Abstract: A tool for the primary shaping of a housing for a sensor which is designed to capture, via a sensing element, a physical area that is dependent on a variable to be measured, and to emit an electrical output signal on the basis of the captured physical area, including: —a mold cavity for receiving a material that molds the housing, and the sensing element, and —a box having a wall that bounds the mold cavity, wherein at least a part of the wall that bounds the mold cavity is mounted in a displaceable manner.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.

Abstract: A surround comprising one or more layers of translucent light filtering silicone having an innermost surface to contact a bulb of a light emitter. Plant materials are internally encapsulated within and throughout the one or more layers of translucent silicone. The plant materials have a plurality of distinct shapes, visible to a naked eye of a person, within the translucent light filtering silicone so as to block light emitted from the light emitter in the shapes of the plant materials.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.

Abstract: A rotational intravascular ultrasound probe for insertion into a vasculature and a method of manufacturing the same. The rotational intravascular ultrasound probe comprises an elongate catheter having a flexible body and an elongate transducer shaft disposed within the flexible body. The transducer shaft comprises a proximal end portion, a distal end portion, a drive shaft extending from the proximal end portion to the distal end portion, an ultrasonic transducer disposed near the distal end portion for obtaining a circumferential image through rotation, and a transducer housing molded to the drive shaft and the ultrasonic transducer.

Abstract: A rotational intravascular ultrasound probe for insertion into a vasculature and a method of manufacturing the same. The rotational intravascular ultrasound probe comprises an elongate catheter having a flexible body and an elongate transducer shaft disposed within the flexible body. The transducer shaft comprises a proximal end portion, a distal end portion, a drive shaft extending from the proximal end portion to the distal end portion, an ultrasonic transducer disposed near the distal end portion for obtaining a circumferential image through rotation, and a transducer housing molded to the drive shaft and the ultrasonic transducer.

Abstract: A terminal end-attachment device (10) for a flexible pipe (12) comprising an attachment body (14) adapted to receive a terminal end of a flexible pipe (12) and to couple the said flexible pipe to a hydrocarbon production installation structure. The device (10) further comprising a strain sensor (16) coupled to a sensor carrier (18), at least part of the sensor carrier (18) and the strain sensor (16) being at least partially incorporated within the attachment body (14). A method of manufacturing a terminal end-attachment device (10) for a flexible pipe (12) is also provided.

Abstract: An improved process for producing a piezoelectric ceramic device is disclosed, wherein the process includes the following steps: securing a metal plate in a mold cavity body by maintaining a binding area on a top surface of the metal plate, and that the top surface other than the binding area is enveloped, confined and secured; coating a metal paste on the binding area; placing a piezoelectric ceramic powder on the metal paste; pressing a pressing pillar on the piezoelectric ceramic powder; securing the pressing pillar in position; heating the mold cavity body so as to sinter the piezoelectric ceramic powder as a sintered body, and heating the mold cavity body so as to treat the sintered body to become a not-yet polarized piezoelectric ceramic sheet. Therefore, the same mold is employed for the piezoelectric ceramic powder sintering, the heat treatment, and the positioning and binding to the metal plate.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.

Abstract: A method for manufacturing a ceramic insulator for a spark plug.

Abstract: A lamp including a lens support (1) and a glass lens (2) designed to be placed in front of a light source (5), said lens being assembled to the lens support which is secured to the light source, said support being made of a plastics material, said lens having a rear face (22) designed to face towards the light source, an optical front face (21), and a peripheral rim (23) which interconnects the rear face and the front face, the lens support coming into engagement with the lens at said rim, said lamp being characterized in that the support (1) is fixed to the lens (2) by overmolding, the plastics material of which the support is made surrounding the rim (23) of the lens at least in part.

Abstract: Provided herein is an ultrasound probe comprising a probe housing defining a distal end, an ultrasonic transducer array disposed within the probe housing and rotatable within said probe housing, an acoustically neutral structure bonded to a surface of the ultrasonic transducer array by an adhesive, a motor coupled to the ultrasonic transducer array, the motor being configured to rotate the ultrasonic transducer array in order to image a three-dimensional volume; and an acoustic coupling fluid disposed within free volume of the probe housing. Also provided is a method of manufacturing.

Abstract: Embodiments of the present invention include apparatus and methods for aerosolizing liquid. One embodiment of the invention provides an apparatus for generating an aerosol. The apparatus includes an actuator having a first face and a second face and defining an opening therethrough, as well as a vibratory element in mechanical communication with the actuator, and a sealing member configured to isolate the vibratory element from a surrounding environment. In accordance with certain embodiments, the apparatus further comprises an aerosolization element mounted on the actuator and disposed substantially over the opening, wherein the aerosolization element defines at least one aperture therethrough. Hence, the vibratory element may be operated to vibrate to cause movement of the aerosolization element in such a manner that a liquid at the first face of the aerosolization element can be dispensed as an aerosol through the at least one aperture.

Abstract: A method for making an LED light bulb where the LED light bulb itself is molded into various shapes. The plastic lens used to surround the diode is shaped when manufactured to resemble various items, such as stars, crosses, hearts, trees, pinecones, bulbs, flat panels with designs, or any other shape the user desires. Because the entire light bulb is the LED, uniform and consistent light can be emitted from every part of the plastic lens that makes up the shaped LED light bulb, allowing the user to view the shaped LED light bulb from any angle. The shaped LED light bulb can be used individually, or strung together to form a strand of shaped lights.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method for encapsulating an area on a substrate comprising the steps of a) providing a substrate having an area on a surface thereof which is to be encapsulated, b) providing an assembly fixture which has features formed into the surface of the fixture, and vacuum orifices associated with the features of the fixture, c) positioning a substantially flat formable sheet onto the assembly fixture, and forming the sheet to the features of the assembly fixture by applying a negative pressure through the vacuum orifices, wherein corresponding features are formed in the sheet, d) patterning an adhesive onto the sheet or onto the substrate, the adhesive pattern corresponding to the perimeter of the area on the substrate to be encapsulated, e) clamping together the substrate and the sheet, causing the patterned adhesive to flow between the substrate and sheet in the area of compression, wherein the patterned adhesive is proximate to the features formed in the sheet, and f) curing the adhesive to form a perimeter seal

Abstract: A method is for manufacturing a speaker-use center cap provided with a first cap member layer of synthetic resin and a second cap member layer layered in intimate contact with the first cap member layer and made of a material different from that of the first cap member layer. The method includes: a pre-molding step of attaching a non-molded sheet-like material which is a raw material of the second cap member layer to a mating surface of one of die parts of an injection molding die and thereafter closing the injection molding die to apply a predetermined cap shape to the sheet-like material; and an injection molding step of injecting the synthetic resin material into the injection molding die closed by the pre-molding step to form the first cap member layer to be intimate contact with the second cap member layer.

Abstract: A method and apparatus for fixedly securing a plastic encapsulated transducer to a metal interface cup for attachment with a machine includes a metal interface cup configured substantially as a cylinder defined by a cylinder wall and a bottom wall closing a bottom of the cylinder, the cylinder including a first bore corresponding to an inner diameter defined by the cylinder wall, the first bore corresponding to an outside diameter of the plastic encapsulated transducer; a second bore extending through opposing sides defining an exterior of the cylinder wall and substantially transverse to the first bore; an undercut configured in the first bore intersecting the second bore, the undercut defining a circumferential groove in the cylinder wall; a cylindrical overmold surrounding the metal interface cup having the plastic encapsulated transducer disposed in the first bore, wherein injection of plastic flows in an axial length defining the overmold toward the metal interface cup and circumferentially into the unde

Abstract: Disclosed is a method for producing light-guiding LED bodies in a mold, using a material that is flowable before becoming definitively solid. Each LED body comprises at least one light-emitting chip and at least two electrical connections that are connected to the chip. At least one flowable material is fed into the mold in chronologically separate steps via at least one of at least two locations. In a first step, the flowable material is fed into the mold so as to flow around the chip and the connections in that area. In further steps, one or several flowable materials are fed into areas other than the one in which the chip and connections are located. The inventive method for producing light-guiding LED bodies allows virtually all produced luminescent diodes to have the same optical characteristics and prevents the individual LED electronics from being spoiled through damage.

Abstract: An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

Abstract: The invention relates to a method for producing light-guiding LED bodies, in two casting and/or injection molding steps, from a material which is free-flowing before being finally solidified. First, the electronic components, consisting of at least one light-emitting chip and at least two electrical terminals connected to said chip, are coated by means of casting or injection molding, and are then recoated by means of casting or injection moulding, at least in one region, in a larger LED end mold. The present invention provides a method for the production of light-guiding LED bodies, whereby almost all light-emitting diodes produced have the same optical characteristics, and rejection caused by damage of the individual LED electronic elements is avoided.

Abstract: A process for manufacturing an inductive component intended to be installed on a printed circuit involves initially winding an electrically conductive wire to form a winding without using a former end connecting the opposed ends of the winding to inner ends of connecting terminals. The body formed of a block of an insulating material is then over-moulded onto the coil and onto the inner ends of the connecting terminals with the body including a central opening that passes through the body along the axis of the coil. Finally, a core made of ferrite is placed on the body such that the core surrounds the body in a center plane containing the axis of the coil with a center core element passing through the opening in the body.

Abstract: An integral single piece extruded LED light strip and an associated process for producing such an LED light strip. The light strip includes first and second bus elements spaced apart from one another by a predetermined distance. The light strip also includes at least one light emitting diode (LED) connected between the bus elements that is illuminated when the first bus element conducts electricity provided from a power source. An extruded plastic material completely encapsulates the first and second bus elements and the LED, thereby providing a barrier to protect the elements from damage and to make the light strip impervious to moisture.

Abstract: An integrally formed single piece light strip and light strip manufacturing system. The light strip also includes a substrate populated with a plurality of LED light circuits. A plurality of bus elements are spaced apart from one another at a predetermined distance and are in electrical communication with the plurality of light circuits. A plastic material is extruded around the plurality of light circuits and the substrate to completely encapsulates the bus elements and the plurality of light circuits to provide a protective housing. In one embodiment, an electrical connector is also integrally formed as part of the light strip to eliminate the need for separate connectors. The light strip is o manufactured in a cost efficient manner, and is impervious to moisture penetration, thereby allowing the strip to be used in a variety of applications and environments.

Abstract: Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the support pin extends within the interior cavity while having an end emanating from the rearward end; cantilevering the emanating end between an upper and a lower mold plate defining a mold cavity for supporting the assembly; injecting moldable material into the mold cavity for molding an encapsulation of material over the assembly for defining an encapsulated probe tip, allowing the encapsulated probe tip to cure; removing the encapsulated probe tip from the mold cavity; removing the support pin from the assembly, and coupling a cable to the encapsulated probe tip for forming the proximity probe.

Abstract: A method for making a piezoelectric composite transducer is disclosed. A block of piezoelectric material having a common base and a plurality of uniform-length rods is utilized. An electric conductor is positioned to extend through a side region of the block. Spaces between the rods are filled up to a first surface region with a viscoelastic material. The common base of the block is removed forming a second surface region. Electrodes are deposited at the first surface region to be in contact with the rods and in electrical contact with the electric conductors. A ground electrode is deposited at the second surface region to be in contact with the rods. The resulting piezoelectric composite transducer can be heated and shaped to conform to complex curves.

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. A plurality of leads end portions are inserted into a plurality of lead holes of an alignment jig. A backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

Abstract: A method of making optical transducers by producing an integrated structure including, in a rectangular matrix array, a plurality of discrete light sources, a plurality of discrete light detectors each laterally spaced from a light source, a light shield in the space between a light source and a light detector for shielding the light detector from direct exposure to the light source, and a transparent plastic potting material embedding the light sources, light detectors and light shield; and cutting the integrated structure, along lines of the matrix, into individual optical units, each including a light source, a light detector, a light shield therebetween all embedded in the transparent plastic potting material, and an optical window for outputting light from the light source and for transmitting to the light detector light reflected back from the light source.

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: Several methods for fabricating an ultrasound transducer assembly having a flexible circuit are provided. Preferably, the method comprises attaching an ultrasound transducer array and integrated circuitry to the flexible circuit during fabrication of the ultrasound transducer assembly while the flexible circuit is in a:substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes.

Abstract: A method for producing an electronic component includes placing an enclosed frame on a baseplate. A chip is provided to be fitted within the frame, forming a first given space between the chip and the baseplate and forming a second given space between the chip and the frame. The first given space is enclosed in a hermetically sealed manner by pressing a film onto the chip, except on a surface of the chip facing the baseplate, such that the film surrounds the chip and at least reaches the surface of the baseplate. The second given space is filled with a casting compound. The film is then removed at surface regions of the film being free of the casting compound. Finally, a cover composed of an electrically conductive material is applied on the chip, the casting compound and the frame.

Abstract: A method of manufacturing a vibration type driving apparatus comprising an elastic member which, in use, is excited with a vibration that sets a moving member into motion relative to the vibrating elastic member. The method includes providing a friction member on at least one of the elastic member and the moving member, and pressing the friction member between a mold and the at least one of the elastic member and the moving member forming a smooth contacting surface on the friction member.

Abstract: A high voltage transformer for a microwave oven includes a core, and primary and secondary coils. An insulation molding part encloses at least a part of the secondary coil and has a sensor accommodation portion formed therein. A temperature sensor is accommodated in the sensor accommodating portion for detecting temperature of the secondary coil. The sensor accommodating portion can be formed inside of the insulation molding part together with the temperature sensor, or formed outside of the insulation molding part in a pocket shape. With either configuration, the temperature sensor can be positioned at the correct sensor position, thereby improving the detecting accuracy of the temperature sensor. In addition, it is easy to repair and/or replace the temperature sensor.

Abstract: The lining is provided with a support layer (4) which can be shaped in a mold so that recesses (8) are formed in it, which will receive the various functions (5), said support (4) complemented by the remaining layers (9) which make up the lining, which are also suitably shaped in order to adapt to support (4), closing the openings of recesses (8). The procedures consists of forming support (4), housing functions (5) in its recesses (8), and in another press, or simultaneously and in the same one, forming the remaining layers (9), and finally attaching the set with suitable adhesives.

Abstract: An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. First, a plurality of printed boards in each of which a plurality of leads are formed in a line are stacked. The end portions of the leads protrude from each printed board. These lead end portions are inserted into a plurality of lead holes of an alignment jig. The plurality of printed boards are buried in the back surface of this alignment jig, and a backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.