Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly 60 along a scribe line M?, the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assembly 60 along the contour line to form the scribe line M? on a lid board wafer 50; and a breaking step of applying a breaking stress along the scribe line M? using a cutting blade to cut the wafer assembly along the scribe line M?, wherein the scribing step involves forming the scribe line M? so that the ratio of a depth dimension D of the scribe line M? to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: An acoustic transducer and method of making the acoustic transducer is disclosed. A transducer element for converting a signal between one of an electrical signal and an acoustic signal and the other of the electrical signal and the acoustic signal is provided. A backing to the transducer is additively fabricated to a side of the transducer element. The backing includes an electrically conductive path therein for conducting the electrical signal.

Abstract: Systems and methods for reducing the effects of stray magnetic flux are provided. For example, an electronic device can employ the system and can include a first audio component configured to have a first acoustic phase and a first magnetic phase. The electronic device can also include a second audio component configured to have the first acoustic phase and a second magnetic phase that is opposite the first magnetic phase. The first audio component can be positioned with respect to the second audio component, such that any stray magnetic flux from the first audio component enters the second audio component during operation of the first and second audio components.

Abstract: Methods, apparatuses, and systems are disclosed for forming a transducer. The transducer may include a bottom plate formed from a first sheet of material, a top plate formed from a second sheet of material, and a middle portion. The middle portion includes a mid-upper element formed from a third sheet of material, the mid-upper element having a mid-upper frame, a mid-upper mass, and a plurality of mid-upper attachment members coupling the mid-upper mass to the mid-upper frame. The middle portion also may include a central element formed from a fourth sheet of material, the central element having a central frame and a central mass.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements for electrically connecting the acoustic elements to the integrated circuit. The conductive elements are electrically connected to the integrated circuit. Solder is engaged between the acoustic elements and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the acoustic elements through the solder.

Abstract: A dual backplate MEMS microphone system including a flexible diaphragm sandwiched between two single-crystal silicon backplates may be formed by fabricating each backplate in a separate wafer, and then transferring one backplate from its wafer to the other wafer, to form two separate capacitors with the diaphragm.

Abstract: The invention relates to an acoustic device and a method of making the same. The acoustic device comprises a diaphragm having an area and having an operating frequency range comprising a part in which the diaphragm moves in whole body mode and a part which includes at least the first bending mode. The acoustic device also comprises a moving coil transducer adapted to move the diaphragm in translation and having a voice coil coupled to the diaphragm and a magnet system and adapted to exchange energy with the diaphragm. The acoustic device also comprises at least one mechanical impedance means coupled to or integral with the diaphragm. The positioning and mass of the transducer voice coil and of the at least one mechanical impedance means is such that the net modal transverse velocity over the area of the diaphragm tends to zero. The transducer comprises a moving coil assembly having a coil former on which are mounted a plurality of voice coils in an axially-spaced array.

Abstract: Provided is a device for predicting an underground behavior by using an acoustic emission (AE) sensor, including: a waveguide rod having an elongated end to be inserted in a borehole; a plurality of acoustic emission sensors mounted on different positions of the waveguide rod; a wrapping layer configured to cover a circumferential surface of the waveguide rod such that a gap is formed between the waveguide rod and the wrapping layer; an acoustic emission generating layer filled into the gap and being homogeneous along a direction of the waveguide rod; and a grouting layer configured to fix the waveguide rod in the borehole.

Abstract: Cochlear implant headpieces with improved moisture resistance. The headpiece comprises a housing (102) including a housing microphone aperture (124), a microphone (108) within the housing, a membrane (148) between the housing microphone aperture and the microphone, a cap (104) including a sound port (158) and a shield (168), the cap being removably connectable to the housing and the headpiece being protected from particulate and moisture ingress.

Abstract: The production of an earpiece for a hearing apparatus and in particular for a hearing device is closely tailored to the simulation. To this end, the earpiece of a hearing apparatus to be inserted into an auditory canal is produced by first selecting a virtual raw vent and manufacturing the earpiece with a real vent. A base frequency of the acoustic transmission function of the virtual raw vent is determined. From that, a virtual vent is determined as a function of the base frequency and of at least one predetermined property of the auditory canal or of the earpiece. The earpiece is then manufactured on the basis of the virtual vent.

Abstract: A method for manufacturing a quartz crystal unit comprises disposing a metal film on a surface of a quartz crystal wafer, disposing a resist on the metal film, forming a tuning fork shape pattern on the surface, etching the quartz crystal wafer to form a quartz crystal tuning fork shape having a base and first and second tines, forming electrodes on opposite side surfaces of the first and second tines so that the electrode of the first tine has an electrical polarity opposite to an electrical polarity of the electrode of the second tine to form a quartz crystal tuning fork resonator that vibrates in a flexural mode of an inverse phase, removing the resist before forming the electrodes, mounting the tuning fork resonator on a mounting portion of the case, disposing a metal or a glass into a through-hole of the case, and adjusting an oscillation frequency of the tuning fork resonator.

Abstract: A method for producing a piezoelectric composite substrate with satisfactory productivity controls the inclination of the crystal axis and the polar axis of a single-crystal thin film and prevents an adverse effect due to pyroelectricity in a production process. The method for producing a piezoelectric composite substrate provided with a plurality of piezoelectric materials includes an ion-implantation step, a bonding step, and a separation step. In the ion-implantation step, H+ ions are implanted into a piezoelectric single crystal material. In the bonding step, the piezoelectric single crystal material is bonded to a piezoelectric single crystal material. At this time, the polarity of the polar surface of the piezoelectric single crystal material is opposite to the polarity of the polar surface of the piezoelectric single crystal material, the polar surfaces being bonded to each other.

Abstract: An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess.

Abstract: An ultrasonic probe apparatus and a method of manufacturing the ultrasonic probe apparatus are provided. The ultrasonic probe apparatus may include at least one first tile which transmits an ultrasonic beam toward a target object, and at least one second tile which receives an ultrasonic beam which is reflected from the target object.

Abstract: A heated resonator includes a base substrate, a piezoelectric piece having a thickness and a top side and a bottom side, a first electrode on the top side, a second electrode opposite the first electrode on the bottom side, an anchor connected between the piezoelectric piece and the base substrate, and a heater on the piezoelectric material. A thermal resistor region in the piezoelectric piece is between the heater and the anchor.

Abstract: A rotational intravascular ultrasound probe for insertion into a vasculature and a method of manufacturing the same. The rotational intravascular ultrasound probe comprises an elongate catheter having a flexible body and an elongate transducer shaft disposed within the flexible body. The transducer shaft comprises a proximal end portion, a distal end portion, a drive shaft extending from the proximal end portion to the distal end portion, an ultrasonic transducer disposed near the distal end portion for obtaining a circumferential image through rotation, and a transducer housing molded to the drive shaft and the ultrasonic transducer.

Abstract: The present invention relates to a new forward-looking ultrasound device including a local actuator embedded inside an elongate member such as a guide wire or catheter. The present invention includes an ultrasound transducer element configured to engage with the local actuator and rotate about an axis of rotation at least when the ultrasound transducer element and the local actuator are engaged. Also disclosed are methods of using the same.

Abstract: A speaker includes a magnetic circuit, a voice coil, and a diaphragm which are disposed in a case. The case is placed in an engine compartment of an automobile. Reproduced sound is emitted through a duct protruding outward from the case. A partition wall, which is a metal body frame of the automobile, is present between the engine compartment and the cabin space. The duct is inserted into a hole formed in the partition wall so that a sound port faces and protrudes into the cabin space. A heat dissipation port is formed in the case, and an end surface the magnetic circuit facing the partition wall is exposed in the heat dissipation port. An elastically deformable thermal conductive sheet is sandwiched between the partition wall and the end surface of the magnetic circuit.

Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.

Abstract: To provide a vibration actuator, a lens barrel, a camera, a manufacturing method for a vibration body and a manufacturing method for a vibration actuator, which have a high driving efficiency and can lead to easy manufacture. A vibration actuator of the present invention is provided with an elastic body and an electromechanical transducer element sintered onto the elastic body in the state that the element is divided into a plurality of areas by a groove-shaped border portion.

Abstract: An ultrasound system and a method of manufacturing an ultrasound system comprising a base comprising a bore; a prismatic segment, coupled to the base, that defines a set of surfaces surrounding the bore; a set of ultrasound transducer panels configured to emit ultrasound signals in a radial direction, each ultrasound transducer panel in the set of ultrasound transducer panels coupled to at least one surface of the set of surfaces, and an interconnect coupling a first ultrasound transducer panel in the set of ultrasound transducer panels to a second ultrasound transducer panel in the set of ultrasound transducer panels, wherein the interconnect facilitates coupling of the first ultrasound transducer panel and the second ultrasound transducer panel to the prismatic segment.

Abstract: An ultrasonic transducer element chip includes a substrate, ultrasonic transducer elements and a reinforcing member. The substrate defines openings arranged in an array pattern. The ultrasonic transducer elements are respectively disposed at the openings on a first surface of the substrate. The reinforcing member is fixed on a second surface of the substrate opposite to the first surface of the substrate. The reinforcing member includes linear groove parts formed on a surface of the reinforcing member fixed on the substrate so that internal spaces of the openings and an external space of the substrate are in communication with each other via the linear groove parts. The linear groove parts extend along a plane of the surface of the reinforcing member, and they are arranged at an interval in a first direction smaller than a width of each opening on the second surface of the substrate in the first direction.

Abstract: A mobile wireless communications device includes a housing and circuit board in the housing and having radio frequency (RF) circuitry and a power amplifier and microphone mounted thereon. An antenna is carried within the housing and operative with the RF circuitry. An RF shield surrounds and isolates the microphone from the RF circuitry, power amplifier and antenna and shields the microphone from radiated energy generated from the RF circuitry, antenna or power amplifier.

Abstract: A facility for performing a medical examination includes a room, a medical imaging system located in the room, and a plurality of elements installed on at least one of the room and the medical imaging system, the elements collectively creating a first theme that forms a physical environment at least partially surrounding a patient, wherein the theme is presented in a manner to reduce the level of patient anxiety and fear experienced by the patient being imaged. A medical imaging system is also described. A method of imaging a patient using the facility, a method of remodeling an existing facility, and a method of determining a theme to be used in a medical facility are also described.

Abstract: An in-ear monitor that can be customized for particular applications and individuals includes a housing formed from a body and a cover. A dynamic driver is mounted in a cavity in the housing on an angled mounting flange. The dynamic driver is acoustically coupled to a trumpet-shaped sound collector. The trumpet-shaped sound collector is coupled to a main sound bore that exits an opening in a nozzle portion of the body that is inserted into the ear canal of a user. An ambient sound port collects ambient sound and couples it to the sound bore. An additional bass post increases the bass response of the monitor. Ear impressions are used to customize the body of the monitor to the ear of a user and the location of the bass and ambient sound ports can be altered for different applications.

Abstract: An electromechanical transducer 180, motor structure 200 and voice coil winding support structure or bobbin 210 are configured to protect and transport heat away from a voice coil 220 which is would solely within the interior of bobbin 210 and configured for reciprocating movement in close proximity to an extended cooling pole piece 204. A compact, economical and efficient adaptation of a pancake style motor includes generous volume for a powerful magnet 208, while providing an extended, linear range of excursion and continuous cooling for the generously overhung voice coil 220.

Abstract: A piezoelectric mirror device fabrication process, including: dividing a silicon wafer into a multiplicity of segments, wherein on one surface of said silicon wafer per segment, a pair of lower electrodes, a mirror portion positioned between said lower electrodes and a pair of mirror support portions adapted to join said mirror portion to said lower electrodes are formed of an electrically conductive material having a Young's modulus of up to 160 GPa and a melting point higher than that of a piezoelectric element to be formed later; stacking the piezoelectric element and an upper electrode on said lower electrodes; removing the silicon wafer in a desired pattern from another surface of said silicon wafer per segment, and obtaining a multiplicity of piezoelectric mirror devices by dicing said multiplicity of piezoelectric mirror devices into individual ones.

Abstract: A method for assembling an ultrasonic surgical device includes the steps of rotatably freely connecting an ultrasonic waveguide to an ultrasonic surgical handle body, the ultrasonic waveguide having a proximal coupling end, substantially simultaneously removably coupling an ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body and removably inserting an ultrasonic-movement-producing distal end of a cordless, rotatably free ultrasonic transducer into the ultrasonic surgical handle body opposite the proximal coupling end of the ultrasonic waveguide, and rotating the ultrasonic waveguide with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer.

Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

Abstract: Ultrasound transducers can be fabricated by bonding a block of piezoelectric material having a conductive coating to a flex circuit that has a conductive region and at least 20 conductive traces disposed on an insulating substrate. The block of piezoelectric material is then diced so as to cut all the way through the block of piezoelectric material and all the way through the conductive region, and part way through, but not completely through, the insulating substrate. The dicing is performed so that the first conductive region is divided into at least 20 regions that are electrically isolated from each other, and each of the at least 20 regions is in electrical contact with a respective one of the at least 20 conductive traces.

Abstract: Provided is a method of manufacturing an electromechanical transducer having a reduced variation in a breakdown strength caused by a variation in flatness of an insulating layer. In the method of manufacturing the electromechanical transducer, a first insulating layer is formed on a first substrate, a barrier wall is formed by removing a part of the first insulating layer, and a second insulating layer is formed on a region of the first substrate after the part of the first insulating layer has been removed. Next, a gap is formed by bonding a second substrate on the barrier wall, and a vibration film that is opposed to the second insulating layer via the gap is formed from the second substrate. In the forming of the barrier wall, a height on a gap side in a direction vertical to the first substrate becomes lower than a height of a center portion.

Abstract: In a loud speaker, the diaphragm has a protruded part protruding on a yoke side on the inside and in the vicinity of an inner coupling part as a coupled portion to a voice coil. The loud speaker can be manufactured with the voice coil accurately positioned with respect to a diaphragm, and the voice coil is accurately vibrated vertically inside a magnetic gap. The possibility of the voice coil coming into contact with a plate and a yoke as a magnetic circuit body of the loud speaker can be reduced, thereby to improve production efficiency and a yield at the time of manufacturing the loud speaker.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasonic transducer for an ultrasonic flow measuring device, comprising an electromechanical transducer element, which is prestressed against an ultrasonic window of the ultrasonic transducer by a suitable structure, wherein a first surface of the electromechanical transducer element faces the ultrasonic window, and wherein a second surface of the electromechanical transducer element lying opposite the first surface is divided into a plurality of segments, which are galvanically connected with the suitable structure for prestressing.

Abstract: A phased-network ultrasound transducer for medical use, includes a single support (2) and a group of transducer elements (3) distributed randomly on the surface of the support (2), the transducer elements (3) being fixed. The group includes at least two sub-groups of transducer elements (3), each of the sub-groups having a different geometric point of convergence such as to focus an ultrasound energy in a different coverage volume (4, 5) such that the arrangement of the coverage volumes covers a target volume to be treated. In addition, the transducer includes control elements for controlling the transducer elements (3) independently of one another.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: A wireless communications device may include wireless communications circuitry and a waveguide transducer coupled to the wireless communications circuitry. The waveguide transducer may include a loop electrical conductor having a plurality of spaced apart gaps therein defining a plurality of respective spaced apart coupling points. The waveguide transducer may also include a feed assembly that may include at least one waveguide feed, and a feed network coupled between the at least one waveguide feed and the plurality of coupling points. The waveguide transducer may further include a waveguide surrounding the loop electrical conductor and extending outwardly therefrom. The waveguide may include a tubular body having an open end and an opposing closed end carrying the loop electrical conductor.

Abstract: A backing element of a ultrasonic probe, a backing layer of a ultrasonic probe, and a manufacturing method thereof, the backing layer formed by arranging a plurality of members each having a shape of a polygonal column in a one-dimensional manner or in a two-dimensional manner while each of the plurality of members is provided with a conductive trace formed at one side surface thereof, thereby electrically connecting an ultrasonic transducer array, which is being acoustically connected to the backing layer, in a further simple and definite manner.

Abstract: Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

Abstract: A method of manufacturing composite structures, or composite substrates, for a Surface Acoustic Wave (SAW) device are provided. In one embodiment of the present disclosure, a piezoelectric substrate is provided. A supporting substrate is formed over a first surface of the piezoelectric substrate. The first surface of the piezoelectric substrate may be unpolished. A second surface of the piezoelectric substrate is then processed to a desired thickness and polished. SAW device components such as, for example, interdigitated transducers (IDTs) and reflectors are then formed on the polished surface of the piezoelectric substrate. The supporting substrate may be formed using any desired type of deposition or growth process.

Abstract: A sonotrode for an ultrasonic surgical instrument has a shaft and an instrument head at a distal end of the shaft. The instrument head is equipped with a cutting structure for the treatment of bones. The shaft has a helical cut-out. The helical cut-out is provided with a transversely running shoulder. A method produces a sonotrode and a surgical instrument having such a sonotrode. As a result of the shoulder in the helical cut-out, the torsional vibration of the instrument head is amplified such that bone material can be ablated in a particularly effective fashion.

Abstract: An electrodynamic speaker in which the number of steps of forming a tinsel wire to be connected to a voice coil and connecting the tinsel wire to a terminal can be reduced is provided. A frame of the electrodynamic speaker includes an edge mounting section, a magnetic circuit mounting section, a coupling section for coupling the edge mounting section and the magnetic circuit mounting section so as to define a plurality of window sections, a terminal fixing section for fixing a terminal, and at least one void for dividing the edge mounting section having an approximately annular shape, the void being communicatively connected to the window sections of the coupling section. A middle portion of the tinsel wire passes through the void or the window sections communicatively connected to the void, and the other end of the tinsel wire is connected and fixed to the terminal.

Abstract: A resonator comprises a bottom electrode layer (12), a top electrode layer (10) which defines a resonator body; and a piezoelectric layer (14) sandwiched between the top and bottom electrode layers. An external region (152) is provided around the outside of the periphery of the resonator body. The cutoff frequency of a first resonance mode of the external region (152) is matched to the cutoff frequency of a second, different, resonance mode of the resonator body. The invention provides a deliberate change (typically increase) in the cutoff frequency the resonance modes in the external region, so that one of the modes has a cutoff frequency close to the cutoff frequency of the fundamental mode of the resonator body.

Abstract: A modular, flexible architecture for offering full-field breast ultrasound (FFBU) functionality and general-purpose ultrasound functionality in a single system is described. A conventional, general-purpose ultrasound system (202) is modified with an FFBU toolkit to create a dual-capability ultrasound system (200), the dual-capability ultrasound system (200) being able to accommodate both general-purpose ultrasound functionality and FFBU functionality, using a single ultrasound engine (112). Among other advantages, real-world clinical environments may enjoy cost savings for initial system procurement, space savings on clinic floors, easier and less expensive system upgrades, and the ability to use a single system and user interface for both FFBU screening and for follow-up diagnosis, biopsy, etc.

Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

Abstract: An ultrasonic transducer structure, an ultrasonic transducer, and a method of manufacturing the ultrasonic transducer are provided. The ultrasonic transducer structure includes a driving wafer that includes a driving circuit; and an ultrasonic transducer wafer that is disposed on the driving wafer and includes a first wafer in which a via-hole is formed, a first insulating layer formed on the first wafer, a second wafer spaced apart from the first insulating layer, and a cavity formed between the first insulating layer and the second wafer.

Abstract: In a method for manufacturing a quartz crystal unit, a quartz crystal tuning fork resonator is formed by etching a quartz crystal wafer to form a quartz crystal tuning fork base, quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, and a groove having stepped portions in at least one of opposite main surfaces of each of the quartz crystal tuning fork tines. A first electrode is disposed on at least one of the stepped portions of each of the grooves and a second electrode is disposed on each of side surfaces of each of the quartz crystal tuning fork tines. A frequency of oscillation of the quartz crystal tuning fork resonator is adjusted at least twice and in different steps. The quartz crystal tuning fork resonator is then mounted in a case and an open end of the case is covered with a lid.