Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention may include a membrane 110, a piezoelectric body 130 formed over the membrane 110, an electrode 140 formed on the piezoelectric body 130, a first pad 150 electrically connected with the electrode 140, a second pad 160 electrically connected with an integrated circuit 170, and a connection member 180 electrically connecting the first pad 150 with the second pad 160.

Abstract: A piezoelectric actuator array comprising a substrate plate (10) with a number of signal leads (14) and at least one common lead (18) formed on at least one surface (12) thereof, and a number of piezoelectric bodies (30, 32) arranged in a row (34) on one surface (12) of the substrate plate and formed by dividing a common piezoelectric block, said piezoelectric bodies comprising a number of active bodies (30) each of which has, on a first side of said row (34), a signal electrode (38) in contact with one of said signal leads (14) and, on an opposite second side of the row, a common electrode (40) in contact with said common lead (18), said substrate plate (10) having at least one connector lead (16) disposed on the first side of the row (34) and electrically connected to the common lead (18) on the second side of the row, wherein said piezoelectric bodies comprise at least one piezoelectric body (32) with a conductive outer surface layer (42) that establishes an electrically conductive path from the connector

Abstract: In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.

Abstract: An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: The present invention is a piezoelectric composition and a piezoelectric element using the piezoelectric composition, the composition being characterized by: having a Perovskite structure represented by general formula ABO3; being represented by composition formula x(Bi0.5K0.5)TiO3-yBi(Mg0.5Ti0.5)O3-zBiFeO3, x+y+z=1 in the composition formula above; and in a triangular coordinate using x, y and z in the composition formula above, having a composition represented by a region which is surrounded by a pentagon ABCDE with apexes of point A (1, 0, 0), point B (0.7, 0.3, 0), point C (0.1, 0.3, 0.6), point D (0.1, 0.1, 0.8) and point E (0.2, 0, 0.8) and which does not include the line segment AE that connects point A (1, 0, 0) and point E (0.2, 0, 0.8).

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: A backcarrying including a carrying portion having a top, a bottom, a front, a rear and two sides. A strap arrangement can also be included for carrying the carrying portion as a backcarrying. The strap arrangement can have a pair of carrying straps. Each carrying strap can be secured to the carrying portion at about the bottom and extend upwardly along respective sides of the carrying portion, and redirected at about the top of said respective sides to extend around to the rear of the carrying portion, and being redirected at about the top of the rear to extend downwardly for securement at about the bottom of the carrying portion at the rear. The strap arrangement can redirect forces to support a load in the carrying portion from the sides of the carrying portion.

Abstract: A method of making a pressure sensing apparatus is provided herein. A plurality of trenches are etched on a first surface of a substrate. The substrate is annealed to form a diaphragm and an embedded cavity from the plurality of trenches, the diaphragm formed of a portion of the substrate wherein an exterior surface of the diaphragm is the first surface of the substrate and an interior surface of the diaphragm is a surface defining the embedded cavity. Piezoresistors are fabricated on the exterior surface of the diaphragm, the piezoresistors configured to change resistivity in response to strain resulting from deflection of the diaphragm. The substrate is mounted, including the diaphragm, in a housing such that a media can apply pressure to the diaphragm and such that the pressure can be sensed by determining a change in the resistivity of the piezoresistors.

Abstract: In some examples, techniques are provided for quick haptic feedback, without the use of a controller, which is local to individual, non-actuating keys, such as keys of a thin keyboard or keypad. The haptic feedback may be in the form of a simulated “key-click” feedback for an individual key that is pressed by a user such that the finger used to press the key feels the tactile sensation. The haptic feedback mimics the tactile sensation of a mechanical key (e.g., buckling spring, pop-dome key switch) to give a user the perception that they have actuated a mechanically movable key.

Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.

Abstract: Electromagnetic radiation is transmitted through a piezoelectric material and is absorbed in at least an adhesive that bonds the piezoelectric material to another material. Absorbing the electromagnetic radiation in the adhesive ablates the adhesive and the ablation of the adhesive acts to remove the piezoelectric material.

Abstract: An oscillation circuit includes a terminal XO, a terminal XI, an oscillation unit, and a voltage generation circuit that generates a first voltage and a second voltage. The oscillation unit includes a variable capacitive element connected to the terminal XO or the terminal XI. In a first mode, a signal having a first amplitude is applied between the terminal XO and the terminal XI, and a first voltage is applied to the other end of the variable capacitive element. In a second mode, a signal having a second amplitude larger than an amplitude of the signal having the first amplitude is applied between the terminal XO and the terminal XI, a second voltage is applied to the other end of the variable capacitive element, and a voltage applied to the both ends of the variable capacitive element is lower than the maximum rated voltage of the variable capacitive element.

Abstract: The vibrating reed includes a detection unit that vibrates along the thickness direction of a piezoelectric body when detecting. The detection unit includes a first main surface and a second main surface that face each other in the thickness direction, outside surfaces, a groove that has a groove bottom at a position between the first main surface and the second main surface in a depth direction from an opening provided in the first main surface, an outside surface electrode that is formed on the outside surfaces, and an inside surface electrode that is formed on an inside surface which is opposite the outside surfaces. At least one of the outside surfaces has a non-electrode-formed area where the outside surface electrode is not provided in an area from the end surface which positioned on the second main surface side in the thickness direction to the second main surface.

Abstract: An ultrasound transducer includes an acoustic layer that includes a micromachined piezoelectric composite body having a front side and an opposite back side. The micromachined piezoelectric composite body is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The micromachined piezoelectric composite body is configured to convert received ultrasound waves into electrical signals. A dematching layer is connected to the back side of the micromachined piezoelectric composite body of the acoustic layer. The dematching layer has a higher acoustic impedance than an acoustic impedance of the acoustic layer.

Abstract: A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure.

Abstract: A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter.

Abstract: A liquid jet head includes: a piezoelectric substrate which includes ejection grooves formed in an upper surface of the piezoelectric substrate and arranged in a reference direction, and a side flow path formed in a first side surface of the piezoelectric substrate and communicating with the plurality of ejection grooves; cover plate bonded to the upper surface; and a nozzle plate bonded to the first side surface and including nozzles communicating with the ejection grooves.

Abstract: A liquid jet head includes an actuator substrate having a plurality of elongated grooves arrayed from an upper surface to a lower surface thereof. The grooves are formed from a vicinity of a peripheral end on one side of the actuator substrate to a peripheral end the other side thereof, ends of the grooves in a longitudinal direction thereof have respective inclined surfaces rising from the lower surface to the upper surface of the actuator substrate, and a crossing angle at crossing portions at which the inclined surfaces and the lower surface cross each other is in a range of 3 degrees to 80 degrees. A width W of the inclined surfaces in the longitudinal direction thereof and a thickness D of the actuator substrate satisfy a relationship 0.2?(W/D)?11 at the ends on one side of the grooves.

Abstract: A method for manufacturing a liquid discharging head, the method including forming a plurality of nozzles that discharge liquid droplets, forming a plurality of piezoelectric elements that generate pressure for discharging liquid droplets from the respective nozzles; and performing a repolarization process on the piezoelectric elements to set non-uniformity of the droplet discharging characteristics of the nozzles to be in a predetermined range by combining adjustment of a polarization sensitivity and adjustment of a polarization voltage for each of the piezoelectric elements.

Abstract: There is provided a piezoelectric device including: a body portion having a plurality of piezoelectric layers stacked therein; and internal electrodes disposed in the body portion with at least one of the plurality of piezoelectric layers interposed therebetween and including a shrinkage inhibitor having at least one of a flake shape and a plate shape, wherein an angle formed by an interface between the internal electrode and the piezoelectric layer on which the internal electrode and the piezoelectric layer are in contact and a long side direction of the shrinkage inhibitor is 15° or less.

Abstract: An ultrasonic device includes a substrate, a first piezoelectric body, a second piezoelectric body, and an acoustic matching section. The substrate has a first surface that is a flat surface. The first piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body has a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate. The acoustic matching section is disposed on the first piezoelectric body and the second piezoelectric body. The acoustic matching section has a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side. A surface of the acoustic matching section on the second side is a flat surface parallel with the first surface of the substrate.

Abstract: A system for the administration of modified plasma to a subject, including: (a) a non thermal plasma (NTP) emitting source for emitting a plasma beam; (b) a plasma coupling mechanism (PCM) with a plasma beam dish having at least one opening for the passage of the plasma beam; the plasma beam dish having a first surface and a second opposite surface. The first surface of the plasma beam dish includes: at least one coupling element selected from the group consisting of: (1) at least one ferroelectric element for providing the field; (2) at least one ferromagnetic element for providing the field; (3) at least one piezoelectric element for providing the field; and (4) at least one piezomagnetic element for providing the field. The system additionally includes at least one reflecting element configured to focus the NTP beam, thereby providing the modified plasma.

Abstract: A process for producing a liquid ejection head having a piezoelectric body provided with an ejection orifice for ejecting liquid and a pressure chamber communicating therewith for retaining the liquid, wherein an electrode is formed on an inner wall surface of the pressure chamber to deform the pressure chamber by piezoelectric action caused by applying voltage to the electrode to eject the liquid, comprising providing the piezoelectric body in which a surface thereof having the ejection orifice has an arithmetic mean roughness of 0.1-1 ?m, forming a dry film resist pattern on the surface of the piezoelectric body so as to expose the ejection orifice and a linear region connected thereto, and forming a metal thin film pattern being connected to the electrode on the inner wall surface and continuously extending from the inner wall surface to the linear region by using the dry film resist pattern as a mask.

Abstract: This touch-sensitive sensor includes a layer of piezoelectric material interposed between, on the one hand, first and second electrically-conductive elements and, on the other hand, at least one third conductive element including a surface opposite at least one of the first and second conductors.

Abstract: A strain amplification structure has a frame with a hexagonal structure incorporating a plurality of rigid beams that are connected to opposing end beams by a plurality of flexible joints. A piezoceramic actuator assembly is connected to the opposing end beams having a collar including an opening. A shaft providing an output is connected to the plurality of rigid beams with flexible joints and passes through the opening in the collar for non-interfering motion orthogonal to the actuator assembly.

Abstract: A piezoelectric element includes a vibration plate; a lower electrode; a piezoelectric film; and an upper electrode, which are laminated in the stated order. An electric field is applied to the piezoelectric film by the lower electrode and the upper electrode. A shape of the piezoelectric film near a boundary face between the piezoelectric film and the upper electrode as viewed from a lamination direction of the piezoelectric film and the upper electrode, is substantially the same as a shape of the upper electrode. A width of the piezoelectric film precipitously extends from an end of the boundary face. A thickness of the piezoelectric film in an area in the width of the piezoelectric film where the upper electrode is not formed, is formed to be proportionate to the precipitous extension of the width of the piezoelectric film.

Abstract: A sound receiver includes a casing, a circuit portion, a conductive member, a first piezoelectric plate, a second piezoelectric plate, a first conductive transmission portion, and a second conductive transmission portion. The casing has an accommodating portion. The accommodating portion has an opening and a base. The circuit portion is disposed to close upon the opening. The conductive member having a first side and a second side is disposed in the accommodating portion. The first piezoelectric plate is disposed at the first side of the conductive member within the accommodating portion. The second piezoelectric plate is disposed at the second side of the conductive member within the accommodating portion. The first conductive transmission is configured to elastically and electrically connect the base and the first piezoelectric plate. The second conductive transmission is configured to elastically and electrically connect the circuit portion and the second piezoelectric plate.

Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.

Abstract: A liquid droplet jetting apparatus includes: a nozzle plate formed with a nozzle; a first flow passage formation body stacked on the nozzle plate and formed with a liquid flow passage including a pressure chamber in communication with the nozzle; a piezoelectric element arranged on a surface of the first flow passage formation body on the side opposite to the nozzle plate and configured to apply a pressure to a liquid in the pressure chamber; and a second flow passage formation body arranged on the side opposite to the nozzle plate with respect to the first flow passage formation body so as not to hinder driving of the piezoelectric element. The second flow passage formation body is formed with a liquid storing chamber and a throttle flow passage configured to restrict an amount of the liquid flowing from the liquid storing chamber into the pressure chamber.

Abstract: Embodiments of apparatuses, systems and methods relating to temperature compensated bulk acoustic wave devices. In some embodiments, temperature compensated bulk acoustic wave devices are described with an over-moded reflector layer.

Abstract: A method of manufacturing a liquid ejecting head includes forming a first electrode made of platinum, forming a buffer layer made of a compound having a pyrochlore structure that contains bismuth or platinum on the first electrode, forming an oxide layer made of an oxide containing bismuth on the buffer layer, forming a piezoelectric layer made of a compound having a perovskite structure that contains bismuth by burning the oxide layer, and forming a second electrode on the piezoelectric layer.

Abstract: A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Abstract: This invention is a manufacturing method of a liquid discharge head that includes a substrate having a plurality of discharge energy generating elements that generate energy that is utilized for discharging a liquid, and a discharge port forming member that constitutes a discharge port group including a plurality of discharge ports that discharge the liquid and flow paths that communicate with the discharge port group. The manufacturing method includes (1) disposing a photosensitive resin as material of the discharge port forming member on or above the substrate, and (2) forming an exposure pattern of the discharge port group using ultraviolet light in the photosensitive resin. In the aforementioned (2), the discharge port group is divided in a longitudinal direction and exposed, and the exposures are respectively performed so that regions in which there is a high degree of telecentricity face each other.

Abstract: The present invention provides electroactive polymer (“EAP”) transducers having improved properties. This improvement is achieved without decreasing film thickness, or by using high dielectric constant and high field, so that this approach does not adversely affect the reliability and physical properties of the resultant dielectric films. Mobile electrically active additives are added to the electrode formulation which significantly improve the performance of electroactive polymer transducers. Such additives do not need to be ionic. These electrically active additives can enable higher performance devices, smaller devices using less active area, lower voltage/power operation, and combinations of these enhancements.

Abstract: A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead.

Abstract: An actuator includes a multi-layer part having a multilayered piezoelectric part comprising a plurality of piezoelectric bodies and an electrode part connected to the multilayered piezoelectric part, and a support part displaceably supporting the multi-layer part. The multilayered piezoelectric part is polled in the same direction. One of the piezoelectric bodies expands or contracts in an opposite direction to another piezoelectric body.

Abstract: In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

Abstract: Provided is a liquid ejection head, including: multiple ejection orifices for ejecting liquid; multiple pressure chambers that communicate with the respective ejection orifices, and are arranged in a first direction and a second direction that intersect each other, the multiple pressure chambers including first electrodes formed on inner walls of the multiple pressure chambers; a piezoelectric block including the multiple pressure chambers and multiple air chambers, the multiple air chambers being arranged in the first direction and the second direction alternately with the multiple pressure chambers, the inner walls of the respective pressure chambers being deformable by application of voltage between the first electrodes and the second electrodes to cause liquid to flow out of open ends of the respective pressure chambers; an orifice plate in which the multiple ejection orifices are arranged; and a plate-like member that is interposed between the piezoelectric block.

Abstract: An electromechanical transducer element includes a substrate; a first electrode formed on the substrate as a common electrode; an electromechanical transducer membrane formed on the first electrode; a second electrode formed on the electromechanical transducer membrane as an individual electrode; a first insulation protection membrane formed on the first and the second electrode; a third electrode electrically connected to the first electrode; a fourth electrode electrically connected to the second electrode; a second insulation protection membrane including a common electrode pad formed on the third electrode and plural individual electrode pads formed on the fourth electrode; and a fifth electrode formed so as to surround a vicinity of at least one of the individual electrode pads disposed at end parts. Further, the fifth electrode is formed on the first insulation protection membrane and is electrically connected to the first electrode.

Abstract: A piezoelectric device and a method of manufacturing a piezoelectric device are provided. The piezoelectric device includes first and second electrodes disposed on a first surface of a piezoelectric layer; third and fourth electrodes disposed on a second surface of the piezoelectric layer, a first conductor electrically connecting the first and fourth electrodes, and a second conductor electrically connecting the second and third electrodes, in a cross-link with the first conductor.

Abstract: Enhanced building blocks may be shaped as platonic solids. The building blocks include a flange on one or more edges, where each flange and each compressed tetrahedral vertex may include magnetic materials (e.g., magnets, ferromagnetic metals). The building block flanges may be used to capture kinetic energy from a fluid. Multiple building blocks may be combined to form larger structures, and the included magnetic materials may be used to retain the formed geometric structure shape.

Abstract: In a method of manufacturing piezoelectric actuators, a vibrating body plate supporting vibrating bodies at vibrational nodes thereof and a moving body plate having moving bodies are provided. Each of the vibrating bodies has a vibrator and a piezoelectric body mounted on the vibrator. The vibrating body plate and the moving body plate are stacked over one another to provide a piezoelectric actuator assembly. The piezoelectric actuator assembly is then cut at the vibrational nodes of the vibrating bodies to provide individual piezoelectric actuators.

Abstract: A method for forming an acoustical stack for an ultrasound probe comprises partly dicing a single crystal piezoelectric material to form single crystal pieces that are partly separated by a plurality of kerfs. The single crystal piezoelectric material comprises a carrier layer. The kerfs are filled with a kerf filling material to form a single crystal composite and the carrier layer is removed. At least one matching layer is attached to the single crystal composite, and dicing within the kerfs is accomplished to form separate acoustical stacks from the single crystal composite.

Abstract: A package manufacturing method where a base substrate and a lid substrate, at least one having a through-hole, are anodically bonded to each other using a jig having a communication-hole and arranged in a vacuum chamber to laminate the lid substrate to the base substrate and thereby form a bonded body having a plurality of cavities, each of which includes an electronic part sealed therein. The through-hole and the communication-hole are aligned with each other inside the vacuum chamber, such that gas within the cavities can escape through the through-hole and the communication-hole during bonding. A plurality of packages are formed by cutting the bonded body for every one of the plurality of cavities.

Abstract: A piezoelectric actuator includes a vibrating plate, a lower electrode provided on the vibrating plate, including a platinum film and a titanium oxide film formed on the platinum film, a piezoelectric thin film provided on the lower electrode, and an upper electrode provided on the piezoelectric thin film, in which the titanium oxide film is provided between the platinum film and the piezoelectric thin film.

Abstract: A head has a base and a piezoelectric element which is superimposed on and fastened to the base in a thickness direction. The piezoelectric element has a plate-shaped piezoelectric body, and a common electrode and a individual electrode arranged so as to sandwich the piezoelectric body in the thickness direction. The base has a higher thermal expansion coefficient than the piezoelectric body (the piezoelectric element 23). The piezoelectric body has a tetragonal principal crystal phase, in which the degree of orientation of the c-axis toward one side in the thickness direction (positive side in z direction) in the region sandwiched by the common electrode and the individual electrode is 44% or more and 56% or less in terms of the Lotgering factor and in which the residual stress in the surface direction is 0 MPa or more and 35 MPa or less in the direction of compression.

Abstract: The present invention generally relates to high frequency piezoelectric crystal composites, devices, and method for manufacturing the same. In adaptive embodiments an improved imaging device, particularly a medical imaging device or a distance imaging device, for high frequency (>20 MHz) applications involving an imaging transducer assembly is coupled to a signal imagery processor. Additionally, the proposed invention presents a system for photolithography based micro-machined piezoelectric crystal composites and their uses resulting in improved performance parameters.

Abstract: A method for manufacturing a composite piezoelectric substrate in which a piezoelectric substrate and a supporting substrate are prepared, ions are implanted in the piezoelectric substrate to form a defective layer at a predetermined depth in the piezoelectric substrate, impurities that are adhered to a surface of the piezoelectric substrate or a surface of the supporting substrate are removed to expose the constituent atoms thereof and to activate the surfaces, the supporting substrate is bonded to the piezoelectric substrate to form a bonded substrate body, the bonded substrate body is separated at the defective layer so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate and bonded to the supporting substrate to form a composite piezoelectric substrate, and the surface of the separation layer of the composite piezoelectric substrate is smoothed.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.