Abstract: An apparatus for serially making formed parts from a web of deformable material with a stud mounted therein having a plurality of progressive die forming stations for forming multiple parts from the web by advancing the web through each forming station. In one embodiment, the apparatus has feeding, driving and transfer mechanisms for controlling the feeding and insertion of studs at spaced locations into the web.

Abstract: The present invention provides a method for manufacturing a plurality of friction plates obtained by adhering friction members to substantially annular core plates, comprising the steps of simultaneously stamping a plurality of coaxial core plates having different diameters with remaining joint portions therebetween, simultaneously stamping a plurality of substantially annular and coaxial friction members having different diameters corresponding to the core plates and with remaining joint portions therebetween to permit adhesion to the core plates, and stamping the joint portions of the friction members and the core plates when or after the friction members are adhered to the core plates.

Abstract: When very high mounting accuracy is required in the mounting of an ink jet head onto a support member, desired positional accuracy can be achieved relatively easily and a reduction in cost resulting from the simplification of the steps of process is achieved. At least two heads are aligned with each other and are joined or adhesively secured to a wiring substrate having an external connecting terminal formed with a lead, and the wiring substrate is cut at least each two heads, whereafter the cut segments are mounted as a unit on a support member.

Abstract: An object of the invention is to manufacture sliders having excellent properties with accuracy and to improve the production efficiency and the cleaning property. In a method of the invention to manufacture a bar in which a row of slider sections are aligned, a wafer block is made from a wafer in which rows of slider sections are aligned. The wafer block is bonded to a dummy block on a support plate. Next, a processing step and a cutting step are repeated. The processing step is to perform a specific processing on the medium facing surfaces of a row of slider sections in the medium facing surface of the wafer block bonded to the support plate. The cutting step is to cut the wafer block together with the support plate such that the row of slider sections whose medium facing surfaces have received the specific processing are separated from the wafer block to be the bar. A tape is affixed to the medium facing surfaces to protect the medium facing surfaces in the cutting step.

Abstract: There is provided a method for producing a friction plate, capable of improving the throughput of friction material and reducing the time and work required for adhering friction material segments to a core plate. The method produces a friction plate having oil grooves communicating between the internal periphery and the external periphery, by fixing friction material segments formed from a friction material to a core plate, and is featured by forming the oil grooves by plastic working of the friction material and fixation of the friction material segments with predetermined gaps therebetween to the core plate.

Abstract: A method of making a small chip resistor properly and efficiently is provided. This method makes chip resistors each of which comprises a unit substrate which is rectangular as viewed in plan and has a predetermined thickness, a resistor element provided on an upper surface of the substrate, and electrodes provided at opposite ends of the unit substrate.

Abstract: A method for manufacturing two kinds of printed circuit boards from one master board, comprises the steps of preparing the master board, forming slits on the master board to define a first circuit area, and executing: (a) forming first cut grooves extending substantially perpendicular to the slits so as to across outer side of both ends of the slits on the master board to define a second circuit area which surrounds the first circuit area, and cutting the master board along the first cut grooves to separate a first individual circuit board including the first and second circuit areas, or (b) forming second cut grooves on the master board so as to across both ends of the slits, and cutting the master board along the second cut grooves to separate a second individual circuit board including only the first circuit area.

Abstract: A metal article of manufacture including a tubular body portion and free-formed metal features on the tubular body portion. The free-formed metal features are formed of a layerwise deposition of a molten metal material in a predefined pattern to form the desired free-formed feature or construction.

Abstract: Elastic strips of a keyboard and a method for producing the same. An elastic sheet is produced by using a mold, wherein the elastic sheet has a plurality of rows of elastic domes formed thereon. Then, the elastic sheet is cut into a plurality of elastic strips, each of which has only one row of elastic domes.

Abstract: A method of manufacturing a leaf seal for use between rotating components comprises forming corrugations within a metallic strip and feeding the corrugated strip into a seal guide. The corrugated strip is then pressed into the guide by an angled ram such that the corrugations lie at an acute angle to the perpendicular axis. The strip is then secured in a seal carrier, the free ends of the corrugations thus forming the angled sealing leaves of a leaf seal.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method of efficiently manufacturing desired piezoelectric actuators capable of being driven stably is disclosed. Each piezoelectric actuator includes a vibrating body constructed of a vibrator to which a piezoelectric body is mounted, a moving body for making contact with the vibrating body to move it, a pressure application member for applying appropriate pressure to the vibrating body and to the moving body, and a guide member for connecting together the vibrating body, the moving body, and the pressure application member. A second piezoelectric actuator assembly is fabricated by stacking a pressure application plate, a moving body plate, and a vibrating body plate on top of each other. The piezoelectric actuator assembly is cut at connector portions at once. A large number of piezoelectric actuators can be manufactured in one process step. Thus, the efficiency of manufacture can be improved. The connector portions are formed at vibrational nodes of the vibrating body. The connector portions are severed.

Abstract: To produce a chamfer or a keyway on a workpiece, the workpiece is machined with a longitudinal feed following the course of the chamfer or groove. To obtain a clean chamfer or groove in an economic way, machining is effected by a peeling operation by means of a peeling knife, whose broadside forming a cutting edge is aligned transverse to the feed direction during the longitudinal feed, and which is guided parallel to the workpiece surface with a certain cutting depth.

Abstract: A method is disclosed for simultaneously producing a plurality of capacitive electroacoustic transducers. The method comprises forming a plurality of electrically insulative substrates by cutting circular slots to an insulating wafer. Each slot is interrupted by at least two tabs connecting a circular area with the remainder of the wafer. The conductive diaphragms are supported on diaphragm mounting rings disposed upon the substrate, spaced from a first electrode. The mounting rings space the diaphragm from the electrode to define a capacitor operative to convert electrical and acoustical signals.

Abstract: The present invention provides a method for manufacturing friction plates obtained by adhering friction members to substantially annular core plates, comprising the steps of simultaneously stamping a plurality of coaxial core plates having different diameters with a joint portion remaining therebetween, preliminarily adhering friction member segments to the stamped plural core plates, and stamping the joint portion during or after a main adhering step following the preliminarily adhering step.

Abstract: There is provided a method of manufacturing a piezoelectric actuator, which has high production efficiency and is available to miniaturize the piezoelectric actuator. Also, piezoelectric actuators are packed simply and a quality examination before shipment is performed easily. In this manufacturing method, various part sheets except for piezoelectric bodies of the piezoelectric actuators are joined to a piezoelectric material sheet having a size that a plurality of piezoelectric actuators can be formed, so as to from the plurality of piezoelectric actuators, and the piezoelectric material sheet is formed with a predetermined poling structure. Then, the piezoelectric material sheet is divided to manufacture the plurality of piezoelectric actuators. Also, dividing of the piezoelectric material sheet may be performed in a place where the piezoelectric actuator is to be used.

Abstract: The measuring instrument for a pressure gauge comprises an indicator unit (2) with two plates (4, 6) that bear rotatably an indicator shaft (24) carrying a pinion (28) and that furthermore bear a gear segment (32). The measuring instrument furthermore comprises a metal Bourdon tube (48) bent into an arc shape, which is soldered on one end to a spring carrier (40) and on the other to a spring end-piece (54). The spring end-piece (54) is connected to the gear segment (32) such that the displacement of the spring end-piece (54) because of the measurement pressure is transferred to the gear segment (32). The spring end-piece (54) constitutes a part that is rigidly attached to one of the two plates (4, 6) prior to the Bourdon tube (48) being soldered to the spring end-piece (54) and that is separated from this plate once the Bourdon tube (48) has been soldered to the spring end-piece (54).

Abstract: A method of manufacturing a sunshade for use with a vehicle having a sunroof includes cutting away material from a headliner to form a cutout and to define a sunroof opening in the headliner; and attaching edging to the cutout to form the sunshade. The sunshade produced by the method has improved color match and/or texture match with the headliner.

Abstract: An end module assembly has an internal support structure. An exterior fascia is mounted to the internal support structure. The fascia is configured to be a portion of a vehicle body assembly when the end module assembly is installed on the vehicle. An external visible component is mounted to the support structure in a fixed relationship with respect to the fascia in proper alignment with respect to the fascia with a surface thereof facing exteriorly of the fascia. A bumper beam and bumper beam mounting structure connects the bumper beam to the internal support structure. A mounting structure is connected to the support structure for attaching the support structure to mounting points on the partially completed motor vehicle.

Abstract: Identical ring-shaped metal blanks are machined whereby each blank forms a plurality of identical components. The blanks are first machined on both sides, and then a stack of the blanks is clamped axially adjacent one another on an arbor. Tools machine the blanks for reshaping the blanks. One of the tools is a slitter which makes axial cuts through the stack to separate each blank into a plurality of components distributed around the axis.

Abstract: According to one aspect of the invention a method is provided for making a combination hub and catheter. A material is molded into a body having at least a first hub, and at least a first nose extending from the first hub. The first nose is then elongated into a catheter.

Abstract: A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes 5 of substantially semicircular arc shape is used as an external connection terminal 3 of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals 3. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.

Abstract: A wafer sawing/grinding process capable of removing cracks and chipping resulted from a wafer sawing operation. A silicon wafer having an active surface and a back surface is provided. A first tape is attached to the back surface of the wafer and then the wafer is sawn along kerfs between neighboring silicon chips. A second tape is attached to the active surface of the silicon wafer before removing the first tape. The back surface of the wafer is then ground until the wafer reaches a desired thickness. A third tape is attached to the ground back surface of the wafer before removing the second tape.

Abstract: A method for assembling a window is described including forming a lineal member having a cross-sectional profile, where the profile includes a sash portion and a frame portion, cutting the lineal member into lengths sized for forming the window, and joining the lengths of the lineal member to form a shape of the window. The sash portions form a sash and the frame portions form a frame. Then the sash is separated from the frame.

Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: An improved method of forming a fusion nib on a part uses a progressive die system. The method utilizes a thin feed strip of rigid, formable material and forms the nib on a side edge of the strip using multiple progressive dies. A first die shears a side edge portion of the strip to define a finger element in the side edge of the strip. A second die is then propelled horizontally into the terminal end of the finger element to form the finger element into a mounting shoulder and a small nib on the center of the mounting shoulder. A third die then blanks out the body portion of the desired piece from the strip in another vertical stamping operation. The desired piece is thus separated from the feed strip with the nib completely formed thereon.

Abstract: A method for manufacturing a case for a secondary battery includes preparing a case material in a plate state; setting a plurality of sections on the case material, each section including parts for forming a pan for a battery main body, a gas receiving portion disposed at a side of the pan, a path connecting the pan and the gas receiving portion, and a cover portion covering the pan and the gas receiving portion together; forming the pan of the battery main body, the gas receiving portion, and the path by molding the case material; and severing each section from the case material.

Abstract: The invention proposes a manufacturing process of handle (6) for coupling the drilling rod (5) in the mandrel (3) of the drilling machine (2). Said process contemplates the handle (6) manufacture by means of a forming process of tubes (10) and (12) with inside diameters (Di) and cross sections compatible with both the cross section and outside diameter of the drilling rod (5); the tubes are subsequently cut in sections (Cn) and (An), thus producing the locking cleat (7) and the extended ring (9), respectively, which are then joined by means of welding so as to form the handle (6).

Abstract: Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, step 1 provides a plastic sheet having an adhesive first surface. Step 2 provides a patterned metal sheet on the first surface of the plastic sheet. The patterned metal sheet includes an array of package sites. Each package site is formed to include a die pad and a plurality of leads around the die pad. Step 3 places an integrated circuit device on each of the die pads. Step 4 connects a conductor between the integrated circuit device and the leads of the respective package site. Step 5 applies an encapsulating material onto the array. Step 6 hardens the encapsulating material. Step 7 removes the first plastic sheet. Step 8 applies solder balls to the exposed surfaces of the leads. Finally, step 9 separates individual packages from the encapsulated array.

Abstract: The method of manufacturing electronic parts comprises the steps of: preparing a mother board; mounting element parts on the mother board; providing a thermosetting resin on a surface of the mother board surface on which the element parts are mounted; semi-curing the thermosetting resin so as to be in a range of a stage B condition of the thermosetting resin; splitting the mother board with the thermosetting resin into individual electronic parts each having a divided mother board, at least one element part and the thermosetting resin thereon; and heating the individual electronic parts so that the thermosetting resin in the stage B condition melts first and is then cured permanently.

Abstract: A full face wheel assembly comprises a full face disc and a rim. The disc is preferably cast from aluminum whereas the rim is rolled from aluminum strip stock. The full face disc comprises an outboard bead seat flange, an outboard bead seat and an outboard well side wall. The disc may also include lightener pockets or a continuous re-entrant channel adjacent the outboard bead seat. The rim comprises an inboard bead seat flange, an inboard bead seat, an inboard leg, and a deep well. The disc and rim are welded together in the deep well or bead seat regions by gas metal arc welding, electron beam welding or other suitable welding technique.

Abstract: Circuit boards are formed within the boundaries of an insulative sheet or panel such that the panel may be automatably processed. The periphery of each printed circuit board is defined by at least a plurality of score lines which do not extend to the edge of the sheets and may include also uncut and/or unscored areas to provide stability to either the sheet or segments of scrap material, lending rigidity to the sheet. Following complete fabrication of the printed circuit board, the sheet is cut by a routing process to extend selected score lines to the edges of the sheet to destroy the integrity of the frame of scrap material surrounding the printed circuit boards.

Abstract: A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and containing connection areas with holes to which small contact plates are applied for the purpose of later bonding with connection leads. The small contact plates are applied in a hard soldering process with the aid of solder paste to the connection areas of the conductor paths and to the surface area of the substrate surface which is made of ceramic and exposed by the holes. It is consequently possible, dispensing with so-called bonding wires, to directly connect connection leads or bonding lugs electrically with the conductor path and mechanically with the printed circuit board. The printed circuit board is preferably designed as a measuring resistor, wherein the conductor path is applied as a resistance layer of platinum or platinum group metal in a thin film process to a small ceramic plate of aluminum oxide.

Abstract: The present invention provides a method of fabricating coated multiple metal substrates comprising the steps of fabricating from a section of metal a gang matrix comprising a frame, at least one piece of base metal which later forms a substrate, and a connective portion connecting or linking the piece to the frame. The connective portion includes a notched portion or break-out zone. A coating of resist or mask material is applied in the immediate proximity of the notched portion and then a layer of dielectric coating material is applied to the carrier gang. The resist serves to prevent the deposition of the dielectric coating material in the proximity of the notched portion. After coating, the carrier gang is fired in order to cure the dielectric material. The piece of base metal may be further processed, for example, screen printed with thick or think film inks. When required, the piece of base metal can be easily removed or separated from the frame by bending and/or twisting.

Abstract: A method is provided for making a combination hub and catheter. A material is molded in a mold into a body having at least a first hub, and at least a first nose extending from the first hub. The first nose is then elongated into a catheter by moving first and second components of the mold away from one another.

Abstract: A manufacturing method and apparatus for dicing printed circuit boards is disclosed that permits PCB's to be manufactured with greater component density and cut less expensively. The disclosed method includes forming a raw substrate to include conductive traces, mounting components on the substrate, testing the PCB and then cutting off the waste edges. The PCB can be formed and tested with components mounted on one or both sides of the PCB, and the waste edges can be cut off even with components mounted on both sides of the board. A workpiece fixture is provided that includes a recessed cavity into which PCB components extend. Double-sided boards can be cut using the disclosed workpiece fixture. The cavity includes a vacuum hole through which suction is provided to hold the PCB in place during cutting. Additional vacuum holes preferably are provided to hold the wings in place after they are removed.

Abstract: A multilayer circuit board 10 has a laminate 11 formed by stacking together a plurality of insulating sheets with intervening inner circuit elements (not shown). In a first main surface of the laminate 11, there is formed a cavity 12 in which electronic parts such as integrated circuits (not shown) are mounted. Further, for example, in each of the four side surfaces of the laminate 11, there is formed a step portion 13 that is at the boundary between upper and lower halves 111 and 112 of the laminate 11. That is, due to the presence of the step portions 13, the lower half 112 having a height h2 protrudes from the upper half 111 having a height h1. Further, external electrodes (not shown) are formed on the second main surface of the laminate 11 by screen printing. By this structure, there is provided a small-sized multilayer circuit board in which the cavity side walls are not chipped off when the multilayer circuit board is separated from the mother laminate.

Abstract: A method and apparatus for forming a hardboard picture puzzle having multiple puzzle pieces without the use of a "start hole" and with the use of a die for cutting the picture puzzle about its perimeter and using a band saw to cut individual pieces forming said picture puzzle.

Abstract: A method for forming a closed channel structural member having a central portion that is enlarged relative to the end portions thereof is disclosed. Initially, a tube is formed in a hydroforming die to have a desired shape that is preferably characterized by a relatively small diameter central portion extending between a pair of relatively large diameter end portions. Next, the tube is divided into two pieces in any conventional manner, such as by cutting, to provide two tube sections. Each of the two tube sections is then oriented in the opposite direction such that the relatively large end portions of the tube are disposed adjacent to one another. Lastly, the relatively large end portions are joined together in any conventional manner, such as by butt welding, to form a unitary member characterized by a relatively large diameter central portion extending between a pair of relatively small diameter end portions. In an alternative embodiment, a pair of tubes are initially formed in the same manner.

Abstract: In a process and apparatus for forming parts from a sheet of metal stock material so that they can be separated by a shake-and-break operation, elongated holes are punched in the sheet to separate the first part from the second part except at at least one shake-and-break location. At the shake-and-break location, a frusto-conical shape punch and die punch an opening on either side of a center tab connecting the parts. The wider ends of the frusto-conical shape holes face the tab, and the narrower ends adjoin the elongated holes and have the same width as such holes. In such a manner, the points where ends of the tab connect to the first and second parts are located in recesses located to the outside of the edges of the elongated holes. When the pieces are subsequently separated in a shake and break process, any residual burrs from where the tabs separate from the parts are located in the recesses, rather than along the edges of the part, and do not need to be removed.

Abstract: A process for manufacturing a ring that has at least one cylindrical end section that ends in a chamfer is disclosed. The process entails providing a flat-shaped article which is formed of a material capable of being deep-drawn. The flat-shaped article is stamped to provide indentations which correspond to the chamfer in the finished product. The flat-shaped article is then punched out to form a preform. The preform is then deep drawn, converting the preform into the shape of the ring. In the step of deep drawing the preform, the indentations form a chamfered section on the ring.

Abstract: A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.

Abstract: A manufacturing process includes mitering each end of a central member and mitering a single end of each of two end members formed, along with the central member, from a single piece of extruded stock having an inner surface including upper and lower attachment slots and an outer surface including upper and lower trim receiving slots. An "L"-shaped corner bracket is placed to extend within the upper and lower attachment slots at each end of the central member and between such slots at the mitered ends of the end members. A heat forming process is then applied to form corners of a decorative trim strip which is then placed to extend between the upper and lower trim receiving slots of the end members and the central members.

Abstract: A method for manufacturing a magneto-optical data storage system. The method includes the steps of providing a support surface and rotatably mounting a magneto-optical disk having a planar storage surface with a plurality of concentrically disposed data tracks onto the support surface. A proximal extremity of an arm is pivotably mounted on the support surface so that a distal extremity of the arm pivots between first and second positions relative to the storage surface. An optical light emitter and receiver emitting a laser beam is carried by the distal extremity of the arm. A flying magneto-optical head is mounted on the distal extremity of the arm. A mirror assembly is attached to the head. The mirror of the mirror assembly can be rocked between first and second positions for reflecting the laser beam between the optical light emitter and receiver and the storage surface of the magneto-optical disk so as to permit the optical recording and/or reading of information on the storage surface.

Abstract: A quiet transformer includes a laminated core having each laminate formed as a flat layer from highly grain oriented silicon steel which is fabricated by laser cutting techniques with each layer including five segments in intimate contact with each other via mitered butt lap joints having increased length and asymmetrical angles at opposite ends for reducing the reluctance of the gaps between adjacent lamination segments. The center segment has V joints of different angles on opposite ends. Clamping holes formed in the element of said lamination having the largest cross section at the location in the segment away from said gaps to prevent magnetic flux crowding and increased local flux density. Indexing pins on opposite faces of the segments close and lock in the gaps of the core with each layer being 100% interleaved for producing low joint reluctance and to minimize magnetostrictive forces. The core is pressurized by clamping brackets and bolts connected to opposite ends of the core.

Abstract: A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions.

Abstract: A multi-void structural member is alterable to form separate yet integral strut members extending from the original member. The defined voids are joined by webs which are removed from any or all of the defined voids to form the integral strut members of a desired configuration. The defined voids may be joined to others or separated to an individual extending strut. The multi-void member or any of the integral strut members formed therefrom are formed to a desired configuration by conventional methods to provide an integral structural member of a desired configuration.

Abstract: A modular high-frequency oscillator structure utilizes a master circuit board to form a plurality of oscillator units. The master circuit board has an upper, middle and lower copper foil layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal regulation circuit patterns. The middle copper foil layer has a plurality of power transfer and ground transfer circuit patterns. The lower copper foil layer has a large common ground circuit pattern. The master circuit board is etched in such a manner that the upper and lower copper foil layers are cut through to isolate each oscillator unit and the middle copper foil layer remains uncut.

Abstract: The present invention relates to a manufacturing procedure for printed circuit boards. It is directed to those printed circuit boards which utilize one or more power devices. There is a printed circuit board having one or more removable regions, each removably joined thereto by means of a boundary which is perforated, scored, formed with a reduced material thickness, or otherwise rendered into a breakaway region. Each removable or breakaway region has one or more fixturing holes. There is a temporary fastener and a mating fastener for each of said fixturing holes, one or more power devices, and at least one heat sink having a mounting hole for each of said fixturing holes. The position of each mounting hole on said heat sink is related to the position of a corresponding fixturing hole on a removable region of said printed circuit board. Thus, when a power device is affixed to a removable region, the mounting hole of said power device will align with the respective mounting hole of the heat sink.

Abstract: To produce a two-part valve housing inexpensively it is proposed to produce from a sleeve-shaped blank (20) by internal high-pressure forming an intermediate product (10) which corresponds to the first housing part in a section lying on one side of a separating surface (T) and to the second housing part in a section lying on the other side of the separating surface (T). Connection sections (24, 32), adjacent to the separating surface, of the intermediate product (20) have different diameters so that cooperating threads by means of which the housing parts are screwed together can be produced on them.