Shaping Material And Uniting To A Preform Patents (Class 264/259)
  • Patent number: 10710471
    Abstract: A method for manufacturing a seat cushion material, the seat cushion material including a front layer part and a back layer part having a back side surface, the method including: preparing for molding the seat cushion by attaching the back layer part to an upper die having an upper cavity surface; molding the seat cushion material by adding foamed resin raw material forming on a lower cavity surface of a lower die and then by closing the upper die to which the back layer part is attached, the lower cavity surface being provided with a plurality of protrusions which is configured to be brought into contact with a seating surface side of the back layer part and press the back layer part against the upper cavity surface when the upper die to which the back layer part is attached is closed; and demolding the molded seat cushion material.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: July 14, 2020
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Yoshiyuki Murata, Tomohiro Sakashita, Kensuke Inuzuka
  • Patent number: 10703036
    Abstract: An article comprising: a carrier (12), activatable material (14) disposed on the carrier, one or more carrier extensions (16) extending from the carrier; wherein the article is adapted to provide sealing, baffling, or reinforcement within a structure's cavity.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: July 7, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Dean Quaderer, Erin White, Keith Novak, Blake Synnestvedt
  • Patent number: 10695992
    Abstract: Thermoplastic 3D objects are printed directly onto permeable materials with a high strength bond. The 3D object can be attached to the permeable material at one side where the bottom layer of the 3D object can be attached to the permeable material or alternatively, at an internal layer where portions of the 3D object are on opposite sides of the permeable material. In order to improve the adhesion of the 3D object to the permeable material, the bonding layer of the liquid thermoplastic material that is printed directly onto the permeable material can be deposited at modified 3D printer settings that can include a hotter than normal material deposition temperature. Additional build layers of the liquid thermoplastic material are printed on the bonding layer to complete the 3D objects.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: June 30, 2020
    Assignee: 3D SYSTEMS, INC.
    Inventors: Jessica Lisagor, Andrew R Miller, Martin Johnson, Nickalaus Podgursky, Leigh Herran
  • Patent number: 10661484
    Abstract: A mold for in-mold foam-molding of a polyolefin-based resin for producing a molded article includes a first mold part, a second mold part, and a divided mold that holds an insert material, wherein the insert material has a protrusion part, the divided mold is formed on the first and the second mold parts in correspondence with the protrusion part of the insert material, the first mold part has a first holding surface, the second mold part has a divided mold member having a second holding surface and a biasing part that guides the divided mold member movably in the mold opening/closing direction and constantly biases the divided mold member toward the first holding surface, and the base portion of the protrusion part of the insert material is configured for being held between the first and second holding surfaces by the divided mold.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: May 26, 2020
    Assignee: KANEKA CORPORATION
    Inventors: Yuki Tobimatsu, Masahiko Sameshima
  • Patent number: 10569464
    Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: February 25, 2020
    Assignee: Board of Regents, The University of Texas System
    Inventors: Eric MacDonald, David Espalin, Isaac Varela, Ryan Wicker
  • Patent number: 10549313
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for an imprint lithography method of edge field patterning, the method including providing a template having a mold, the mold having a patterning surface comprising patterned features; providing a substrate having an edge step layer positioned thereon the edge step layer including a sloped profile; depositing a polymerizable material on the edge step layer of the substrate; contacting the polymerizable material at one or more of a plurality of edge fields located at a perimeter of the substrate with the mold of the template; and based on the contacting, forming a pattern based on the patterned features at the one or more edge fields to provide an edge field pattern, wherein contact between the template and the substrate proximate to the plurality of edge fields is prevented based on the edge step layer of the substrate.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: February 4, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Zhengmao Ye
  • Patent number: 10548216
    Abstract: In some embodiments, a tamper-respondent system includes a PCB having a coating on a surface thereof, wherein the coating includes spinel-based, non-conductive metal oxide mixed into a non-conductive supporting material. The tamper-respondent system also includes a conductive track writing unit, a sensor, and an enclosure substantially enclosing the PCB, conductive track writing unit, and sensor. Responsive to a determination that a signal output from the sensor is indicative of tampering, the conductive track writing unit writes a conductive track within a predetermined portion of the coating by irradiating the predetermined portion of the coating to reduce the spinel-based, non-conductive metal oxide in the predetermined portion of the coating to metal nuclei. In some embodiments, the conductive track may modify circuit paths of the PCB and/or create electrical features on the PCB detectable by monitoring agents.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: January 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson
  • Patent number: 10531561
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 7, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kathleen Ann Fadden, James A. Busby, David C. Long, John R. Dangler, Alexandra Echegaray, Michael J. Fisher, William Santiago-Fernandez
  • Patent number: 10493673
    Abstract: Provided are a method for molding a foamed resin molded article having a mounting hole which is formed with good dimensional precision without occurrence of shape sag and which has an improved load resistance, a mold therefor, and a foamed resin molded article thereby. A method for molding a foamed resin molded article 1 including a mounting section 11 and a non-mounting section 12, using a mold 3 including a first mold 31 having a non-mounting-section mold portion 31a and a mounting-section mold portion 31b, a second mold 32, and a cavity 4 having a non-mounting-section cavity portion 42 for molding the non-mounting section 12 and a mounting-section cavity portion 41 for molding the mounting section 11.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: December 3, 2019
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Hitoshi Fujisawa, Yu Hishida, Kunio Yamazaki, Yasuaki Nakamura
  • Patent number: 10480287
    Abstract: An epoxy-based insulation material and a method of thermally insulating a subsea production apparatus are disclosed. The epoxy-based insulation material has an amine-cured epoxy elastomer matrix and a plurality of non-metallic beads suspended in the matrix. The epoxy-based insulation material is located on the subsea production apparatus to thermally insulate a hydrocarbon fluid from sea water.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: November 19, 2019
    Assignee: Carboline Company
    Inventors: Benjamin Lee Thornton, John Orlin Kloepper, Steve Vincent Liebhart
  • Patent number: 10383216
    Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 10363706
    Abstract: A 3D printing method and apparatus using the same are provided. The printing method includes: generating a two-dimensional layer information related with multiple layer objects of a three-dimensional object according to a three-dimensional model information, whereas the three-dimensional object has a forming part and an object embedded part; analyzing the two-dimensional layer information to identify a forming region and an object embedded region within each of the layer objects, whereas the forming regions constitute the forming part and the object embedded regions constitute the object embedded part; selecting at least one section of the three-dimensional object as a separation plane; printing the layer objects, layer by layer, with a forming material and a supporting material, to coat the forming material onto the forming region without overlapping with the separation plane, and coat the supporting material onto the forming region overlapping with the separation plane and the object embedded region.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: July 30, 2019
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Ting-Yu Lu, Yi-Lung Lin
  • Patent number: 10305343
    Abstract: To provide a waterproof structure for an electric motor that can more reliably seal a boundary at which an insert component of a stator and a mold resin join. A sealing member (5) includes a first sealing part (55) arranged more to a side of an insert component (3) than a joint (23), a second sealing part (56) arranged more to a side of a mold resin (4) than the joint (23), and a connecting part (57) that connects the first and second sealing parts (55, 56).
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: May 28, 2019
    Assignee: FANUC CORPORATION
    Inventors: Kouji Kobayashi, Takeshi Tamaki
  • Patent number: 10251288
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: April 2, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, Thomas Weiss, James E. Tersigni
  • Patent number: 10172239
    Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John R. Dangler, Phillip Duane Isaacs, David C. Long
  • Patent number: 10172232
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 10156352
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 18, 2018
    Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • Patent number: 10011158
    Abstract: A method of forming a unitary perimeter seal for attachment at a fixed window panel of a slider window assembly of a vehicle includes forming upper, lower and side sealing portions each having elongated body portions and sealing lips extending substantially therealong. The upper and lower sealing portion are arranged with first ends adjacent a respective end of a first side sealing portion and second ends adjacent a respective end of a second side sealing portion. The sealing portions are arranged so as to result in a perimeter frame that circumscribes an opening for the slider window assembly. Corner regions are molded at and partially over adjacent ends of the elongated body portions of the sealing portions, such that the corner regions include a curved sealing lip that provides a transition between the sealing lips of the adjacent ends of the sealing portions.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: July 3, 2018
    Assignee: MAGNA MIRRORS OF AMERICA, INC.
    Inventors: Troy F. Tooker, David K. Johnson, Michael J. Hulst
  • Patent number: 9993951
    Abstract: A device, system, and method for creating a molded crayon body are provided. In embodiments, the device includes a receiving and positioning device having a channel for receiving a wax stick. The channel may be configured to receive and position a wax stick for melting by a melting component. The device may further include a positioning and/or adjustment component that raises and lowers a mold plate with respect to a front surface of the melting component. In some embodiments, the melting component includes a nozzle having a nozzle tip configured to transfer melted portions of the wax stick from the nozzle of the melting component to a mold on a mold plate. The mold component may also include a chilling mechanism for cooling a completed, molded crayon body.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: June 12, 2018
    Assignee: Crayola, LLC
    Inventors: James McCauley, Eric Adams, David E. Wieand, Eric Silvanage, Christopher C. Giering, Matthew T. Carden, Eric A. King
  • Patent number: 9987653
    Abstract: A method for depositing thin films using a nominally curved substrate. Drops of a pre-cursor liquid organic material are dispensed at a plurality of locations on a nominally curved substrate by one or more inkjets. A superstrate is brought down on the dispensed drops to close the gap between the superstrate and the substrate thereby allowing the drops to form a contiguous film captured between the substrate and the superstrate. A non-equilibrium transient state of the superstrate, the contiguous film and the substrate is enabled to occur after a duration of time. The contiguous film is then cured to solidify it into a solid. The solid is separated from the superstrate thereby leaving a polymer film on the substrate. In this manner, such a technique for film deposition has the film thickness range, resolution and variation required to be applicable for a broad spectrum of applications.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: June 5, 2018
    Assignee: Board of Regents, The University of Texas System
    Inventors: Sidlgata V. Sreenivasan, Shrawan Singhal
  • Patent number: 9981408
    Abstract: Polymer optical waveguides can be produced by separating the processes into a distinct embossing process and a distinct UV exposure process. Separating the processes can create a more refined product and a more efficient process, thus eliminating the need for special polymer optical waveguide fabrication machinery.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: May 29, 2018
    Assignee: City University of Hong Kong
    Inventors: Wei Jin, Kin Seng Chiang, Hau Ping Andy Chan
  • Patent number: 9976029
    Abstract: The invention relates to a method for producing compositions containing vinylaromatic copolymers which are obtained in an emulsion polymerization process and comprise production-related salt inclusions. Said compositions are characterized by an improved surface quality once the extruded polymer, before being granulated, or the granulate, after being granulated, has been moistened by bringing the polymer in contact with liquid water in a water bath, a tube system filled with water, or a dipping tank, thus making the compositions suitable for producing molded articles having a class A surface that remains flawless over time.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: May 22, 2018
    Assignee: COVESTRO DEUTSCHLAND AG
    Inventors: Hans-Juergen Thiem, Ingmar Hermsdorfer, Birgit Mannel, Andreas Seidel, Eckhard Wenz, Hans-Juergen Klankers
  • Patent number: 9937584
    Abstract: A method for producing an electrical component is provided. The method includes steps of providing a continuous strip material and separating a section from the continuous strip material using an electron beam.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: April 10, 2018
    Assignee: TE Connectivity Germany GmbH
    Inventors: Helge Schmidt, Eva Henschel, Soenke Sachs
  • Patent number: 9877383
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: January 23, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 9811688
    Abstract: Systems and methods for providing a battery module 110 with secure identity information and authentication of the identity of the battery 110 by a host 120. In one embodiment, the system for providing a battery module with secure identity information includes: (1) a tamper resistant processing environment 200 located within the battery module 110 and (2) a key generator configured to generate a key based on an identity of the battery module 110 and cause the key to be stored within the tamper resistant processing environment 200.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: November 7, 2017
    Assignee: Texas Instruments Incorporated
    Inventors: Narendar M. Shankar, Erdal Paksoy, Todd Vanyo
  • Patent number: 9808972
    Abstract: In a method for manufacturing a motor bobbin around which a coil is wound, an insulating sheet and a core material are disposed within the cavity of an injection mold, and the motor bobbin is formed by the injection mold into which a resin is injected. The motor bobbin consists of the insulating sheet and a resin molded body.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: November 7, 2017
    Assignee: DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
    Inventors: Shinji Naruse, Tatsushi Fujimori, Chihiro Kondo, Yasunori Tanaka
  • Patent number: 9776348
    Abstract: In a method for manufacturing a motor bobbin around which a coil is wound, an insulating sheet and a core material are disposed within the cavity of an injection mold, and the motor bobbin is formed by the injection mold into which a resin is injected. The motor bobbin consists of the insulating sheet and a resin molded body.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: October 3, 2017
    Assignee: DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
    Inventors: Shinji Naruse, Tatsushi Fujimori, Chihiro Kondo, Yasunori Tanaka
  • Patent number: 9757931
    Abstract: A method for coating a surface of a supporting element with a layer of ligneous material in order to form a motor vehicle trim element. The method includes the following consecutive steps: precutting the coating layer so as to form at least one precut area in the layer of ligneous material; positioning the layer of ligneous material relative to the supporting element by means of the precut area; and attaching the layer of ligneous material to the surface of the supporting element.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: September 12, 2017
    Assignee: Faurecia Interieur Industrie
    Inventors: Nathalie Durand, Hugo Piccin
  • Patent number: 9757884
    Abstract: An apparatus and method for manufacturing a crash pad with a foaming layer formed by injecting a foaming solution between a core and a skin are disclosed. The apparatus includes a first mold and a second mold used to form the skin by injecting molten resin of a skin material into a skin forming cavity when the first and second molds are combined. In addition, a third mold and the fourth mold form the core by injecting molten resin of a core material into a core forming cavity when the third and fourth molds are combined. The first mold has a vacuum aperture in an inner surface of the first mold to adsorb and fix a thread to implement a stitch before the forming of the skin, and the vacuum aperture exerts a vacuum suctioning force to absorb and fix via a vacuum pressure applied from a vacuum pressure providing unit.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: September 12, 2017
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Byung Seok Kong, Ji Min Park
  • Patent number: 9669424
    Abstract: A method of decorating an element. This method includes the following steps: taking the element (1, 11, 21, 31), the element including anchoring for improving the securing of the decoration (5) to the element; making a mask (4) of the desired thickness of the decorations (5), and having at least one opening (4?); placing the at least one opening in the mask (4) against the place to be decorated so as to form at least one mould (4?, 6, 6?, 6?,100); filling the at least one mould with an at least partially amorphous material via hot forming; and removing the mask (4).
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 6, 2017
    Assignee: The Swatch Group Research and Development Ltd
    Inventors: Yves Winkler, Stewes Bourban, Pascal Grossenbacher
  • Patent number: 9661747
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: May 23, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 9658484
    Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (?m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 ?m, where the connection layer connects the plurality of pattern structure units to each other.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Jaeseung Chung, Sukgyu Hahm
  • Patent number: 9616603
    Abstract: A tool (1200) includes a mold defining a cavity (1202). The cavity can be for receiving a glass layer (402). A floating core insert (1201) can be placed in the cavity. One or more wedge-shaped backing plates (1203,1204) can translate along a first axis, in response to a servo or other translation engine, to apply a preloading force through the floating core insert against a first major face of the glass layer, preclude an overmolding operation on the first major face, and allow overmolding only on minor faces of the glass layer when polymeric material is injected into the tool.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: April 11, 2017
    Assignee: Google Technology Holdings LLC
    Inventor: Eric J. Haupt
  • Patent number: 9554477
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: January 24, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher, David C. Long, Michael T. Peets, William Santiago-Fernandez, Thomas Weiss
  • Patent number: 9532688
    Abstract: A spherical or ovoid design for a robotic vacuum in which the housing of the vacuum also serves as the means by which the device moves. Steering of the device is controlled by adjusting the center of gravity within the housing. Perforations in the housing allow debris to be vacuumed into the device.
    Type: Grant
    Filed: October 3, 2015
    Date of Patent: January 3, 2017
    Assignee: Bobsweep, Inc.
    Inventors: Ali Ebrahimi Afrouzi, Soroush Mehrnia, Amin Ebrahimi Afrouzi, Masih Ebrahimi Afrouzi, Azadeh Afshar Bakooshli
  • Patent number: 9523146
    Abstract: A Ti—Si—C—N coating for a piston ring and a method forming such coating, wherein the deposited coating exhibits a thickness in the range of 10.0 micrometers to 20.0 micrometers and exhibits a coefficient of friction of less than 0.15 and a wear rate of less than 10×10?6 mm3/N/m. The coefficient of friction being measured on a Plint TE77 and the wear rate being measured against an alumina ball of 0.25 inches in diameter at a load of 1 N at 100 rpm in a dry environment. The deposited Ti—Si—C—N coating includes nanocrystalline phases in an amorphous matrix.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: December 20, 2016
    Assignee: SOUTHWEST RESEARCH INSTITUTE
    Inventors: Jianliang Lin, Ronghua Wei, Peter Mark Lee, Daniel Christopher Bitsis, Jr.
  • Patent number: 9486948
    Abstract: The invention relates to a method for producing interior lining parts in a foaming tool, to an interior lining part produced accordingly, and to a foaming tool which can be used for production. The interior lining part has at least one molded skin, at least one foam layer and at least one carrier, the foam layer being located between the molded skin and the carrier. In order to produce an interior lining part according to the invention, the molded skin is introduced into a mold of a foaming tool. The foaming tool contains at least one separating edge. During back-foaming, the carrier is pressed against the molded skin at the position of the separating edge and connected to said molded skin such that a molded skin end can be severed manually, that is without the aid of tools, from the molded skin or is severed by the pressing step.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: November 8, 2016
    Assignee: Faurecia Inneraum Systeme GmbH
    Inventors: Axel Hauck, Bernd Keller
  • Patent number: 9457736
    Abstract: A pillar covering for motor vehicles is described. The cover has a carrier part having a projected integrated window guide web and a projecting mounting element, an elevated circular, oval, or polygonal surface structure on the window guide web and/or the mounting element, and a polymer cover part connected to the carrier part via a contact surface.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: October 4, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Sebastian Schmidt, Luc-Henry Blanche, Ulrich Riegler
  • Patent number: 9421922
    Abstract: A pillar covering for motor vehicles is described. The pillar covering has a carrier part with an integrated window guide web and a mounting element, a narrowing at the point of contact between the window guide web and the carrier part (1), and a cover part connected to the carrier part via a contact surface, where a stiffening rib is fitted within the narrowing.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: August 23, 2016
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Sebastian Schmidt, Luc-Henry Blanche, Ulrich Riegler
  • Patent number: 9333683
    Abstract: A honeycomb structure includes porous partition walls via which a plurality of cells constituting through channels for a fluid are partitioned; and an outer peripheral wall positioned in the outermost periphery of the structure. Open frontal areas of predetermined cells in an end face of the structure on a fluid inlet side thereof and open frontal areas of remaining cells in an end face of the structure on a fluid outlet side thereof have plugged portions. The outward end faces of the plugged portions are flat, the plugged portions do not have any bubble having a diameter of 0.3 mm or more, and a value obtained by dividing the standard deviation of the plugging depths of the plugged portions by the average plugging depth of the plugged portions is 0.15 or less.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: May 10, 2016
    Assignee: NGK Insulators, Ltd.
    Inventors: Koji Kimura, Takuya Nunome, Shuhei Fujita
  • Patent number: 9085326
    Abstract: A pillar covering for motor vehicles is described The pillar covering has a carrier part having an integrated window guide web and a mounting element, a narrowing at the point of contact of the window guide web with the carrier part, and a cover part connected to the carrier part via a contact surface, whereby the carrier part and the cover part form at least one common end portion and the contact surface within the end piece runs over a length of at least 1 mm at a mean angle of 5° to 60° above or below a mean axis along the contact surface outside the end piece.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: July 21, 2015
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Sebastian Schmidt, Luc-Henry Blanche, Ulrich Riegler
  • Publication number: 20150147937
    Abstract: Disclosed are polymeric swords and sparring instruments having improved mechanical properties and methods of making such swords and sparring instruments. In one embodiment, a polyurethane sword comprises a handle portion and a blade portion. In this embodiment, the polyurethane sword also comprises a flexible support member having a handle support portion and a blade support portion. In this embodiment, the polyurethane sword also comprises a polyurethane outer layer configured to encase the flexible support member from the handle support portion to the blade support portion. The handle portion comprises the handle support portion and the polyurethane outer layer encasing the handle support portion. Moreover, the blade portion comprises the blade support portion and the polyurethane outer layer encasing the blade support portion. In addition, the polyurethane outer layer may be composed of a machine perfused polyurethane mixture.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Inventor: Margaret Lu
  • Publication number: 20150145384
    Abstract: An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: MOTOROLA SOLUTIONS, INC.
    Inventors: KIOK YUNG LEE, CHEE KIT CHAN, BOON AIK EEO, WENG KONG HOR, BAN HIN OOI, CLEMENT TOBIAS XAVIER PAKIAM
  • Publication number: 20150145167
    Abstract: An insert moldable cap retainer for securing a bearing cap to a pulley assembly is disclosed. The cap retainer includes a hollow neck configured to receive a bearing cap, a plate that extends outward from the neck with the neck protruding upward from the plate, and a continuous or discontinuous flange extending downward from the outer periphery of the plate. The plate is configured to be juxtaposed with an upper surface of an outer race of a bearing and the flange is configured to be juxtaposed with an outer surface of the outer race of the bearing when the cap retainer is positioned on the bearing. The cap retainer and bearing are insert moldable together to have an integral pulley body connected thereto. A pulley assembly is also disclosed that includes the insert moldable cap retainer.
    Type: Application
    Filed: February 3, 2015
    Publication date: May 28, 2015
    Applicant: Dayco IP Holdings, LLC
    Inventor: Jeffrey A. Swane
  • Publication number: 20150136290
    Abstract: The present invention relates to a tire integrated with a wheel and a method for manufacturing the same, more particularly relates to a non-pneumatic tire integrated with a wheel and a method for manufacturing the same, in which elastic rubber and tread rubber are formed on a produced wheel of a vehicle in a strip to form a semi-product and then the semi-produced tire is cured so as to form the semi-produced tire with the wheel integrally, a rim corresponding to the outer peripheral surface of the wheel is formed in multiple stages, rim flanges are formed at both sides of the rim to be protruded in a T-shape so as to fix an elastic layer formed on a peripheral surface between the rim flanges, and a tread layer is covered on the upper surface of the rim flanges in order to distribute and buffer an impact transferred to the elastic layer from the ground, thereby improving the driving performance of the vehicle.
    Type: Application
    Filed: February 4, 2013
    Publication date: May 21, 2015
    Applicant: HNC CO., LTD.
    Inventor: Young Jin Kim
  • Publication number: 20150140309
    Abstract: A process and apparatus for embossing relatively rigid polymeric panels having precise microstructured surfaces on at least one face of the panel including using a continuous press having upper and lower belts; providing tools with the embossing pattern(s); feeding the tools and panels juxtaposed thereon through the press where heat and pressure are applied to form the em bossed precise microstructured surface and cooling the embossed panel, all while maintaining pressure on the panel and the tool, and thereafter separating the embossed polymeric panel from the tool.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 21, 2015
    Inventor: Robert M. Pricone
  • Publication number: 20150140841
    Abstract: A receptacle connector includes a receptacle insulator having an annular outer peripheral wall which defines a fitting recess; receptacle contacts; and a receptacle-side metal fixing member. When a projecting fitting portion of a plug insulator of a plug connector is fitted into the fitting recess, plug contacts of the plug connector come into contact with the receptacle contacts, and the plug connector comes into contact with the receptacle-side metal fixing member. The receptacle-side metal fixing member and the receptacle insulator are integrally formed by insert molding, and the receptacle-side metal fixing member includes a resilient contact portion which is spaced from a surface of the outer peripheral wall on the circumferentially inner side thereof when the resilient contact portion is in a free state.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 21, 2015
    Applicant: KYOCERA CONNECTOR PRODUCTS CORPORATION
    Inventor: Hiroaki Watanabe
  • Publication number: 20150130117
    Abstract: An apparatus and method for multi-stage printing teaches means for removing and replacing a printed component during the printing process and accurately placing the component in the printer for continuation of the printing process. This can be accomplished through the use of a scanner, probe machine, or scanning Additionally, the present invention teaches the use of heating means in combination with a 3D printer to overcome additional issues with multi-sage printing.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Inventors: Alberto Daniel Lacaze, Karl Nicholas Murphy
  • Publication number: 20150122402
    Abstract: A method of producing a tyre tread with lugs; the tread having a tread base, and a number of lugs projecting upwards from the tread base; and the method including the steps of: preparing a green-rubber blank tread thinner at the sides and thicker at the centre to define a raised centre portion; applying green-rubber blocks to the areas of the blank tread where the lugs are to be formed, which blocks rest centrally against the raised centre portion; and curing the blank tread, together with the blocks, in a curing mold negatively reproducing the pattern of the tread.
    Type: Application
    Filed: April 19, 2013
    Publication date: May 7, 2015
    Inventor: Roberto Mattocci
  • Patent number: 9023256
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: May 5, 2015
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Masao Tokunari