Abstract: A pattern forming method includes: a first step of forming a first pattern to define a first shot arrangement; and a second step of performing an imprint process, thereby forming a second pattern on the imprint material on the first pattern and defining a second shot arrangement. In the second step, the second shot arrangement is defined so as to reduce an overlay error between the first and second shot arrangements by deforming the mold. In the first step, based on information of the estimated second shot arrangement definable on the substrate when the second step is performed after the second pattern formed on the mold is amended by deforming the mold, the first pattern is formed to make an overlay error between the first and second shot arrangements fall within an allowable range.

Abstract: A method is described for utilizing NIL materials with switchable mechanical properties. The method comprises applying an imprint mask to a nano-imprint lithography (NIL) material layer. The NIL material layer is comprised of a NIL material with a modulus level below a flexibility threshold. The NIL material layer has an internal property, that when changed, causes a change in the modulus level of the NIL material. The method further comprises detaching the imprinted NIL material layer from the imprint mask, with the low modulus level of the NIL material causing a shape of the imprinted NIL material layer to remain unchanged after detachment. A modulus level of the NIL material is increased by changing an internal property of the NIL material, with the modulus level increased beyond a strength threshold to create a first imprint layer that has a structure that remains unaffected by a subsequent process.

Abstract: The present invention provides a molding apparatus that performs a molding process for molding a composition on a substrate using a mold, including a holding unit configured to hold the substrate, and a control unit configured to control the molding process, wherein the control unit starts a process for pressing the mold against the composition on the substrate while the substrate is held by the holding unit with a first holding force, causes the holding unit to hold the substrate with a second holding force smaller than the first holding force after the process is started, and maintains the holding of the substrate by the holding unit with the second holding force until completion of filling of the composition on the substrate into the mold.

Abstract: A method of patterning a substrate includes dispensing droplets of a resist onto a first region and a second region of a surface, pressing a patterned portion of an imprint template into the resist in the first region, curing the resist on the surface, and then removing the imprint template from the resist. An image of the resist in the second region is acquired to evaluate wettability of the resist. In some examples, the evaluation of wettability may be performed by image analysis on the acquired image and used in determining whether or not the patterning of the substrate was successful or likely to have been successful.

Abstract: An ejection device is used for an imprint apparatus that presses a mold against an ejection material ejected onto a substrate to form a pattern. The ejection device includes: a housing unit having an ejection head configured to eject the ejection material onto the substrate, and housing configured to accommodate the ejection material; and a control unit configured to control processing of the ejection device. The control unit switches the processing according to a usage status of a consumable part included in the housing unit.

Abstract: A pick-up head assembly comprises a body of a liquid crystalline elastomer (LCE) that undergoes a reversible expansion when exposed to a first frequency of light and contracts when exposed to a second frequency of light. Selective portions of the LCE in the pick-up head assembly are irradiated with the first frequency to cause an expansion in the selective portions. The adhesive forces of the expanded portions of the LCE are used to pick-up semiconductor devices from a first substrate. The semiconductor devices are placed on a second substrate by exposing the expanded portions of the LCE to the second frequency of light, causing the expanded portions to contract.

Abstract: A method of making a bonded polymeric assembly by transfer printing comprises contacting a stamp with a solid-phase ink comprising a photoresist to form an inked stamp, where the solid-phase ink is reversibly bound to the stamp. The inked stamp is aligned with an object comprising the photoresist and is stamped onto the object. The stamp is then removed, thereby transferring the solid-phase ink onto the object. The solid-phase ink is thermally joined with the object. Thus, a bonded polymeric assembly comprising a bonded joint between the solid-phase ink and the object is formed.

Abstract: A film forming apparatus for forming a film on a substrate includes a driver configured to bring a curable composition arranged on the substrate and a flat surface into contact with each other, a heater configured to heat the curable composition by electromagnetic waves to reduce the viscosity of the curable composition and make the curable composition conform to the flat surface, and a curing device configured to form a film made of a cured product of the curable composition by curing the curable composition in a state in which the curable composition conforms to the flat surface.

Abstract: An imprinting apparatus, a method of manufacturing an article, with a template having at least one mass velocity variation feature in a region that alters the filling rate of formable material in the second region surrounding a pattern region. The altered filling rate varies from a first filling rate, at a center of an outer edge of the region to a second filling rate, at corners of the outer edge of the region. The second filling rate is greater than the first filling rate.

Abstract: A replica manufacturing apparatus performs imprint processing of forming a pattern of an imprint material on a replica substrate using a master mold, processes the replica substrate with the formed pattern to manufacture a replica mold, and transfers data of a condition concerning the imprint processing to a management apparatus. An imprint apparatus acquires the data from the management apparatus, and performs the imprint processing of forming a pattern of an imprint material on a substrate using the replica mold.

Abstract: A fabrication method comprises selecting an initial drop pattern defining a position of drops of a formable material, the initial drop pattern comprising a grid pattern of drops, designating the drops of the grid pattern to be dispensed by a first series of nozzles of a dispenser based on a spacing between drops in the Y-dimension; generating a modified drop pattern by shifting the grid pattern in a first direction along the Y-dimension, wherein a shift distance is selected such that the drops of the shifted grid pattern are designated to be dispensed from a second series of nozzles of the dispenser; dispensing the plurality of drops according to the modified drop pattern onto a substrate; during the dispensing of the drops, shifting a position of the stage or dispenser along the Y-dimension opposite to the first direction by an amount equal to the shift distance.

Abstract: The present disclosure relates to an aerosol production assembly. The aerosol production assembly may include a reservoir that contains an aerosol precursor composition and an atomizer that receives the aerosol precursor composition from the reservoir and heats the aerosol precursor composition to produce an aerosol. The aerosol production assembly may additionally include a body that directs the aerosol through an outlet. The body may include a surface including a micro-pattern that defines at least one of hydrophobic and anti-microbial properties. The surface including the micro-pattern may not include a chemical coating that provides these properties. Rather, the surface may define a three-dimensional structure that provides hydrophobic and/or anti-microbial properties. A related assembly method is also provided.

Abstract: There is provided a method for non-penetration joining of members. The method includes: keeping a joining member having a protruding part by a receiving mold so that the protruding part is exposed; placing a joined member over the joining member so that the protruding part of the joining member is positioned in a blind hole of the joined member, and compressing the joined member against the receiving mold to plastically deform the joined member and the joining member at the same time and to wrap excess thickness of the joined member around an undercut part while forming the undercut part on the joining member, thereby non-detachably joining both the members.

Abstract: There is provided a method of managing an imprint apparatus that comprises a processor configured to execute an imprint process for forming a layer of an imprint material on a substrate by using a mold, a chamber configured to accommodate the processor, and a chemical filter configured to remove a chemical impurity contained in a gas flowing inside the chamber. The method comprises retaining a test substrate inside the chamber during execution of the imprint process, forming a layer of an imprint material on the test substrate by executing the imprint process on the test substrate by the processor after the retaining, inspecting the layer formed on the test substrate in the forming, and determining whether or not to replace the chemical filter based on an inspection result obtained in the inspecting.

Abstract: A method and apparatus provide a base structure at least partially with a cured polymer coating having microscopic polymer structures. The method includes applying an uncured polymer material on at least a part of the base structure, the uncured polymer material being electrically charged with a charge that has a first sign; providing at least one electrode at a distance above at least a part of said uncured polymer material; charging the at least one electrode with an electrical charge that has a second sign opposite to the first sign, thereby electrostatically attracting uncured polymer material towards the at least one electrode and deforming the uncured polymer material into uncured structured polymer material comprising one or more uncured microscopic polymer structures that have a shape; and curing the one or more uncured microscopic polymer structures, thereby forming the cured polymer coating.

Abstract: There is provided a planarization apparatus that planarizes composition in a specified region on a substrate using a planar section of a mold. The planarization apparatus includes a mold holding unit configured to hold the mold, a measurement unit configured to measure a shape of the planar section of the mold held by the mold holding unit and convexly deformed, and a control unit configured to align, based on a result of measurement by the measurement unit, the planar section of the mold and the substrate with respect to a direction along a surface of the substrate so as to bring the planar section of the mold into contact with the specified region on the substrate, and bring the mold and the composition into contact with each other.

Abstract: A shaping apparatus that shapes a composition on a substrate by using a mold, includes a substrate positioning mechanism for positioning the substrate, a mold positioning mechanism for positioning the mold, a dispenser for arranging the composition on a shot region of the substrate, and a gas supply for supplying a gas onto the substrate from a gas supply port in a state in which the substrate is driven by the substrate positioning mechanism. A flow rate of the gas supplied onto the substrate by the gas supply starts to decrease in a period during which the substrate is driven by the substrate positioning mechanism so that the shot region where the composition is arranged by the dispenser is moved under the mold.

Abstract: A decorative material includes a first gloss control layer provided as a surface layer and a second gloss control layer provided on part of the first gloss control layer. The first gloss control layer contains a gloss control agent comprised of a hydrophobic inorganic material and a silicone-based release agent having a reactive terminal group. The reactive terminal group of the silicone-based release agent preferably has at least one of a hydroxyl group and an amino group. Preferably, the second gloss control layer contains a silicone-based release agent having a reactive terminal group, and the reactive terminal group of the silicone-based release agent has at least one of an acryloyl group and a methacryloyl group.

Abstract: An apparatus and method configured to stabilize imprint head temperature. The apparatus and method includes an imprinting apparatus including, a mount attached to a fixed surface, a movable plate movable relative to the mount, at least one electromagnetic actuator mounted between the movable plate and the mount, wherein an electrical current is applied to the at least one electromagnetic actuator for controlling movement of the moveable plate, and wherein a root-mean-square of the electrical current applied to the at least one electromagnetic actuator in an idle state is equal to a root-mean-square of the electrical current applied to the at least one electromagnetic actuator during a continuous imprinting state.

Abstract: A photocurable composition for imprint at least has a polymerizable compound (A) and a photopolymerization initiator (B), in which the polymerizable compound (A) contains 20% by weight or more of a multifunctional (meth)acrylic monomer and the glass transition temperature of a photocured substance of the photocurable composition is 90° C. or more.

Abstract: Reducing an alignment error of an imprint lithography template with respect to a substrate includes locating central alignment marks of the template with respect to corresponding central alignment marks of the substrate and locating peripheral alignment marks of the template with respect to corresponding peripheral alignment marks of the substrate. In-plane alignment error of the template is assessed based on relative positions of central alignment marks of the template and corresponding central alignment marks of the substrate. A combined alignment error of the template is assessed based on relative positions of peripheral alignment marks of the template and corresponding peripheral alignment marks of the substrate. Out-of-plane alignment error of the template is assessed based on a difference between the-combined and the in-plane alignment error of the template, and a relative position of the template and the substrate is adjusted to reduce the out-of-plane alignment error of the template.

Abstract: A blade comprises an airfoil extending from a trailing edge to a leading edge. The airfoil includes a body formed of an aluminum containing material. A sheath is at the leading edge and is formed of a titanium containing material. A sandwich is positioned intermediate the sheath and the airfoil body, the sandwich including an outer adhesive layer adjacent the sheath, an intermediate fabric layer and an inner adhesive layer adjacent the body. A gas turbine engine is also disclosed.

Abstract: A bending area structure of a flexible display panel is disclosed and includes a flexible substrate layer, a circuit layer, and at least one organic layer. The circuit layer is disposed on the flexible substrate layer. The at least one organic layer is disposed on the circuit layer. A plurality of protrusions are arranged on an upper surface of the at least one organic layer.

Abstract: Disclosed is an electroluminescence display apparatus. The electroluminescence display apparatus includes a substrate, a bank provided to define a plurality of emission areas on the substrate, and a first light emitting layer provided in a first emission area of the plurality of emission areas, and a second light emitting layer provided in a second emission area of the plurality of emission areas. An anti-spread part is provided on an upper surface of the bank disposed between the first light emitting layer and the second light emitting layer.

Abstract: An apparatus, method, or platter for modifying mesa sidewalls of a template by cleaning or coating the mesa sidewalls. In which the template has a pattern area on a first surface of a mesa. Mesa sidewalls surround the first surface of the mesa. The mesa sidewalls are exposed to a gas. The gas modifies the mesa sidewalls. Resistance to the flow of gas towards the pattern area is provided.

Abstract: An imprint apparatus includes a mold holder that holds a mold, a substrate holder that holds a substrate by suction, a driving device that brings the mold into contact with an imprint material on the substrate by relatively bringing the mold holder and the substrate holder close to each other, and a controller. The controller controls the driving device so as to bring the mold into contact with the imprint material in a state in which the substrate is deformed into a convex shape with respect to the mold by controlling pressures inside the plurality of suction regions based on surface shape data of the substrate held by the substrate holder.

Abstract: A mold includes a rugged pattern layer, an inorganic sheet layer, and an elastic sheet layer. The inorganic sheet layer is formed of an inorganic material and supports the rugged pattern layer. The elastic sheet layer supports the inorganic sheet layer.

Abstract: A method for transferring a micro device, includes: a compression step in which a carrier film having a micro-device attached to an adhesive layer thereof is brought into contact with a substrate comprising a solder deposited on metal electrodes formed on the substrate and is compressed on the substrate; a first adhesive strength generation step in which the solder disposed between the micro-device and the metal electrodes is compressed in the compression step to generate first adhesive strength between the micro-device and the solder; a second adhesive generation step in which the micro-device is bonded to the adhesive layer through press-fitting in the compression step to generate second adhesive strength between the micro-device and the adhesive layer; and a release step in which the carrier film is separated from the substrate, with the micro-device adhered to the solder.

Abstract: An imprint apparatus, to perform an imprinting process for bringing a mold and an imprint material on a substrate into contact with each other and curing the imprint material, includes a substrate deforming mechanism and a controller. The substrate deforming mechanism deforms the substrate in such a manner that a surface geometry of at least part of the substrate protrudes toward the mold. The controller determines a condition for the imprinting process on a shot area of the substrate based on the surface geometry of the shot area when the mold is brought into contact with the imprint material on the shot area.

Abstract: An imprint apparatus for forming a pattern on an imprinting material includes an alignment unit that detects a mold-side mark formed on a mold and a substrate-side mark formed on the substrate, forming a mark pair, and aligns the mold and the substrate on the basis of a detection result. The alignment unit obtains, by using the detection result of a first mark pair and the detection result of a second mark pair, which is different from the first mark pair, positional deviation information of the first mark pair and positional deviation information of the second mark pair in the same direction; obtains a determination value by using the positional deviation information of the first mark pair and the positional deviation information of second mark pair; and determines that mark detection is abnormal when the determination value is not in an allowable range.

Abstract: A method of controlling a control apparatus for use with a fluid dispenser having a plurality of nozzles includes obtaining, dividing, and substituting. A drop pattern is obtained as data for use in dispensing drops onto a substrate from the plurality of nozzles of the fluid dispenser. The obtained drop pattern is divided into a plurality of drop patterns based on a distance between drops of the obtained drop pattern. The plurality of drop patterns are substituted in place of the obtained drop pattern to dispense the drops onto the substrate from the fluid dispenser.

Abstract: A method for transferring a pattern from a template to a nanoimprint object. A perimeter portion of the nanoimprint object is supported by a perimeter support structure. A gas pressure induced force is applied to the nanoimprint object to facilitate bending of a central portion of the nanoimprint object in a direction toward a surface of the template until the central portion of the nanoimprint object is brought into contact with the surface of the template. While the nanoimprint object is held in contact with the surface of the template, the pattern from the template is transferred to a surface of the nanoimprint object thereby creating a patterned surface on the nanoimprint object.

Abstract: A progressive indent system is used to manufacture a mold for a microlens array. The system includes a die, an actuator, and a controller. The die comprises a plurality of protrusions, wherein each of the protrusions is configured to create an impression in a substrate. Each protrusion has a different priority and is arranged in order of increasing priority on the die. The actuator is coupled to the die and receives actuation instructions from the controller. The actuation instructions cause the actuator to stamp a specific location on the substrate with the plurality of protrusions in order of increasing priority, wherein successive impressions at the specific location progressively form the final shape of a microlens mold. The actuator may move the die repeatedly across the substrate to form a plurality of individual microlens molds at several locations on the substrate, forming a mold for a microlens array.

Abstract: The present invention addresses certain problems facing flexible packages and the packaging industry. Embodiments of the present invention are directed to a method of heat scoring the film or material of the package in various shapes and locations to facilitate the consumer opening the package. Embodiments are also directed to a heat scoring device for delivering the heat score to the package material during the manufacturing process. Other embodiments are directed to a package having one or more heat scores for permitting a user to easily access the contents of a package while maintaining the integrity of the package.

Abstract: A manufacturing method of a circuit board and a stamp are provided. The method includes: forming a circuit pattern and a dielectric layer on a dielectric substrate; forming a conductive via in the dielectric layer; forming a thermal-sensitive adhesive layer on the dielectric layer; forming a photoresist material layer on the thermal-sensitive adhesive layer; imprinting the photoresist material layer using a stamp, wherein a first conductive layer is disposed on the surface of the pressing side of the stamp, a second conductive layer is disposed on the surface of the other portions; applying a current to the stamp; removing the stamp and the photoresist material layer and the thermal-sensitive adhesive layer below the pressing side to form a patterned photoresist layer and thermal-sensitive adhesive layer; forming a patterned metal layer on the region exposed by the patterned photoresist layer; removing the patterned photoresist layer and thermal-sensitive adhesive layer.

Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.

Abstract: An imprint apparatus includes a mold stage that holds a mold, a substrate stage that holds a substrate, a dispensing device that dispenses resin on the substrate, and a controller configured to obtain a result of a foreign substance inspection conducted on the substrate. In a case that the obtained result indicates existence of a foreign substance, the controller controls the dispensing device to dispense the resin onto the foreign substance, cures the dispensed resin without bringing the resin into contact with the mold, controls the dispensing device to dispense the resin again on a first chip region of the substrate where the foreign substance and the cured resin thereon exists, and performs imprint processing to the first chip region.

Abstract: The present invention provides an imprint apparatus comprising a plurality of processing devices configured to perform imprint processes for a plurality of substrates in parallel, and a controller configured to control the plurality of processing devices, wherein the controller is configured to control the plurality of processing devices so that each of the plurality of processing devices performs imprint processes for a plurality of regions whose positions correspond to each other over the plurality of substrates, and so that the plurality of processing devices respectively perform imprint processes for a plurality of regions whose positions are different from each other and which have shapes corresponding to each other in a single substrate.

Abstract: An imprint method includes: before contacting a mold with an imprint material on a target shot region, obtaining relative position of the target shot region with respect to the mold, and performing first alignment between the target shot region and the mold by driving a correction unit configured to correct the relative position of the target shot region; after contacting the mold with the imprint material on the target shot region, performing second alignment between the target shot region and the mold by driving the correction unit; and performing the imprint process on the target shot region after the second alignment. The first alignment includes alignment performed based on a driving amount of the correction unit in the second alignment for another shot region where the imprint process has been performed earlier than in the target shot region.

Abstract: A rotary press device (33) includes a restriction section (36) configured to restrict a motion of a roll (30) around a central axis of a roll (30) against movement of the roll (30) around a central axis of a hub main body (8) during rotary forging. In an example, the restriction section (36) has guide teeth (44) meshed with teeth formed on a processing surface of the roll (30).

Abstract: An imprint device and an imprint method which form mold patterns on both surfaces of a molding target. An imprint device transfers mold patterns on both surfaces of a molding target using flexible first and second dies and includes first and second casings which each apply pressure of first and second pressurizing rooms respectively, to the first and second dies respectively and the molding target, a pressurizer that adjusts the pressures of the pressurizing rooms, first and second moving units that move the first and second dies respectively and the molding target in a direction coming close to or distant from each other, a depressurizer that depressurizes a depressurizing room formed between the first and second casings, and eliminates fluids present between the dies and the molding target, and a pressure adjuster that adjusts pressures to reduce pressure differences between the depressurizing room and the pressurizing rooms.

Abstract: A semiconductor tool and methods of forming semiconductor device assemblies. The semiconductor tool is a bond tip having a vacuum port and a plurality of purge ports with channels coupling the vacuum port with the purge ports. Air may be withdrawn through the vacuum to create a vacuum on the bottom of the bond tip to selectively couple a semiconductor device with the bond tip. The bond tip positions the semiconductor device on top of a stack of semiconductor devices to form a semiconductor device assembly. The assembly may be heated to reflow interconnects between the semiconductor device and the top device of the stack of semiconductor devices. Fluid provided through the purge ports may help to counter warpage of the semiconductor device to help form adequate interconnects between the devices. Fluid may also be provided through the vacuum port to counter the warpage.

Abstract: The present the invention is directed to a process and the new materials that are biodegradable for medical use, particularly for drug delivery, therapeutic devices and gene therapy/delivery. The invention illustrates a method of producing a degradable material using polymers made from thiol compounds and alkene/alkyene compounds, wherein one of these compounds contains one or more anhydride groups; and using a thiol-ene step-growth polymerization process, initiated by a free radical initiator. The polymerization process is initiated through photochemical, redox or thermal means, or any combination thereof.

Abstract: A ceramic article includes a flexible backing selected from paper, woven fabric, non-woven fabric, polymeric films, metal foils, and combinations thereof. A green ceramic layer is on a first side of the flexible backing, wherein the green ceramic layer includes a ceramic material and a polymeric binder. A major surface of the green ceramic layer includes a pattern of features.

Abstract: Provided are a cylindrical base, a master and a method for manufacturing a master enabling a uniform transfer of a fine pattern. A cylindrical base of a quartz glass having an internal strain in terms of birefringence of less than 70 nm/cm is used. A resist layer is deposited to an outer circumference surface of this cylindrical base, a latent image is formed on the resist layer, the latent image formed on the resist layer is developed and the pattern of the developed resist layer is used as a mask for etching to form a structure including concaves or convexes arranged in a plurality of rows on the outer circumference surface of the cylindrical base.

Abstract: In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Abstract: In an imprint process in a gaseous atmosphere containing a condensable gas, the curable composition for photoimprint is difficult to cure, the pattern is not fully formed to cause defects. The present invention relates to a curable composition for photoimprint in a gaseous atmosphere containing a condensable gas. The curable composition for photoimprint at least comprises the following component (A) and component (B): (A) polymerizable compound, and (B) photopolymerization initiator. Component (B) has a saturated solubility of less than 1% by weight in the condensable gas in a liquid state at 5° C. and 1 atm or has a Hansen distance (Ra) of larger than 7.6 to the condensable gas.

Abstract: A stamp-face platemaking device transports a medium holder inserted into a plate insertion portion to a printing unit. The medium holder holds a stamp face material in a plate-like member, and has a predetermined pattern in a side end portion thereof. An optical sensor detects the top end portion of the medium holder on a sensor scanning line in the inserting direction, and the pattern start point and the pattern end point of the predetermined pattern. At least one of the horizontal and vertical sizes of the stamp face material is set based on the positions of two of the detected end portions. When the pattern end point is detected, platemaking with the stamp face material is started.

Abstract: Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

Abstract: An imprinting method includes a resin application process of applying a light curing resin so that the resin covers a surface of the substrate and protrudes from an outer periphery of the substrate to contact an adhesive sheet in a state where a reverse surface of the substrate is adhered to the adhesive sheet, an advance curing process of curing the light curing resin contacting the adhesive sheet by irradiating the substrate with light from the reverse surface side, a pressurizing process of pressing a fine pattern formed in a mold onto the light curing resin on the surface of the substrate, a curing process of curing the light curing resin on the surface of the substrate by irradiating the substrate with light from the surface side and a mold releasing process of releasing the mold from the light curing resin by performing peeling from a portion cured on the adhesive sheet.