Including Weight Biased Lever Patents (Class 269/175)
  • Patent number: 8430386
    Abstract: In a wave linear motion mechanism (4) of a holding mechanism (1), those portions of a flexible screw (14) where first and second male screws (32, 33) are formed are elliptically deformed by first and second wave generators (12, 13) installed on an input shaft (11), and the first and second male screws (32, 33) are respectively partially engaged with first and second female screws (42, 44) of first and second circular nuts (15, 16). First and second holding members (5, 6) are mounted on the first and second circular nuts (15, 16), respectively. When the input shaft (11) is rotated by a motor (3), the first and second holding members (5, 6) are opened or closed depending on the rotation direction to release or hold an object (W).
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: April 30, 2013
    Assignee: Harmonic Drive Systems Inc.
    Inventor: Keiji Ueura
  • Patent number: 5653929
    Abstract: A process for preparing a photopolymerizable printing element includes feeding a layer of a photopolymerizable composition, calendering the layer to form a web, applying tension to the web, and cooling the web wherein during cooling, a gripping force is applied at side edges of the web. The application of the gripping force to the web substantially reduces non-uniformities in the thickness of the photopolymerizable layer.
    Type: Grant
    Filed: August 25, 1995
    Date of Patent: August 5, 1997
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Emil Frederick Miele, Robert S. Hutnich
  • Patent number: 4766027
    Abstract: The method is directed to a method of forming a hermetic flux-sintered ceramic multilayer structure with internal copper conductor comprising:(a) forming at least one green ceramic layer comprised of a thermoplastic organic binder having dispersed therein a finely divided ceramic powder and a low melting flux;(b) forming on the surface of a first green ceramic layer a pattern of copper-based conductor paste comprised of fine copper powder, a non-cellulosic binder, and a solvent for the non-cellulosic binder which is a nonsolvent for the thermoplastic organic binder in the green ceramic layer;(c) laminating a second green ceramic layer on the surface of the first ceramic layer to sandwich the pattern therebetween;(d) heating the composite structure in an ambient gas comprising a dry buffered gas mixture whereby maintaining an oxygen partial pressure sufficient to remove the organics but not to oxidize the copper.
    Type: Grant
    Filed: January 13, 1987
    Date of Patent: August 23, 1988
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Ian Burn