Abstract: According to a molding method for a conductive plate of this invention, a substrate having through holes each corresponding to each protruded portion is employed and the substrate is sandwiched between both dies. Then raw powder is filled into each housing portion provided opposing each through hole in the substrate provided in each of both dies, through the through hole in order to form each protruded portion. Then the protruded portion is formed integrally with the substrate by heating the raw powder under pressure.

Abstract: A battery pack for use with a cellular telephone device includes a flat battery cell assembly encased by a resin using low temperature molding techniques or injection molding techniques under low pressure. An interface assembly cap provides an electrical connection means between the cell assembly and the cellular telephone device with which it is used. The resin molded cell assembly accommodates a smaller physical size than preformed plastic battery packs without sacrificing relative available power density.

Abstract: Conductor bars for the stator winding of an electrical machine are impregnated by winding the bars with an insulation, impregnating the insulation, and then curing. Specifically, the bars are provided on their surface with an insulation which is produced by wrapping each conductor bar with an insulating tape, preferably with a mica-containing insulating tape, which is impregnated with an insulating fluid, preferably curable synthetic resin. Each conductor bar provided with the finished insulation is provided over its entire length with a press-tight and fluid-tight casing. The encased conductor bar is subjected on all sides to a pressure p1 in a pressing device. The impregnating fluid is introduced into the interspace between the insulated conductor bar and the casing at a pressure P2<P1. The conductor bar, loaded with impregnating resin over its entire length in this way and surrounded by the casing, is pressed to shape and size at the curing temperature.

Abstract: A hoop metal lead frame (1) having, solid electrolytic capacitor elements (5) on its terminal sections (2) is provided with a crosspiece (3) bridging both sides in terms of the width direction disposed along the length direction in a region between the capacitor elements (5), one crosspiece for two capacitor elements (5). The metal lead frame (1) is placed on a molding die so that the region without having the crosspiece is locating at the sub runner (8), which has branched out from the main runner (7). The capacitor elements (5) are encapsulated with a molding resin injected through the sub runner (8). Since the molding resin is not covering the crosspiece (3), the main runner portion (7) and the sub runner portion (8) can be severed from the metal lead frame (1) without effecting unwanted stress on the solid electrolytic capacitors (10). The solid electrolytic capacitors (10) thus manufactured have a superior property in the tight hermetic sealing.

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.