Preventing Flash Patents (Class 264/276)
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Patent number: 12208548Abstract: An assembly for molding a composite article including a foam core and a layer is disclosed. The assembly includes a mold. The mold has an inner surface and at least partially defines a cavity, one or more gas discharge ports, and one or more retaining elements. Each of the one or more gas discharge ports has a passageway opening in fluid communication with the cavity of the mold the mold. The assembly further includes one or more sealing elements moveably engaged with the mold. Each of the one or more sealing elements includes a head and is shaped to engage the retaining element on the mold in a vented position. Further, each of the one or more sealing elements corresponds with each of the one or more gas discharge ports.Type: GrantFiled: February 19, 2020Date of Patent: January 28, 2025Assignee: Proprietect L.P.Inventor: Kevin G. Kangas
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Patent number: 11594788Abstract: The present disclosure discloses an electric connection assembly having a support and a connector; the support comprises a support body; the support body is provided with a mounting groove and a limiting protrusion; at least part of the connector is arranged within the mounting groove; and the limiting protrusion can cooperate with the connector so as to prevent the connector from withdrawing from the mounting groove. Compared with the prior art, the electric connection assembly is simple in overall structure and convenient to assemble. In the electric connection assembly, the stability of the integral assembly of the connector and the support can be enhanced by arranging the corresponding limiting protrusions on the support.Type: GrantFiled: August 23, 2019Date of Patent: February 28, 2023Assignees: TYCO ELECTRONICS (SHANGHAI) CO. LTD., TYCO ELECTRONICS JAPAN G.K.Inventors: Litao Dong, Ziwei Li, Haifeng Liu
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Patent number: 11565490Abstract: The invention provides a surface covering product, in particular a floor covering product, comprising boundary walls defining a lower face which in use faces a surface to be covered, said boundary walls having an upper face extending up to 60 cm from said lower face, said boundary walls dividing a part of said surface to be covered into at least partially enclosed surface parts and providing a boundary for at least one filling composition in said at least partially enclosed surface parts, wherein said surface covering product further comprises a base web having said boundary walls coupled to said base web for holding said boundary walls in position, and said base web comprises an upper surface below said upper face of said boundary walls, and a lower surface which in use rests on said surface to be covered, said boundary walls are coupled on top of said base web, and in use said filling composition covers said base web and at least part of said boundary walls, and wherein at least said boundary walls are formType: GrantFiled: May 17, 2019Date of Patent: January 31, 2023Assignee: AECTUAL HOLDING B.V.Inventors: Hedwig Heinsman, Hans Vermeulen, Martine De Wit
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Patent number: 11325291Abstract: A tool for driving a threaded fastener includes a driver head, a motor, and an injector. The driver head includes a spindle rotatable about an axis. A distal end of the spindle defines a plurality of drive surfaces configured to engage mating drive surfaces on the fastener to rotate the fastener about the axis. The driver head defines a fluid passage having an outlet proximate to the distal end of the spindle. The motor is drivingly coupled to the spindle to rotate the spindle about the axis. The injector is coupled to an inlet of the fluid passage and configured to feed a liquid insulator through the fluid passage.Type: GrantFiled: February 14, 2019Date of Patent: May 10, 2022Assignee: Ford Motor CompanyInventors: Christopher William Coyne, Samuel Jeffrey Tomlinson
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Patent number: 11105089Abstract: There is provided a self-sealing article comprising a polymeric layer disposed on and covering a first major surface of an elastic porous layer, wherein the article passes Modified Test 1 of ASTM D-1970/D-1970M-13 or Modified Test 2 of ASTM D-1970/D-1970M-13, or Modified Test 3 of ASTM D-1970/D-1970M-13, and further wherein the self-sealing article is water vapor permeable and an air and water barrier. There is also provided a linered version of the self-sealing article in which a liner is disposed on a major surface of the polymeric layer opposite the first major surface of the elastic porous layer.Type: GrantFiled: August 18, 2016Date of Patent: August 31, 2021Assignee: 3M Innovative Properties CompanyInventors: Martin J. Widenbrant, Taylor M. Seabaugh, Daniel R. Fronek, Rajan B. Bodkhe
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Patent number: 10821636Abstract: In a skin integral molded article which is formed by filling the inside of a skin which is formed into a bag shape with a foamed body and molding the foamed body integrally with the skin, an opening through which a foaming raw material is supplied into the skin is formed in the skin, in one side skin and other side skin which are formed with the opening being interposed, the one-side skin is bent into inside the opening, the other-side skin is provided with a part disposed ahead of a part which is bent into inside the opening and is formed to be pliable, and the part which is disposed ahead of the other-side skin part and is formed to be pliable is formed in contact with a leading end part of the one-side skin part which is bent into the opening.Type: GrantFiled: December 19, 2017Date of Patent: November 3, 2020Assignee: TACHI-S CO., LTD.Inventor: Tsuyoshi Tabata
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Patent number: 10775055Abstract: A bulkhead assembly includes bulkhead having a first surface facing a first direction and a second surface facing a second direction. The second surface is opposite the first surface. A first connector is disposed on the bulkhead facing the first direction. A second connector is disposed on the bulkhead facing the second direction.Type: GrantFiled: September 26, 2018Date of Patent: September 15, 2020Assignee: Haier US Appliance Solutions, Inc.Inventors: Wilbur Carl Bewley, Jr., Robert William Jewell, James Bryan Rawson, Stephen D. Hatcher, Mike Fradkin
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Patent number: 10608260Abstract: A gasket has a gasket main body which is made of a rubber-like elastic body, and a reinforcement body which is made of a material having a higher rigidity than the gasket main body. The gasket main body integrally has a tabular base portion, and a seal portion which is provided in an end portion in a width direction of the base portion, the reinforcement body is formed into a tabular shape, is set its thickness to be smaller than a thickness of the base portion, and is buried in the base portion in such a manner as to be exposed to a surface with one surface in a thickness direction of the base portion, and the reinforcement body is provided with a positioning hole for positioning the reinforcement body in relation to a metal mold forming the gasket main body on a plane.Type: GrantFiled: March 31, 2016Date of Patent: March 31, 2020Assignee: NOK CORPORATIONInventor: Takayuki Horimoto
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Patent number: 10576674Abstract: A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200° F., and injecting the molten mass into the cooled mold assembly.Type: GrantFiled: July 26, 2017Date of Patent: March 3, 2020Assignee: The Boeing CompanyInventors: Julie M. Drexler, David E. Sterling, Robert F. McDevitt, Randall A. Rogers
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Patent number: 9808968Abstract: A mold, a molding machine, and a foamed molded body manufacturing method are provided that are capable of more reliably preventing ingress of foamed resin into a gas discharge hole using a gas-impermeable member and capable of adequately discharging gas inside the cavity to the cavity outside through the gas discharge hole during foam molding, and that are also capable of achieving good design characteristics in a foamed molded body. A gas discharge hole 5 is provided at a cavity 4 inner face of a mold 1 and discharges gas inside the cavity 4 to outside the cavity 4. A gas-permeable member 6 is disposed inside the cavity 4 of the mold 1 so as to cover the gas discharge hole 5, and a gas-impermeable member 8 is disposed on the gas discharge hole 5 side of the gas-permeable member 6 so as to face the gas discharge hole 5.Type: GrantFiled: June 7, 2012Date of Patent: November 7, 2017Assignee: BRIDGESTONE CORPORATIONInventors: Taisuke Yonezawa, Yoshinori Ohashi
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Patent number: 9337064Abstract: Methods of processing semiconductor wafers may involve, for example, encapsulating an active surface and each side surface of a wafer of semiconductor material, a plurality of semiconductor devices located on the active surface of the wafer, an exposed side surface of an adhesive material located on a back side surface of the wafer, and at least a portion of a side surface of a carrier substrate secured to the wafer by the adhesive material in an encapsulation material. At least a portion of the side surface of the adhesive material may be exposed by removing at least a portion of the encapsulation material. The carrier substrate may be detached from the wafer. Processing systems and in-process semiconductor wafers are also disclosed.Type: GrantFiled: September 15, 2014Date of Patent: May 10, 2016Assignee: Micron Technology, Inc.Inventors: Wei Zhou, Aibin Yu, Zhaohui Ma
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Patent number: 9285156Abstract: A refrigeration appliance includes a body having an interior compartment, a door, and a mechanism for opening and/or closing the door that is adapted to act on the door. The interior compartment is adapted to receive products to be cooled. The door is movably attached to the body and adapted to close the interior compartment. The mechanism for opening and/or closing the door is an integral module and is disposed in a corresponding pocket of the refrigeration appliance.Type: GrantFiled: April 15, 2014Date of Patent: March 15, 2016Assignee: MIELE & CIE. KGInventor: Patrick Linke
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Patent number: 8974224Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.Type: GrantFiled: March 8, 2011Date of Patent: March 10, 2015Inventor: Craig M. Stanley
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Patent number: 8901336Abstract: Embodiments of the present disclosure provide for catalysts such as those shown in FIG. 1.1 and in the Examples, methods of making catalysts, methods of using catalysts, and the like.Type: GrantFiled: August 31, 2012Date of Patent: December 2, 2014Assignee: University of Florida Research Foundation, Inc.Inventors: Sukwon Hong, Hwi Min Seo, David R. Snead
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Patent number: 8623254Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.Type: GrantFiled: November 26, 2008Date of Patent: January 7, 2014Assignee: Robert Bosch GmbHInventors: Rolf Goetz, Steffen Schulze, Daniel Matthie, Markus Kny, Frank Weishaeutel
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Patent number: 8460589Abstract: A method for producing a ceramic honeycomb filter by immersing an end surface of a ceramic honeycomb structure having a lot of flow paths partitioned by cell walls in a plugging material slurry in a container to introduce the plugging material slurry into the predetermined flow paths to form plugs, and taking the ceramic honeycomb structure provided with the plugs out of the container horizontally.Type: GrantFiled: September 28, 2006Date of Patent: June 11, 2013Assignee: Hitachi Metals, Ltd.Inventor: Shinya Tokumaru
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Publication number: 20110018311Abstract: Embodiments disclosed herein provide a vehicle roof having a roof panel formed of molded fiberglass. The panel has a first surface and a second surface. An insert is molded into the roof panel. The insert has an interior surface generally concentrically disposed about an axis that is generally perpendicular to the first surface and the second surface of the roof panel. The insert is at least substantially embedded in the roof panel.Type: ApplicationFiled: July 23, 2009Publication date: January 27, 2011Applicant: International Truck Intellectual Property Company, LLCInventor: Stephen F. Burns
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Patent number: 7704430Abstract: A method for making an article of footwear is disclosed. The method can include a number of steps where various molds are used to attach or mold a tread element onto a substrate or matrix lining. The tread element can be formed by compressing a rubber block between various molding members to cause the resulting rubber material to flow through at least one injection cavity, which penetrates through holes in the matrix lining, into at least one lug cavity disposed on the side of the matrix lining opposite to the injection cavity. The rubber material eventually enters the lug cavity and becomes attached to the matrix lining.Type: GrantFiled: June 5, 2006Date of Patent: April 27, 2010Assignee: Nike, Inc.Inventors: Jeffrey L. Johnson, Jang Rae Cho
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Patent number: 7531119Abstract: There is disclosed a boot for a constant-velocity universal joint, in which a secondary molded portion including a thick portion is formed on an inner peripheral portion of a large-diameter side end portion formed as a primary molded member and in which a material in secondary molding is prevented from leaking. A manufacturing method includes: a step of forming a secondary molding space between a large-diameter side end portion inner peripheral surface of the primary molded member and an outer peripheral surface of a core mold; and a step of injecting a molten material into the secondary molding space to mold the secondary molded portion.Type: GrantFiled: August 18, 2004Date of Patent: May 12, 2009Assignee: Fukoku Co., Ltd.Inventors: Kazuhiko Sueoka, Yasuji Takada
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Patent number: 7482700Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin and by judging only presence or absence of the circular projections using an image processor, it is possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package, an image processor reads only presence or absence of the circular projections even if disconnection of the line or addition of a line should occur, and this allows the circular projections to be always read as being “present”.Type: GrantFiled: September 26, 2005Date of Patent: January 27, 2009Assignee: NEC Electronics CorporationInventor: Norifumi Hori
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Patent number: 7147809Abstract: In at least one embodiment, the present invention takes the form of a panel comprising a substrate, a cover layer, and foam disposed between at least a portion of the substrate and the cover layer. At least one of the cover layer or the substrate being is provided with an integrally formed member for sealing the cover layer to the substrate. The present invention also relates to a method for forming the panel.Type: GrantFiled: November 8, 2005Date of Patent: December 12, 2006Assignee: Lear CorporationInventors: Glenn A. Cowelchuk, Richard Morabito, Joseph T. Donatti, Todd L. DePue
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Patent number: 7135138Abstract: A retractable pin reaction injection molding device and method for forming a layer on an object are disclosed and claimed. The device includes mold plates that cooperate to form a cavity. Retractable pins hold the object within the cavity. Material is inserted into the cavity under pressure to form a layer on the object. The pins are retracted and material fills the voids left by the retracted pins. A system prevents the material from flowing into the clearance between the pins and the mold plates. The system provides a counter pressure of a non-reacting gas to resist the material insertion pressure. The counter pressure may also be used to balance and control the material injection into the mold. Suitable materials for use with the apparatus and method are also disclosed.Type: GrantFiled: May 7, 2003Date of Patent: November 14, 2006Assignee: Acushnet CompanyInventors: Paul A. Puniello, Robert A. Wilson
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Patent number: 7063878Abstract: A process produces foamed articles, especially foamed articles for upholstering car seats. The foamed articles include an adhesive closing part having adhesive elements incorporated into the foaming mold generating the foamed article and covered by a foam-protecting cover. The adhesive closing part itself constitutes the cover. A lateral cover of the adhesive closing part whose width overlaps the surface area on which the adhesive elements are arranged and is releasably attached to the foaming mold by a fixing device. This design simplifies the foaming process and keeps production costs low.Type: GrantFiled: September 28, 1998Date of Patent: June 20, 2006Assignee: Gottlieb Binder GmbH & Co.Inventor: Konstantinos Poulakis
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Patent number: 7029610Abstract: In a process for producing a polyurethane-foam product molded integrally with an insert, wherein a molded body, including a substrate and a polyurethane-foam molded body being molded integrally with the substrate, is produced, the substrate being disposed in an expansion-molding mold as the insert, a fine groove-shaped polyurethane-foam relief groove and a polyurethane-foam adjuster are formed in an end of the substrate and/or a mold surface of the expansion-molding mold which contacts with the substrate. The relief groove communicates with a cavity of the mold. The adjuster communicates with the relief groove, and has a volume larger than that of the relief groove. The relief groove and the adjuster can control the pressure exerted within the cavity. Polyurethane foam, which is formed by the relief groove and the adjuster, adheres to molded product. Therefore, it is possible to obviate the deflashing operation. An expansion-molding mold therefor is also disclosed.Type: GrantFiled: July 1, 2002Date of Patent: April 18, 2006Assignees: Tokai Rubber Industries, Ltd., Tokai Chmical Industries, Ltd.Inventors: Shinji Miyakawa, Juro Ueda
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Patent number: 7005101Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.Type: GrantFiled: March 3, 2003Date of Patent: February 28, 2006Assignee: Texas Instruments IncorporatedInventor: Selvarajan Murugan
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Patent number: 6994813Abstract: A method of foam-embedding cables, in particular for foam-embedding a steering wheel skeleton which is equipped with cables, comprises the following steps: the cable is positioned in a foaming mold; a portion of the cable, which is not to be embedded in foam, is positioned in a resealable cavity provided in the foaming mold, the cavity being sealed against the ingress of foam; the cavity and the foaming mold are closed; the foaming mold is filled with foam; and the foaming mold and the cavity are opened to remove a product produced. There is also proposed a foaming tool for performing such method.Type: GrantFiled: October 24, 2002Date of Patent: February 7, 2006Assignee: TRW Automotive Safety Systems GmbHInventor: Martin Kreuzer
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Patent number: 6989122Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.Type: GrantFiled: October 17, 2002Date of Patent: January 24, 2006Assignee: National Semiconductor CorporationInventors: Ken Pham, Luu Thanh Nquyen, William Paul Mazotti
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Patent number: 6915570Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold the both edge parts, and pouring a forming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).Type: GrantFiled: May 17, 2000Date of Patent: July 12, 2005Assignee: Kaneka CorporationInventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
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Patent number: 6908577Abstract: A process for manufacturing a capital for an architectural column. The inside of a mold for an architectural column is lightly coated with a mold release. A first opening of the mold is placed upon a surface, and a plug is positioned on the surface within the first opening. Through another opening foam is poured around the plug. After the foam has hardened, the mold is removed from the surface. All other openings in the mold are securely covered. Then an elastomer is introduced into the mold, and the mold is rotated about multiple different axes. The introduction of the elastomer is repeated after the prior coating created by the introduced elastomer has become tacky but before the prior coating has become firm. After the final coating of elastomer has become tacky but not firm, foam is introduced into the mold.Type: GrantFiled: June 29, 2001Date of Patent: June 21, 2005Inventor: Barney J. Auman
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Patent number: 6905643Abstract: A process of molding a component on a substrate utilizes a substrate having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange has a projecting, continuous circuitous ridge that forms a seal between the substrate and an upper mold segment. The process allows a substantially flash free molded component to be formed directly on a substrate, thus eliminating the need for a separate flash removal step.Type: GrantFiled: December 4, 2002Date of Patent: June 14, 2005Assignee: Dow Global Technologies Inc.Inventors: Christian Junker, Michael J. Anderson
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Patent number: 6843950Abstract: The invention relates to a device for the plastic sheathing of connections, which are produced by circular weld seams, of a pipeline comprising steel pipes which are provided with a factory-fitted plastic insulation and are reinsulated in the region of the circular weld seam by injection molding, having a split injection mold, which can be connected to an injection-molding fixture and, in the region of the weld seam, can be laid and secured, in the manner of a sleeve, around the steel pipes in such a manner that the injection mold in each case covers the end of the factory-fitted plastic insulation of the two steel pipes which have been welded together, the injection mold having an internal diameter, at least in the axial region between the factory-fitted plastic insulations, which corresponds to the external diameter of the plastic sheathing which is to be produced in the region of the weld seam and having an internal diameter, at its ends, which corresponds to the external diameter of the factory-fitted plaType: GrantFiled: November 2, 2000Date of Patent: January 18, 2005Assignee: EUPEC Pipe Coatings GmbHInventors: Günter Mally, Peter A. Blome
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Patent number: 6773652Abstract: A preferred process comprises providing a pre-formed, substantially transparent window for a cover of an electrical-energy meter, and molding the cover from a molten resin that, when solidified, is substantially opaque. Molding the cover from a molten resin comprises causing a portion of the molten resin to contact a periphery of the window and allowing the portion of the molten resin to cool and thereby solidify so that the portion of the molten resin, upon solidifying, is molded over the periphery of the window and thereby seals and secures the window to the cover.Type: GrantFiled: October 2, 2002Date of Patent: August 10, 2004Assignee: Elster Electricity, LLCInventors: Garry M. Loy, Lars A. Lindqvist
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Patent number: 6770236Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.Type: GrantFiled: August 22, 2001Date of Patent: August 3, 2004Assignee: APIC Yamada Corp.Inventor: Fumio Miyajima
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Patent number: 6676885Abstract: The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.Type: GrantFiled: February 12, 2001Date of Patent: January 13, 2004Assignee: NEC Electronics CorporationInventors: Kazuo Shimizu, Hisayuki Tsuruta
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Patent number: 6666997Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.Type: GrantFiled: October 2, 2001Date of Patent: December 23, 2003Assignee: Micron Technology, Inc.Inventors: Vernon M. Williams, Michael D. Gifford
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Patent number: 6660558Abstract: A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The semiconductor package includes a substrate and a semiconductor die attached to the substrate. The substrate includes a pattern of conductors wire bonded to the die, and an array of solder balls bonded to ball bonding pads on the conductors. In addition, the substrate includes a die encapsulant encapsulating the die, and a wire bond encapsulant encapsulating the wire bonds. During molding of the wire bond encapsulant, the flash control cavities collect flash, and provide pressure relief for venting the mold cavity. In addition, the flash control cavities restrict the flash to a selected area of the package substrate, such that the ball bonding pads and solder balls are not contaminated.Type: GrantFiled: May 2, 2001Date of Patent: December 9, 2003Assignee: Micron Technology, Inc.Inventors: Todd O. Bolken, David L. Peters, Patrick W. Tandy, Chad A. Cobbley
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Patent number: 6643919Abstract: A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such as an image sensor or an ultraviolet-sensitive EPROM (Electrically-Programmable Read-Only Memory) device. The proposed method is characterized in the use of a support pillar, which is positioned beneath the lead frame when the lead frame is clamped between a top inserted mold and a bottom cavity mold, to help prevent resin flash on the lead frame during the molding of the core-hollowed portion.Type: GrantFiled: May 19, 2000Date of Patent: November 11, 2003Assignee: Siliconware Precision Industries Co., Ltd.Inventor: Chien-Ping Huang
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Publication number: 20030201573Abstract: A laminate composite material comprises a layer of an open weave supporting fabric having a layer of breathable resin adhered thereto by an extruded layer of a thermoplastic resin blended with a high temperature volatile particulate. The resultant composite material is substantially impervious to air and water and permeable to water vapor and having a water vapor transmission rate exceeding one (1) perm of water vapor.Type: ApplicationFiled: May 21, 2003Publication date: October 30, 2003Inventor: Jennifer M. Cabrey
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Patent number: 6635209Abstract: An improved encapsulation method is proposed for the encapsulation of a substrate-based package assembly, which can help to prevent mold flash over exposed package surfaces after encapsulation process is completed. The proposed encapsulation method is characterized by the forming of a cutaway portion in a solder mask over the substrate along a seam line between the solder mask and the molding tool that would exist between the solder mask and the molding tool when the semi-finished package assembly is fixed in position in the molding tool. During encapsulation process, the cutaway portion defines a constricted flow passage to the injected encapsulation material; and consequently, when the encapsulation material flows into this constricted flow passage, it would more quickly absorb the heat in the molding tool, thereby increasing its viscosity and retarding its flow speed.Type: GrantFiled: December 15, 2000Date of Patent: October 21, 2003Assignee: Siliconware Precision Industries Co., Ltd.Inventor: Chien-Ping Huang
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Patent number: 6623684Abstract: A sealing gasket for a hard disc drive unit is made by molding an annular sealing member over an annular metal plate. The mold is, provided with an annular cavity and gatings to the cavity including sprue gates and film gates. The gatings are arranged radially outwardly of the cavity to ensure that any flashes or burrs resulting from the presence of the gatings are situated radially outwardly of the sealing member.Type: GrantFiled: September 20, 1999Date of Patent: September 23, 2003Assignee: NOK CorporationInventors: Norikazu Satoh, Masayuki Kishimoto
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Patent number: 6596428Abstract: There is provided herein a graphite plate assembly including an injection molded plastic frame which carries the border detail for the graphite plate. The planar graphite plate is provided with a frame engaging protrusion around its periphery and with beveled edges bordering the broad top and bottom surfaces of the graphite plate. These beveled edges seal against respective beveled surfaces of the mold to prevent plastic from entering onto the graphite plate surfaces during injection molding of the frame. The graphite plate is held in position within the mold by a vacuum grid and locating pins while plastic is injected into the cavity space around the graphite plate from a plurality of spaced plastic injection gates.Type: GrantFiled: May 23, 2001Date of Patent: July 22, 2003Inventor: George J. Gemberling
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Patent number: 6579481Abstract: A process for manufacturing a capital for an architectural column. The inside of a mold for an architectural column is lightly coated with a mold release. A first opening of the mold is placed upon a surface, and a plug is positioned on the surface within the first opening. Through another opening foam is poured around the plug. After the foam has hardened, the mold is removed from the surface. All other openings in the mold are securely covered. Then an elastomer is introduced into the mold, and the mold is rotated about three different axes. The introduction of the elastomer is repeated after the prior coating created by the introduced elastomer has become tacky but before the prior coating has become firm. After the final coating of elastomer has become tacky but not firm, foam is introduced into the mold.Type: GrantFiled: May 22, 2001Date of Patent: June 17, 2003Inventor: Barney J. Auman
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Patent number: 6562271Abstract: A nonslip member in which a large number of nonslip convexes are fixed to an upper surface of a base fabric performing an anchoring action, and the nonslip convexes are made of rubber. By engaging a male mold and a female mold with each other, a large number of small pieces coincident to a shape of through holes of the female mold are punched out from a plate-like material. By pressurizing and heating each small piece between a punching convex and a mounting base while engaging the male mold and the female mold with each other, the small piece is bridged and fixed to the base fabric to serve as a nonslip convex.Type: GrantFiled: March 1, 2001Date of Patent: May 13, 2003Assignee: ASICS CorporationInventors: Keiji Hiraoka, Tomohiro Hayashi, Masanobu Inohara
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Patent number: 6444157Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.Type: GrantFiled: June 2, 1998Date of Patent: September 3, 2002Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 6440347Abstract: A method of manufacturing a tube-covered roller for fixing includes a step of setting a core material in a substantially central portion of a cylindrical mold and setting, outside the core material, a tube and a resin layer which is capable of coming into contact with an inner surface of the mold, a step of putting a rubber material between the core material and the tube and hardening the rubber material to produce a roller, and a step of, after detaching the roller covered with the tube and the resin layer from the mold, removing the resin layer from the roller.Type: GrantFiled: November 26, 1999Date of Patent: August 27, 2002Assignee: Canon Kabushiki KaishaInventors: Satoru Izawa, Masahiro Goto
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Patent number: 6375878Abstract: An instrument panel of an automotive vehicle includes a rigid retainer preformed with an air bag opening and a recessed ledge extending about the opening. A separately formed door is installed on the opening and hinged to the retainer along one edge. The remaining three edges overlie the ledge to prevent inward movement of the door. The retainer and door are placed in a cavity of a mold tool in spaced relation to an outer skin and foam constituents are reacted therebetween to develop a foam layer. A foam seal is provided at the interface of the ledge and door to prevent the escape of foam past the ledge.Type: GrantFiled: September 8, 2000Date of Patent: April 23, 2002Assignee: Textron Automotive Company Inc.Inventors: John D. Gray, C. Christopher Griggs, David M. Smoger
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Patent number: 6352659Abstract: A mold (100) for producing foamed articles is described. The mold comprises an upper mold and a lower mold (102) releasingly engageable in a closed position to define a mold cavity (106) having a parting line about a periphery of the mold cavity. The parting line of the mold defines: (i) a first channel (108) along a first length of a periphery of the mold cavity, and (ii) a second channel (110) in communication with first channel, the second channel having a second length which is less than the first length. A method for producing a molded article use is also described. The subject mold and method are particularly well suited for the production of molded foam (e.g, polyurethane) articles.Type: GrantFiled: June 2, 2000Date of Patent: March 5, 2002Assignee: Woodbridge Foam CorporationInventors: Leslie E. Clark, Craig A Hunter, Donald J. McFarland, Harold W Freitag, Jr., Christopher A. Leite
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Patent number: 6319449Abstract: A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the space of the mold in which the elastomer is formed. The substrate may also have a datum surface on which the mold locates, with the molding seal disposed in a plane which differs from the plane of the datum surface of the substrate. A process of molding the insert on the substrate is also provided.Type: GrantFiled: September 14, 1999Date of Patent: November 20, 2001Assignee: International Business Machines CorporationInventors: Jeffrey S. Campbell, James T. Holton
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Publication number: 20010035595Abstract: There is provided herein a graphite plate assembly including an injection molded plastic frame which carries the border detail for the graphite plate. The planar graphite plate is provided with a frame engaging protrusion around its periphery and with beveled edges bordering the broad top and bottom surfaces of the graphite plate. These beveled edges seal against respective beveled surfaces of the mold to prevent plastic from entering onto the graphite plate surfaces during injection molding of the frame. The graphite plate is held in position within the mold by a vacuum grid and locating pins while plastic is injected into the cavity space around the graphite plate from a plurality of spaced plastic injection gates.Type: ApplicationFiled: May 23, 2001Publication date: November 1, 2001Inventor: George J. Gemberling
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Patent number: 6280669Abstract: A method for making insulated pre-formed wall panels for attachment to like insulated pre-formed wall panels for building a wall. The method includes providing a mold for casting a concrete body having a generally planar portion with a plurality of rib portions extending therefrom, nesting at least one insulation strip within a respective spring member, covering the end portions of the respective spring member with a thermally insulating material to limit thermal conductivity from each respective rib portion of the concrete body to each respective spring member, inserting each respective spring member with the at least one nested insulation strip in the mold, and casting the concrete body in the mold with each respective spring member with the at least one insulation strip being unitarily attached to an edge portion of each respective rib portion with the end portion of each respective spring member being anchored in each respective rib portion of the concrete body to make the insulated pre-formed wall panel.Type: GrantFiled: July 22, 1998Date of Patent: August 28, 2001Assignee: Kistner Concrete Products, Inc.Inventors: Michael J. Kistner, Paul J. Rowe, Kenneth J. Kistner, William M. Kistner