Packaging (epo) Patents (Class 257/E33.056)
  • Patent number: 11605619
    Abstract: A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: March 14, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Koji Taguchi, Yumiko Kameshima, Masaaki Katsumata
  • Patent number: 11587831
    Abstract: Provided is a method for machining a workpiece including a substrate that has front and back surfaces and a ductile material layer that contains a ductile material and is disposed on the front or back surface. The method includes a tape bonding step of bonding a tape on a side of the substrate of the workpiece, a holding step of holding the workpiece by a holding table via the tape, and a cutting step of relatively moving the holding table and a cutting blade to cause the cutting blade to cut into the ductile material layer and the substrate. In the cutting step, the cutting blade is rotated such that a portion of the cutting blade, the portion being located on a forward side in a moving direction of the cutting blade relative to the holding table, cuts into the workpiece from the ductile material layer toward the substrate.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: February 21, 2023
    Assignee: DISCO CORPORATION
    Inventor: Naoko Yamamoto
  • Patent number: 11582871
    Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: February 14, 2023
    Assignees: Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Pan Tang, Fu-Lin Chang
  • Patent number: 11569148
    Abstract: In this semiconductor device, a positioning protrusion is formed at a side surface of a sealing resin from which one end of a main electrode wire protrudes. Thus, the outer size of the sealing resin can be reduced as compared to a case where a positioning protrusion is formed at the bottom of the sealing resin. In addition, a thickness regulating protrusion is provided with a space from solder. Thus, it is possible to prevent interface separation or crack that would occur starting from a contact part between the thickness regulating protrusion and the solder, whereby the life of a joining part between a semiconductor module and a cooler can be ensured. Accordingly, a semiconductor device having enhanced heat dissipation property and reliability is obtained without increase in the outer size of the semiconductor module.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: January 31, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koki Hayakashi, Ryuichi Ishii, Dai Yoshii
  • Patent number: 11569474
    Abstract: An organic light-emitting diode (OLED) display and method of fabricating the same are disclosed. In one aspect, the OLED display includes a first substrate including a display area and a peripheral area surrounding the display area. The display area includes a plurality of pixels each including an OLED and the peripheral area includes a signal driver electrically connected to the pixels. A conductive layer is formed over the signal driver and on opposing sides of the signal driver and a second substrate is formed over the first substrate. The OLED display further includes a first seal interposed between the first and second substrates in the peripheral area and substantially sealing the first and second substrates and a second seal surrounding the first seal and formed over the signal driver.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: January 31, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventor: Do-Hoon Kim
  • Patent number: 11549656
    Abstract: A lighting unit for a motor vehicle, having a reflector, a circuit board with at least one light source, and a heat sink, wherein the circuit board is arranged on the reflector in an assembled state of the lighting unit in such a way that the light source is associated with a reflecting surface of the reflector for directed emission of the light emitted by the light source, and wherein the circuit board can be cooled in the region of the light source via the heat sink in the assembled state of the lighting unit. The circuit board is arranged between the reflector and the heat sink in the assembled state of the lighting unit and is positioned relative to the reflector and the heat sink in a predefined spatial position via the reflector and the heat sink.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: January 10, 2023
    Assignee: Hella GmbH & Co. KGaA
    Inventor: Martin Kappelhoff
  • Patent number: 11538718
    Abstract: Process for producing semiconductor devices in a substrate, comprising: photolithography of a pattern of a reticle onto a portion of the substrate, defining first elements of the semiconductor devices, an exposure of the pattern being repeated a plurality of times in order to define all of the devices, photolithography of a pattern of an etch mask over all of the substrate, etching photolithography patterns into one portion of the thickness of the substrate, wherein first dicing lanes encircling the devices are included in the pattern of the etch mask and/or of the reticle, and the photolithography of the etch mask defines second dicing lanes defined by predetermined fracture lines of the edges of the substrate, and furthermore comprising the implementation of a step of irradiating the substrate with a laser beam through the first and second dicing lanes.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 27, 2022
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, SAFRAN
    Inventors: Mikaël Colin, Audrey Berthelot
  • Patent number: 11532776
    Abstract: Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: December 20, 2022
    Assignee: ROHM CO., LTD.
    Inventor: Tomoichiro Toyama
  • Patent number: 11485903
    Abstract: Systems and methods to provide multiple channels of light to form a blended white light output, the systems and methods utilizing recipient luminophoric mediums to alter light provided by light emitting diodes. The predetermined blends of luminescent materials within the luminophoric mediums provide predetermined spectral power distributions in the white light output.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: November 1, 2022
    Assignee: KORRUS, INC.
    Inventors: Raghuram L. V. Petluri, Paul Kenneth Pickard
  • Patent number: 11489099
    Abstract: A light-emitting device includes: a resin package; and a first light-emitting element and a second light-emitting element. The resin package includes: a resin portion; a first lead having an upper surface and an end surface; a second lead having an upper surface and an end surface; and a recess having lateral surfaces and a bottom surface that includes a portion of the upper surface of the first lead and a portion of the upper surface of the second lead that are exposed from the resin portion. The first light-emitting element and the second light-emitting element are disposed in the recess. The first lead and the second lead are arranged in a first direction. The first light-emitting element and the second light-emitting element are arranged in a second direction perpendicular to the first direction.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 1, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Horikawa, Takuya Miki, Shoichi Ishikawa, Ryosuke Wakaki
  • Patent number: 11476236
    Abstract: A display apparatus including a flexible substrate, a plurality of light emitting devices spaced apart from one another and disposed on the flexible substrate, and a light shielding layer disposed between the light emitting devices, and partially covering the light emitting devices to define light extraction surfaces, in which a distance between adjacent light extraction areas is the same.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: October 18, 2022
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventor: Chung Hoon Lee
  • Patent number: 11473751
    Abstract: According to an embodiment, there is provided a vehicle luminaire including: a socket; a board provided on one end side of the socket; at least one light-emitting element provided on the board; a frame part provided on the board to surround the light-emitting element; a sealing part that is provided on an inner side of the frame part and contains a resin; and an optical element provided on the sealing part. The frame part includes at least any one of a trap provided on an outer surface to retain at least a part of the resin overflowed to an outer side of the frame part, and an inclined surface provided in an edge of an opening opposite to the board side.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: October 18, 2022
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Misaki Ueno, Kiyokazu Hino
  • Patent number: 11469357
    Abstract: A reflective composite material with a carrier consisting of aluminum with, on one side (A) of the carrier, an interlayer made of aluminum oxide, and with, above the interlayer, an optically active reflection-boosting multilayer system. In order to provide a high-reflectivity composite material of this kind which exhibits improved electrical connectivity when surface-mounting procedures are used, it is proposed that the thickness of the interlayer is in the range 5 nm to 200 nm, and that a layer of a metal or a metal alloy has been applied superficially on side (B) of the carrier that is opposite to the optically active reflection-boosting multilayer system, where the electrical resistivity at 25° C. of the metal or metal alloy is at most 1.2×10?1 ?mm2/m, where the thickness of the layer applied superficially is in the range 10 nm to 5.0 ?m.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: October 11, 2022
    Assignee: Alanod GmbH & Co. KG
    Inventor: Stefan Ziegler
  • Patent number: 11450795
    Abstract: A light-emitting module according to an embodiment includes a plurality of light-emitting elements, light-guiding plates each having a light-exiting surface, and a wiring layer connected to electrodes of the plurality of light-emitting elements on a surface opposite to the light-exiting surface. The wiring layer includes a first terminal, a second terminal, a first wiring pattern connecting the first terminal and the second terminal, a second wiring pattern connecting the first terminal and the second terminal, a third wiring pattern disposed between the first wiring pattern and the second wiring pattern to connect the first terminal and the second terminal, a fourth wiring pattern connecting the first to third wiring patterns in parallel, the fourth wiring pattern being connected to the first terminal, and a fifth wiring pattern connecting the first to third wiring patterns in parallel, the fifth wiring pattern being connected to the second terminal.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: September 20, 2022
    Assignee: Nichia Corporation
    Inventors: Satoshi Yoshinaga, Yasunori Shinomiya
  • Patent number: 11442567
    Abstract: An organic light emitting display device includes a substrate including a light-emitting region and a reflection region, a plurality of sensing patterns disposed in the light-emitting region and the reflection region, and including a material having a first reflectivity, and a reflection pattern disposed in the reflection region, and including a material having a second reflectivity, and overlapping the plurality of sensing patterns.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: September 13, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung-Lyong Bok, Young-Seok Seo, Mu-Gyeom Kim
  • Patent number: 11444219
    Abstract: A sensor package array, a method of manufacturing the same, and a sensor package structure are provided. The method of manufacturing a sensor package array including: disposing a plurality of sensors on a substrate sequentially in an array; electrically connecting the plurality of sensors to the substrate; disposing a plastic shield on the substrate, so as to form a plurality of channels and a plurality of accommodating grooves among the plastic shield, the substrate, and the plurality of sensors; and filling a sealing material in the plurality of accommodating grooves, through the plurality of channels.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 13, 2022
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: Guang-Li Song, Wei-Chee Lee, Qian Pang
  • Patent number: 11444225
    Abstract: A light emitting diode package, including: a housing, wherein the housing includes a top section having an aperture; a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; a light emitting diode light source, wherein the light emitting diode light source is associated with the aperture of the housing; an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source and the housing; and a protective coating associated with at least a portion of the encapsulant and the housing, wherein the protective coating reduces and/or eliminates oxidative degradation, thermal degradation, and/or photodegradation.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: September 13, 2022
    Inventors: Tek Beng Low, Chee Sheng Lim
  • Patent number: 11417805
    Abstract: A semiconductor device includes: a mounting board; and a semiconductor element disposed on the mounting board via metal bumps, wherein the semiconductor element includes a semiconductor stacked structure and first electrodes, the mounting board includes second electrodes, the metal bumps include a first layer in contact with the first electrodes of the semiconductor element and a second layer located on a side opposite to the first electrodes, an average crystal grain size of crystals included in the first layer is larger than an average crystal grain size of crystals included in the second layer, and the second layer is spaced apart from the first electrodes of the semiconductor element.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: August 16, 2022
    Assignee: NUVOTON TECHNOLOGY CORPORATION JAPAN
    Inventors: Masanori Hiroki, Shigeo Hayashi, Kenji Nakashima, Toshiya Fukuhisa, Keimei Masamoto, Atsushi Yamada
  • Patent number: 11411369
    Abstract: A method for manufacturing a semiconductor device includes: heating solder to wetly spread toward a first end face or a second end face of a submount substrate under restriction on the wet spreading by a burr to form an extending part, so that the extending part directly connects a laser chip and a barrier layer.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: August 9, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masatsugu Kusunoki, Kyosuke Kuramoto, Takehiro Nishida
  • Patent number: 11367994
    Abstract: A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body and positioned inward of the frame; and a cover including: a support member that is fixed to an upper surface of the frame and that has an opening inside the frame, and a light transmissive portion that is fixed to the support member and that is disposed so as to close the opening. A first interface, between the light transmissive portion and the support member, is located inward of and lower than a second interface, between the support member and the frame. A portion of the support member that extends at least from an outermost end of the first interface to an innermost end of the second interface has a constant thickness.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: June 21, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Hashimoto, Eiichiro Okahisa
  • Patent number: 11362128
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: June 14, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Patent number: 11335670
    Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
    Type: Grant
    Filed: June 20, 2020
    Date of Patent: May 17, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Ming-Ru Chen, Tzyy-Jang Tseng, Cheng-Chung Lo
  • Patent number: 10993771
    Abstract: Trackable apparatuses and methods involving at least one arrangement of at least one trackable feature configured for disposition in relation to at least one substrate, each arrangement of the at least one arrangement having a distinct pattern of trackable features configured to facilitate determining at least one of: an identity of at least one object and at least one subject, a disposition of at least one object and at least one subject, a disposition between at least one object and at least one subject, and a disposition among at least one object and at least one subject, and each arrangement of the at least one arrangement configured to optimize tracking by a navigation tracking system, whereby at least one spatial relationship among the at least one object and the at least one subject is optimizable. The navigation tracking system is optionally multi-modal.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 4, 2021
    Assignee: SYNAPTIVE MEDICAL INC.
    Inventors: Kirusha Srimohanarajah, Gal Sela, Kelly Noel Dyer, Dorothy Lui, Brent Andrew Bailey
  • Patent number: 10797211
    Abstract: A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: October 6, 2020
    Assignee: OSRAM GMBH
    Inventors: Lorenzo Baldo, Alessio Griffoni, Federico Poggi
  • Patent number: 10651336
    Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: May 12, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Takeshi Kususe, Satoshi Shichijo, Kunihito Sugimoto
  • Patent number: 10490754
    Abstract: The present invention relates to metal complexes of the general formula L1ML2 (I), wherein M is selected from Ir and Rh, L1 is a ligand of formula L2 is a ligand of formula to OLEDs (Organic Light-Emitting Diodes) which comprise such complexes, to a device selected from the group consisting of illuminating elements, stationary visual display units and mobile visual display units comprising such an OLED, to the use of such a metal complex in OLEDs, for example as emitter, matrix material, charge transport material and/or charge or exciton blocker.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: November 26, 2019
    Assignee: UDC IRELAND LIMITED
    Inventor: Ilona Stengel
  • Patent number: 10176742
    Abstract: There are provided an organic light emitting display device, a driving method thereof and a display apparatus. The organic light emitting display device includes an underlay substrate, and organic light emitting pixel units arranged in a matrix on the underlay substrate; wherein the respective organic light emitting units comprise at least two organic light emitting structures which have different light emitting colors, are disposed in cascades and insulated from each other, and a pixel circuit connected corresponding to the organic light emitting structures and configured to drive the organic light emitting structures to emit light.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: January 8, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Hailin Xue, Haisheng Wang, Hongjuan Liu, Yingming Liu, Xiaoliang Ding, Weijie Zhao, Changfeng Li, Wei Liu
  • Patent number: 10177126
    Abstract: Described herein are devices and methods related to lighting systems that are color tunable and have a long lifetime. In certain embodiments, the device comprises two independently controlled phosphorescent OLED lighting panels coupled together in one package to emit light in one direction. In certain embodiment, aspects of the device are tunable, such as RGB color, color temperature, and luminance.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 8, 2019
    Assignee: Universal Display Corporation
    Inventors: Michael Hack, Michael S. Weaver
  • Patent number: 10070535
    Abstract: A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the electronic device. The waterproof structure includes a shell, a first material layer, a second material layer, and a third material layer. The first material layer covers at least a part of the implanted electronic device. The second material layer covers the first material layer. The internal space of the shell is configured for accommodating the implanted electronic device. The shell is made of PEEK (polyether ether ketone). The third material layer is disposed between the second material layer and the shell.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: September 4, 2018
    Assignee: GIMER MEDICAL CO., LTD.
    Inventors: Chi-Heng Chang, Chan-Yi Cheng, Chen-Tun Wu
  • Patent number: 9942536
    Abstract: A stacked display has the different color layers (20r), (20g), (20b) ordered with respect to the wavelength-dependency of the lens focus so that there is better focus of the colors on the display layers that modulate those colors. The optical system (30), (32) can be designed to have a wavelength-dependent focus that matches the position of each of the light modulating layers.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: April 10, 2018
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Bart Kroon, Mark Thomas Johnson
  • Patent number: 9899598
    Abstract: The objective of the present invention is to provide an organic electroluminescent element which exhibits excellent light transmitting properties by having an intermediate electrode that is formed as a thin film, and which is suppressed in disconnection or resistance increase of the intermediate electrode, thereby being ensured with respect to electrical conductivity. This organic EL element (100) comprises light emitting units (4-6) which include at least a light emitting layer and are arranged between a first electrode (2) that is formed on a substrate (1) and a second electrode (3) that faces the first electrode (2); and each one of the light emitting units (4-6) independently emits light by having intermediate electrodes (7, 8), which are arranged between the light emitting units (4-6), connected to an external power supply via first lead-out wiring lines (10, 11).
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: February 20, 2018
    Assignee: KONICA MINOLTA, INC.
    Inventor: Daisuke Takeuchi
  • Patent number: 9776555
    Abstract: A vehicular lamp includes a planar light emitting member having an organic EL light emitting portion at part of a substrate, and a reflecting member and a half mirror that are disposed so as to face each other so that light emitted from the organic EL light emitting portion is reflected repeatedly while allowing part of the light to be transmitted to the front.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: October 3, 2017
    Assignee: KOITO MANUFACTURING CO., LTD.
    Inventors: Kunio Fukai, Yukihiro Onoda, Masaya Shido, Haruhiko Iyoda, Asami Nakada
  • Patent number: 9590203
    Abstract: An organic light-emitting device with a plurality of subpixels, each subpixel including an emission region and a non-emission region, the organic light-emitting device including a substrate; an anode on the substrate, the anode including patterns that separately correspond to respective ones of the plurality of subpixels; an organic layer on the anode, the organic layer being common to the plurality of subpixels; and a cathode on the organic layer, the cathode including a plurality of subcathodes that each correspond to at least one of the subpixels and that allow light to pass through in emission regions, wherein adjacent two of the subcathodes overlap with each other in non-emission regions.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: March 7, 2017
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seok-Gyu Yoon, Dong-Chan Kim, Won-Jong Kim, Eung-Do Kim, Dong-Kyu Seo, Young-Woo Song, Da-Hea Im, Bo-Ra Jung
  • Patent number: 9281297
    Abstract: A package includes a first package including a device die, a molding compound molding the device die therein, a through-via penetrating through the molding compound, and a first plurality of Redistribution Lines (RDLs) and a second plurality of RDLs on opposite sides of the molding compound. The through-via electrically couples one of the first plurality of RDLs to one of the second plurality of RDLs. The package further includes a second package bonded to the first package, a spacer disposed in a gap between the first package and the second package, and a first electrical connector and a second electrical connector on opposite sides of the spacer. The first electrical connector and the second electrically couple the first package to the second package. The spacer is spaced apart from the first electrical connector and the second electrical connector.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: March 8, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Chen-Hua Yu, Szu Wei Lu, Shih Ting Lin, Shin-Puu Jeng
  • Patent number: 9041033
    Abstract: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a p-side electrode, a plurality of n-side electrodes, a first insulating film, a p-side interconnect unit, and an n-side interconnect unit. The p-side interconnect unit is provided on the first insulating film to connect to the p-side electrode through a first via piercing the first insulating film. The n-side interconnect unit is provided on the first insulating film to commonly connect to the plurality of n-side electrodes through a second via piercing the first insulating film. The plurality of n-side regions is separated from each other without being linked at the second surface. The p-side region is provided around each of the n-side regions at the second surface.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: May 26, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yosuke Akimoto, Yoshiaki Sugizaki, Akihiro Kojima, Miyoko Shimada, Hideyuki Tomizawa, Hideto Furuyama
  • Patent number: 9034672
    Abstract: A method of manufacturing a light-emitting device includes forming a first optical element on a first carrier, wherein the first optical element comprises an opening; forming a light-emitting element in the opening; forming a second optical element on the light-emitting element; forming a second carrier on the first optical element and the second optical element; removing the first carrier after forming the second carrier on the first optical element and the second optical element; and forming two separated conductive structures under the first optical element.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 19, 2015
    Assignee: EPISTAR CORPORATION
    Inventor: Chao-Hsing Chen
  • Patent number: 9024518
    Abstract: In a first aspect of the present invention, a light-emitting diode includes a light-emitting element with a p-n junction, a first light-transmitting member including a phosphor and sealing the light-emitting element, and first and second covers disposed on opposite surfaces of the first light-transmitting member. It is disclosed that the first and second covers extend over edges of the opposite surfaces of the first light-transmitting member. In a second aspect of the present invention, a first cover disposed on a first parallel surface of a first light-transmitting member can be greater in thickness than a second cover. In some embodiments, it is disclosed that a second light-transmitting member with higher diffusion coefficient than the first light-transmitting member is disposed in contact with a first perpendicular surface of the first light-transmitting member.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: May 5, 2015
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventors: Kosuke Tsuchiya, Toshiyuki Mizuno
  • Patent number: 8994061
    Abstract: A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: March 31, 2015
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Do Hyoung Kang, Oh Sug Kim
  • Patent number: 8994060
    Abstract: An object of the invention is to provide a method for manufacturing semiconductor devices that are flexible in which elements fabricated using a comparatively low-temperature (less than 500° C.) process are separated from a substrate. After a molybdenum film is formed over a glass substrate, a molybdenum oxide film is formed over the molybdenum film, a nonmetal inorganic film and an organic compound film are stacked over the molybdenum oxide film, and elements fabricated by a comparatively low-temperature (less than 500° C.) process are formed using existing manufacturing equipment for large glass substrates, the elements are separated from the glass substrate.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: March 31, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasuhiro Jinbo, Toshiyuki Isa, Tatsuya Honda
  • Patent number: 8987765
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 24, 2015
    Assignee: Luxvue Technology Corporation
    Inventors: Andreas Bibl, Charles R. Griggs
  • Patent number: 8981392
    Abstract: There is provided a light emitting device package including: a package substrate; a blue light emitting device and a green light emitting device mounted on the package substrate; a flow prevention part formed on the package substrate and substantially enclosing the blue light emitting device; and a wavelength conversion part including a red wavelength conversion material and formed on a region defined by the flow prevention part to cover the blue light emitting device, so that white light having a high degree of color reproducibility may be emitted thereby.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ho Young Song
  • Patent number: 8981416
    Abstract: An organic light-emitting diode has a carrier substrate. The light-emitting diode also contains an active layer that generates and emits electromagnetic radiation at a carrier front face. The active layer is mounted on the carrier substrate. At least one contacting device is located on a carrier rear face and is arranged simultaneously for electrical contacting and for mechanical attachment of the light-emitting diode. The contacting device includes a contact region. The contact region and/or the contacting device, seen in a side view parallel to the carrier rear face, are elevated in a U-shape or L-shape above the carrier rear face and/or extend in a lateral direction away from the active layer.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: March 17, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Simon Schicktanz
  • Patent number: 8981418
    Abstract: An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.
    Type: Grant
    Filed: August 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: 8975646
    Abstract: An optoelectronic semiconductor component comprising at least one radiation emitting semiconductor chip disposed in a recess of a housing base body, wherein the recess is bounded laterally by a wall surrounding the semiconductor chip and is at least partially filled with an encapsulant that covers the semiconductor chip and is well transparent to an electromagnetic radiation emitted by the semiconductor chip An inner side of the wall, bounding the recess, is configured such that, as viewed looking down on the front side of the semiconductor component, a subarea of the inner side is formed which extends ring-like all the way around the semiconductor chip and which is in shadow as viewed from the radiation emitting semiconductor chip and which is at least partially covered by encapsulant all the way around the semiconductor chip. A housing base body for such a semiconductor component is also specified.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: March 10, 2015
    Assignee: Osram Opto Semiconductors GmbH
    Inventor: Karlheinz Arndt
  • Patent number: 8975100
    Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: March 10, 2015
    Assignee: Nichia Corporation
    Inventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
  • Patent number: 8975659
    Abstract: A chip on board light emitting diode (LED) device includes a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device includes a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer includes a thermal conductive material. A printed circuit board (PCB) includes a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate include the thermal conductive material. The dissipation unit array includes a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: March 10, 2015
    Assignee: Cofan USA, Inc.
    Inventor: Pao Chen
  • Patent number: 8969885
    Abstract: Disclosed herein is a light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one light emitting diode electrically connected to the first conductive layer and second conductive layer, the at least one light emitting device is thermally contacted to an exposed portion of the heat transfer member, wherein the heat transfer member has an exposed portion disposed within the cavity between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: March 3, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Gun Kyo Lee, Nam Seok Oh, Young Hun Ryu
  • Patent number: 8963191
    Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: February 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jiun Kong, Il Seo
  • Patent number: 8952407
    Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 10, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won Jin Son
  • Patent number: 8952404
    Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: February 10, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-jun Yoo, Young-hee Song