Preventing Flash Patents (Class 264/276)
  • Patent number: 10821636
    Abstract: In a skin integral molded article which is formed by filling the inside of a skin which is formed into a bag shape with a foamed body and molding the foamed body integrally with the skin, an opening through which a foaming raw material is supplied into the skin is formed in the skin, in one side skin and other side skin which are formed with the opening being interposed, the one-side skin is bent into inside the opening, the other-side skin is provided with a part disposed ahead of a part which is bent into inside the opening and is formed to be pliable, and the part which is disposed ahead of the other-side skin part and is formed to be pliable is formed in contact with a leading end part of the one-side skin part which is bent into the opening.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: November 3, 2020
    Assignee: TACHI-S CO., LTD.
    Inventor: Tsuyoshi Tabata
  • Patent number: 10775055
    Abstract: A bulkhead assembly includes bulkhead having a first surface facing a first direction and a second surface facing a second direction. The second surface is opposite the first surface. A first connector is disposed on the bulkhead facing the first direction. A second connector is disposed on the bulkhead facing the second direction.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: September 15, 2020
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Wilbur Carl Bewley, Jr., Robert William Jewell, James Bryan Rawson, Stephen D. Hatcher, Mike Fradkin
  • Patent number: 10608260
    Abstract: A gasket has a gasket main body which is made of a rubber-like elastic body, and a reinforcement body which is made of a material having a higher rigidity than the gasket main body. The gasket main body integrally has a tabular base portion, and a seal portion which is provided in an end portion in a width direction of the base portion, the reinforcement body is formed into a tabular shape, is set its thickness to be smaller than a thickness of the base portion, and is buried in the base portion in such a manner as to be exposed to a surface with one surface in a thickness direction of the base portion, and the reinforcement body is provided with a positioning hole for positioning the reinforcement body in relation to a metal mold forming the gasket main body on a plane.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: March 31, 2020
    Assignee: NOK CORPORATION
    Inventor: Takayuki Horimoto
  • Patent number: 10576674
    Abstract: A method for molding amorphous polyether ether ketone including steps of preparing a molten mass including polyether ether ketone, cooling a mold assembly to a temperature of at most about 200° F., and injecting the molten mass into the cooled mold assembly.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 3, 2020
    Assignee: The Boeing Company
    Inventors: Julie M. Drexler, David E. Sterling, Robert F. McDevitt, Randall A. Rogers
  • Patent number: 9808968
    Abstract: A mold, a molding machine, and a foamed molded body manufacturing method are provided that are capable of more reliably preventing ingress of foamed resin into a gas discharge hole using a gas-impermeable member and capable of adequately discharging gas inside the cavity to the cavity outside through the gas discharge hole during foam molding, and that are also capable of achieving good design characteristics in a foamed molded body. A gas discharge hole 5 is provided at a cavity 4 inner face of a mold 1 and discharges gas inside the cavity 4 to outside the cavity 4. A gas-permeable member 6 is disposed inside the cavity 4 of the mold 1 so as to cover the gas discharge hole 5, and a gas-impermeable member 8 is disposed on the gas discharge hole 5 side of the gas-permeable member 6 so as to face the gas discharge hole 5.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: November 7, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Taisuke Yonezawa, Yoshinori Ohashi
  • Patent number: 9337064
    Abstract: Methods of processing semiconductor wafers may involve, for example, encapsulating an active surface and each side surface of a wafer of semiconductor material, a plurality of semiconductor devices located on the active surface of the wafer, an exposed side surface of an adhesive material located on a back side surface of the wafer, and at least a portion of a side surface of a carrier substrate secured to the wafer by the adhesive material in an encapsulation material. At least a portion of the side surface of the adhesive material may be exposed by removing at least a portion of the encapsulation material. The carrier substrate may be detached from the wafer. Processing systems and in-process semiconductor wafers are also disclosed.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: May 10, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Wei Zhou, Aibin Yu, Zhaohui Ma
  • Patent number: 9285156
    Abstract: A refrigeration appliance includes a body having an interior compartment, a door, and a mechanism for opening and/or closing the door that is adapted to act on the door. The interior compartment is adapted to receive products to be cooled. The door is movably attached to the body and adapted to close the interior compartment. The mechanism for opening and/or closing the door is an integral module and is disposed in a corresponding pocket of the refrigeration appliance.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: March 15, 2016
    Assignee: MIELE & CIE. KG
    Inventor: Patrick Linke
  • Patent number: 8974224
    Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 10, 2015
    Inventor: Craig M. Stanley
  • Patent number: 8901336
    Abstract: Embodiments of the present disclosure provide for catalysts such as those shown in FIG. 1.1 and in the Examples, methods of making catalysts, methods of using catalysts, and the like.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: December 2, 2014
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Sukwon Hong, Hwi Min Seo, David R. Snead
  • Patent number: 8623254
    Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: January 7, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Goetz, Steffen Schulze, Daniel Matthie, Markus Kny, Frank Weishaeutel
  • Patent number: 8460589
    Abstract: A method for producing a ceramic honeycomb filter by immersing an end surface of a ceramic honeycomb structure having a lot of flow paths partitioned by cell walls in a plugging material slurry in a container to introduce the plugging material slurry into the predetermined flow paths to form plugs, and taking the ceramic honeycomb structure provided with the plugs out of the container horizontally.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: June 11, 2013
    Assignee: Hitachi Metals, Ltd.
    Inventor: Shinya Tokumaru
  • Publication number: 20110018311
    Abstract: Embodiments disclosed herein provide a vehicle roof having a roof panel formed of molded fiberglass. The panel has a first surface and a second surface. An insert is molded into the roof panel. The insert has an interior surface generally concentrically disposed about an axis that is generally perpendicular to the first surface and the second surface of the roof panel. The insert is at least substantially embedded in the roof panel.
    Type: Application
    Filed: July 23, 2009
    Publication date: January 27, 2011
    Applicant: International Truck Intellectual Property Company, LLC
    Inventor: Stephen F. Burns
  • Patent number: 7704430
    Abstract: A method for making an article of footwear is disclosed. The method can include a number of steps where various molds are used to attach or mold a tread element onto a substrate or matrix lining. The tread element can be formed by compressing a rubber block between various molding members to cause the resulting rubber material to flow through at least one injection cavity, which penetrates through holes in the matrix lining, into at least one lug cavity disposed on the side of the matrix lining opposite to the injection cavity. The rubber material eventually enters the lug cavity and becomes attached to the matrix lining.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: April 27, 2010
    Assignee: Nike, Inc.
    Inventors: Jeffrey L. Johnson, Jang Rae Cho
  • Patent number: 7531119
    Abstract: There is disclosed a boot for a constant-velocity universal joint, in which a secondary molded portion including a thick portion is formed on an inner peripheral portion of a large-diameter side end portion formed as a primary molded member and in which a material in secondary molding is prevented from leaking. A manufacturing method includes: a step of forming a secondary molding space between a large-diameter side end portion inner peripheral surface of the primary molded member and an outer peripheral surface of a core mold; and a step of injecting a molten material into the secondary molding space to mold the secondary molded portion.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: May 12, 2009
    Assignee: Fukoku Co., Ltd.
    Inventors: Kazuhiko Sueoka, Yasuji Takada
  • Patent number: 7482700
    Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin and by judging only presence or absence of the circular projections using an image processor, it is possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package, an image processor reads only presence or absence of the circular projections even if disconnection of the line or addition of a line should occur, and this allows the circular projections to be always read as being “present”.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: January 27, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Norifumi Hori
  • Patent number: 7147809
    Abstract: In at least one embodiment, the present invention takes the form of a panel comprising a substrate, a cover layer, and foam disposed between at least a portion of the substrate and the cover layer. At least one of the cover layer or the substrate being is provided with an integrally formed member for sealing the cover layer to the substrate. The present invention also relates to a method for forming the panel.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: December 12, 2006
    Assignee: Lear Corporation
    Inventors: Glenn A. Cowelchuk, Richard Morabito, Joseph T. Donatti, Todd L. DePue
  • Patent number: 7135138
    Abstract: A retractable pin reaction injection molding device and method for forming a layer on an object are disclosed and claimed. The device includes mold plates that cooperate to form a cavity. Retractable pins hold the object within the cavity. Material is inserted into the cavity under pressure to form a layer on the object. The pins are retracted and material fills the voids left by the retracted pins. A system prevents the material from flowing into the clearance between the pins and the mold plates. The system provides a counter pressure of a non-reacting gas to resist the material insertion pressure. The counter pressure may also be used to balance and control the material injection into the mold. Suitable materials for use with the apparatus and method are also disclosed.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: November 14, 2006
    Assignee: Acushnet Company
    Inventors: Paul A. Puniello, Robert A. Wilson
  • Patent number: 7063878
    Abstract: A process produces foamed articles, especially foamed articles for upholstering car seats. The foamed articles include an adhesive closing part having adhesive elements incorporated into the foaming mold generating the foamed article and covered by a foam-protecting cover. The adhesive closing part itself constitutes the cover. A lateral cover of the adhesive closing part whose width overlaps the surface area on which the adhesive elements are arranged and is releasably attached to the foaming mold by a fixing device. This design simplifies the foaming process and keeps production costs low.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: June 20, 2006
    Assignee: Gottlieb Binder GmbH & Co.
    Inventor: Konstantinos Poulakis
  • Patent number: 7029610
    Abstract: In a process for producing a polyurethane-foam product molded integrally with an insert, wherein a molded body, including a substrate and a polyurethane-foam molded body being molded integrally with the substrate, is produced, the substrate being disposed in an expansion-molding mold as the insert, a fine groove-shaped polyurethane-foam relief groove and a polyurethane-foam adjuster are formed in an end of the substrate and/or a mold surface of the expansion-molding mold which contacts with the substrate. The relief groove communicates with a cavity of the mold. The adjuster communicates with the relief groove, and has a volume larger than that of the relief groove. The relief groove and the adjuster can control the pressure exerted within the cavity. Polyurethane foam, which is formed by the relief groove and the adjuster, adheres to molded product. Therefore, it is possible to obviate the deflashing operation. An expansion-molding mold therefor is also disclosed.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: April 18, 2006
    Assignees: Tokai Rubber Industries, Ltd., Tokai Chmical Industries, Ltd.
    Inventors: Shinji Miyakawa, Juro Ueda
  • Patent number: 7005101
    Abstract: The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so that the leadframe space acts as a virtual gate. This reduces the need for trimming and lowers stress on the finished package.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: February 28, 2006
    Assignee: Texas Instruments Incorporated
    Inventor: Selvarajan Murugan
  • Patent number: 6994813
    Abstract: A method of foam-embedding cables, in particular for foam-embedding a steering wheel skeleton which is equipped with cables, comprises the following steps: the cable is positioned in a foaming mold; a portion of the cable, which is not to be embedded in foam, is positioned in a resealable cavity provided in the foaming mold, the cavity being sealed against the ingress of foam; the cavity and the foaming mold are closed; the foaming mold is filled with foam; and the foaming mold and the cavity are opened to remove a product produced. There is also proposed a foaming tool for performing such method.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: February 7, 2006
    Assignee: TRW Automotive Safety Systems GmbH
    Inventor: Martin Kreuzer
  • Patent number: 6989122
    Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: January 24, 2006
    Assignee: National Semiconductor Corporation
    Inventors: Ken Pham, Luu Thanh Nquyen, William Paul Mazotti
  • Patent number: 6915570
    Abstract: A resin roller (10) is produced by disposing a core body (21) in a forming metal mold (1) having a cylindrical metal mold (13) and core supporting members (14) furnished at both edge parts of the cylindrical metal mold (13) as well as causing the core supporting members (14) to hold the both edge parts, and pouring a forming resin into the metal mold and solidifying it. The resin roller (10) has the core body (21) of the same outer diameter over a full length and a cylindrical resin-formed body (12), sealing members (24, 26) are furnished around the core body (21) in the vicinity of both edge parts of the resin-formed body (12), and the core body is disposed such that the sealing members (24, 26) contact edge faces (14a) at sides of a roller forming space of the core supporting members (14).
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: July 12, 2005
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ohgoshi, Toshiyuki Komatsu, Koji Sezaki, Hidenari Tsunemi, Kenji Kobayashi
  • Patent number: 6908577
    Abstract: A process for manufacturing a capital for an architectural column. The inside of a mold for an architectural column is lightly coated with a mold release. A first opening of the mold is placed upon a surface, and a plug is positioned on the surface within the first opening. Through another opening foam is poured around the plug. After the foam has hardened, the mold is removed from the surface. All other openings in the mold are securely covered. Then an elastomer is introduced into the mold, and the mold is rotated about multiple different axes. The introduction of the elastomer is repeated after the prior coating created by the introduced elastomer has become tacky but before the prior coating has become firm. After the final coating of elastomer has become tacky but not firm, foam is introduced into the mold.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 21, 2005
    Inventor: Barney J. Auman
  • Patent number: 6905643
    Abstract: A process of molding a component on a substrate utilizes a substrate having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange has a projecting, continuous circuitous ridge that forms a seal between the substrate and an upper mold segment. The process allows a substantially flash free molded component to be formed directly on a substrate, thus eliminating the need for a separate flash removal step.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: June 14, 2005
    Assignee: Dow Global Technologies Inc.
    Inventors: Christian Junker, Michael J. Anderson
  • Patent number: 6843950
    Abstract: The invention relates to a device for the plastic sheathing of connections, which are produced by circular weld seams, of a pipeline comprising steel pipes which are provided with a factory-fitted plastic insulation and are reinsulated in the region of the circular weld seam by injection molding, having a split injection mold, which can be connected to an injection-molding fixture and, in the region of the weld seam, can be laid and secured, in the manner of a sleeve, around the steel pipes in such a manner that the injection mold in each case covers the end of the factory-fitted plastic insulation of the two steel pipes which have been welded together, the injection mold having an internal diameter, at least in the axial region between the factory-fitted plastic insulations, which corresponds to the external diameter of the plastic sheathing which is to be produced in the region of the weld seam and having an internal diameter, at its ends, which corresponds to the external diameter of the factory-fitted pla
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: January 18, 2005
    Assignee: EUPEC Pipe Coatings GmbH
    Inventors: Günter Mally, Peter A. Blome
  • Patent number: 6773652
    Abstract: A preferred process comprises providing a pre-formed, substantially transparent window for a cover of an electrical-energy meter, and molding the cover from a molten resin that, when solidified, is substantially opaque. Molding the cover from a molten resin comprises causing a portion of the molten resin to contact a periphery of the window and allowing the portion of the molten resin to cool and thereby solidify so that the portion of the molten resin, upon solidifying, is molded over the periphery of the window and thereby seals and secures the window to the cover.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: August 10, 2004
    Assignee: Elster Electricity, LLC
    Inventors: Garry M. Loy, Lars A. Lindqvist
  • Patent number: 6770236
    Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: August 3, 2004
    Assignee: APIC Yamada Corp.
    Inventor: Fumio Miyajima
  • Patent number: 6676885
    Abstract: The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: January 13, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Kazuo Shimizu, Hisayuki Tsuruta
  • Patent number: 6666997
    Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: December 23, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Vernon M. Williams, Michael D. Gifford
  • Patent number: 6660558
    Abstract: A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The semiconductor package includes a substrate and a semiconductor die attached to the substrate. The substrate includes a pattern of conductors wire bonded to the die, and an array of solder balls bonded to ball bonding pads on the conductors. In addition, the substrate includes a die encapsulant encapsulating the die, and a wire bond encapsulant encapsulating the wire bonds. During molding of the wire bond encapsulant, the flash control cavities collect flash, and provide pressure relief for venting the mold cavity. In addition, the flash control cavities restrict the flash to a selected area of the package substrate, such that the ball bonding pads and solder balls are not contaminated.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: December 9, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, David L. Peters, Patrick W. Tandy, Chad A. Cobbley
  • Patent number: 6643919
    Abstract: A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such as an image sensor or an ultraviolet-sensitive EPROM (Electrically-Programmable Read-Only Memory) device. The proposed method is characterized in the use of a support pillar, which is positioned beneath the lead frame when the lead frame is clamped between a top inserted mold and a bottom cavity mold, to help prevent resin flash on the lead frame during the molding of the core-hollowed portion.
    Type: Grant
    Filed: May 19, 2000
    Date of Patent: November 11, 2003
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventor: Chien-Ping Huang
  • Publication number: 20030201573
    Abstract: A laminate composite material comprises a layer of an open weave supporting fabric having a layer of breathable resin adhered thereto by an extruded layer of a thermoplastic resin blended with a high temperature volatile particulate. The resultant composite material is substantially impervious to air and water and permeable to water vapor and having a water vapor transmission rate exceeding one (1) perm of water vapor.
    Type: Application
    Filed: May 21, 2003
    Publication date: October 30, 2003
    Inventor: Jennifer M. Cabrey
  • Patent number: 6635209
    Abstract: An improved encapsulation method is proposed for the encapsulation of a substrate-based package assembly, which can help to prevent mold flash over exposed package surfaces after encapsulation process is completed. The proposed encapsulation method is characterized by the forming of a cutaway portion in a solder mask over the substrate along a seam line between the solder mask and the molding tool that would exist between the solder mask and the molding tool when the semi-finished package assembly is fixed in position in the molding tool. During encapsulation process, the cutaway portion defines a constricted flow passage to the injected encapsulation material; and consequently, when the encapsulation material flows into this constricted flow passage, it would more quickly absorb the heat in the molding tool, thereby increasing its viscosity and retarding its flow speed.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: October 21, 2003
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventor: Chien-Ping Huang
  • Patent number: 6623684
    Abstract: A sealing gasket for a hard disc drive unit is made by molding an annular sealing member over an annular metal plate. The mold is, provided with an annular cavity and gatings to the cavity including sprue gates and film gates. The gatings are arranged radially outwardly of the cavity to ensure that any flashes or burrs resulting from the presence of the gatings are situated radially outwardly of the sealing member.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: September 23, 2003
    Assignee: NOK Corporation
    Inventors: Norikazu Satoh, Masayuki Kishimoto
  • Patent number: 6596428
    Abstract: There is provided herein a graphite plate assembly including an injection molded plastic frame which carries the border detail for the graphite plate. The planar graphite plate is provided with a frame engaging protrusion around its periphery and with beveled edges bordering the broad top and bottom surfaces of the graphite plate. These beveled edges seal against respective beveled surfaces of the mold to prevent plastic from entering onto the graphite plate surfaces during injection molding of the frame. The graphite plate is held in position within the mold by a vacuum grid and locating pins while plastic is injected into the cavity space around the graphite plate from a plurality of spaced plastic injection gates.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: July 22, 2003
    Inventor: George J. Gemberling
  • Patent number: 6579481
    Abstract: A process for manufacturing a capital for an architectural column. The inside of a mold for an architectural column is lightly coated with a mold release. A first opening of the mold is placed upon a surface, and a plug is positioned on the surface within the first opening. Through another opening foam is poured around the plug. After the foam has hardened, the mold is removed from the surface. All other openings in the mold are securely covered. Then an elastomer is introduced into the mold, and the mold is rotated about three different axes. The introduction of the elastomer is repeated after the prior coating created by the introduced elastomer has become tacky but before the prior coating has become firm. After the final coating of elastomer has become tacky but not firm, foam is introduced into the mold.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: June 17, 2003
    Inventor: Barney J. Auman
  • Patent number: 6562271
    Abstract: A nonslip member in which a large number of nonslip convexes are fixed to an upper surface of a base fabric performing an anchoring action, and the nonslip convexes are made of rubber. By engaging a male mold and a female mold with each other, a large number of small pieces coincident to a shape of through holes of the female mold are punched out from a plate-like material. By pressurizing and heating each small piece between a punching convex and a mounting base while engaging the male mold and the female mold with each other, the small piece is bridged and fixed to the base fabric to serve as a nonslip convex.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: May 13, 2003
    Assignee: ASICS Corporation
    Inventors: Keiji Hiraoka, Tomohiro Hayashi, Masanobu Inohara
  • Patent number: 6444157
    Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
    Type: Grant
    Filed: June 2, 1998
    Date of Patent: September 3, 2002
    Assignee: Apic Yamada Corporation
    Inventor: Fumio Miyajima
  • Patent number: 6440347
    Abstract: A method of manufacturing a tube-covered roller for fixing includes a step of setting a core material in a substantially central portion of a cylindrical mold and setting, outside the core material, a tube and a resin layer which is capable of coming into contact with an inner surface of the mold, a step of putting a rubber material between the core material and the tube and hardening the rubber material to produce a roller, and a step of, after detaching the roller covered with the tube and the resin layer from the mold, removing the resin layer from the roller.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: August 27, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoru Izawa, Masahiro Goto
  • Patent number: 6375878
    Abstract: An instrument panel of an automotive vehicle includes a rigid retainer preformed with an air bag opening and a recessed ledge extending about the opening. A separately formed door is installed on the opening and hinged to the retainer along one edge. The remaining three edges overlie the ledge to prevent inward movement of the door. The retainer and door are placed in a cavity of a mold tool in spaced relation to an outer skin and foam constituents are reacted therebetween to develop a foam layer. A foam seal is provided at the interface of the ledge and door to prevent the escape of foam past the ledge.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: April 23, 2002
    Assignee: Textron Automotive Company Inc.
    Inventors: John D. Gray, C. Christopher Griggs, David M. Smoger
  • Patent number: 6352659
    Abstract: A mold (100) for producing foamed articles is described. The mold comprises an upper mold and a lower mold (102) releasingly engageable in a closed position to define a mold cavity (106) having a parting line about a periphery of the mold cavity. The parting line of the mold defines: (i) a first channel (108) along a first length of a periphery of the mold cavity, and (ii) a second channel (110) in communication with first channel, the second channel having a second length which is less than the first length. A method for producing a molded article use is also described. The subject mold and method are particularly well suited for the production of molded foam (e.g, polyurethane) articles.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: March 5, 2002
    Assignee: Woodbridge Foam Corporation
    Inventors: Leslie E. Clark, Craig A Hunter, Donald J. McFarland, Harold W Freitag, Jr., Christopher A. Leite
  • Patent number: 6319449
    Abstract: A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the space of the mold in which the elastomer is formed. The substrate may also have a datum surface on which the mold locates, with the molding seal disposed in a plane which differs from the plane of the datum surface of the substrate. A process of molding the insert on the substrate is also provided.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: November 20, 2001
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey S. Campbell, James T. Holton
  • Publication number: 20010035595
    Abstract: There is provided herein a graphite plate assembly including an injection molded plastic frame which carries the border detail for the graphite plate. The planar graphite plate is provided with a frame engaging protrusion around its periphery and with beveled edges bordering the broad top and bottom surfaces of the graphite plate. These beveled edges seal against respective beveled surfaces of the mold to prevent plastic from entering onto the graphite plate surfaces during injection molding of the frame. The graphite plate is held in position within the mold by a vacuum grid and locating pins while plastic is injected into the cavity space around the graphite plate from a plurality of spaced plastic injection gates.
    Type: Application
    Filed: May 23, 2001
    Publication date: November 1, 2001
    Inventor: George J. Gemberling
  • Patent number: 6280669
    Abstract: A method for making insulated pre-formed wall panels for attachment to like insulated pre-formed wall panels for building a wall. The method includes providing a mold for casting a concrete body having a generally planar portion with a plurality of rib portions extending therefrom, nesting at least one insulation strip within a respective spring member, covering the end portions of the respective spring member with a thermally insulating material to limit thermal conductivity from each respective rib portion of the concrete body to each respective spring member, inserting each respective spring member with the at least one nested insulation strip in the mold, and casting the concrete body in the mold with each respective spring member with the at least one insulation strip being unitarily attached to an edge portion of each respective rib portion with the end portion of each respective spring member being anchored in each respective rib portion of the concrete body to make the insulated pre-formed wall panel.
    Type: Grant
    Filed: July 22, 1998
    Date of Patent: August 28, 2001
    Assignee: Kistner Concrete Products, Inc.
    Inventors: Michael J. Kistner, Paul J. Rowe, Kenneth J. Kistner, William M. Kistner
  • Patent number: 6277316
    Abstract: A method of forming a prefabricated insulated wall panel for installation with like wall panels for easily and inexpensively building a wall.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: August 21, 2001
    Assignee: Kistner Concrete Products, Inc.
    Inventors: Michael J. Kistner, Paul J. Rowe
  • Publication number: 20010008319
    Abstract: A prefabricated insulated wall panel for building a wall. The wall panel includes one or more outer planar portions, a plurality of rib portions integral therewith and normal thereto and between which insulation is received, a strip of insulation attached to the inner edge of each rib portion for reducing thermal conductivity from the respective rib portion to wallboard attached to the wall panel, and a wallboard nailer strip which extends about the sides of the strip of insulation and has edge portions which are anchored in the respective rib portion. In accordance with one aspect of the invention, the nailer edge portions are insulated from the respective rib portion to limit thermal conductivity from the respective rib portion to the nailer. In accordance with another aspect of the invention, a pair of planar portions extend at an angle relative to each other so that the panel serves as a corner wall panel.
    Type: Application
    Filed: July 22, 1998
    Publication date: July 19, 2001
    Inventors: MICHAEL J. KISTNER, PAUL J. ROWE, KENNETH J. KISTNER, WILLIAM M. KISTNER
  • Patent number: 6261502
    Abstract: A method and an apparatus are used for injection molding composite devices comprised of a plastic material and a component being at least partially embedded in the plastic material. A mold is provided having a cavity therein. The cavity has a surface and an access bore is provided in the mold which ends in the cavity surface via an opening. The component is fed through the access bore and via the opening to the cavity. The component is configured to positively cover with overlap the opening upon transition thereof while coming to rest on the surface. Molten plastic material is injected into the cavity to enclose the component, thus forming the composite device. After solidifying of the plastic material the composite device is ejected from the cavity.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: July 17, 2001
    Inventor: Richard Herbst
  • Patent number: 6261501
    Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: July 17, 2001
    Assignee: Apic Yamada Corporation
    Inventors: Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama, Fumio Miyajima
  • Patent number: 6258314
    Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: July 10, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada