Preventing Flash Patents (Class 264/276)
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Publication number: 20010008319Abstract: A prefabricated insulated wall panel for building a wall. The wall panel includes one or more outer planar portions, a plurality of rib portions integral therewith and normal thereto and between which insulation is received, a strip of insulation attached to the inner edge of each rib portion for reducing thermal conductivity from the respective rib portion to wallboard attached to the wall panel, and a wallboard nailer strip which extends about the sides of the strip of insulation and has edge portions which are anchored in the respective rib portion. In accordance with one aspect of the invention, the nailer edge portions are insulated from the respective rib portion to limit thermal conductivity from the respective rib portion to the nailer. In accordance with another aspect of the invention, a pair of planar portions extend at an angle relative to each other so that the panel serves as a corner wall panel.Type: ApplicationFiled: July 22, 1998Publication date: July 19, 2001Inventors: MICHAEL J. KISTNER, PAUL J. ROWE, KENNETH J. KISTNER, WILLIAM M. KISTNER
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Patent number: 6261501Abstract: A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.Type: GrantFiled: January 22, 1999Date of Patent: July 17, 2001Assignee: Apic Yamada CorporationInventors: Tsutomu Miyagawa, Kunihiro Aoki, Masahiro Kodama, Fumio Miyajima
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Patent number: 6261502Abstract: A method and an apparatus are used for injection molding composite devices comprised of a plastic material and a component being at least partially embedded in the plastic material. A mold is provided having a cavity therein. The cavity has a surface and an access bore is provided in the mold which ends in the cavity surface via an opening. The component is fed through the access bore and via the opening to the cavity. The component is configured to positively cover with overlap the opening upon transition thereof while coming to rest on the surface. Molten plastic material is injected into the cavity to enclose the component, thus forming the composite device. After solidifying of the plastic material the composite device is ejected from the cavity.Type: GrantFiled: November 9, 1998Date of Patent: July 17, 2001Inventor: Richard Herbst
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Patent number: 6258314Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.Type: GrantFiled: June 20, 2000Date of Patent: July 10, 2001Assignee: Matsushita Electronics CorporationInventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada
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Publication number: 20010001514Abstract: A prefabricated insulated wall panel for installation with like wall panels for easily and inexpensively building a wall. The wall panel is a unitary combination of (1) a member having a planar portion and a plurality of spaced rib portions integral therewith and extending therefrom for receiving insulation therebetween, (2) insulating material attached to edges of the rib portions for reducing thermal conductivity from the rib portions to wallboard attached to the wall panel, and (3) a nailer for attachment of wallboard.Type: ApplicationFiled: June 7, 1999Publication date: May 24, 2001Inventors: MICHAEL J KISTNER, PAUL J ROWE
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Patent number: 6200506Abstract: A method for forming a headrest, which involves pre-assembling an incomplete headrest unit including a trim cover assembly having an opening therein and a headrest frame having been placed via the opening within the trim cover assembly, and a foaming process for subjecting such incomplete headrest unit to a foaming by injecting a liquid base foaming material into the interior of trim cover assembly and curing that foaming material, so as to produce a final headrest. In the method, an injection nozzle device is utilized, which has an entrapping or catching element provided at the nozzle portion thereof. Prior to the foaming process, the nozzle portion of injection nozzle device is inserted via the opening into the interior of trim cover assembly in a first direction, and then drawn in a second direction opposite to the first direction, thereby causing the opening to be closed positively by the catching element, to prevent leakage of the liquid base foaming material from the opening.Type: GrantFiled: December 10, 1999Date of Patent: March 13, 2001Assignee: Tachi-Co., LTDInventor: Yoshiyuki Takei
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Patent number: 6200505Abstract: This invention relates to an improved method for the production of a pour-in-place composite article. These composite articles comprise an exterior covering and a flexible polyurethane foam core. This method comprises inserting a support armature into a pre-sewn exterior covering, positioning an exterior covering in a shaped mold, and applying pressurized gas to the outside surface of the exterior covering at the point directly opposite the position that the reaction mixture will be injected into the mold. The pressurized gas is either applied to the outside surface of the exterior covering either at some point prior to injection of the reaction mixture into the shaped mold, or the pressurized gas is applied simultaneously with the injection of the reaction mixture into the shaped mold. The application of pressurized gas is discontinued once the injection step is completed, allowing the reaction mixture to fully react and expand to conform the composite article to the shape of the mold.Type: GrantFiled: July 31, 2000Date of Patent: March 13, 2001Assignee: Bayer CorporationInventor: Ronald Zibert
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Patent number: 6191955Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.Type: GrantFiled: January 21, 1998Date of Patent: February 20, 2001Assignee: Dallas Semiconductor CorporationInventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
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Patent number: 6187243Abstract: The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.Type: GrantFiled: July 8, 1998Date of Patent: February 13, 2001Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 6171534Abstract: A method of making a loudspeaker cone and surround assembly comprises clamping at least the outer marginal edge of a cone in a mold having a cavity defining a surround and injecting an elastomeric material into the cavity through an annular orifice extending substantially continuously around the said marginal outer edge to form a surround attached to the outer marginal edge of the cone. The method includes the step of feeding the elastomeric material to the annular orifice through an annular feed chamber extending around the mold cavity. The annular orifice may be narrow in width in comparison to the thickness of the surround and the method may comprise the step of separating the surround from an annular ring of sprue formed by elastomer which has solidified in or outside the annular orifice by tearing while the elastomer is still hot from the injection molding step.Type: GrantFiled: January 14, 1993Date of Patent: January 9, 2001Inventors: Patrick Arthur Leach, David Ian Leach
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Patent number: 6136250Abstract: An apparatus and method of fabricating an electric motor encapsulates the major assemblies of the motor in protective encapsulating material. The method begins by assembling a blade and housing, a motor stator, a motor rotor and associated control circuitry into a complete electric fan. The operational characteristics of the complete fan are then tested to verify proper operation. The blade and rotor assemblies are then removed from the complete fan so that a mold may be positioned onto the fan. Encapsulating material is injected into the mold so as to encase the fan in the encapsulating material. The mold is removed and the blade and rotor assemblies are reinserted. Embodiments may use various encapsulating materials such as urethanes, silicones, or epoxies.Type: GrantFiled: January 30, 1998Date of Patent: October 24, 2000Assignee: Comair Rotron, Inc.Inventor: Fred A. Brown
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Patent number: 6126882Abstract: A socket tool is formed primarily from non-metallic composite material. The socket tool body is compression molded of high-strength, glass-reinforced vinyl ester sheet molding compound. Metal inserts are respectively received in the driven and driving ends of the tool body, the inserts respectively defining openings for respectively mateably receiving associated driving and driven members, the inserts being disposed in the body so that no portion of the inserts projects outwardly beyond the exterior surface of the body. The inserts are preferably insert molded in the body, but may also be fixedly secured in pre-existing recesses in the ends of the body, as by press-fitting or bonding. In the latter case, the inserts are provided with anti-rotation outer surfaces which are non-circular in transverse cross-sectional shape.Type: GrantFiled: June 10, 1999Date of Patent: October 3, 2000Assignee: Snap-on Technologies, Inc.Inventors: Dean J. Iwinski, Marco E. DeVecchis, Gregory A. Zurbuchen, George Ulics
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Patent number: 6126885Abstract: According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.Type: GrantFiled: June 26, 1998Date of Patent: October 3, 2000Assignee: Matsushita Electronics CorporationInventors: Seishi Oida, Yukio Yamaguchi, Nobuhiro Suematsu, Takeshi Morikawa, Yuichiro Yamada
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Patent number: 6096250Abstract: A process for releasing a runner or gate from an electronic device on a laminate plate after molding process is included. The area of the laminate plate designed to be covered with molding compound is cleaned in advance by appropriate physical and chemical process to enhance the adhesion property, and the area to be covered by the runner or gate is protected from the cleaning process to maintain the original property of low adhesion to the laminate plate. The runner or gate can be easily released from the laminate plate without damage to the molding compound after the molding process, and the yield of the electronic device is increased.Type: GrantFiled: March 6, 1998Date of Patent: August 1, 2000Assignee: Caesar International, Inc.Inventor: Shih-Li Chen
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Patent number: 6090322Abstract: A method for producing a sealing member for a battery includes integrally insert-molding a gasket on a peripheral edge of a metal sealing plate. The gasket is molded on the peripheral edge of the metal sealing plate by inserting the metal sealing plate between the female and male molds, the female mold having a concave surface conforming to the upper surface of the metal sealing plate and provided with a magnet or vacuum suction mouth to attract the metal sealing plate in its center, and the male mold having a surface conforming to the lower surface of the metal sealing plate, then injecting a molten resin into a cavity formed between the female mold and the male mold while pressing the female and male molds against each other by an elastic member.Type: GrantFiled: June 5, 1998Date of Patent: July 18, 2000Assignees: Matsushita Electric Industrial Co., Ltd., Shinsei Kagaku Kogyo Co., Ltd.Inventors: Shinji Tsurutani, Syunichi Tanoue, Fumio Daio
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Patent number: 6080354Abstract: A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower molType: GrantFiled: May 1, 1998Date of Patent: June 27, 2000Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 6045731Abstract: According to the invention, a novel guide member for integrally forming the fastening parts with the urethane mold and an integral molding method using the guide member are provided. The guide member includes a guide body that has an extended body which includes concave cross-section and at least one open end (4, 7), and isolation members (5, 6) provided near the ends of said guide portion. The isolation members are detachable, and by engaging with the fastening surface of the fastening parts, they effectively block any seepage of liquid foaming raw material. With the integral forming method using said guide member of the invention, it is possible to embed the ends of the fastening parts within the urethane molding and to improve its peeling strength at low cost.Type: GrantFiled: January 30, 1997Date of Patent: April 4, 2000Assignee: Namba Press Works Co., Ltd.Inventor: Chikara Matsuoka
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Patent number: 5997783Abstract: A vent for a mold for producing foamed articles is described. The mold comprises an upper mold and a lower mold releaseably engageable in a closed position to define a mold cavity. The vent comprises a housing which is engageable to the mold, a passageway and an obstruction disposed in the passageway. The passageway and the obstruction are slidably movable in a first direction with respect to one another and define an opening between an interior and an exterior of the housing. The obstruction has a varying diameter in a direction parallel to the first direction. The subject mold and method are particularly well suited for the production of molded foam (e.g., polyurethane) articles.Type: GrantFiled: October 31, 1997Date of Patent: December 7, 1999Assignee: Woodbridge Foam CorporationInventors: Craig A. Hunter, Hassan Balbaa
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Patent number: 5984414Abstract: In forming a donut-like headrest under a foaming process, a sealing garnish element is provided, which includes a garnish portion and an edge abutment portion. Prior to a foaming step, the sealing garnish element is brought to a donut-like trim cover assembly and inserted fit in an annular opening formed in the annular inward wall region of the trim cover assembly, such that the edge portions of the annular opening are abutted against the edge abutment portion of sealing garnish element, while the garnish portion is attached on and along the annular inward wall region of trim cover assembly. Hence, during the foaming step, those edge abutment and garnish portions of sealing garnish element effectively prevents a liquid foaming base material injected in the trim cover assembly, against leakage from the annular opening.Type: GrantFiled: December 31, 1997Date of Patent: November 16, 1999Assignee: Tachi-s Co., Ltd.Inventors: Mitsuhiro Adachi, Makoto Shimada
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Patent number: 5985198Abstract: A method for manufacturing a film-coated article by the following steps. A pre-molded film having a backing surface and a decorative surface is formed in the shape of the molded article. The film includes an opening that allows the molted plastic to pass through the film. The film is placed within a mold press having a mold with a cavity surface and a movable core. The mold includes an resin inlet with an inlet surface. The film is placed on the mold with the decorative surface juxtaposed the mold. The opening on the film overlies the resin inlet. The mold is closed and the film held securely in place against the inlet surface. A molten plastic material is injected through the resin inlet. The plastic material passes through the film and fuses to the backing surface. After the article has cooled, the press is opened. The molded article is retained on the core and removed from the press.Type: GrantFiled: July 30, 1997Date of Patent: November 16, 1999Assignee: Ford Motor CompanyInventors: Mark Alan Harris, Dale Moore, Zinoviy Chernyak
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Patent number: 5985189Abstract: A refrigeration apparatus cabinet has an outer shell and an inner liner to define an insulation space therebetween. There is an opening through a wall of the liner and opening into the insulation space. An opening through a wall of the shell opens into the insulation space. A wiring harness is provided in the insulation space. The wiring harness comprises a pair of electrical plug-in connectors and a plurality of conductors extending therebetween, one connector being received in the liner wall opening and the other connector being received in the shell wall opening. Foamed-in-place insulation is provided in the insulation space, the connectors sealing the liner wall opening and the shell wall opening to prevent leakage of the foamed-in-place insulation.Type: GrantFiled: September 23, 1993Date of Patent: November 16, 1999Assignee: Whirlpool CorporationInventors: Shelby A. Lynn, Edward L. Ryan, III, Donald R. Mowerton, Lori Ann Cook
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Patent number: 5972278Abstract: A method of forming a synthetic resin formed article having a double-layer structure of a base portion and a covering portion which covers an outer periphery of the base portion and which has an inwardly curved portion for covering an end portion of the base portion.Type: GrantFiled: February 18, 1993Date of Patent: October 26, 1999Assignee: Toyoda Gosei Co., Ltd.Inventors: Keizo Ito, Takashi Kato, Shoji Sakaida, Hikaru Ando
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Patent number: 5968628Abstract: A molded structure formed in a mold having a space, the molded structure itself constituting a molding body when combined with an upper mold. The molded structure has a substrate which may be a carrier frame for an electrical connector. An insert which may be an elastomer is disposed on the substrate and formed in the space in the mold. A deformable (preferably elastic) molding seal is disposed directly on the substrate and under the elastomer, the molding seal preventing elastomer flash during molding. The molding seal may be a ridge surrounding the space of the mold in which the elastomer is formed. The substrate may also have a datum surface on which the mold locates, with the molding seal disposed in a plane which differs from the plane of the datum surface of the substrate. A process of molding the insert on the substrate is also provided.Type: GrantFiled: October 20, 1997Date of Patent: October 19, 1999Assignee: International Business Machines CorporationInventors: Jeffrey S. Campbell, James T. Holton
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Patent number: 5961912Abstract: An encapsulating method of a substrate-based electronic device of the present invention comprises:the substrate-based electronic device to be encapsulated is placed in the cavity of an encapsulating mold, then an encapsulant is put in a pot of the encapsulating mold, and said encapsulating mold is closed;said encapsulant in the pot is liquidized by heating, and let the liquidized encapsulant go in the cavity through a runner and a gate, and then fill in a semiconductor die;after the encapsulant filled in said semiconductor die is substantially solidified, said encapsulating mold is opened and an encapsulated substrate-based electronic device is taken out from said cavity;which is characterized by that, before encapsulant injection, a degate shim is pre-placed on the substrate of said substrate-based electronic device locating at the position where the runner passes through, in order to let this degate shim substantially makes said encapsulant have no contact with said substrate during injection of encapsulantType: GrantFiled: December 8, 1997Date of Patent: October 5, 1999Assignee: Siliconware Precision Industries Co., LTD.Inventors: Chien Ping Huang, Kevin Yu, Chih Ming Huang
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Patent number: 5942178Abstract: A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.Type: GrantFiled: December 16, 1997Date of Patent: August 24, 1999Assignee: Texas Instruments IncorporatedInventors: Raymond A. Frechette, Daniel S. Troiano
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Patent number: 5928595Abstract: A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.Type: GrantFiled: September 22, 1997Date of Patent: July 27, 1999Assignee: Motorola, Inc.Inventors: James H. Knapp, Cliff J. Scribner, Albert J. Laninga, Sr.
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Patent number: 5895613Abstract: A method of manufacturing a molded plastic product prepares a core and a skin. The core has a pad supporting face, a sidewall surrounding the supporting face, and a pad housing defined by the supporting face and sidewall. The skin has a side face to be fitted to the sidewall of the core. The method sets the core on an upper mold so that the pad supporting face is oriented toward a lower mold, and places the skin on the lower mold so that the back face of the skin is oriented toward the pad supporting face. The method closes the upper and lower molds and injects foam ingredients between the core and the skin. The foam ingredients is reacted and adheres to the skin to form the pad as well as to the pad housing, to thereby integrate them into one body. The method is characterized by arranging an elastic seal on the side face of the skin so that the side face of the skin is attached to the sidewall of the pad housing through the elastic seal by the pressure of the reacted foam ingredients.Type: GrantFiled: June 16, 1997Date of Patent: April 20, 1999Assignee: Kabushiki Kaisha Inoac CorporationInventors: Yasuhiro Nakai, Hiroshi Suzuki
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Patent number: 5891377Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189 are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65.Type: GrantFiled: April 15, 1996Date of Patent: April 6, 1999Assignee: Texas Instruments IncorporatedInventors: Jeremias L. Libres, Raymond A. Frechette, Mario A. Bolanos, Ireneus J. T. M. Pas
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Patent number: 5891384Abstract: An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.Type: GrantFiled: November 21, 1995Date of Patent: April 6, 1999Assignee: Apic Yamada CorporationInventor: Fumio Miyajima
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Patent number: 5874037Abstract: Apparatus, method and sealing means for liquid urethane reaction mixture injection molding of a composite styled metal and plastic vehicle wheel wherein a metal wheel subassembly serves as a preform between the separable mold parts in the mold apparatus and which is united with the plastic body molding material to form the composite wheel. One of the mold parts has a mold cavity surface operable in mold closed condition to define with the outboard face of the wheel subassembly a mold cavity adapted to provide an ornamental configuration for an outboard face of the plastic body of the composite wheel. A gas permeable and liquid infiltratable mold sealing membrane has a first portion thereof communicating with ambient atmosphere externally of the mold cavity and a second portion thereof communicating with the mold cavity.Type: GrantFiled: February 6, 1995Date of Patent: February 23, 1999Assignee: Motor Wheel CorporationInventors: Ronald P. Saia, Paul N. Skotynsky
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Patent number: 5868980Abstract: A method for masking components of a hot water tank from insulation wherein a carrier sheet containing a pair of inflatable rings is insertable into the space between the inner tank and outer shell of the hot water tank. The inflatable rings surround electrical components on the inner tank to prevent insulation injected into the space from covering the electrical components. Inflatable bags are insertable into threaded bores on fittings connected to the inner tank to prevent the insulation from covering the threaded bores, and to prevent insulation from escaping to the outside of the outer shell.Type: GrantFiled: November 25, 1997Date of Patent: February 9, 1999Inventor: Bob C. Brandon
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Patent number: 5855831Abstract: In forming a headrest for automotive seat, a three-dimensional trim cover assembly with an opening formed therein is subjected to a foaming process. The trim cover assembly has a pair of extensions formed in that opening and a foldable sealing portion defined in one of those two extensions. The foldable sealing portion is formed with a hole. In operation, both two extensions are turned over via the opening into the trim cover assembly, and during the foaming process, an injection nozzle is inserted through the opening and into the hole of foldable sealing portion. Then, a liquid base foaming material is injected from the injection nozzle into the trim cover assembly and cured therein, during which, the foldable sealing portion is folded about another of the two extension by a pressure applied thereto from the liquid base foaming material being cured, so as to close and seal the opening against leakage of the liquid base foaming material from that particular opening.Type: GrantFiled: December 31, 1997Date of Patent: January 5, 1999Assignee: Tachi-S Co., Ltd.Inventor: Yoshiyuki Takei
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Patent number: 5851472Abstract: A method of manufacturing a waterproof connector housing and an apparatus for use in such method wherein an overflow preventing wall which is projected to joining direction of both a male metal mold and a female metal mold is formed around at an edge portion of space for forming a packing, after the overflow preventing wall and the housing are allowed to adhere in such a way that the overflow preventing wall presses the housing arranged between both the metal molds, the rubber material is injected into the space. It can be surely prevented the overflow of the rubber material from the space.Type: GrantFiled: July 20, 1995Date of Patent: December 22, 1998Assignee: Yazaki CorporationInventor: Motohisa Kashiyama
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Patent number: 5846469Abstract: A method of manufacturing an implantable electrode using a mold having a chamber with a compressible interior surface portion. Encapsulant and a conductive lead are placed into the chamber, and the mold is closed. With the mold closed, the compressible interior surface portion of the mold is biased against the lead at a region of contact with the lead, such that the biasing squeezes or excludes any encapsulant from between the lead and the mold at the region of contact. The electrode may have a body having an active portion with a smoothly contoured surface. The active portion may include a conductive wire partially embedded in an electrically insulative encapsulant, with the surface of the active portion comprising a major insulative surface portion defined by the surface of the encapsulant, and a plurality of curved conductive surface portions defined by exposed portions of the surface of the wire.Type: GrantFiled: May 30, 1996Date of Patent: December 8, 1998Assignee: Pacesetter, Inc.Inventor: D. Scott Romkee
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Patent number: 5846468Abstract: A method of manufacturing a waterproof connector housing, that enables the formation of a uniform packing ring which is an integral part of the housing by engaging a hollow body of a housing with a trapezoidal engaging portion provided on a male mold, holding the housing by contacting tightly an inner wall of the hollow body with the trapezoidal engaging portion to align the center of the male mold with that of the housing, and injecting a rubber material into a packing ring forming space uniformly defined by one of both of the male and female mold through a rubber supply paths of the housing. The housing having the hollow body with tapered shoulder, a male mold having the trapezoidal engaging portion and a female mold beveled or thinned at the open edge are employed for implementing the method.Type: GrantFiled: October 30, 1997Date of Patent: December 8, 1998Assignee: Yazaki CorporationInventors: Sakai Yagi, Masanori Tsuji, Motohisa Kashiyama, Takuya Kitamura
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Patent number: 5846477Abstract: A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.Type: GrantFiled: December 7, 1995Date of Patent: December 8, 1998Assignee: Nitto Denko CorporationInventors: Yuji Hotta, Hitomi Shigyo, Shinichi Ohizumi
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Patent number: 5843354Abstract: A method for compression molding a resin-impregnated preform to fabricate an impact-resistance, fiber-reinforced composite fan blade for use in a high bypass turbofan engine. The method is compatible with the use of high viscosity resin systems that contribute greater impact resistance to the fan blade, but whose flow through the fan blade during molding would cause unacceptable movement of the reinforcing fibers. The method entails restricting the flow of the resin system within the preform through selective placement of a resin-impervious material on certain surfaces of the preform, so as to prevent resin loss and fiber movement during the compression molding operation.Type: GrantFiled: November 18, 1997Date of Patent: December 1, 1998Assignee: General Electric CompanyInventors: Charles R. Evans, Jackie D. Jones, James M. Campbell
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Patent number: 5798070Abstract: A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.Type: GrantFiled: March 4, 1996Date of Patent: August 25, 1998Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kunito Sakai, Kazuharu Oshio, Hirozoh Kanegae
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Patent number: 5779951Abstract: An improved vehicle wheel construction having an injection molded generally annular filler ring disposed in a radially inwardly facing circumferential cavity of the wheel to prevent material from accumulating in the circumferential cavity of the wheel and causing an out-of-balance wheel condition and method for producing the same is disclosed.Type: GrantFiled: January 7, 1997Date of Patent: July 14, 1998Assignee: Hayes Lemmerz International, Inc.Inventor: Martin D. Osborne
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Patent number: 5779958Abstract: An electronic device packaging apparatus using molding techniques is provided. This packaging apparatus includes an upper die, a lower die, and a resin injection mechanism. The lower die is designed to mate with the upper die, and includes a cavity block which has an upper block surface and a lower block surface. The upper block surface has formed therein a mold cavity for packaging an electronic device placed between the upper and lower dies with a resin material. The lower block surface has formed therein a groove communicating with the mold cavity. The resin injection mechanism is operable to inject a melted resin material into the mold cavity of the cavity block through the groove formed in the lower block surface of the cavity block.Type: GrantFiled: January 14, 1997Date of Patent: July 14, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Syoujirou Nishihara, Teruaki Nishinaka
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Patent number: 5766539Abstract: A process of molding a racket frame having an evacuation stage for shrinking a lamination of an inner bladder, a tubular prepreg and an outer protective tube before closing a mold, and the reinforcing fibers of the prepreg are not cut by inner edges of the mold, thereby preventing the racket frame from burr due to the reinforcing fibers cut by the inner edges.Type: GrantFiled: October 1, 1996Date of Patent: June 16, 1998Assignee: Yamaha CorporationInventors: Takashi Fujita, Takeru Ohkubo
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Patent number: 5762842Abstract: A passenger seat comprising: a frame element, vehicle anchorage means connected to the frame element, a seat body comprising a resilient material fixed with respect to the frame element and trim cover attachment means, the trim cover attachment means comprising a relatively high density, rigid foam member having a groove disposed in a surface thereof, the groove capable of receiving connection means comprised in a trim cover. A process, system and mold for producing a passenger seat are also described.Type: GrantFiled: August 30, 1996Date of Patent: June 9, 1998Inventors: Charles R. Burchi, Keith Hill
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Patent number: 5744084Abstract: Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.Type: GrantFiled: July 24, 1995Date of Patent: April 28, 1998Assignee: LSI Logic CorporationInventors: Chok J. Chia, Seng-Sooi Lim, Maniam Alagaratnam
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Patent number: 5730917Abstract: A method of molding a headrest of automotive seat comprises the following steps. First, a bag shaped flexible outer skin member is prepared, has an elongate slit formed therethrough. A part of a stay member is inserted into the outer skin member through the slit and set relative to the outer skin member. A given biasing force is applied to longitudinal ends of the slit so that the slit is stretched in longitudinally opposed directions and thus caused to take a closed position. Then, an injection nozzle of a foamable material feeder is put into the slit by expanding the slit against the biasing force. A foamable material is poured into the outer skin member, and the material feeding is stopped when a given amount of material is fed to the outer skin member. The application of the biasing force to the slit is continued until the material is sufficiently cured.Type: GrantFiled: October 8, 1996Date of Patent: March 24, 1998Assignee: Ikeda Bussan Co., Ltd.Inventors: Yoshiharu Ishikawa, Syuzaburo Kimura, Tohru Satoh, Eiichi Yamano, Masatoshi Yasuno
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Patent number: 5728343Abstract: In a method of molding a resin pulley in which a rolling bearing is integrally fitted to the inner periphery of an annular resin body simultaneously with the molding of the resin body, a dummy boss shaft closes the inner periphery and a lateral side of the metallic member. With the cavity molds closed, an annular film gate is formed, by a flange of the dummy boss shaft and a cavity mold, in the vicinity of the outer peripheral edge of an end surface of the rolling bearing. The cavity is charged with molten resin through the film gate.Type: GrantFiled: November 17, 1995Date of Patent: March 17, 1998Assignee: Koyo Seiko Co., Ltd.Inventor: Hiroshi Ueno
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Patent number: 5716571Abstract: A device for obtaining a glazing surrounded, on at least a portion of its periphery, by cast plastic including an injection head, a cavity, an injection dam and at least one mold part in the wall of which a duct is provided. The duct has two parts, one part located outside the joint plane and one part located in the joint plane.Type: GrantFiled: June 17, 1994Date of Patent: February 10, 1998Assignee: Saint-Gobain Vitrage InternationalInventor: Patrick Le Lievre
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Patent number: 5709828Abstract: A vehicle interior trim component, such as a glove compartment or console door, and its method of fabrication includes an outer flexible shell having a peripheral contoured return flap captured within a peripheral gap provided between insert and backing panels of the component. Foam is injected into a space between the outer shell and insert panel and any gases and excess foam are allowed to escape from the foam space into an adjacent overflow chamber in a controlled manner through the gap while the return flap seals the assembly against external leakage of such excess foam.Type: GrantFiled: October 26, 1995Date of Patent: January 20, 1998Assignee: Davidson Textron Inc.Inventors: Claude E. Bemis, Craig B. Labrie, Norman J. Clavette
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Patent number: 5665397Abstract: A mold assembly for forming a panel assembly having a gasket on one surface for use as a flush-mounted panel or window in vehicles, buildings, or other structures includes a mold cavity defined in a facing surface of one mold section and a pressure pad on the second mold section, the pressure pad being urged against the surface of a sheet-like panel at a position opposite the mold cavity with the panel being held against a support surface adjacent the mold cavity when the mold sections are closed. Preferably, the pressure pad is a heat insulative pad which is urged against the panel surface by a resilient member preferably formed from urethane. The support surface and mold cavity are preferably raised above and offset from adjacent portions of the first mold section, and the size of the raised area of the support surface and mold cavity preferably corresponds in size to the area of the pressure pad.Type: GrantFiled: July 21, 1995Date of Patent: September 9, 1997Assignee: Donnelly CorporationInventors: Daniel J. Fisher, Marc A. Lovell, James L. Brodie
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Patent number: 5660771Abstract: In order to prevent the formation of flash on a gasket used to seal a filter element when the filter element is mounted in a housing to filter a fluid, such as air for an internal combustion engine, a molding method and apparatus utilizes a pair of mold components which abut along a mold line and define a cavity for forming the gasket. As the expandable material expands to fill the cavity and form the gasket, a portion of the material adjacent the mold line is received in an annular groove in one of the mold components so that flash is not formed at the mold line. One of the mold components also has an upwardly sloping ramp surface so that air and gas move along the ramp surface as the material expands and does not become trapped in the cavity, thus avoiding defects and blemishes in the gasket due to trapped air bubbles.Type: GrantFiled: November 29, 1995Date of Patent: August 26, 1997Assignee: Dana CorporationInventors: William F. Dunfee, Ronald Ray Puckett, Edward Allen Covington
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Patent number: RE36413Abstract: A novel method of molding an article includes providing a mold with a vent of a pre-determined size such that, due to the difference in viscosities, gases to be vented from the mold may easily pass through the vent while the material to be molded cannot quickly pass through the vent. In fact, the vent is designed such that the material to be molded which enters the vent, does not exit the end of the vent. In the most preferred embodiment, the vent is in the form of a thin ribbon-like groove so that the material to be molded which does enter the vent forms a thin ribbon of extruded material which need not be removed prior to a finish cover being applied to the molded article.Type: GrantFiled: April 2, 1997Date of Patent: November 30, 1999Assignee: Woodbridge Foam CorporationInventors: Leslie Edward Clark, Craig Allen Hunter, Robert Basil Magee, Gerry Vande Wetering, Wilfred Wang Tai Cheng