dies with a bonding adhesive.

Abstract: A display device includes a flexible substrate having a display area for displaying an image, and a pad area adjacent the display area, a circuit film coupled to the flexible substrate at the pad area, and a passivation layer on at least a part of the circuit film and at part of the pad area.

Abstract: Flexible LED light arrays particularly suitable for use in clothing and other articles are disclosed. The light arrays are disposed on flexible printed circuit boards (PCBs). The flexible PCBs include substantially sinusoidal metal contact traces, along which the LEDs are attached at an angle preselected to minimize stresses in the expected directions of bending. The flexible PCBs may have control electronics provided on separate, attachable control boards, which may be either flexible or rigid. The flexible LED light arrays may also be arranged in master-slave configurations with a number of arrays, in which one master control array or board is attached to a number of slave arrays and handles external communication for the slave arrays.

Abstract: A driving board folding machine comprises a machine housing, a movable table and one or more pre-folding stations for holding an unfolded flexible circuit and a circuit housing. When the driving board folding machine is activated, the one or more pre-folding stations are moved to a folding station located within the machine housing and the flexible circuit is folded and inserted within the circuit housing. The driving board folding station is able to comprise multiple pre-folding stations on one or more sides of the movable table. A holding pin holds the flexible circuit in place while a forming press moves in order to preform the flexible circuit, fold the flexible circuit and move the circuit housing to insert the flexible circuit into the housing.

Abstract: An electronic apparatus includes a frame, at least one circuit board, at least one hardware device, and at least one first connector. The frame includes a first frame body and a second frame body. The first frame body includes a first wire therein. The circuit board includes a first edge and a second, and at least a portion of the circuit board is flexible. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The circuit board is electrically connected to the first wire. The hardware device is disposed on the circuit board. The first frame body includes a first inner surface, and the first connector is disposed on the first inner surface and electrically connected to the first wire, and the first edge of the circuit board is plugged in the first connector.

Abstract: A flexible board includes a first sheet section including a first principal surface, a second sheet section including a second principal surface and provided in a different position from the first principal surface in a normal direction to the first principal surface, at least one first bent sheet section configured to connect ends of the first and second sheet sections, the first bent sheet section including a third principal surface not parallel to the first and second principal surfaces, and at least two second bent sheet sections each including a fourth principal surface and provided in different positions from the third principal surface in a normal direction to the third principal surface. The second bent sheet sections are positioned so as to sandwich the first bent sheet section therebetween when viewed in a plan view in the normal direction to the third principal surface.

Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Abstract: A display device includes a TFT substrate with gate signal lines, drain signal lines, thin-film transistors connected thereto, a gate driver connected to the gate signal lines, a drain driver having output terminals connected to drain signal lines, and a film substrate having first wirings. The first wirings are disposed between the drain driver and the film substrate. The drain driver is mounted on the film substrate, and the output terminals are connected to the first wirings between the film substrate and the drain driver. The output terminal includes first group terminals formed in parallel with a longer edge of the drain driver, and second group terminals formed in parallel with the longer edge and disposed between the loner edge and the first group terminals.

Abstract: An electronic control unit includes a board, a heat-generating device, a connector, and a heatsink. The board has an insulating layer and a wiring pattern partially exposed outside the insulating layer. The heat-generating device is mounted on the board and electrically connected to the wiring pattern. The connector is located adjacent to the heat-generating device and has a connection terminal connected to the wiring pattern. The heatsink is located opposite to the board across the heat-generating device and in contact with the heat-generating device to dissipate heat of the heat-generating device. The wiring pattern has a land pattern including a mount portion and a connection portion. The heat-generating device is mounted on the mount portion. The connection terminal of the connector is connected to the connection portion.

Abstract: A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and conductors being bendable together about two orthogonal axes. The stretchable circuit also includes a stretchable sensor layer attached to the base substrate with a cavity formed therein which has a contact point exposing one of the plurality of stretchable conductors. The stretchable electronic circuit further includes a surface mount device (SMD) package with a conductor contact protrusion installed into the cavity, and wherein a substantially constant electrical connection is established between the conductor contact protrusion and the stretchable conductor at the contact point by tensile forces interacting between the stretchable base substrate and the stretchable sensor layer.

Abstract: A method for manufacturing an active device array substrate includes providing a flexible substrate having a transistor region and a transparent region; forming a gate electrode on the transistor region; sequentially forming a dielectric layer and a semiconductor layer to cover the gate electrode and the flexible substrate; removing a part of the semiconductor layer to form a channel layer above the gate electrode and removing a thickness of the dielectric layer disposed on the transparent region, such that a portion of the dielectric layer on the gate electrode has a first thickness, and another portion of the dielectric layer on the transparent region has a second thickness less than the first thickness; respectively forming a source electrode and a drain electrode on opposite sides of the channel layer; and forming a pixel electrode electrically connected to the drain electrode.

Abstract: A stretchable organic light-emitting display device includes a stretchable base plate including a stretchable substrate, first metal electrodes that are separated from each other and located in a plurality of rows on a the stretchable substrate, and first power wirings electrically coupling respective ones of the metal electrodes of each row, a light-emitting layer on the stretchable base plate, second metal electrodes located in a plurality of rows on the light-emitting layer and corresponding to the first metal electrodes, second power wirings for electrically coupling respective ones of the second metal electrodes of each row, and an encapsulation substrate covering the second power wiring.

Abstract: A display apparatus including an organic light emitting display including a terminal portion, a battery disposed on a surface of the organic light emitting display, and a flexible printed circuit board (PCB) bent to cover the organic light emitting display and the battery, a side of the flexible PCB being connected to the terminal portion and another side of the flexible PCB extending outside and attached to the battery.

Abstract: A display system provides a first semiconductor light source that is electrically connected in a first plane. A second semiconductor light source is electrically connected in a second plane separate from the first plane. A third semiconductor light source is electrically connected in the first plane at least a distance away from the first semiconductor light source equal to the width of the second semiconductor light source. The first plane and the second plane are merged into a combined plane by positioning the electrically connected second semiconductor light source between the electrically connected first semiconductor light source and the electrically connected third semiconductor light source.

Abstract: A reconfigurable polarity detachable connector assembly includes a housing defining two accommodation channels and providing a springy protruding member at a top side, two mating simplex connectors respectively detachably mounted in the accommodation channels of the housing, a fiber optic cable fastened to the housing with two optical fiber cores thereof respectively inserted into respective calibration support rods of the mating simplex connectors, and a sliding cap slidably coupled to the housing. The sliding cap is unlocked and can be moved backwardly relative to the housing to expose the optical fiber cores of the fiber optic cable to the outside of the housing for allowing position exchange between the two mating simplex connectors after the user presses the springy protruding member.

Abstract: A semiconductor device includes a wafer level substrate having a plurality of first conductive vias formed through the wafer level substrate. A first semiconductor die is mounted to the wafer level substrate. A first surface of the first semiconductor die includes contact pads oriented toward a first surface of the wafer level substrate. A first encapsulant is deposited over the first semiconductor die. A second semiconductor die is mounted to the wafer level substrate. A first surface of the second semiconductor die includes contact pads oriented toward a second surface of the wafer level substrate opposite the first surface of the wafer level substrate. A second encapsulant is deposited over the second semiconductor die. A plurality of bumps is formed over the plurality of first conductive vias. A second conductive via can be formed through the first encapsulant and connected to the first conductive via. The semiconductor packages are stackable.

Abstract: An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking.

Abstract: A stacked structure of semiconductor packages includes an upper semiconductor package, a lower semiconductor package and inter-package connectors. The upper semiconductor package includes an upper package substrate, a plurality of upper semiconductor chips stacked on the upper package substrate, and conductive upper connection lands formed on a bottom surface of the upper package substrate. The lower semiconductor package includes a lower package substrate, a plurality of lower semiconductor chips stacked on the lower package substrate, and lower through-silicon vias vertically penetrating the lower semiconductor chips. The inter-package connectors may electrically connect the through-silicon vias to the upper connection lands.

Abstract: A semiconductor device may include: first and second wiring boards separated from each other via a gap; a semiconductor chip; first and second groups of electrode pads; and first and second groups of connection pads. The semiconductor chip is fixed to upper surfaces of the first and second wiring boards, and has a first portion adjacent to the gap. The first and second groups of electrode pads are disposed on the first portion. The first and second groups of electrode pads are aligned adjacent to side surfaces of the first and second wiring boards, respectively. The side surfaces of the first and second wiring boards face each other. The first and second groups of connection pads are disposed on lower surfaces of the first and second wiring boards, respectively. The first and second groups of connection pads are aligned adjacent to the side surfaces of the first and second wiring boards, respectively.

Abstract: A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a stepped pad, a plurality of first bonding wires and a second bonding wire. The first semiconductor chip is stacked on a substrate having a plurality of bonding pads, the first semiconductor chip having a plurality of first chips pads formed along a side portion of the first semiconductor chip. The second semiconductor chip is stacked like a step of a staircase on the first semiconductor chip to form a stepped portion through which the first chip pads are exposed on the first semiconductor chip, the second semiconductor chip having a plurality of second chip pads formed along a side portion of the first semiconductor chip. The stepped pad is arranged between the first chip pads on the stepped portion of the first semiconductor chip, the stepped pad including an adhesive pad adhered to the first semiconductor chip and a conductive pad formed on the adhesive pad.

Abstract: Mitigating electrostatic discharge damage when fabricating a 3-D integrated circuit package, wherein in one embodiment when a second tier die is placed in contact with a first tier die, conductive bumps near the perimeter of the second tier die that are electrically coupled to the substrate of the second tier die make contact with corresponding conductive bumps on the first tier die that are electrically coupled to the substrate of first tier die before other signal conductive bumps and power conductive bumps on the second tier and first tier dice make electrical contact.

Abstract: In a lead frame used for manufacturing a semiconductor device by forming a circuit pattern group including unit lead frames having plural upper side terminal parts in the periphery of a semiconductor element mounting region in one line or plural lines and an outer frame surrounding the circuit pattern group in a state of having a gap in a lead frame material and then mounting a semiconductor element every the unit lead frame and carrying out necessary wiring and enclosing the entire surface of the circuit pattern group in which the semiconductor element is mounted and a part of the outer frame with a resin from an upper surface side and further etching from a lower surface side and forming lower side terminal parts joined to the upper side terminal parts of the circuit pattern group, the circuit pattern group and the outer frame are had and the inner edge of the outer frame is formed in an uneven portion in plan view and bonding between the resin and the outer frame is enhanced.

Abstract: A semiconductor package which is structured to allow for the edge mounting thereof in a vertical mount orientation. The semiconductor package comprises a flexible substrate or “flex circuit.” The flexible substrate includes a conductive pattern disposed on a first surface thereof, and a plurality of conductive pads or terminals disposed on a second surface thereof which is disposed in opposed relation to the first surface. Mounted to the first surface of the flexible substrate are one or more electronic components such as semiconductor dies. The semiconductor die(s) is/are electrically connected to the conductive pattern, and thereafter covered or encapsulated by a package body applied to a portion of the first surface of the flexible substrate. That portion of the flexible substrate including the conductive pads or terminals formed on the second surface thereof is thereafter folded and adhered to a portion of the package body through the use of a suitable adhesive.

Abstract: It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 ?m to 200 ?m inclusive. Further, an electronic device using the flexible light-emitting device is provided.

Abstract: A mounting structure includes: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is structured to be wrapped by the flexible wiring board, the mounting structure is provided with outer electrodes on both sides of the flexible wiring board, one side being a side where outer terminals of the semiconductor device are formed, and the other side being an opposite side thereof. At least one wiring layer is formed on the flexible wiring board. A supporting member is provided covering side faces and a surface of the semiconductor device opposite to the side where the outer terminals are formed and protruding from the side faces of the semiconductor device and extending toward the surface on which the outer terminals are formed.

Abstract: Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected ends. The connector is unbundled from an initial state in which the first and second connected ends are separated by a first proximate distance and applied in an extended state in which the first and second connected ends are separated by a second distance that is greater than the first proximate distance.

Abstract: A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract: The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.

Abstract: A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.

Abstract: Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected ends. The connector is unbundled from an initial state in which the first and second connected ends are separated by a first proximate distance and applied in an extended state in which the first and second connected ends are separated by a second distance that is greater than the first proximate distance.

Abstract: Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods.

Abstract: A first multilayer wiring structural body 16 and a second multilayer wiring structural body 56 are simultaneously formed on both surfaces 101A, 101B of a substrate 101 and thereafter the portion of a structural body 120 corresponding to a third region C1 is folded so as to oppose a second structural body 22 to a second structural body 62 and the first multilayer wiring structural body 16 is electrically connected to the second multilayer wiring structural body 56.

Abstract: A semiconductor apparatus of the present invention includes: (i) a wire substrate having an insulating substrate in which a plurality of wire patterns are provided, (ii) a semiconductor element installed on the wire substrate with the insulating resin interposed therebetween, and a plurality of connecting terminals provided in the semiconductor element are electrically connected to connecting terminals of the wire patterns, respectively. In the semiconductor apparatus, the insulating substrate has mark patterns for alignment of the connecting terminals of the semiconductor element and the connecting terminals of the wire patterns, and an entire upper face of each of the mark patterns is covered with the insulating resin.

Abstract: The present invention stacks integrated circuits into modules that conserve board surface area. In a precursor assembly devised as a component for a stacked circuit module in accordance with a preferred embodiment of the present invention, one or more stiffeners are disposed at least partially between a flex circuit and an integrated circuit. In a two-high stacked circuit module devised in accordance with a preferred embodiment of the present invention, an integrated circuit is stacked above a precursor assembly. The two integrated circuits are connected with the flex circuit of the precursor assembly. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules.