Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: The present invention relates to the fabrication of multichannel nerve conduits for use in the repair of nerve injury. In particular, the invention relates to collagen multichannel nerve conduits which are suitable for use in repair of peripheral nerves.

Abstract: A medical device includes a polymer stent scaffold crimped to a catheter having an expansion balloon. A process for forming the medical device includes placing the scaffold on a support supported by an alignment carriage, and deionizing the scaffold to remove any static charge buildup on the scaffold before placing the scaffold within a crimper to reduce the scaffold's diameter. The polymer scaffold is heated to a temperature below the polymer's glass transition temperature to improve scaffold retention without adversely affecting the mechanical characteristics of the scaffold when deployed to support a body lumen.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.

Abstract: An aluminum-plastic composite structure includes an aluminum portion and a plastic portion. The aluminum portion defines a plurality of micro grooves by ultraviolet lithography. The plastic portion is integrally formed on the aluminum portion and substantially filling in the micro grooves. A width of each micro groove is in a range from 0.02 millimeters to 0.05 millimeters. A depth of each micro groove is in a range from 0.2 millimeters to 0.25 millimeters.

Abstract: A process for making a protective assembly for an article, such as a circuit, includes forming a flexible layer of the protective assembly over the circuit to be protected during circuit operation, wherein said protective assembly is non-adhesive to the circuit and wherein the flexible layer is conformed to the topography of the circuit and non-adhesive to the circuit.

Abstract: The present invention relates to a process for manufacturing composite structures formed by two subcomponents of the same material, characterized in that it comprises the following steps: providing a first subcomponent (13), particularly a skin; providing a tool (15) made of a composite and precured for the manufacture of the second subcomponent (17), particularly a stiffener; positioning said tool (15) on said first subcomponent (13); applying preimpregnated composite (21) on said tool (15) so as to form the second subcomponent (17); consolidating the composite structure by means of a process of curing the assembly resulting from the previous steps under suitable pressure and/or temperature conditions.

Abstract: A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.

Abstract: The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.

Abstract: A multi-sectional form includes first and second half-cylindrical sections with each section having opposed edges. The cylindrical sections are secured together by two elongated generally H-shaped connectors, each connector including a pair of opposed generally U-shaped grooves. The first and second cylindrical sections are connected together by inserting one edge of one section and one edge of another section into the opposed U-shaped grooves of one H-shaped connector. One or more bands are secured around the exterior of the sections to secure and hold the sections together.

Abstract: A honeycomb body includes ceramic walls all being entirely formed of printed layers forming channels through which a fluid can flow. The channels lie next to one another. At least one of at least one measuring sensor or electrically conductive mass forms a monolithic, unitary structure with one of the ceramic walls. Sensor material may be used as an alternative to ceramic material. A method of producing the honeycomb body is also provided.

Abstract: This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmission or reception of radio frequency (RF) signals. The invention further involves a stand-off bracket, composed of one or more materials that have minimal effect on transmission or reception of RF signals, for mounting an RFID device on or near materials that impede RF transmission and reception. The encapsulated RFID tag and stand-off bracket, separately, may have an adhesive or other attachment means on one of their surfaces so that they may be adhered or otherwise attached to another surface. In one application, an encapsulated RFID tag in the 860-928 MHz range is mounted on a stand-off bracket and may be used for tracking items to which it is attached.

Abstract: Disclosed is a method of manufacturing a BPF (bandpass filter) for GHz bands of the structure that an input signal line (2) and an output signal line (3) run with a small gap on one surface of a sheet (1) made by dispersing soft magnetic metal powder in a sheet-formed polymer matrix, an internal line (6) bridges on the signal lines, and a GND line (4) runs on the reverse surface of the sheet. The method comprises inserting an intermediate product made by disposing on both the sides of an insulating film (5) the above-mentioned input signal line (2), output signal line (3) and internal line (6), on one side of the cavity of a mold for injection, and inserting a metal piece for the GND line (4) on the other side of the cavity; and injecting a polymer compound to obtain a molded article.

Abstract: The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

Abstract: Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor that interact with magnetic fields generated by magnets that are mounted to the frame. The diaphragm is driven by a motive force created when current passes through the conductor within the magnetic field. The electrical current is varied to create an acoustical output from the electro-dynamic loudspeaker. Different frame structures are provided for simplifying the manufacturing process and defining a reduced cost electro-dynamic loudspeaker.

Abstract: An electrical box for use with insulated concrete form building systems includes a main body having an electrical box cavity for housing electrical outlets, switches, and electrical connections. The insulated concrete form building systems utilize insulated forms to form concrete and the insulated forms are left in place after the concrete has been poured thereby creating an overall insulated concrete element that includes the concrete and the insulated forms. In accordance with the method and the arrangement of the invention, the electrical box includes an arrangement for attaching the electrical box to the insulated form without requiring the use of any additional fasteners.

Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: A mixed potential electrochemical sensor for the detection of gases has a ceria-based electrolyte with a surface for exposing to the gases to be detected, and with a reference wire electrode and a sensing wire electrode extending through the surface and fixed within the electrolyte as the electrolyte is compressed and sintered. The electrochemical sensor is formed by placing a wire reference electrode and a wire sensing electrode in a die, where each electrode has a first compressed planar section and a second section depending from the first section with the second section of each electrode extending axially within the die. The die is filled with an oxide-electrolyte powder and the powder is pressed within the die with the wire electrodes. The wire-electrodes and the pressed oxide-electrolyte powder are sintered to form a ceramic electrolyte base with a reference wire electrode and a sensing wire electrode depending therefrom.

Abstract: A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump.

Abstract: Ceramic sintered bodies having a different thickness along a predetermined axial direction are manufactured in the following manner. At first, a ceramic formed body to be sintered having different thickness along the predetermined axial direction is accommodated in a hot press apparatus. An upper forming mold and a lower forming mold each having a forming surface corresponding to an upper surface and a lower surface of the ceramic formed body to be sintered are set. A pressure along the predetermined axial direction is applied to the ceramic formed body to be sintered via the upper forming mold and the lower forming mold while heating the ceramic formed body to be sintered to perform a hot press sintering thereof. A thickness of a ceramic sintered body is controlled in such a manner that a maximum thickness in the predetermined direction is not more than two times a minimum thickness in the predetermined direction.

Abstract: An outer sheath for an electronic device which includes an electronic element is formed by placing a thermosetting resin on the outer surface of the electronic element to form a first thermosetting resin layer, placing a thermoplastic resin on the outer surface of the first thermosetting resin layer to form a thermoplastic layer and placing a thermosetting resin layer on the thermoplastic layer to form a second thermosetting resin layer. All three layers are then heated so as to cure the first and second thermosetting resin layers and to cause the thermoplastic layer to melt and form a non-porous layer which is subsequently solidified.

Abstract: Ceramic sintered bodies having a different thickness along a predetermined axial direction are manufactured in the following manner. At first, a ceramic formed body to be sintered having different thickness along the predetermined axial direction is accommodated in a hot press apparatus. An upper forming mold and a lower forming mold each having a forming surface corresponding to an upper surface and a lower surface of the ceramic formed body to be sintered are set. A pressure along the predetermined axial direction is applied to the ceramic formed body to be sintered via the upper forming mold and the lower forming mold while heating the ceramic formed body to be sintered to perform a hot press sintering thereof. A thickness of a ceramic sintered body in such a manner that a maximum thickness in the predetermined direction is not two times larger or more than a minimum thickness in the predetermined direction.

Abstract: Proportional solenoids have low friction bearings formed by molding a pair of annular bearings in imprecise grooves formed in armatures so that radially outer surfaces of the bearings have a precise and low friction fit within precision machined interiors of solenoid housings. The bearings can be formed on body or push rod portions of the armatures and can have different outside diameters that are formed in a single precision mold to ensure concentricity and accuracy without requiring precision machining of armature or bearing surfaces.