Abstract: Methods of designing surface acoustic wave (SAW) filters and SAW filters fabricated on piezoelectric substrates are disclosed. A filter design including two or more SAW resonators may be established. Admittances of relevant plate modes associated with each of the two or more SAW resonators may be modeled and added in parallel with the admittances of the respective SAW resonators. The filter design including the admittances of relevant plate modes may be iterated to establish a final filter design that satisfies a set of design requirements.

Abstract: A method for making a micro-electro-mechanical systems (MEMS) vibrating structure is disclosed. The MEMS is supported by a MEMS anchor system and includes a single-crystal piezoelectric thin-film layer that has a specific non-standard crystal orientation, which may be selected to increase an electromechanical coupling coefficient, decrease a temperature coefficient of frequency, or both. The MEMS vibrating structure may have dominant lateral vibrations or dominant thickness vibrations. The single-crystal piezoelectric thin-film layer may include Lithium Tantalate or Lithium Niobate, and may provide MEMS vibrating structures with precise sizes and shapes, which may provide high accuracy and enable fabrication of multiple resonators having different resonant frequencies on a single substrate.

Abstract: An installation hole, in which a detector is accommodated, is formed in a substantially central portion of a body of a vortex flowmeter. A first ring is formed on an annular wall that forms a boundary between a first aperture portion and a second aperture portion of the installation hole. In the detector, a detecting element made up from a piezoelectric element is accommodated in a holder. A pair of second rings is formed on the outer circumferential surface of the holder. By inserting the detector in the installation hole, the second rings are placed in sliding contact with the inner circumferential surface of the installation hole, and the first ring comes into abutment with a boundary region of the holder. Consequently, a seal is formed between the detector and the body by the first and second rings.

Abstract: A method of making inkjet print heads may include forming a first wafer including a sacrificial substrate layer, and a first dielectric layer thereon having first openings therein defining inkjet orifices. The method may also include forming a second wafer having inkjet chambers defined thereon, and joining the first and second wafers together so that each inkjet orifice is aligned with a respective inkjet chamber. The method may further include removing the sacrificial substrate layer thereby defining the inkjet print heads.

Abstract: To manufacture a switching apparatus that includes a piezoelectric actuator with increased lifespan, provided is a method for manufacturing a bimorph actuator, comprising first piezoelectric element layer formation of forming a first piezoelectric element layer on a substrate; support layer formation of forming a support layer made of an insulator on the first piezoelectric element layer; second piezoelectric element layer formation of forming a second piezoelectric element layer on the support layer; and removal of removing a portion of the substrate to form an actuator that includes the first piezoelectric element layer, the support layer, and the second piezoelectric element layer.

Abstract: An object of the present invention is to provide a liquid discharge head in which a driver IC is not easily damaged at the time of assembling, and a recording device using the same. A liquid discharge head of the present invention is the liquid discharge head including a head main body, a casing, and a driver IC that drives the head main body. The casing has an opening and is in contact with the head main body at the opening so as to cover at least a part of the head main body, a part of an inner surface of a side plate of the casing continuing from the opening has an inclination portion inclined toward the inner side of the casing with respect to the opening, and the driver IC is in contact with the inclination portion of the inner surface.

Abstract: A method of manufacturing a head chip includes a groove forming step for forming grooves which are the bases of ejection grooves on a first surface of the actuator substrate, a substrate grinding step for grinding a second surface of the actuator substrate so that each of the grooves has a predetermined depth, a recessed portion forming step for forming an inspection recessed portion which changes its state in the second surface of the actuator substrate according to the grinding amount of the actuator substrate in the substrate grinding step, and a grinding amount determination step for determining the grinding amount of the actuator substrate on the basis of a state of the inspection recessed portion after the substrate grinding step.

Abstract: An elastic wave device includes an interdigital transducer (IDT) electrode disposed on an upper surface of a piezoelectric substrate, a wiring electrode disposed on the upper surface of the piezoelectric substrate and connected to the IDT electrode, and a first insulator layer disposed on the upper surface of the piezoelectric substrate. The first insulator layer seals the IDT electrode and the wiring electrode and includes a first resin and a first filler. A resin layer including no filler is provided on an upper surface of the first insulator layer. An inductor electrode is disposed on an upper surface of the resin layer. A second insulator layer is disposed on the upper surface of the resin layer and covers the inductor electrode. A terminal electrode is disposed on an upper surface of the second insulator layer. A connecting electrode electrically connects the wiring electrode, the terminal electrode, and the inductor electrode.

Abstract: A semiconductor device includes a piezoelectric layer interposed between a first metal layer and a hardmask layer. A first trench extends through the hardmask layer, the piezoelectric layer and the first metal layer. A self-limiting second trench extends through the hardmask layer and the piezoelectric layer without reaching the first metal layer.

Abstract: An ultrasound transducer and methods of fabricating and using the ultrasound transducer. The ultrasound transducer includes a composite layer having a first surface and comprising a plurality of piezoelectric elements separated by isolating material filled kerfs. The composite layer is configured so that the first surface includes an exposed face of each element of the plurality of piezoelectric elements. The transducer further includes a plurality of electrodes defined on the first surface, the electrodes having boundaries configured so that none of the exposed faces are in contact with more than one of the plurality of electrodes. The electrodes may be defined in a conductive layer deposited on the first surface of the composite body by forming a channel in the conductive layer that is aligned vertically with the dielectric kerfs. The transducer may be used to scan a treatment region with both HIFU and imaging ultrasound signals.

Abstract: A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Abstract: A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.

Abstract: A method of manufacturing a protection frame used in a miniature microphone is provided.

Abstract: A semiconductor device, a piezoelectronic transistor (PET) device, and a method of fabricating the PET device are described. The method includes forming a first stack of dielectric layers, forming a first metal layer over the first stack, forming a piezoelectric (PE) material on the first metal layer, and forming a second metal layer on the PE material. The method also includes forming a piezoresistive (PR) element on the second metal layer through a gap in a first membrane formed a distance d above the second metal layer.

Abstract: A resonator element includes a base portion, and a vibrating arm which extends from the base portion and on which a weight portion is provided, and the weight portion includes a first weight portion which is disposed on one main surface of a distal end portion of the vibrating arm, and a second weight portion which is disposed on the distal end side with respect to the first weight portion and has a thickness smaller than that of the first weight portion. The vibrating arm transmits an energy beam, and a laser incidence area where incidence of the energy beam to the inside of the vibrating arm is allowed, is disposed in a position of the other main surface on the opposite side of the vibrating arm overlapped with the second weight portion.

Abstract: A piezoelectric element includes a first electrode; a seed layer comprised of a composite oxide having a perovskite structure and preferentially oriented to a (100) plane, the seed layer including bismuth in an A site and including iron and titanium in a B site, the seed layer having a thickness of less than 20 nm; a piezoelectric layer provided on the seed layer, the piezoelectric layer consisting of a piezoelectric material having a perovskite structure and preferentially oriented to a (100) plane; and a second electrode provided on the piezoelectric layer.

Abstract: In a method for manufacturing an electronic device, an ion implantation layer is formed at a desired depth from one principal surface of a piezoelectric single crystal substrate by implanting hydrogen ions into the piezoelectric single crystal substrate under desired conditions. The piezoelectric single crystal substrate in which the ion implantation layer has been formed is bonded to a supporting substrate, and a piezoelectric thin film is then formed by the application of heat using the ion implantation layer as a detaching interface. This heated detachment is performed at a reduced pressure less than atmospheric pressure and at a heating temperature determined in accordance with the reduced pressure.

Abstract: A tactile sensor including a piezoresistive layer having its electric resistance varying according to mechanical stress exerted thereon, the piezoresistive layer being at least partially transparent to light; a photosensitive layer, having its electric resistance varying according to the quantity of incident light thereon, the photosensitive layer being arranged opposite the piezoresistive layer; and electric connection elements electrically connecting in parallel the piezoresistive layer and the photosensitive layer.

Abstract: A piezoelectric resonator element includes a piezoelectric substrate formed of an AT-cut quartz crystal substrate in which the thickness direction thereof is a direction parallel to the Y? axis; and excitation electrodes disposed so as to face vibrating regions on both front and rear principal surfaces of the piezoelectric substrate. The piezoelectric substrate includes a rectangular excitation portion in which sides parallel to the X axis are long sides thereof, and sides parallel to the Z? axis are short sides thereof; and a peripheral portion having a smaller thickness than the excitation portion and formed around the excitation portion. Each of side surfaces of the excitation portion extending in a direction parallel to the X axis is present in one plane, and each of side surfaces of the excitation portion extending in a direction parallel to the Z? axis has a step.

Abstract: A piezoelectric element and a manufacturing method to reduce extraneous radial vibration modes is disclosed, in an example embodiment, four slots, arranged at 90 degrees, are made in one surface such that the slots do not reach the opposite surface.

Abstract: An ultrasonic transducer, an ultrasonic probe, and an image diagnosis apparatus perform an ultrasonic procedure. The ultrasonic transducer includes: a piezoelectric layer; an acoustic matching layer disposed on an upper surface of the piezoelectric layer; and a plurality of back efficiency layers that are disposed on a lower surface of the piezoelectric layer and have different acoustic impedances. The sensitivity, bandwidth, and pulse length of the ultrasonic transducer may be controlled by appropriately changing acoustic impedances and thicknesses of the back efficiency layers.

Abstract: A piezoelectric multilayer component is specified. At least one external electrode is fixed to a stack of piezoelectric layers and electrode layers arranged therebetween. At least one region of the external electrode projects beyond the stack and the external electrode is at least partly pressure-deformed in said region. Furthermore, a method for forming an external electrode in a piezoelectric multilayer component is specified.

Abstract: A duplexer includes: a first filter of which first and second ends connect to a common terminal and a first terminal respectively; and a second filter having a passband higher than that of the first filter, a first end and second end thereof connecting to the common terminal and a second terminal respectively, wherein a phase shifter is located neither between the first filter and the common terminal nor between the second filter and the common terminal, the second filter is a ladder-type filter including piezoelectric thin film resonators connected in a ladder shape, a propagation constant in a direction perpendicular to a thickness direction of a piezoelectric thin film in the piezoelectric thin film resonator is a real number at frequencies lower than a resonance frequency of the piezoelectric thin film resonator, and a resonator at a first stage is a parallel resonator in the second filter.

Abstract: A method of making a liquid discharge head which includes a nozzle to discharge liquid, a pressure chamber communicating with the nozzle, a pressure chamber substrate to form surfaces of the pressure chamber, and a piezoelectric actuator to apply pressure to liquid in the pressure chamber having a lower electrode, a ferroelectric film, and an upper electrode, includes a silicon wafer supplying process, a position adjustment process, a surface treatment process to reform a surface of the lower electrode, a liquid applying process to apply ferroelectric precursor on the lower electrode by an inkjet method, a heating process to heat the ferroelectric precursor film, and a cooling process. A series of processes from the position adjustment process to the cooling process is iterated to form a ferroelectric film having a predetermined thickness. The series of processes is performed with certain waiting times inserted between key processes.

Abstract: A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.

Abstract: A surface acoustic wave (SAW) device includes a piezoelectric crystal substrate on which an acoustic channel is formed, at least one electro-mechanical transducer operatively associated with the acoustic channel, and an encapsulating casing having a cover spaced above the acoustic channel and thereby defining a sealed volume around the substrate. A mass deposition device within the casing is spaced between the acoustic channel and the cover, preferably as gold-coated heating wire spanning the acoustic channel and having ends that are connectable to an electric power source outside the casing. Stress and aging shifts can be induced after sealing of the cover. Tuning is achieved by evaporating metal molecules off the heated wire onto the acoustic channel as the frequency is monitored, until the mass loading of metal molecules on the transducer produces the target frequency.

Abstract: A manufacturing method of an ultrasonic generating device includes applying a compressive force to an attachment unit toward a first axial direction while a first end of a bolt-shaped member is a free end and the second end thereof is fixed, and thereby generating a first elastic force in the attachment unit. The manufacturing method includes attaching a fastening member to a bar portion of the bolt-shaped member in a balanced condition in which a second elastic force of the bolt-shaped member and the first elastic force are in balance, and thereby maintaining the balanced condition.

Abstract: A manufacturing method of a piezoelectric film element includes forming a piezoelectric film including a lead-free alkali niobate based compound having a perovskite structure represented by a compositional formula of (K1-XNaX)NbO3 on a substrate, and dry-etching the piezoelectric film by using a low-pressure plasma including a fluorine system reactive gas.

Abstract: A liquid ejection head includes a substrate on a surface of which an energy-generating element for generating energy for ejecting liquid is formed; and a flow path forming member formed on the substrate, the flow path forming member forming an ejection orifice for ejecting the liquid and a liquid flow path communicating with the ejection orifice. The flow path forming member includes, at a position surrounding the liquid flow path, a depression that opens to an upper surface of the flow path forming member and a groove that opens to the first depression. The angle between the upper surface of the flow path forming member and a slope surface of the depression on the flow path forming member side is an obtuse angle. The groove has a serrated side wall.

Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.

Abstract: An ultrasonic transducer for use in a fluid medium includes at least one transducer core having at least one electroacoustic transducer element, and further includes at least one housing having at least two housing parts. At least one first housing part at least partially encloses the transducer core such that a rear side of the electroacoustic transducer element which faces away from the fluid medium is accessible. Furthermore, at least one second housing part is connected to the first housing part. The ultrasonic transducer is essentially terminated by the second housing part on its side, which faces away from the fluid medium.

Abstract: A manufacturing process provided herein pertains to a single-piece, multi-layer piezoelectric stack in a sonar transducer element utilized in acoustic arrays requiring many thousands of elements. A slurry formed by mixing ceramics, powders, and binders is filtered, dried and cast into a thin film on a moving substrate. When the film has dried, it is removed from the substrate and layered into piezoelectric stacks. Screening a pattern of conductive platinum ink onto a desired layer forms electrodes. Applied heat and pressure forms a unitary body with electrically accessible layers. Burning removes the binders and sintering produces a final density. Dicing the body exposes the desired electrode polarities. A strip of conductive material is applied to connect the electrodes of like polarity and the ceramic parts are polarized. The transducer elements may be arrayed to conform to the curved surfaces such as a ship's hull.

Abstract: An ultrasonic sensor includes a substantially cylindrical case including a bottom portion and a side wall portion and a plurality of members disposed within the case. A reinforcement having a substantially ring shape is fitted on a thick section in the case at a location that is not in contact with an inner surface of a thin section of the side wall portion. A piezoelectric element is attached to an inner bottom surface of the case. An elastic member is fitted on the reinforcement so as to cover a substantially ring-shaped opening region of the reinforcement. A gap between the elastic member and an inner circumferential surface of the case is filled with a first filler. The terminal holding member is placed on the elastic member. A surrounding region of the terminal holding member is filled with a second filler.

Abstract: An apparatus for operating on tissue includes a body, a lip in communication with the body, and at least one electrode also in communication with the body. The body is able to mechanically couple with a portion of an end effector, which may be controlled by a user through a handpiece. The lip is configured to grip a portion of the end effector. The at least one electrode is configured to provide sufficient electrical energy to weld at least a portion of tissue. In some versions, a temperature sensitive material may be positioned on a portion of the end effector. Additionally, in some versions, the handpiece of the end effector may comprise feedback features able to convey information to the user.

Abstract: An ultrasound vibration device is provided with a stacked transducer in which a plurality of piezoelectric single crystal element layers are stacked between two metal blocks. Since each of the two metal blocks and the plurality of piezoelectric single crystal element layers is fusion-bonded relative to a stack direction by bonding metal having a melting point corresponding to half a Curie point of the plurality of piezoelectric single crystal element layers or below, it is possible to use non-lead material, reduce a processing cost and realize inexpensiveness.

Abstract: Embodiments of the invention provide a quartz vibrator and a method for manufacturing the same. The quartz vibrator includes a quartz substrate vibrating depending on an electrical signal, first and second electrodes formed on both surfaces of the quartz substrate, and a first protective layer including an opening corresponding to a trimming region of the first electrode and formed on the first electrode.

Abstract: According to embodiments of the present invention, an energy harvesting device is provided. The energy harvesting device includes a plurality of energy harvesting elements, each energy harvesting element including a transducer, and at least one spring arranged in between at least two energy harvesting elements of the plurality of energy harvesting elements to mechanically couple the at least two energy harvesting elements to each other. According to further embodiments of the present invention, a method for forming an energy harvesting device is also provided.

Abstract: Embodiments of the present invention provide a quartz vibrator and a method for manufacturing the same. The quartz vibrator includes a quartz substrate including an exciting part having a rectangular plate and a peripheral part having a thickness smaller than that of the exciting part and formed around the exciting part, a first electrode formed on one surface of the quartz substrate and the whole surface of the exciting part, and a second electrode formed on the other surface of the quartz substrate and the whole surface of the exciting part.

Abstract: A transducer is provided, which includes a substrate, wherein a cavity is defined at least partially through the substrate, at least one stopper structure arranged within the cavity, a support layer arranged over the at least one stopper structure and the cavity to seal the cavity, and a piezoelectric functional arrangement arranged on the support layer. According to further embodiments of the present invention, a method for forming a transducer is also provided.

Abstract: A nanoprinthead including an array of nanotip cantilevers, where each nanotip cantilever includes a nanotip at an end of a cantilever, and a method for forming the nanoprinthead. Each nanotip may be individually addressable through use of an array of piezoelectric actuators. Embodiments for forming a nanoprinthead including an array of nanotip cantilevers can include an etching process from a material such as a silicon wafer, or the formation of a metal or dielectric nanotip cantilever over a substrate. The nanoprinthead may operate to provide uses for technologies such as dip-pen nanolithography, nanomachining, and nanoscratching, among others.

Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention may include a membrane 110, a piezoelectric body 130 formed over the membrane 110, an electrode 140 formed on the piezoelectric body 130, a first pad 150 electrically connected with the electrode 140, a second pad 160 electrically connected with an integrated circuit 170, and a connection member 180 electrically connecting the first pad 150 with the second pad 160.

Abstract: A piezoelectric actuator array comprising a substrate plate (10) with a number of signal leads (14) and at least one common lead (18) formed on at least one surface (12) thereof, and a number of piezoelectric bodies (30, 32) arranged in a row (34) on one surface (12) of the substrate plate and formed by dividing a common piezoelectric block, said piezoelectric bodies comprising a number of active bodies (30) each of which has, on a first side of said row (34), a signal electrode (38) in contact with one of said signal leads (14) and, on an opposite second side of the row, a common electrode (40) in contact with said common lead (18), said substrate plate (10) having at least one connector lead (16) disposed on the first side of the row (34) and electrically connected to the common lead (18) on the second side of the row, wherein said piezoelectric bodies comprise at least one piezoelectric body (32) with a conductive outer surface layer (42) that establishes an electrically conductive path from the connector

Abstract: In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10 nm at the bonding interface with the membrane.

Abstract: An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: The present invention is a piezoelectric composition and a piezoelectric element using the piezoelectric composition, the composition being characterized by: having a Perovskite structure represented by general formula ABO3; being represented by composition formula x(Bi0.5K0.5)TiO3-yBi(Mg0.5Ti0.5)O3-zBiFeO3, x+y+z=1 in the composition formula above; and in a triangular coordinate using x, y and z in the composition formula above, having a composition represented by a region which is surrounded by a pentagon ABCDE with apexes of point A (1, 0, 0), point B (0.7, 0.3, 0), point C (0.1, 0.3, 0.6), point D (0.1, 0.1, 0.8) and point E (0.2, 0, 0.8) and which does not include the line segment AE that connects point A (1, 0, 0) and point E (0.2, 0, 0.8).

Abstract: A pressure sensing element includes a sensing sub-element disposed on a diaphragm, the element including a shield disposed over the sub-element and configured to substantially eliminate influence of external charge on the sub-element during operation. A method of fabrication and a pressure sensor making use of the pressure sensing element are disclosed.

Abstract: A backcarrying including a carrying portion having a top, a bottom, a front, a rear and two sides. A strap arrangement can also be included for carrying the carrying portion as a backcarrying. The strap arrangement can have a pair of carrying straps. Each carrying strap can be secured to the carrying portion at about the bottom and extend upwardly along respective sides of the carrying portion, and redirected at about the top of said respective sides to extend around to the rear of the carrying portion, and being redirected at about the top of the rear to extend downwardly for securement at about the bottom of the carrying portion at the rear. The strap arrangement can redirect forces to support a load in the carrying portion from the sides of the carrying portion.

Abstract: A method of making a pressure sensing apparatus is provided herein. A plurality of trenches are etched on a first surface of a substrate. The substrate is annealed to form a diaphragm and an embedded cavity from the plurality of trenches, the diaphragm formed of a portion of the substrate wherein an exterior surface of the diaphragm is the first surface of the substrate and an interior surface of the diaphragm is a surface defining the embedded cavity. Piezoresistors are fabricated on the exterior surface of the diaphragm, the piezoresistors configured to change resistivity in response to strain resulting from deflection of the diaphragm. The substrate is mounted, including the diaphragm, in a housing such that a media can apply pressure to the diaphragm and such that the pressure can be sensed by determining a change in the resistivity of the piezoresistors.

Abstract: In some examples, techniques are provided for quick haptic feedback, without the use of a controller, which is local to individual, non-actuating keys, such as keys of a thin keyboard or keypad. The haptic feedback may be in the form of a simulated “key-click” feedback for an individual key that is pressed by a user such that the finger used to press the key feels the tactile sensation. The haptic feedback mimics the tactile sensation of a mechanical key (e.g., buckling spring, pop-dome key switch) to give a user the perception that they have actuated a mechanically movable key.