Abstract: A micro-machined ultrasonic transducer substrate for immersion operation is formed by a particular arrangement of a plurality of micro-machined membranes that are supported on a silicon substrate. The membranes, together with the substrate, form surface microcavities that are vacuum sealed to provide electrostatic cells. The cells can operate at high frequency and can cover a broader bandwidth in comparison with conventional piezoelectric bulk transducers.

Abstract: The movement detector having six degrees of freedom comprises a support on which three position sensors are arranged according to three orthogonal axes. Each sensor comprises a rigid body (3), a deformable element (4) which is electrically conductive, and four conductive areas (6b) which are disposed on rigid walls (3). The deformable element (4) is balanced around the centre part thereof and has a rest position and four active positions wherein it is temporarily in contact with two of the conductive areas (6b) of the rigid body (3). The deformable element (4) of a sensor moves from a rest position to one of the active positions in response to a predetermined directional or axial translation or votation.

Abstract: A method for making a pressure sensor including the steps of providing a substrate and forming or locating a pressure sensing component on the substrate. The method further includes the step of, after the forming or locating step, etching a cavity in the substrate below the pressure sensing component to define a diaphragm above the cavity with the pressure sensing component located on the diaphragm. The pressure sensing component includes an electrically conductive electron gas which changes its electrical resistance thereacross upon movement of the diaphragm.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: The present invention discloses an inertial sensor comprising a planar mechanical resonator with embedded sensing and actuation for substantially in-plane vibration and having a central rigid support for the resonator. At least one excitation or torquer electrode is disposed within an interior of the resonator to excite in-plane vibration of the resonator and at least one sensing or pickoff electrode is disposed within the interior of the resonator for sensing the motion of the excited resonator. In one embodiment, the planar resonator includes a plurality of slots in an annular pattern; in another embodiment, the planar mechanical resonator comprises four masses; each embodiment having a simple degenerate pair of in-plane vibration modes.

Abstract: A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or compression, as well as electrical structures which are in connection therewith. To this end, a sacrificial layer is produced on or within a substrate and an activatable layer on top of the sacrificial layer, the sensitive region and at least a portion of the electrical structures being positioned on top or within an activatable layer, and a circumferential trench is produced around the region of the sensor element to be produced and having the sensitive region and the portion of the electrical structures, the trench being interrupted by at least one connecting point, which connects the region of the sensor element to the portion of the activatable layer lying outside the circumferential trench.

Abstract: A method of manufacturing a micro flux gate sensor that has a good electrical connection and can be easily manufactured includes operations of forming a metal pattern, forming a first insulation layer to cover the metal pattern and forming viaholes to expose a certain portion of the metal pattern, applying an electrical signal through the metal pattern and plating the viaholes with a metal material to form a connection portion, forming a magnetic core on an upper portion of the first insulation layer, forming a second insulation layer to cover the magnetic core and forming an upper coil portion electrically connected to the connection portion to form the excitation coil and the magnetic field detecting coil, forming a third insulation layer to cover the upper coil portion, and removing a certain portion of the metal pattern to leave only the lower coil portion of the metal pattern.

Abstract: A method for manufacturing an acoustic matching member, the acoustic matching member being incorporated into an ultrasonic transducer for transmitting and receiving ultrasonic waves, and including: at least two layers including a first layer and a second layer that have different acoustic impedance values from each other. The method for manufacturing including the steps of: filling voids of a porous member with a fluid filling material, and solidifying both the fluid filling material inside the voids and the surplus fluid filling material at the same time. The acoustic matching member does not have independent intermediate layers between the layers, so that delamination hardly occurs and the difficulty in the designing associated with the presence of intermediate layers can be avoided.

Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

Abstract: A measurement sensor for determining a physical property of a measurement gas, e.g., the concentration of a gas component or the temperature of a measurement gas, in particular of the exhaust gas of internal combustion engines, has a housing and a sensor element accommodated in the housing. The sensor element has an end segment at the measurement gas side that protrudes from the housing and a connection-side end segment that bears at least one contact surface. The sensor element also has at least one conductor element that contacts the at least one contact surface. In order to achieve low transition resistances at the electrical contacting and a decoupling from mechanical stress, the contact surface and the conductor element are connected to one another by welding, and are embedded in a ceramic compound at least in the area of the welded connection.

Abstract: A temperature sensor temperature sensing tube and its fabrication method comprised of a step that provides for a tubular blank of an appropriate length, a step in which a curvilinear semifinished product of the tube member bottom section aperture is formed, a step in which a semifinished product of the neck base and the neck body is formed, a step in which a semifinished product of the neck base and the neck body is further formed, and a step in which a finished product having an outer conoidal hem and an inner conoidal hem is formed. Executing each step completes the fabrication of the temperature sensing tube.

Abstract: A method of assembling an inductive proximity sensor maintains inductive coil wound bobbins in fixed relation to an inductive core within a housing. The method includes configuring two inductive coil wound bobbins with an integral ledge cantilevered from an inside surface thereof for forming a pocket under the integral ledge at a bottom of each bobbin; disposing each inductive coil wound bobbin around a corresponding leg of the inductive core; containing a foot of each core leg into the pocket of the corresponding bobbin; inserting each of two legs of a thruster element into a corresponding bobbin so that each leg rests upon the ledge of the corresponding bobbin; disposing the inductive core, inductive coil wound bobbins, and thruster element into the housing; disposing a spring element on a top surface of the thruster element; and compressing the spring element against the top surface of the thruster element.

Abstract: A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support electrode exposed. An upper electrode is formed on the sacrificial film and support electrode. The sacrificial film is selectively removed and a protective film is formed on the upper electrode. A photosensitive resin film having photosensitivity is formed on the protective film. A plurality of projections are formed in a region of the protective film above a capacitive detection element. In this manner a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed.

Abstract: A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.

Abstract: A magnetoelectric generator includes: a generating coil that is constituted by: a generating coil main body in which a conducting wire is wound onto respective teeth of a stator core; and an output wire that is led axially outward from the generating coil main body; and a varnish that is applied to a surface of the generating coil and heat-hardened, and an insulating insert is inserted into a gap in the generating coil between adjacent teeth; and the output wire is fixed to the generating coil main body by the varnish and is also fixed by being held between the insulating insert and the generating coil main body.

Abstract: The present invention provides a field weldable connection. In one embodiment, the field weldable connection is a downhole connector assembly for sealingly attaching a first and a second segment of a control line. The control line has an outer housing that encapsulates a polymeric secondary housing. A communication line runs therethrough the secondary housing. The connector further comprises a weld coupling welded to the outer housing of the first and second segments of the control line. To protect the communication line from the thermal radiation and heat generated during the welding process, at least one reflective sleeve replaces a portion of the secondary housing at a location intermediate the communication line and the welds of the coupling.

Abstract: Methods for integrating quartz-based resonators with electronics on a large area wafer through direct pick-and-place and flip-chip bonding or wafer-to-wafer boding using handle wafers are described. The resulting combination of quartz-based resonators and large area electronics wafer solves the problem of the quartz-electronics substrate diameter mismatch and enables the integration of arrays of quartz devices of different frequencies with the same electronics.

Abstract: A pressure module is provided which comprises a capsule having a cavity formed therein, and a pressure transducer disposed within the cavity of the capsule. A feedthrough pin, fixedly coupled to the capsule, extends into the capsule and is electronically coupled to the pressure transducer.

Abstract: A method of manufacturing a tactile sensor, which is capable of implementing a wide range of senses, including sensing contact pressure (vertical force and horizontal force) with an external object and heat caused by the contact pressure, comprises forming a side block formation pattern of a force sensor and forming a piezo-resistor formation pattern of a heat sensor; forming a piezo-resistor and depositing an oxide film on the piezo-resistor; forming contact holes and forming a line hole formation pattern; forming a metal line, a temperature measurement metal line, and a heater; depositing an oxide film on the metal line, the temperature measurement metal line, and the heater, and forming a load block on the oxide film; and forming a side block by etching a bottom surface of the wafer on which the load block is formed.

Abstract: A humidity sensor capable of self-regulating temperature compensation and a manufacturing method thereof overcomes the inaccuracy caused by the resistor value of a conventional humidity-sensitive element changing depending due to changes in the temperature. The present invention proposes disposing two different humidity-sensitive elements in a humidity-sensitive substrate, wherein one humidity-sensitive element includes a saturated salt solution. The humidity-sensitive substrate has two different humidity-sensitive elements for achieving a self-regulating temperature compensation feature. The present invention of the humidity-sensitive element having the saturated salt solution can maintain the amount of humidity in the air regardless of the temperature.

Abstract: A method is provided for effectively manufacturing a piezoelectric device equipped with a piezoelectric film with a crystal orientation that is aligned in a desired direction. An interlayer which partially has a layer formed by an ion beam assisted laser ablation method while controlling a temperature rise accompanied by an ion beam irradiation by a cooling device and is bi-axially oriented as a whole, is formed on a surface of a substrate. A lower electrode is formed on the interlayer. A piezoelectric film is formed on the lower electrode. An upper electrode is formed on the piezoelectric film. The lower electrode and the piezoelectric film are formed by epitaxial growth.

Abstract: A method that involves establishing the performance level of a proposed acoustic transducer array. Deriving a geometric shape for the array based on the established performance level. Selecting piezoceramic materials based on considerations related to the performance level and derived geometry. Forming small primary shapes of the selected piezoceramic materials for use as the basic elements of the larger derived geometric shape of the array. Arranging the basic elements into a mosaic of the larger derived geometric shape. Filling the interstices between the basic elements with urethane to bind the mosaic of basic elements thereby fabricating the completed piezoceramic transducer array.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.

Abstract: A fingerprint-sensing device with a sensor array that does not use active switching elements is fabricated on a base. Sensor support integrated circuits, which contain processing and addressing circuitry, are separately fabricated and subsequently mounted on the base, establishing electrical connections with an interconnect structure within the base, and are thus not integrated with the sensor array. The sensor support integrated circuits can be covered by a bezel structure and the sensor array by a covering material. In addition, a connection cable can be provided to connect the sensor array and the sensor support integrated circuits with a power source and to other external devices and to convey signals generated by the sensor array to the external devices.

Abstract: A biosensor is provided that comprises a plate element with a pre-determined reaction zone and a recess positioned adjacent to the reaction zone. The biosensor also comprises a reagent that is positioned on the reaction zone. In preferred embodiments, the recess circumscribes at least a portion of the reaction zone.

Abstract: A cantilever includes: a lever portion; a holder portion supporting the proximal end of the lever portion; a probe portion arranged at the distal end of the lever portion and having a spherical surface to face a sample; and a retaining portion fixed to the distal end of the lever portion and retaining the probe portion to surround a periphery of the probe portion. There is provided a cantilever allowing mounting of a probe portion with little effect in a short time without using any adhesive.

Abstract: A humidity sensor element, a humidity sensor device and a method for manufacturing thereof are provided. The humidity sensor element includes a substrate having a nanocomposite film as sensing material, wherein said nanocomposite film consists of carbon nanotube/perfluorinated polymer with acid functional groups in weight ratio of 0.01-20; and at least a pair of electrodes, which contact with the sensing material at one or both side(s). The nanocomposite film increases the sensitivity of humidity sensor element such that even an infinitesimal amount of moisture can be detected with minimum detection limit of 15.76 ppmv.

Abstract: A method of fabricating the parallel leading wire in a focusing mesh of field emission display and a structure thereof is provided. A cathode leading wire is formed along one edge of a cathode plate in a field emission display. When the metal mesh is formed on the cathode plate, one edge of the mesh becomes a leading wire parallel to another edge thereof. The leading wire has a designated length and a thickness thinner than the metal mesh. Without applying external force, the parallel leading wire is drooped and contacted the cathode plate because of itself weight. Be way of sintering, parallel leading wire is connected to cathode leading wire and enveloped by the metal mesh within the cathode plate.

Abstract: According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.

Abstract: A high-bandwidth electrical test probe having a probe contact spring of reduced size and characteristic capacitance is presented. The probe includes a contact spring connected at one end to the input port of a probe circuit. The opposite end of the contact spring enters the a probe socket and a predetermined angle of entry. The probe socket has a bore formed therein which is arranged at a non-zero angle relative to the angle of entry of the contact spring into said probe socket bore, thereby guaranteeing electrical contact with the bore. The design allows the use of a very small contact spring, on the order of tens of mils, thereby reducing the parasitic capacitance of the spring and allowing much higher bandwidths than heretofore achievable.

Abstract: A gas flowmeter capable of reducing a secular change comprises a silicon semiconductor substrate formed with a cavity and a heat element formed above the cavity of the semiconductor substrate by way of an insulating film. The heat element is a silicon (Si) semiconductor thin film impurity-doped at high concentration. Stoichiometrically stable silicon nitride (Si3N4) thin films as barrier layers which less permeate and less absorb hydrogen in the heat generating temperature range of the heat element are formed above and below the silicon (Si) semiconductor thin film.

Abstract: An inner terminal installation jig used to install an inner electrode terminal mount formed on an inner peripheral surface of a hollow cylindrical sensor element of a gas sensor.

Abstract: Methods for manufacturing electrochemical sensors are described. The sensors have a working electrode and a counter electrode, which are planar, and optionally an indicator electrode. The sensor includes a sample chamber to hold a sample of no more than 1 ?L in electrolytic contact with the working electrode. The methods provide sensors that can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry.

Abstract: An improved structure of a gas sensor is provided which is designed for achieving desired crimping of an end portion of a sensor housing to establish a higher degree of gas-tight seal between the housing and a sensor element. The sensor element is fitted within the sensor housing. The end portion of the sensor housing is crimped or bent to urge the sensor element into constant abutment with an inner wall of the housing through a sealing member. The housing has an unique shape and dimensions selected to ensure the higher degree of gas-tight seal regardless of the degree of wear of a crimper and/or dimensional error of the housing.

Abstract: Method for manufacturing an electromechanical sensor element for converting mechanical forces produced by the movements and vital functions or a person into electric signals, in which method a sensor film (11) is provided with metallic electrodes (15,16) placed on either side of it, at least one of said electrodes being a signal electrode, in which method is produced by cutting off a larger amount of sensor element material, in which method in the manufacture of sensor element material the electrodes are created in a continuous roll-to-roll process, and in which method the sensor element material is produced by laminating as a continuous roll-to-roll process. At least the sensor element material consists of repeated electrode patterns and a sensor element of a desired size and/or shape is formed by cutting the material between the patterns.

Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

Abstract: A load sensor plate (100) is adapted for manufacture by stamping spaced apart openings (110) through a thin blank to define flexure beams (112) beside the openings (110); and forming the blank with spaced apart columnar walls (102), (106) joined by a web (104) having the openings (110) and the flexure beams (112) whereby, an applied load (116) exerted on one of the columnar walls (102) is distributed among the flexure beams (12), and another of the columnar walls (106) bears an opposing force (118) that resists the applied load (118).

Abstract: A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to form a stack of alternating layers of piezoelectric material and adhesive material, and cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet having two sides comprising a plurality of piezoelectric fibers in juxtaposition to the adhesive material. The method further comprises bonding two electrically conductive films to the two sides of the piezoelectric fiber sheet. At least one conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric fiber sheet.

Abstract: An improved manufacturing method for a gas sensor is provided which is capable of establishing a required hermetic seal in a body of the gas sensor. The method includes preparing a sensor assembly including a housing, an air cover, an insulation porcelain, and a sensor element, pressing the air cover against the housing to fit an end of the air cover on an end of the housing to form an overlap thereof, and welding the air cover to the housing over the overlap. The welding is accomplished while pressing the air cover against the housing, thereby compressing an elastic member in the air cover to establish a hermetic seal between the sensor element and the housing.

Abstract: A high-reliability complex sensor is protected against vibration and electromagnetic wave noise from outside. A shield case is provided with a power conjunction terminal, GND conjunction terminal, angular velocity conjunction terminal, X axis acceleration conjunction terminal and Y axis acceleration conjunction terminal. Both a power supply terminal of an angular velocity detection device and a power supply terminal of an acceleration detection device are electrically connected with a power connector terminal of a protection case, via the power conjunction terminal of the shield case. Both a GND terminal of the angular velocity detection device and a GND terminal of the acceleration detection device are electrically connected with a GND connector terminal of the protection case, via the GND conjunction terminal of the shield case. A circuit board is contained completely within the shield case.

Abstract: A pressure sensor includes a pressure sensor house assembly which contains a reference cavity, in which a vacuum exists, and a getter capable of being thermally activated. The getter is activated by directly contacting the getter with an exterior heated body, conducting heat from the exterior heated body, maintaining the exterior heated body in direct contact with the getter for a predetermined period of time, and removing the exterior heated body.

Abstract: A microactuator includes a stationary element, a movable element, and a first microstructure. The stationary element is fixed on a substrate and has a plurality of stationary element electrodes arranged at a predetermined pitch. The movable element has a plurality of movable element electrodes opposing to the stationary element electrodes. The movable element is moved by applying a voltage across the stationary element and the movable element. The first microstructure is formed on at least one of the opposing surfaces of the movable element and the stationary element to prevent the movable element from attaching to the stationary element.

Abstract: A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at a small distance from the first housing body (1) creating a reference vacuum chamber (25) therebetween. An electrically conductive material (7) coats opposing surfaces of the first housing body (1) and the membrane (2) to form a capacitor. A measurement vacuum chamber (26) is provided between the membrane (2) and the second housing body (4). A port (5) communicates with the second housing body (4) to connect the measurement vacuum chamber (26) of the measuring cell to the medium to be measured. The membrane (2) is made from an Al2O3 slurry that is sintered in a first heating step, cooled, and then reheated to smooth the membrane.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: A method and apparatus for attaching a proximity probe offset to an axis defining an extension cable. The method and apparatus include a sensing element; a cylindrical part molded with a moldable material; a recess configured in one of two opposing ends defining the cylindrical part to receive the sensing element; a first and a second ferrule each extending from opposing surfaces defining an exterior of the cylindrical part, a first axis defining the first and second ferrules being offset from a second axis defining the cylindrical part; and an extension cable operably attached to the sensing element via the first and second ferrules, the sensing element being disposed offset relative to the extension cable.

Abstract: The invention relates to a noise suppressor unit for installing a common mode choke for a noise suppressor in a power source module onto a circuit board of the power source module, the module being arranged onto a circuit board of a plug-in unit. The noise suppressor unit includes a holder onto which the common mode choke for the noise suppressor of the power source module is arranged, at least one lifting element for an assembly head or the like of an automatic assembly machine for placing the noise suppressor unit onto the circuit board of the power source module with the automatic assembly machine or the like, and at least one surface mounting element for surface mounting the common mode choke for the noise suppressor onto the circuit board of the power source module.

Abstract: A two-phase rotary encoder is provided which includes a substrate for the encoder which is double-faced and has a copper-foil-bonded substrate etched thereon, a first ring-shaped electrode pattern and a second ring-shaped electrode pattern formed concentrically around a center hole on the substrate, a smooth, level ring-shaped comb electrode pattern formed on an outermost periphery of the substrate, wiring patterns which cover the electrode patterns through each of external connecting terminals provided on the substrate, and a common external connecting terminal provided on an edge of the substrate, formed on a surface thereof via the center hole or a through hole. The rotary encoder further includes a resin-molded case, a shaft, a gear-shaped rotor, a click mechanism and a tact switch mechanism.

Abstract: A method of making a biosensor is provided. The biosensor includes an electrically conductive material on a base and electrode patterns formed on the base, the patterns having different feature sizes. The conductive material is partially removed from the base using broad field laser ablation so that less than 90% of the conductive material remains on the base and that the electrode pattern has an edge extending between two points. A standard deviation of the edge from a line extending between two points is less than about 6 ?m.

Abstract: An electrical component testing device comprising a housing having at least one recess covered by a flexible membrane so as to form a chamber. A fluid passage extends through a portion of the housing and connects to the chamber thus permitting passage of a fluid material into the chamber. At least one contact member is positioned on the flexible membrane so as to provide an electrical connection to an electrical contact on a device to be tested.

Abstract: It is an object of the invention to provide a sensor which is highly reliable, and a method or producing a sensor which is highly reliable, and which can be easily produced. A method of producing a sensor in which bending of a heater and the like hardly occur is provided. In the invention, an oxygen sensor (1) has: an oxygen sensor element (2); a metal shell (3); first and second sensor terminal metal parts (11), (12); a heater (15); heater terminal metal parts (16), (17); a metal outer tube (21); and a separator (31) which is housed inside the metal outer tube (21), in which the terminal metal part (11) and the like and the heater (15) are held, and which provides insulation between the terminal metal part (11) and the like. An outer-tube butting face (34a) is formed in a flange portion (34) of the separator (31). In the metal outer tube (21), a flange butting face (24b) which butts against the outer-tube butting face (34a) is formed.