Abstract: An apparatus including a piezoelectric convertor layer; at least one piezoresistive layer on the piezoelectric convertor layer; and electrical conductor outputs. The at least one piezoresistive layer includes a plurality of spaced apart piezoresistive electrodes. The apparatus is configured such that when the piezoelectric convertor layer is deformed to generate a charge, at least one of the piezoresistive electrodes is stressed, where the at least one piezoresistive layer is configured to control flow of charge from the piezoelectric convertor layer. The electrical conductor outputs are electrically connected to the piezoresistive electrodes. The outputs are configured to allow the charge from the piezoelectric convertor layer to flow out of the piezoresistive electrodes.

Abstract: A method of manufacturing an elastic wave device is provided with a lamination step of forming, on a substrate (1), a plurality of elastic wave devices, each of which includes a lower electrode (2), a piezoelectric film (3), and an upper electrode (4); a measuring step for measuring the operation frequency distribution of the elastic wave devices on the substrate (1); and an adjusting step for forming an adjusting region, in which the thickness of the elastic wave device is different from the thicknesses of other portions in a resonance portion of each elastic wave device, corresponding with the distribution of the operation frequencies. The adjusting region is formed so that the size of the area of the adjusting region of the resonator portion of each elastic wave device is different in accordance with the operation frequency distribution that is measured. Thus, the frequency characteristics of the elastic wave devices are easily adjusted by a small number of steps.

Abstract: A composite ceramic transducer structure for use in the construction of an ultrasound probe includes a substrate and a plurality of piezoelectric transducer posts. The plurality of piezoelectric transducer posts are controllably formed on the substrate in a plurality of spatial positions located on an X-Y plane of the substrate. The plurality of piezoelectric posts includes a plurality of shapes defined in an X-Y-Z plane of the substrate, wherein the plurality of piezoelectric transducer posts are configured to facilitate minimizing shear waves within the ultrasound probe.

Abstract: An ultrasonic transducer device includes a base, a first electrode film, a piezoelectric film, a second electrode film and a first conductive film. The base has a plurality of vibrating film portions arranged in an array pattern. The first electrode film is disposed on each of the vibrating film portions. The piezoelectric film is disposed on the first electrode film. The second electrode film is disposed on the piezoelectric film. The first conductive film is connected to the first electrode film. The first conductive film has a film thickness larger than a film thickness of the first electrode film.

Abstract: A method for fabricating a vibrator with a vibrating plate and an electrode for vibrating the vibrating plate includes laminating, forming, filling-in, patterning, subsequently laminating, and subsequently etching. The forming forms a through hole that passes through a conductive film and a second sacrifice film and reaches at least a middle portion in a film thickness direction of a first sacrifice film. The filling-in fills in an auxiliary film for adjusting temperature characteristics including silicon and oxygen from a lower end position to an upper end position of the through hole. The subsequently etching etchs an upper end portion of the auxiliary film, a lower end portion of the auxiliary film, the first sacrifice film, the second sacrifice film, and a third sacrifice film, while leaving the auxiliary film inside the through hole on the vibrating plate, with a use of an etching fluid including hydrogen fluoride.

Abstract: A method of manufacturing resonation device (a quartz crystal oscillator) includes the steps of applying a thermosetting thermal insulating connection material and an electrically-conductive connection material, which is higher in curing temperature than the thermosetting thermal insulating connection material, on a principal surface of a substrate, mounting fixation terminals of a resonator (a quartz crystal resonator), which has a heating element, and to which the fixation terminals and connection terminals are connected, in application positions of the insulating connection material on the substrate, and connection terminals in application positions of the electrically-conductive connection material, and heating the insulating connection material and the electrically-conductive connection material based on a reflow profile to make the insulating connection material and the electrically-conductive connection material cure in this order.

Abstract: A piezoelectric and ferroelectric bulk wave transducer operating at a predetermined frequency includes a block of substrate, having a first thickness and in a first material, and a piezoelectric and ferroelectric transduction plate, having a length, a width and a second thickness, and in a second piezoelectric material, first and second metal electrodes covering the plate in the direction of the length thereof. The plate has first and second ferroelectric domains with alternating polarizations, distributed along the length of the plate according to a periodic pattern of pitch. The plate is attached perpendicularly to the block so that the width of the plate and the first thickness of the block are the same direction. The first and second material, the first thickness of the block, the length, the width, the second thickness, the pitch of the plate are configured for generating and trapping bulk waves at the operating frequency of the transducer, guided between both electrodes.

Abstract: A piezoelectric/electrostrictive element has a piezoelectric body, a through-hole electrode, a first electrode, a second electrode, a third electrode. The piezoelectric body includes a through-hole in communication with a first main surface and a second main surface. The through-hole electrode is formed on an inner side surface of the through-hole. The first electrode is formed on the first main surface of the piezoelectric body. The first electrode is connected to the through-hole electrode. The second electrode is formed on the second main surface of the piezoelectric body. The second electrode is connected to the through-hole electrode. The third electrode is formed on the second main surface of the piezoelectric body. The third electrode is isolated from the second electrode. A calculated average roughness in the inner side surface is larger than 0.11 microns and smaller than 16 microns. A maximum height roughness in the inner side surface is larger than 0.2 microns and smaller than 20 microns.

Abstract: A vibrator element has a first vibration mode in which first and second detection portions perform flexural vibration in opposite directions in the opposite phase to first and second driving portions which vibrate in opposite directions according to a Coriolis force, and a second vibration mode in which the first and second detection portions perform flexural vibration in opposite directions in the same phase as the first and second driving portions which vibrate in opposite directions according to a Coriolis force. A ratio r=R2/R1 of equivalent series resistance R2 at the time of the second vibration mode to equivalent series resistance R1 at the time of the first vibration mode is set between 0.15 and 6.0.

Abstract: In a composite substrate, a back surface of a piezoelectric substrate and a front surface of a support substrate are bonded to each other with an adhesive layer. The adhesive layer includes a swelling portion at an outer peripheral area thereof, and the piezoelectric substrate is bonded to the support substrate in an area excluding the swelling portion 16a. Accordingly, air bubbles do not easily enter between the swelling portion of the adhesive layer and the piezoelectric substrate, and separations caused by the air bubbles can be prevented. As a result, the support substrate and the piezoelectric substrate can be reliably bonded to each other with the adhesive layer including the swelling portion in the outer peripheral area thereof.

Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

Abstract: A piezoelectric thin film element includes a substrate, a vibration plate provided on the substrate, a lower electrode provided on the vibration plate, the lower electrode including at least a platinum metal film or an iridium metal film, a piezoelectric film provided on the lower electrode, the piezoelectric film including a polycrystalline body, and an upper electrode provided on the piezoelectric film, the lower electrode being provided on an upper portion of a titanium oxide film formed on the vibration plate, the lower electrode including a platinum metal film or an iridium metal film formed on the titanium oxide film and conductive oxide formed on the platinum metal film or the iridium metal film, and the platinum metal film or the iridium metal film being a precise film.

Abstract: The present invention relates to an energy harvester device comprising an elongate resonator beam extending between first and second ends. A base connected to the resonator beam at the first end with the second end being freely extending from the base as a cantilever. A mass is attached to the second end of the elongate resonator beam. The elongate resonator beam comprises either: (1) a first oxide layer on a first piezoelectric stack layer over a cantilever layer on a second oxide layer over a second piezoelectric stack layer on a third oxide layer or (2) a first oxide layer on a first piezoelectric stack layer over a second oxide layer on a cantilever layer over a third oxide layer on a second piezoelectric stack over a fourth oxide layer. Also disclosed is a system comprising an electrically powered apparatus and the energy harvester device, as well as methods of making and using the energy harvester.

Abstract: A flow channel substrate includes pressure chambers, and the pressure chambers communicate with nozzle openings. Piezoelectric elements located on either side of the flow channel substrate include a first electrode, a piezoelectric layer, and a second electrode. The piezoelectric layer contains lead, titanium, and zirconium. The second electrode includes a first layer on the piezoelectric layer side and a second layer on the side of the first layer opposite the piezoelectric layer. The second electrode also includes projections. The projections are aggregates of the lead originating in the piezoelectric layer, and the projections stick out of the surface of the second electrode opposite the piezoelectric layer.

Abstract: Embodiments provide a solidly-mounted bulk acoustic wave (BAW) resonator and method of making same. In embodiments, the BAW resonator may include one or more extensions that are acoustical similar to active region components of the BAW resonator. Other embodiments may be described and claimed.

Abstract: An accelerometer including a metal housing and at least one of an integrated piezoelectric sensor and an integrated electronic piezoelectric (IEPE) amplified sensor within the housing. A metal boot extends from the housing and a plurality of sensor wires extends from the sensor into the boot. The accelerometer also includes a metal cable sheath connected to the boot having a plurality of cable wires insulated by a metal oxide powder contained by the sheath. At least one of the plurality of sensor wires is connected to at least one of the plurality of cable wires within the boot. The housing, the boot, and the metal cable sheath provide a sealed enclosure for the at least one sensor, the plurality of sensor wires and the plurality of cable wires.

Abstract: A system and method for lowering resonant frequency in a synthetic jet device for less noise, as well as lowering vibration, is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first or second plates to selectively cause deflection thereof, wherein the first and second plates are formed at least in part of a non-metallic material.

Abstract: Methods, compositions, and apparatus for generating electricity are provided. Electricity is generated through the mechanisms nuclear magnetic spin and remnant polarization electric generation. The apparatus may include a material with high nuclear magnetic spin or high remnant polarization coupled with a poled ferroelectric material. The apparatus may also include a pair of electrical contacts disposed on opposite sides of the poled ferroelectric material and the high nuclear magnetic spin or high remnant polarization material. Further, a magnetic field may be applied to the high nuclear magnetic spin material.

Abstract: A method for producing a composite piezoelectric body includes: forming a composite piezoelectric body by filling a non-conductive polymer between a plurality of piezoelectric materials arranged in an array state at predetermined intervals, and polishing one surface of the composite piezoelectric body, from which surface at least the piezoelectric materials and the polymer are exposed, by using an abrasive film in which an abrasive particle is applied to a base film.

Abstract: A method for fabricating a piezoelectric device that includes a piezoelectric resonator to be mounted on a solder applied over a surface of a substrate. The piezoelectric resonator includes a metal case and at least a pair of lead terminals extracted from the metal case. The lead terminal includes a first part, a second part, and a third part. The method includes: applying solder cream at a case region and a lead region of a surface of the substrate, the case region corresponding to the metal case, the lead region corresponding to the third part; placing a block solder with a smaller area than an area of the case region at the case region; arranging the metal case of the piezoelectric resonator to the case region, arranging the third part to the lead region; and heating the substrate and the piezoelectric resonator in a reflow furnace.

Abstract: A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20° C. to about 90° C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.

Abstract: In a method of manufacturing a liquid jet head, a piezoelectric substrate is bonded onto a first base. Ejection grooves for ejection channels and dummy grooves for dummy channels are alternately formed in parallel with one another. The ejection grooves and the dummy grooves have such a depth as to pierce the piezoelectric substrate and to reach the first base substrate. An electrode material is deposited on inner surfaces of the ejection grooves and the dummy grooves. A cover plate is bonded to the piezoelectric substrate so as to cover the ejection grooves and the dummy grooves. In a subsequent first base substrate removing step, a part of the first base substrate on a side opposite to the cover plate and the electrode material deposited on bottom surfaces of the dummy grooves are removed. A second base substrate is then bonded to the first base substrate.

Abstract: A bulk wave piezoelectric resonator operating at a predetermined frequency includes a substrate block, having a plane face, a first thickness and consisting of a first material, a resonant plate having a length, width and second thickness, and consisting of a second piezoelectric material, first and second metal electrodes at least partly covering the resonant plate on each side and partly facing each other. The resonant plate is fixed perpendicularly in the vicinity of the plane face of the substrate block so that the width of the resonant plate and the first thickness of the substrate block have the same direction, and the first material, the second material, the first thickness of the block of substrate, the length, the width, the second thickness of the resonant plate are configured for trapping bulk waves at the operating frequency of the resonator and for producing a plane-plane type bulk wave piezoelectric resonator.

Abstract: A process for producing an acoustic device having a phononic crystal structure comprising inclusions produced in a first medium distributed in a matrix of a second medium, to block propagation of acoustic waves within a bandgap frequency band, includes: defining geometric parameters of said inclusions, which have walls contacting said matrix, making at least one non-zero first wall angle, to the normal of the plane of said structure, said geometric parameters including said first wall angle; determining a function relating to variation in frequency position of said bandgap with said wall angle or relating to variation in width of said bandgap with said wall angle; determining said at least first angle, for a selected frequency position and/or selected width of the bandgap, from the function or functions determined beforehand; and producing said inclusions having at least said first wall angle in said matrix formed by said second medium.

Abstract: A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.

Abstract: Disclosed herein is an active roughness actuator and a method of forming an active roughness actuator. The active roughness actuator includes a surface having at least one aperture; a compliant layer disposed on the surface such that the compliant layer covers the at least one aperture; a chamber having a fluid therein and a piezoelectric surface mechanically coupled to the chamber. The chamber is in fluid communication with the compliant layer via the at least one aperture. The piezoelectric surface is configured to displace the fluid in the chamber to control production of at least one dimple in the compliant layer proximate to the at least one aperture.

Abstract: A method of manufacturing a piezoelectric inkjet printhead includes processing a lower silicon-on-insulator substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer, processing the lower silicon-on-insulator substrate by etching the second silicon layer to form a manifold, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, and a plurality of dampers connected with the pressure chambers, and by etching the first silicon layer and the intervening oxide layer to form a plurality of vertical nozzles through the first silicon layer and the intervening oxide layer to corresponding ones of the plurality of dampers, stacking and bonding an upper substrate on the lower substrate, reducing the upper substrate to a predetermined thickness, and forming a piezoelectric actuator on the upper substrate.

Abstract: A method for fabricating a piezoelectric multilayer are described. The method includes providing conductive layers. Alternating conductive layers are electrically connected. A first plurality of alternating conductive layers is electrically isolated from a second plurality of alternating conductive layers. Piezoelectric layers are interleaved with the conductive layers. Apertures are provided in the piezoelectric layers. A first conductive plug electrically connects the first plurality of alternating conductive layers, includes a first plurality of segments, and is in apertures in the piezoelectric layers. Each of the first plurality of segments extends through one of the piezoelectric layers. A second conductive plug electrically connects the second plurality of alternating conductive layers, includes a second plurality of segments, and is in a second portion of the plurality of apertures. Each of the second plurality of segments extends through one of the plurality of piezoelectric layers.

Abstract: A method of manufacturing a piezoelectric element, which includes a first electrode adjacent a first main surface of a mother piezoelectric substrate and a second electrode adjacent a second main surface. During formation of the first electrode and the second electrode, cutouts are provided in the first electrode and the second electrode so that the shapes of the first electrode and the second electrode are different from each other when the mother piezoelectric substrate is inverted.

Abstract: A piezo sensor having an inner conductor having an inner conductor segment, where the inner conductor segment forms a tubular sidewall having a break, and also having an interior surface and an exterior surface; a plurality of individually polarized piezoelectric members, each having an inner face and an outer face, and each inner face contacting the first conductor exterior surface, each piezoelectric member being adjacent to another on the exterior face of the inner conductor, forming sets of adjacent faces; an outer conductor having an outer conductor segment forming a tubular sidewall having a break, the outer conductor having an interior surface and an exterior surface, where the interior surface contacts the outer face of the piezoelectric members; and where the break of the outer conductor segment is alignable with adjacent faces of two of the plurality of piezoelectric members, and further being alignable with the break of the inner conductor segment.

Abstract: Method and apparatus for a piezoelectric apparatus are provided. In some embodiments, a method for fabricating a piezoelectric device may include etching a series of vertical trenches in a top substrate portion, depositing a first continuous conductive layer over the trenches and substrate, depositing a continuous piezoelectric layer over the first continuous conductive layer such that the piezoelectric material has trenches and sidewalls, depositing a second continuous conductive layer over the continuous piezoelectric layer, etching through the vertical trenches of the first continuous conductive layer, continuous piezoelectric layer, second continuous conductive layer, and top substrate portion into a bottom substrate portion, etching a series of horizontal trenches in the bottom substrate portion such that the horizontal trenches and vertical trenches occupy a continuous free space and allow movement of a piezoelectric MEMS device created by the above method in three dimensions.

Abstract: A piezoelectric generator includes: a base body; and at least one piezoelectric transducer disposed on the base body, and including a first electrode, a piezoelectric body, and a second electrode, wherein the piezoelectric transducer includes a support section fixed to the base body, and a vibrating section disposed apart from the base body, having one end connected to the support section and the other end set as a free end, and vibrating due to a vibration applied externally, and a distance between the other end of the vibrating section and the base body is larger than a distance between the one end of the vibrating section and the base body.

Abstract: A piezoelectric component has at least one piezoelectric ceramic layer and at least one electrode adjacent the piezoelectric ceramic layer. The piezoelectric ceramic layer has a piezoelectric ceramic material of the general formula Pb1-x-y-[(2a-b)/2]-p/2V[(2a-b)/2-p/2]?CupBaxSry[(TizZr1-z)1-a-bWaREb]O3, where 0?x?0.035, 0?y?0.025, 0.42?z?0.5, 0.0045?a?0.009, 0.009?b?0.011, 2a>b, p?2a-b, RE is a rare earth metal, and V? is a Pb vacancy.

Abstract: A piezoelectric power generating device is provided which is capable of extracting a large amount of power without an increase in device size, even when applied with vibration of low frequency or weak external force, and which is easy to manufacture. The piezoelectric power generating device includes a piezoelectric power generating plate including a piezoelectric plate having a polarized regions that are different in polarization direction, and a support member attached to the piezoelectric power generating plate. Further, the piezoelectric power generating plate includes a fixed portion fixed to the support member, a free end displaced relative to the fixed portion when an external forced, such as a vibration forced, is applied, and a cutout located between the fixed portion and the free end.

Abstract: A motor includes a vibrating plate having a projection part to be pressed against a driven member and a piezoelectric material provided on the vibrating plate, wherein a Young's modulus EL in the pressing direction of the vibrating plate and a Young's modulus ES in a direction crossing the pressing direction are different.

Abstract: Method for producing a laminated ceramic electronic component including: forming a laminated body by layering and press-bonding a plurality of ceramic green sheets to become a protective layer and a plurality of the ceramic green sheets with metal paste printed thereon, forming an extended part by printing and drying a conductive paste for the extended part on the main face of the laminated body, forming a laminated ceramic element by cutting off the laminated body with the extended part formed and separating the laminated body into fragments, and forming a curled part by applying a conductive paste for the curled part on said end face of said laminated ceramic element. In the step of forming the laminated body, the laminated body is press-bonded so that the main face of the lead part of the laminated body is positioned lower than the main face of the function part.

Abstract: A method of forming a piezoelectric actuator on a vibration plate to provide a driving force to each of a plurality of pressure chambers includes forming a lower electrode on the vibration plate, forming a piezoelectric layer on the lower electrode at a position corresponding to each of the pressure chambers, forming a supporting pad on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, forming an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad, and bonding the upper electrode to a driving circuit above the supporting pad to receive a voltage from the driving circuit.

Abstract: A method for manufacturing a quartz crystal unit, comprising the steps of forming a quartz crystal tuning fork shape having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, a quartz crystal tuning fork resonator having the quartz crystal tuning fork shape, forming at least one groove in at least one of opposite main surfaces of each of the first and second quartz crystal tuning fork tines, determining each of a length of the at least one groove and an overall length of the quartz crystal tuning fork resonator so that a series resistance R1 of a fundamental mode of vibration of the quartz crystal tuning fork resonator is less than a series resistance R2 of a second overtone mode of vibration thereof, housing the quartz crystal tuning fork resonator in a case, connecting a lid to the case, and disposing a metal or a glass in a through-hole of the case.

Abstract: Disclosed is an electromechanical transducer and the method for manufacturing the same, which can detect or control deformation and vibration of a structure and flow of fluids by applying controlling forces. The electromechanical transducer of the present invention comprises a base substrate to which initial stress is applied; an electro-active material layer attached on the base substrate; and electrodes installed on the top and bottom side of the electro-active material layer for actuating the electro-active material layer, the base substrate and the electro-active material layer which is deformed when initial stress is removed from the base substrate so that the base substrate and the electro-active material layer have curvatures.

Abstract: An aspect of the present invention relates to a vibration element comprising: a substrate; a ceramic layer containing glass and provided on the substrate; and a piezoelectric element comprising an electrode layer fixed to the substrate with the ceramic layer therebetween and a piezoelectric layer, wherein the piezoelectric layer, the electrode layer, the substrate, and the ceramic layer are integrated by the piezoelectric layer, the electrode layer, the substrate, and the ceramic layer being sintered together at a sintering temperature of from 800° C. or higher to 940° C. or lower.

Abstract: A vibration element includes: a substrate; a ceramic layer containing molten glass and provided on the substrate; and a piezoelectric element fixed to the substrate with the ceramic layer therebetween, wherein the piezoelectric element includes a first electrode layer provided in contact with the ceramic layer, a second electrode layer, and a piezoelectric layer provided between the first electrode layer and the second electrode layer, and the first electrode layer has a thickness larger than that of the second electrode layer.

Abstract: A process for manufacturing a high-temperature ultrasonic transducer, said transducer comprising a steel or metal top electrode, a piezoelectric converter, a steel or metal support ensuring the interface between the converter and the propagation medium of the acoustic waves, a first joint between the support and the piezoelectric crystal, and a second joint between the converter and the top electrode, comprises, to produce said gold-and-indium-based joints, a brazing and diffusing operation comprising the following steps: a first step of increasing temperature to a first temperature comprised between about 150° C. and about 400° C. and of maintaining this first temperature for a first length of time corresponding to a first plateau; and a second step of increasing temperature to a second temperature comprised between about 400° C. and about 1000° C. and of maintaining this second temperature for a second length of time corresponding to a second plateau.

Abstract: Individual electrode pads to be connected to individual electrodes are formed on a first principal face of an actuator substrate at a +X side end thereof. Common electrode pads to be connected to common electrodes are formed on a ?X side with respect to the individual electrode pads on the first principal face of the actuator substrate. A groove is formed along a Y direction between the individual electrode pads and the common electrode pads on the first principal face of the actuator substrate.

Abstract: Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.

Abstract: A method of fabricating a thickness shear mode (TSM) gas and organic vapor sensor having a visco-elastic polymer coating and a fundamental frequency greater than 20 MHz. The method begins by providing a piezoelectric crystal and milling a central region of the crystal. Milling the crystal creates a central oscillating region of reduced thickness surrounded by a thicker outer region. Two electrodes are then deposited in the oscillating region of the crystal—one on each side of the crystal. The oscillating region on both sides of the crystal and the electrodes are then coated with a polymer coating.

Abstract: A modular piezoelectric sensor system, wherein the system comprises: a sensor pod including at least one standard sensor interface; and a plurality of different mounting adapters that include different external mounting interfaces wherein each mounting adapter has at least one complementary standard sensor interface.

Abstract: There is provided a liquid jetting apparatus which includes: a liquid jetting head including a channel unit and a piezoelectric actuator, an elastic deformation layer arranged on the piezoelectric actuator, a plurality of head-side contact points arranged on the elastic deformation layer, a substrate arranged to face a surface of the liquid jetting head, a plurality of substrate-side contact points arranged on the substrate, and a fixing member fixing the liquid jetting head and the substrate. When the fixing member fixes the liquid jetting head and the substrate, a portion of the elastic deformation layer, on which the head-side contact points are arranged, is sandwiched by the piezoelectric actuator and the substrate to undergo elastic deformation. The elastic deformation layer is configured to press the plurality of head-side contact points onto the substrate-side contact points by a force arising from a tendency to restore a state before elastic deformation.

Abstract: In manufacturing method of a cylindrical piezoelectric element, a cylindrical piezoelectric material is formed by molding a piezoelectric material into a cylindrical shape and subjecting the molded piezoelectric material to calcination. A reference electrode is provided on an inner circumferential surface of the cylindrical piezoelectric material. Drive electrodes are provided in a circumferential direction so that the drive electrodes are extending in an axial direction from one end to the other end on an outer circumferential surface. A polarization electrode is provided at a part of the circumferential surface in the vicinity of the one end. A predetermined voltage is applied between the polarization electrode and the reference electrode. The polarization electrode is removed from the cylindrical piezoelectric material.

Abstract: A process for fabricating an integrated Micro-Electro-Mechanical Systems (MEMS) filter includes bonding an insulating substrate having a first end and a second end to a base substrate, the second end of the insulating substrate cantilevered over and separated from the base substrate by a gap, forming a resonator element on the second end of the insulating substrate, forming an inductive element comprising a coil, wherein the coil is formed on the insulating substrate, and forming a capacitive element on the first side of the insulating substrate, the capacitive element comprised of two conductive plates, wherein one of the two conductive plates is formed on the insulating substrate.

Abstract: A method of manufacturing an ink jet recording head. The method includes providing a laminated structure in which a first electrode layer is located on a diaphragm, a piezoelectric layer is located on the first electrode layer, and a second electrode layer is located on the piezoelectric layer and etching the first electrode layer, the second electrode layer and the piezoelectric layer so that a portion of the diaphragm is exposed. In this method, at least the second electrode layer and the piezoelectric layer are etched simultaneously.